Totally-closed air cooling server

Abstract

The utility model discloses a totally-enclosed air-cooled server, which relates to the technical field of air-cooled servers, and comprises a shell, an air-cooled air-cooled server, an air-cooled air-cooled server, an air-cooled air-cooled server, an air-cooled air-cooled server, an air-cooled air-cooled server, an air-cooled air-cooled server The power module is arranged on the shell and used for providing power for gas convection; and the calculation module is arranged in the closed containing space, and a space with a certain height is reserved between the calculation module and the inner wall of the closed containing space, so that an internal circulation air duct is formed. Therefore, the technical effects of better environmental adaptability and electromagnetic compatibility, prevention of water vapor, dust, impurities and the like from entering, and prolonging of the service life of equipment are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of air-cooling servers, in particular to a fully enclosed air-cooling server. Background Art

[0002] The mainstream air-cooled servers in the existing technology use radiators to export the heat of chips such as CPU to the surface of the fins, and use fans to blow cold air into the chassis to remove the heat on the fins of the radiator. Water-cooled servers use water cooling to dissipate heat for major heat-generating components such as CPUs, while other heat sources usually still need to be cooled by air cooling. There is a technical problem that the inside of the server is directly connected to the outside world and cannot be fully enclosed. Summary of the invention

[0003] In view of the defects in the prior art, the embodiment of the utility model provides a fully enclosed air-cooled server, including: a shell, a closed accommodation space is formed in the shell, and a shell heat dissipation path is arranged on the outer surface of the shell; a power module, the power module is arranged on the shell, and is used to provide power for gas convection; a computing module, the computing module is arranged in the closed accommodation space, and a certain height space is left between the computing module and the inner wall of the closed accommodation space to form an internal circulation air duct. Thus, better environmental adaptability and electromagnetic compatibility are achieved, water vapor, dust, impurities, etc. are prevented from entering, and the technical effect of improving the life of the equipment is achieved.

[0004] The utility model provides a fully enclosed air-cooled server, comprising a shell, wherein a closed accommodating space is formed in the shell, and a shell heat dissipation passage is arranged on the outer surface of the shell; a power module, wherein the power module is arranged on the shell and is used to provide power for gas convection; and a computing module, wherein the computing module is arranged in the closed accommodating space, and a certain height space is left between the computing module and the inner wall of the closed accommodating space to form an internal circulation air duct.

[0005] In a feasible design, the power module includes:

[0006] An internal circulation power component, which is disposed in the enclosed accommodation space and is used to provide circulation power for the gas in the internal circulation air duct;

[0007] The external power component is used to provide power for the airflow flowing through the heat dissipation passage of the shell.

[0008] In a feasible design, the housing includes:

[0009] A base, wherein the inner surface of the base is provided with heat dissipation fins to form a lower heat conduction air duct;

[0010] An upper cover, the inner surface of which is provided with heat dissipation fins to form an upper heat conduction air duct;

[0011] Among them, the base cooperates with the upper cover to form the enclosed accommodation space, and the inner surface of the enclosed accommodation space is provided with a mounting part, and the computing module is arranged in the enclosed accommodation space through the mounting part; the end surface after the base and the upper cover cooperate to form a half open space for setting the external power component.

[0012] In a feasible design, the computing module includes:

[0013] A computing chip, wherein a heat conducting member is disposed on the computing chip;

[0014] A peripheral chip, wherein a heat dissipation fin is provided on the peripheral chip;

[0015] An expansion board, wherein the expansion board is provided with heat dissipation fins;

[0016] The heat conducting component includes a heat conducting plate and a heat conducting copper tube. The heat conducting plate is bonded to the surface of the computing chip. One end of the heat conducting copper tube is connected to the heat conducting plate, and the other end of the heat conducting copper tube extends to bond to the inner surface of the upper cover.

[0017] In a feasible design, the outer surfaces of the base and the upper cover are provided with heat dissipation fins to form the shell heat dissipation passage, wherein the shell heat dissipation passage includes an upper cover heat dissipation passage and a bottom shell heat dissipation passage.

[0018] In a feasible design, the internal circulation air duct includes front-to-back circulation and left-to-right circulation.

[0019] In a feasible design, the directions of the heat dissipation passage of the shell include front-to-back blowing and left-to-right blowing.

[0020] In a feasible design, both ends of the upper cover and the base have arc-shaped protrusions, and the arc-shaped protrusions of the upper cover and the base cooperate with each other to form internal arc-shaped U-turns at both ends of the enclosed accommodation space.

