Pin header type pluggable miniaturized optical device

Abstract

The utility model discloses a pin header type plugging miniaturized optical device, which comprises a shell, uniformly distributed pins are fixedly arranged at the bottom of the shell, and a heating part is arranged in the shell. According to the utility model, the heat conduction mechanism is used for conducting out heat generated when the heating component is used, and the heat is conducted to the heat dissipation mechanism, so that the heat of the heating component is rapidly conducted out, and the heat is prevented from being stored in the shell, resulting in overheating of the heating component and easy damage of the heating component; the heat dissipation mechanism is arranged to dissipate heat conducted out by the heat conduction mechanism, the heat conduction efficiency of the heat conduction mechanism on the heat of the heating component is improved, the heat dissipation effect on the heating component is further improved, and meanwhile the problems that due to the fact that a miniaturized optical device is small in size and internal components are integrated in a high-density mode, the internal space of the optical device is limited, and cost is low are solved. And heat generated by parts in use is difficult to effectively dissipate through a limited space, so that the problem of poor heat dissipation effect is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of miniaturized optical devices, in particular to a pin-row plug-in miniaturized optical device. Background Art

[0002] Optical devices are divided into active devices and passive devices. Active optical devices are optoelectronic devices that need external energy to drive them in optical communication systems and can convert electrical signals into optical signals or vice versa. They are the heart of optical transmission systems. Passive optical devices are optoelectronic devices that do not require external energy to drive them.

[0003] With respect to the above-mentioned and existing related technologies, the inventors believe that the following defects often exist: miniaturized optical devices have small size and high-density integration of internal components, resulting in limited internal space of the optical devices. The heat generated by the components during use is difficult to effectively dissipate through the limited space, resulting in poor heat dissipation effect; therefore, a miniaturized optical device with pin header plug-in is proposed to address the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a miniaturized optical device with pin header plug-in, which has the advantage of improving the heat dissipation effect of the miniaturized optical device, and solves the problem that the miniaturized optical device has a small size and its internal components are highly densely integrated, resulting in limited internal space of the optical device, and the heat generated by the components when in use is difficult to be effectively dissipated through the limited space, resulting in poor heat dissipation effect.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a miniaturized optical device with pin-header plug-in, comprising a shell, the bottom of the shell is fixedly mounted with evenly distributed pins, a heat-generating component is arranged inside the shell, the surface of the shell is provided with evenly distributed through holes, the surface of the heat-generating component is provided with evenly distributed heat-conducting mechanisms, the surface of the shell has evenly distributed heat-dissipating mechanisms, and a closing plate is clamped on the top of the shell.

[0006] The effects achieved by the above components are: by arranging a heat-conducting mechanism to dissipate the heat generated when the heating component is in use, and leading the heat to the heat dissipation mechanism, the heat of the heating component can be quickly dissipated, avoiding the heat from being retained inside the shell, causing the heating component to overheat, and easily causing damage to the heating component; by arranging a heat dissipation mechanism to dissipate the heat dissipated by the heat-conducting mechanism, the efficiency of the heat-conducting mechanism in dissipating the heat of the heating component is improved, and the heat dissipation effect on the heating component is further improved; by arranging a closing plate to seal the top of the shell, the protection effect on the heating component is improved.

[0007] Preferably, the heat-conducting mechanism includes a heat-conducting copper plate, which is sleeved on the surface of the heat-generating component, and a heat-conducting silicone is fixedly installed on the inner side of the heat-conducting copper plate, and the heat-conducting silicone is sleeved on the surface of the heat-generating component and in contact with the heat-generating component, and a uniformly distributed copper tube is fixedly installed on the outer side of the heat-conducting copper plate, and the other end of the copper tube passes through a through hole.

[0008] The effects achieved by the above components are: by arranging the heat-conducting copper plate and the copper tube to cooperate with each other to conduct the heat generated by the heating component, and dissipating the heat through the heat dissipation mechanism, the contact between the heat-conducting copper plate and the surface of the heating component is increased under the action of the thermally conductive silicone, and the thermal conductivity between the heat-conducting copper plate and the heating component is improved, thereby improving the heat conduction efficiency of the heating component.

[0009] Preferably, the heat dissipation mechanism includes a heat dissipation ring, which is sleeved on the surface of the shell, the inner side of the heat dissipation ring is fixedly connected to the other end of the copper tube, and the outer side of the heat dissipation ring is fixedly installed with evenly distributed heat dissipation plates, which are corrugated and bent.

[0010] The effect achieved by the above components is: by setting the heat dissipation ring and the heat dissipation plate to cooperate with each other to dissipate heat, the heat dissipation effect of the heat-generating components is improved, and the poor heat dissipation effect inside the shell is avoided, which leads to overheating of the heat-generating components and easily causes damage to the heat-generating components.

