Display module for improving anti-vibration level

Abstract

The utility model discloses a display module for improving the anti-vibration grade, which comprises a lower substrate and an upper substrate arranged above the lower substrate, frame glue, plastic cement balls and liquid crystal are arranged between the lower substrate and the upper substrate, the plastic cement balls and the liquid crystal are arranged in a space enclosed by the frame glue, and the liquid crystal is arranged in the space. A silicon dioxide isolation layer, an ITO wiring layer, a top coating and a high-thickness PI layer are sequentially arranged on the upper surface of the lower substrate from bottom to top in a stacked mode, the PI layer is used for liquid crystal orientation or alignment, and the thickness of the PI layer ranges from 50 nm to 80 nm. Due to the fact that the PI layer is a high-thickness PI layer, the thickness of the PI layer ranges from 50 nm to 80 nm, the orientation capacity of the PI layer on liquid crystal molecules can be improved, the phenomenon that water ripples appear on the liquid crystal layer due to vibration of the plastic balls under the high-frequency vibration condition is avoided, the anti-vibration grade of the display module is improved, and the problem of uneven display is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a display module with improved anti-vibration level. Background Art

[0002] As electric vehicles, especially electric bicycles and electric motorcycles, are becoming more and more popular, high-frequency vibration (generally defined as 5G acceleration or above) is also a trend requirement in the high-end market. Some models even require 10G acceleration and 15G acceleration vibration conditions. This places higher and more detailed requirements on the structural design of the instrument, especially the design of the display module.

[0003] Traditional display modules use spherical supports (called plastic balls or glass powder in the industry) between the upper and lower glass substrates to ensure that the liquid crystal box has a sufficiently uniform thickness. This sandwich structure design has almost no constraints between the substrate glass, plastic balls and liquid crystal, which means that when external force is applied, there will be displacement between the three. This structure has no problem coping with general application conditions. However, when this display module is used in a vibration environment with a high acceleration environment, due to the relative position changes between the above three, at a specific vibration frequency, relative to the glass substrate and liquid crystal, the vibration of the plastic ball can be understood as a "microscopic resonance phenomenon". The vibration of the plastic ball will cause a phenomenon similar to "water ripples" in the liquid crystal layer, resulting in uneven display problems. Utility Model Content

[0004] The technical problem to be solved by the utility model is how to avoid the phenomenon similar to "water ripples" in the liquid crystal layer caused by the vibration of the plastic ball under high-frequency vibration conditions, thereby improving the vibration resistance level of the display module and avoiding the problem of uneven display.

[0005] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0006] In order to solve the above technical problems, the utility model provides a display module with improved vibration resistance, which includes a lower substrate and an upper substrate arranged above the lower substrate, frame glue, plastic balls and liquid crystal are arranged between the lower substrate and the upper substrate, the plastic balls and the liquid crystal are arranged in a space enclosed by the frame glue, and the upper surface of the lower substrate is sequentially stacked with a silicon dioxide isolation layer, an ITO wiring layer, a top coating and a high-thickness PI layer from bottom to top, the PI layer is used for liquid crystal orientation or alignment, and the thickness of the PI layer is 50nm-80nm.

[0007] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, the PI layer is a PI layer obtained by solidifying a high-concentration PI liquid.

[0008] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, the PI layer is a stack of multiple PI layers.

[0009] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, the thickness of the PI layer is 60 nm.

[0010] As a preferred embodiment of the display module with improved vibration resistance provided by the utility model, the upper surface of the lower substrate is bound with a driver IC and an FPC, an insulating shielding integrated layer is attached to the driver IC and the FPC, the insulating shielding integrated layer includes insulating paper and a conductive shielding material arranged above the insulating paper, the area of ​​the insulating paper is smaller than the area of ​​the conductive shielding material, the insulating paper can completely cover the driver IC and the FPC, the conductive shielding material has a through hole at the edge of the insulating paper, and the through hole is located in an area where no components are provided.

[0011] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, the through hole is a round hole.

[0012] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, one end of the opening waste material at the through hole is connected to the conductive shielding material.

[0013] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, a double-sided tape is provided at the bottom of the open hole waste material.