[0021] In a feasible design, the internal circulation power component is set at a location including any one or more combinations of the front, middle, and rear of the computing module.

[0022] In a feasible design, the server includes:

[0023] A front panel, the front panel is arranged at one end of the housing, and an air inlet is arranged on the front panel;

[0024] A rear panel is arranged at the other end of the shell opposite to the front panel, and a plurality of interface openings are provided on the rear panel, and the computing module interface is connected with the outside world through the interface openings, wherein the computing module interface includes an IO interface and a power interface.

[0025] The fully enclosed air-cooled server provided by the utility model comprises: a shell, a closed accommodation space is formed in the shell, and a shell heat dissipation passage is arranged on the outer surface of the shell; a power module, the power module is arranged on the shell, and is used to provide power for gas convection; a computing module, the computing module is arranged in the closed accommodation space, and a certain height space is left between the computing module and the inner wall of the closed accommodation space to form an internal circulation air duct. Thus, better environmental adaptability and electromagnetic compatibility are achieved, water vapor, dust, impurities, etc. are prevented from entering, and the technical effect of improving the service life of the equipment is achieved.

[0026] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limiting of the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0028] Figure 1 A schematic diagram of a rear side view of a fully enclosed air-cooled server provided by the utility model;

[0029] Figure 2 This is a schematic diagram of the explosion of the fully enclosed air-cooled server provided by the utility model;

[0030] Figure 3 A schematic diagram of the external air duct of the fully enclosed air-cooled server provided by the utility model.

[0031] Explanation of the reference numerals: upper cover 11, upper cover heat dissipation passage 12, base 13, bottom shell heat dissipation passage 14, IO interface 15, power interface 16, rear panel 17, heat conduction plate 21, internal circulation power component 22, computing module 23, front panel 24, external power component 25, air inlet 31, base internal fins 32, upper cover internal fins 33, computing chip 34. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] In the description of the embodiments of the present utility model, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly defined. In the present utility model, unless otherwise clearly defined and defined, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0034] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] In the description of the present invention, it should be understood that the terms "inside", "outside", "upper", "bottom", "front", "back" and the like indicate directions or positional relationships (if any) based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] Embodiment 1

[0037] like Figure 1, Figure 2 , Figure 3 As shown, the utility model provides a fully enclosed air-cooled server, including:

[0038] A shell, wherein a closed accommodation space is formed in the shell, and a shell heat dissipation passage is provided on the outer surface of the shell;

[0039] A power module, which is disposed on the housing and is used to provide power for gas convection;

[0040] The computing module 23 is arranged in the enclosed accommodation space, and the computing module 23 leaves a certain height space on the inner wall of the enclosed accommodation space to form an internal circulation air duct.

[0041] In the utility model, the shell is a fully enclosed air-cooled server shell, which is used to provide a stable installation foundation for the air-cooled server and protect the air-cooled server inside. A closed accommodation space is formed inside the shell, providing a fully enclosed environment for the air-cooled server to prevent water vapor, dust, impurities, etc. from entering. The outer surface of the shell is provided with a shell heat dissipation channel for evacuating the heat generated by the server.

[0042] There are multiple areas in the shell, and multiple fixed positions on the shell for mounting and fixing the power module. The power module has corresponding matching structures and fixing devices for forming a connection pair with the shell and ensuring a stable connection. The power module is arranged on the shell, which provides the necessary power for the gas convection inside the server, ensuring that the heat can be effectively transferred and dissipated.

[0043] The computing module 23 is the core part of the fully enclosed air-cooled server, which is responsible for performing data processing, storage and other computing tasks. In the design of the fully enclosed air-cooled server, the computing module 23 is placed in the enclosed accommodation space provided by the shell, and a certain height space is left to form an internal circulation air duct, thereby optimizing the heat dissipation effect.

[0044] Furthermore, the power module includes:

[0045] An internal circulation power component 22, which is disposed in the enclosed accommodation space and is used to provide circulation power for the gas in the internal circulation air duct;

[0046] The external power component 25 is used to provide power for the airflow flowing through the heat dissipation passage of the shell.

[0047] In the present invention, the internal circulation power component 22 is directly disposed in the closed accommodation space provided by the shell, and is closely connected to the internal circulation air duct. It generates wind pressure and airflow to ensure that the gas forms an effective circulation around the computing module 23, thereby taking away the generated heat. The existence of the internal circulation power component 22 allows the gas to flow continuously in the internal circulation air duct, effectively convects and dissipates heat, and provides an important guarantee for the continuity and stability of the server.