[0011] Preferably, a fixing ring is fixedly installed on the inner side of the shell, and evenly distributed slots are opened on the top of the fixing ring. The closing plate is located on the inner side of the fixing ring, and evenly distributed blocks are fixedly installed on the side of the closing plate, and the blocks are connected to the inside of the slots.

[0012] The effect achieved by the above components is: by setting the card slot and the card block to cooperate with each other to clamp the closing plate to the inner side of the fixing ring, it is convenient to install and disassemble the closing plate and to repair the heating component.

[0013] Preferably, an abutment block is fixedly mounted on the bottom of the closing plate, and the abutment block is located on the top of the heat-generating component and abuts against the heat-generating component.

[0014] The effect achieved by the above components is: by providing an abutment block for abutting the top of the heating component, the heating component is prevented from shaking and deviating inside the shell, thereby improving the installation stability of the heating component.

[0015] Preferably, evenly distributed positioning plates are fixedly mounted on the bottom of the inner cavity of the shell, evenly distributed positioning blocks are fixedly mounted on the bottom of the surface of the heat-generating component, and the positioning blocks are clamped on the inner side of the positioning plates.

[0016] The effects achieved by the above components are: by arranging the positioning block and the positioning plate to cooperate with each other to position and install the heating component, the heating component is prevented from being offset inside the shell, and the use stability of the heating component is improved.

[0017] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0018] The utility model provides a heat conducting mechanism for conducting away the heat generated by the heating component when in use, and directs the heat to the heat dissipation mechanism, so as to quickly conduct the heat of the heating component, avoid the heat being retained inside the shell, which may cause the heating component to overheat and easily cause damage to the heating component, and provide a heat dissipation mechanism for dissipating the heat conducted by the heat conducting mechanism, thereby improving the efficiency of the heat conducting mechanism in conducting away the heat of the heating component, and further improving the heat dissipation effect of the heating component, and providing a closing plate for closing the top of the shell, thereby improving the protection effect of the heating component, and at the same time solving the problem that the internal space of the miniaturized optical device is limited due to its small size and high-density integration of components inside, and the heat generated by the components when in use is difficult to be effectively dissipated through the limited space, resulting in poor heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the housing and the heating component of the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the heating component of the utility model;

[0022] Figure 4 This is a schematic diagram of the heat conduction mechanism structure of the utility model;

[0023] Figure 5 This is a schematic diagram of the card slot structure of the utility model;

[0024] Figure 6 This is a schematic diagram of the closed plate structure of the utility model.

[0025] In the figure: 1. shell; 2. heat-conducting mechanism; 201. heat-conducting copper plate; 202. heat-conducting silicone; 203. copper tube; 3. heat dissipation mechanism; 301. heat dissipation ring; 302. heat dissipation plate; 4. pin; 5. heat-generating component; 6. positioning block; 7. positioning plate; 8. through hole; 9. fixing ring; 10. slot; 11. closing plate; 12. block; 13. abutment block. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-6 A miniaturized optical device with pin-header plug-in includes a shell 1, the bottom of the shell 1 is fixedly mounted with evenly distributed pins 4, a heat-generating component 5 is arranged inside the shell 1, the surface of the shell 1 is provided with evenly distributed through holes 8, the surface of the heat-generating component 5 is provided with evenly distributed heat-conducting mechanisms 2, the surface of the shell 1 is provided with evenly distributed heat-dissipating mechanisms 3, and a closing plate 11 is clamped on the top of the shell 1.

[0028] Specifically, the heat-conducting mechanism 2 includes a heat-conducting copper plate 201, which is sleeved on the surface of the heat-generating component 5. A heat-conducting silicone 202 is fixedly installed on the inner side of the heat-conducting copper plate 201. The heat-conducting silicone 202 is sleeved on the surface of the heat-generating component 5 and contacts the heat-generating component 5. A uniformly distributed copper tube 203 is fixedly installed on the outer side of the heat-conducting copper plate 201, and the other end of the copper tube 203 passes through the through hole 8.

[0029] Specifically, the heat dissipation mechanism 3 includes a heat dissipation ring 301, which is sleeved on the surface of the shell 1, and the inner side of the heat dissipation ring 301 is fixedly connected to the other end of the copper tube 203. The outer side of the heat dissipation ring 301 is fixedly installed with evenly distributed heat dissipation plates 302, and the heat dissipation plates 302 are corrugated and bent.

[0030] Specifically, a fixing ring 9 is fixedly installed on the inner side of the shell 1, and evenly distributed card grooves 10 are opened on the top of the fixing ring 9. The closing plate 11 is located on the inner side of the fixing ring 9, and evenly distributed card blocks 12 are fixedly installed on the side of the closing plate 11. The card blocks 12 are connected to the inside of the card grooves 10.