[0014] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, one side of the insulating paper extends beyond the conductive shielding material.

[0015] As a preferred implementation of the display module with improved vibration resistance provided by the utility model, the conductive shielding material is conductive paper or copper foil.

[0016] The utility model has the following beneficial effects:

[0017] Since the PI layer is a high-thickness PI layer with a thickness of 50nm-80nm, it can enhance the directional ability of the PI layer to the liquid crystal molecules, thereby avoiding the vibration of the plastic ball under high-frequency vibration conditions causing a "water ripple" phenomenon in the liquid crystal layer, thereby enhancing the vibration resistance of the display module and avoiding the problem of uneven display. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 The utility model provides a structural schematic diagram of a display module with improved vibration resistance level.

[0020] Figure 2 for Figure 1 Schematic diagram of the structure of the middle and lower substrates.

[0021] Figure 3 for Figure 1 Schematic diagram of the improved structure.

[0022] Figure 4 for Figure 3 Top view of the .

[0023] Figure 5 for Figure 4 Schematic diagram of the structure of the middle insulation and shielding integrated layer.

[0024] Description of Figure Numbers:

[0025] Lower substrate 1; upper substrate 2; frame glue 3; plastic ball 4; liquid crystal 5; silicon dioxide isolation layer 11; ITO wiring layer 12; top coating 13; PI layer 14;

[0026] Driver IC 6 ; FPC 7 ; insulating shielding integrated layer 8 ; insulating paper 81 ; conductive shielding material 82 ; through hole 83 . DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] The utility model provides a display module with improved vibration resistance level, which includes a lower substrate and an upper substrate arranged above the lower substrate, frame glue, plastic balls and liquid crystal are arranged between the lower substrate and the upper substrate, the plastic balls and the liquid crystal are arranged in a space enclosed by the frame glue, and the upper surface of the lower substrate is sequentially stacked with a silicon dioxide isolation layer, an ITO wiring layer, a top coating and a high-thickness PI layer from bottom to top, the PI layer is used for liquid crystal orientation or alignment, and the thickness of the PI layer is 50nm-80nm.

[0031] Since the PI layer is a high-thickness PI layer with a thickness of 50nm-80nm, it can enhance the directional ability of the PI layer to the liquid crystal molecules, thereby avoiding the vibration of the plastic ball under high-frequency vibration conditions causing a "water ripple" phenomenon in the liquid crystal layer, thereby enhancing the vibration resistance of the display module and avoiding the problem of uneven display.

[0032] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.

[0033] See also Figure 1 and Figure 2 , a display module with improved vibration resistance level provided by the utility model, comprising a lower substrate 1 and an upper substrate 2, the upper substrate 2 is arranged above the lower substrate 1, a sealant 3, a plastic ball 4 and a liquid crystal 5 are arranged between the lower substrate 1 and the upper substrate 2, the plastic ball 4 and the liquid crystal 5 are arranged in a space enclosed by the sealant 3, and a silicon dioxide isolation layer 11, an ITO wiring layer 12, a top coating 13 and a high-thickness PI layer 14 are sequentially stacked on the upper surface of the lower substrate 1 from bottom to top, the PI layer 14 is used for the orientation or alignment of the liquid crystal 5, and the thickness of the PI layer 14 is 50nm-80nm. In this embodiment, the thickness of the PI layer 14 is preferably 60nm. Since the PI layer 14 is a high-thickness PI layer 14, and the thickness of the PI layer 14 is 50nm-80nm, it can improve the orientation ability of the PI layer 14 to the liquid crystal 5 molecules, thereby avoiding the phenomenon of "water ripples" similar to the liquid crystal 5 layer caused by the vibration of the plastic ball 4 under high-frequency vibration, thereby improving the vibration resistance level of the display module and avoiding the problem of uneven display.

[0034] Furthermore, the PI layer 14 is a PI layer 14 obtained by solidifying a high-concentration PI liquid. The concentration of the PI liquid is increased, thereby increasing the effective thickness of the PI after solidification.

[0035] Furthermore, the PI layer 14 is a stack of multiple PI layers 14 , and during the PI coating process, the effective thickness is increased through multiple coating processes.