[0048] The external power component 25 is closely connected to the heat dissipation passage of the shell. It provides power for the airflow flowing through the passage, effectively promoting the airflow to flow quickly in the heat dissipation passage, taking away the heat generated inside the server, optimizing the heat dissipation effect, ensuring the stability and reliability of the server when running at high load, and extending the service life of the server.

[0049] Furthermore, the housing comprises:

[0050] A base 13, wherein the inner surface of the base 13 is provided with heat dissipation fins 32 to form a lower heat conduction air duct;

[0051] An upper cover 11, wherein the inner surface of the upper cover 11 is provided with heat dissipation fins 33 to form an upper heat conduction air duct;

[0052] Among them, the base 13 cooperates with the upper cover 11 to form the enclosed accommodation space, and the inner surface of the enclosed accommodation space is provided with mounting parts, and the computing module 23 is arranged in the enclosed accommodation space through the mounting parts; the end surface of the base 13 after cooperating with the upper cover 11 forms a half open space for setting the external power component 25.

[0053] In the present invention, the inner surface of the base 13 is provided with base internal fins 32, which are a group of heat dissipation fins oriented in the same direction as the inner circulation air duct. These heat dissipation fins are tightly attached to the base, which not only increases the heat dissipation area and improves the heat dissipation efficiency, but also forms a lower heat conduction air duct. The lower heat conduction air duct, as a specific path for heat transfer, ensures that the heat can be effectively extracted from the base and flows along the air duct, thereby optimizing the heat dissipation effect.

[0054] The inner surface of the upper cover 11 is provided with heat dissipation fins 33, which are closely attached to the inner surface of the upper cover 11, which not only increases the heat dissipation area and improves the heat dissipation efficiency, but also forms an upper heat conduction air duct. The upper heat conduction air duct serves as a specific path for heat transfer, ensuring that the heat can be effectively conducted from the upper cover 11 and flows along the air duct, thereby further optimizing the heat dissipation effect.

[0055] The base 13 and the upper cover 11 are tightly connected by matching, and together form a closed accommodation space. This space is the working area of ​​key components inside the server, such as the computing module 23, ensuring that they operate in a stable and fully closed environment. The inner surface of the closed accommodation space is provided with mounting parts, which play a role of fixing and supporting. The computing module 23 is accurately placed in the closed accommodation space through these mounting parts, ensuring its stability and operational reliability. In addition, the end surface of the base 13 after matching with the upper cover 11 forms a half open space, and this open space is specifically used to set the external power component 25. This allows the external power component 25 to be easily installed and disassembled, and also provides it with sufficient space to perform its function. The external power component 25 further enhances the heat dissipation effect of the server by providing power for the airflow flowing through the heat dissipation path of the shell, ensuring the stable operation of the server.

[0056] Furthermore, the computing module 23 includes:

[0057] A computing chip 34, wherein a heat conducting member is disposed on the computing chip 34;

[0058] A peripheral chip, wherein a heat dissipation fin is provided on the peripheral chip;

[0059] An expansion board, wherein the expansion board is provided with heat dissipation fins;

[0060] The heat conducting component includes a heat conducting plate 21 and a heat conducting copper tube. The heat conducting plate 21 is bonded to the surface of the computing chip 34 . One end of the heat conducting copper tube is connected to the heat conducting plate 21 , and the other end of the heat conducting copper tube extends to bond to the inner surface of the upper cover 11 .

[0061] In the present invention, the computing chip 34 is the core processing unit of the server, and a heat conductor is arranged on it. The computing chip 34 is tightly attached to the heat conductor. The function of the heat conductor is to quickly and effectively conduct away the heat generated by the computing chip 34 during operation, so as to prevent the chip from being degraded or damaged due to overheating. Through the heat conductor, the heat of the computing chip 34 can be effectively dispersed and then discharged to maintain the stable operating temperature of the chip. This connection relationship and function ensure that the computing chip 34 can continuously and efficiently perform data processing tasks, providing a strong guarantee for the overall performance of the server.

[0062] The peripheral chips are provided with heat sink fins, and this arrangement forms a direct connection between the chip and the heat sink fins. The main function of the heat sink fins is to enhance the heat dissipation effect of the peripheral chips. Since the peripheral chips also generate heat during operation, if they are not dissipated in time, the chip performance will be degraded or damaged. By providing heat sink fins on the peripheral chips, the heat generated by the chips can be effectively transferred to the heat sink fins, and then the surface area of ​​the heat sink fins is increased, the heat dissipation efficiency is improved, and the heat is dissipated into the above-mentioned enclosed accommodation space.