[0031] The clamping groove 10 and the clamping block 12 cooperate with each other to clamp the closing plate 11 to the inner side of the fixing ring 9 , so as to facilitate installation and removal of the closing plate 11 and maintenance of the heating component 5 .

[0032] Specifically, an abutment block 13 is fixedly mounted on the bottom of the closing plate 11 . The abutment block 13 is located on the top of the heating component 5 and abuts against the heating component 5 .

[0033] The abutment block 13 is used to abut against the top of the heat-generating component 5 to prevent the heat-generating component 5 from shaking or deviating inside the housing 1 , thereby improving the installation stability of the heat-generating component 5 .

[0034] Specifically, evenly distributed positioning plates 7 are fixedly installed at the bottom of the inner cavity of the shell 1 , and evenly distributed positioning blocks 6 are fixedly installed at the bottom of the surface of the heat-generating component 5 . The positioning blocks 6 are clamped on the inner side of the positioning plates 7 .

[0035] The positioning block 6 and the positioning plate 7 cooperate with each other to position and install the heat generating component 5 , thereby preventing the heat generating component 5 from shifting inside the housing 1 and improving the stability of the heat generating component 5 .

[0036] When in use, the heat-conducting copper plate 201 and the copper tube 203 cooperate with each other to dissipate the heat generated by the heating component 5, and dissipate the heat through the heat dissipation mechanism 3. Under the action of the thermally conductive silicone 202, the contact between the heat-conducting copper plate 201 and the surface of the heating component 5 is increased, and the thermal conductivity between the heat-conducting copper plate 201 and the heating component 5 is improved, thereby improving the heat dissipation efficiency of the heating component 5. The heat dissipation ring 301 and the heat dissipation plate 302 cooperate with each other to dissipate the heat, thereby improving the heat dissipation effect of the heating component 5, avoiding poor heat dissipation effect inside the shell 1, resulting in overheating of the heating component 5, and easily causing damage to the heating component 5.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pin-type plug-in miniaturized optical device, comprising a housing (1), characterized in that: The bottom of the shell (1) is fixedly provided with uniformly distributed pins (4), the interior of the shell (1) is provided with a heat-generating component (5), the surface of the shell (1) is provided with uniformly distributed through holes (8), the surface of the heat-generating component (5) is provided with uniformly distributed heat-conducting mechanisms (2), the surface of the shell (1) is provided with uniformly distributed heat-dissipating mechanisms (3), and the top of the shell (1) is clamped with a closing plate (11).

2. The pin-type pluggable miniaturized optical device according to claim 1, characterized in that: The heat-conducting mechanism (2) comprises a heat-conducting copper plate (201), the heat-conducting copper plate (201) being sleeved on the surface of the heating component (5), a heat-conducting silicone rubber (202) being fixedly mounted on the inner side of the heat-conducting copper plate (201), the heat-conducting silicone rubber (202) being sleeved on the surface of the heating component (5) and in contact with the heating component (5), and evenly distributed copper tubes (203) being fixedly mounted on the outer side of the heat-conducting copper plate (201), the other end of the copper tube (203) passing through the through hole (8).

3. The pin-type pluggable miniaturized optical device according to claim 1, characterized in that: The heat dissipation mechanism (3) comprises a heat dissipation ring (301), the heat dissipation ring (301) is sleeved on the surface of the housing (1), the inner side of the heat dissipation ring (301) is fixedly connected to the other end of the copper tube (203), and the outer side of the heat dissipation ring (301) is fixedly mounted with evenly distributed heat dissipation plates (302), and the heat dissipation plates (302) are arranged in a corrugated bending manner.

4. The pin-type pluggable miniaturized optical device according to claim 1, characterized in that: A fixing ring (9) is fixedly mounted on the inner side of the shell (1), and evenly distributed card slots (10) are opened on the top of the fixing ring (9). The closing plate (11) is located on the inner side of the fixing ring (9), and evenly distributed card blocks (12) are fixedly mounted on the side of the closing plate (11), and the card blocks (12) are card-engaged in the inside of the card slots (10).

5. The pin-type pluggable miniaturized optical device according to claim 1, characterized in that: An abutment block (13) is fixedly mounted on the bottom of the closing plate (11); the abutment block (13) is located on the top of the heating component (5) and abuts against the heating component (5).

6. The pin-type pluggable miniaturized optical device according to claim 1, characterized in that: The bottom of the inner cavity of the shell (1) is fixedly mounted with evenly distributed positioning plates (7), and the bottom of the surface of the heating component (5) is fixedly mounted with evenly distributed positioning blocks (6), and the positioning blocks (6) are snap-fitted to the inner side of the positioning plates (7).

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