[0036] See also Figures 3 to 5 As a further optimization scheme of Example 1, in this embodiment, the upper surface of the lower substrate 1 is bound with the driver IC6 and FPC7, and the driver IC6 and FPC7 are attached with an insulating shielding integrated layer 8, and the insulating shielding integrated layer 8 includes insulating paper 81 and conductive shielding material 82, and the conductive shielding material 82 is arranged above the insulating paper 81, and the area of ​​the insulating paper 81 is smaller than the area of ​​the conductive shielding material 82, and the insulating paper 81 can completely cover the driver IC6 and FPC7, and the conductive shielding material 82 is provided with a through hole 83 at the edge of the insulating paper 81, and the through hole 83 is located in the area where no components are provided. Since the conductive shielding material 82 is provided with a through hole 83 at the edge of the insulating paper 81, the operator can see the edge of the insulating paper 81, so that the operator can judge the position of the insulating paper 81 when attaching, so as to avoid being attached to the driver IC6 and FPC7 in an offset manner or not being attached, thereby preventing a short circuit and avoiding economic losses.

[0037] Furthermore, the through hole 83 is a circular hole, and one end of the opening waste is connected to the conductive shielding material 82. So that the position of the insulating paper 81 can still be observed by breaking the opening waste at the circular hole, and the opening waste is covered back after being pasted, so as to avoid the opening being unable to ensure conductive shielding.

[0038] Furthermore, a double-sided tape is provided at the bottom of the waste material with holes, and the waste material with holes is pasted back by the double-sided tape to avoid failure to ensure conductive shielding at the holes.

[0039] Furthermore, one side of the insulating paper 81 extends beyond the conductive shielding material 82, so that the operator can determine the specific position of the insulating paper 81 through the insulating paper 81 extending beyond the conductive shielding material 82, thereby avoiding biased or non-attachment to the driver IC6 and FPC7, thereby preventing a short circuit and economic losses.

[0040] Furthermore, the conductive shielding material 82 is conductive paper or copper foil, which can form a conductive shielding effect.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A display module with improved vibration resistance, characterized in that: It includes a lower substrate and an upper substrate arranged above the lower substrate, frame glue, plastic balls and liquid crystal are arranged between the lower substrate and the upper substrate, the plastic balls and the liquid crystal are arranged in the space enclosed by the frame glue, and the upper surface of the lower substrate is sequentially stacked with a silicon dioxide isolation layer, an ITO wiring layer, a top coating and a high-thickness PI layer from bottom to top, the PI layer is used for liquid crystal orientation or alignment, and the thickness of the PI layer is 50nm-80nm.

2. The display module with improved vibration resistance according to claim 1, characterized in that: The PI layer is a PI layer obtained by solidifying a high-concentration PI liquid.

3. The display module with improved vibration resistance according to claim 1, characterized in that: The PI layer is composed of multiple superimposed PI layers.

4. The display module with improved vibration resistance according to claim 1, characterized in that: The thickness of the PI layer is 60 nm.

5. The display module with improved vibration resistance according to claim 1, characterized in that: The upper surface of the lower substrate is bound with a driver IC and an FPC, and an insulating shielding integrated layer is attached to the driver IC and the FPC. The insulating shielding integrated layer includes insulating paper and a conductive shielding material arranged above the insulating paper. The area of ​​the insulating paper is smaller than the area of ​​the conductive shielding material. The insulating paper can completely cover the driver IC and the FPC. The conductive shielding material has a through hole at the edge of the insulating paper, and the through hole is located in an area where no components are provided.

6. The display module with improved vibration resistance according to claim 5, characterized in that: The through hole is a round hole.

7. The display module with improved vibration resistance according to claim 5, characterized in that: One end of the open hole waste material at the through hole is connected to the conductive shielding material.

8. The display module with improved vibration resistance according to claim 7, characterized in that: The bottom of the open hole waste material is provided with double-sided adhesive tape.

9. The display module with improved vibration resistance according to claim 5, characterized in that: One side of the insulating paper exceeds the conductive shielding material.

10. The display module with improved vibration resistance according to claim 5, characterized in that: The conductive shielding material is conductive paper or copper foil.

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