[0063] The expansion board is provided with heat sink fins, which establish a direct connection between them. The existence of heat sink fins is to enhance the heat dissipation effect of the expansion board and ensure that it can work stably during operation. Through the heat sink fins, the heat generated by the expansion board can be quickly dissipated into the above-mentioned closed accommodation space to prevent performance degradation or damage caused by overheating. This design optimizes the heat dissipation performance of the server and improves its overall stability and reliability.

[0064] The heat conducting plate 21 fits tightly on the surface of the computing chip 34, ensuring that heat can be quickly transferred from the chip to the heat conducting plate. One end of the heat conducting copper tube is connected to the heat conducting plate 21, and the other end fits with the inner surface of the upper cover 11, forming an efficient heat transfer channel. In this way, the heat generated by the computing chip can be smoothly transferred to the upper cover through the heat conducting plate and the heat conducting copper tube, and then dissipated to the external environment through the heat dissipation structure of the upper cover. A variety of methods can be used to ensure tight and efficient heat conduction between the heat conducting plate 21 and the computing chip 34, the heat conducting copper tube and the heat conducting plate 21, and the heat conducting copper tube and the upper cover 11. Among them, brazing, interference fit or connection through a heat conducting medium are included. Brazing achieves a firm connection between components by melting low melting point metals, provides stable structural support, and ensures that heat is smoothly transferred between the heat conducting parts, the computing chip and the upper cover, thereby improving the heat dissipation performance of the server. Interference fit uses the size difference between the parts to achieve a tight fit by pressing in or thermal expansion and contraction to reduce thermal resistance. In addition, applying thermal conductive media such as thermal grease can fill the tiny gaps between the contact surfaces, further improving the efficiency of heat conduction. Through these connection methods, the thermal conductive parts form a complete heat dissipation system, which efficiently transfers and dissipates the heat generated by the computing chip, ensuring that the server can operate stably within the appropriate operating temperature range. This not only improves the heat dissipation performance of the server, but also enhances its stability and reliability, providing a strong guarantee for the long-term and efficient operation of the server.

[0065] Furthermore, the outer surfaces of the base 13 and the upper cover 11 are provided with heat dissipation fins to form the shell heat dissipation passage, wherein the shell heat dissipation passage includes an upper cover heat dissipation passage 12 and a bottom shell heat dissipation passage 14 .

[0066] In the utility model, the outer surfaces of the base 13 and the upper cover 11 are provided with heat dissipation fins. The heat dissipation fins are directly fixed on the outer surfaces of the base 13 and the upper cover 11. These fins are tightly connected to the base and the upper cover by one of a variety of connections, including welding, riveting or other mechanical connection methods. Such a connection method ensures the heat conduction efficiency between the heat dissipation fins and the base and the upper cover, so that the heat generated inside can be effectively transferred to the fins. The heat dissipation fins on the base 13 form a continuous heat dissipation surface, namely, the bottom shell heat dissipation passage 14. Similarly, the heat dissipation fins on the upper cover 11 also form a continuous heat dissipation surface, namely, the upper cover heat dissipation passage 12. Although these two heat dissipation passages are located on the base and the upper cover respectively, they constitute a complete heat dissipation system, namely, the shell heat dissipation passage, through the connection of the heat dissipation fins with the base and the upper cover. Among them, the setting of the heat dissipation fins and the shell heat dissipation passage is to enhance the heat dissipation effect of the server. By increasing the heat dissipation area and providing an effective heat dissipation path, as well as a specific shape and layout, the air flow is guided to enhance the convection effect. When the fan or other heat dissipation equipment is working, air will flow along the gaps between the heat dissipation fins, take away the heat on the fins, quickly dissipate the heat generated inside the server, and discharge it to the external environment through the shell heat dissipation path, thereby achieving effective heat dissipation. The upper cover heat dissipation path 12 and the bottom shell heat dissipation path 14 are responsible for dissipating the heat from the upper cover and the base part respectively, ensuring that the key components inside the server, such as computing chips, expansion boards, etc., can be maintained within a suitable operating temperature range.

[0067] Furthermore, the internal circulation air duct includes front-to-back circulation and left-to-right circulation.

[0068] In the utility model, the internal circulation air duct is composed of two parts: a front-to-back circulation air duct and a left-to-right circulation air duct. The front-to-back circulation air duct forms an effective air flow path between the front and rear of the server. This circulation method introduces cold air from the front of the server through a fan or other heat dissipation device, and after passing through the heating elements inside the server, the hot air is discharged from the rear, forming a front-to-back blowing. This circulation helps to ensure that the cooling air in the front of the server can flow evenly through each component, while discharging heat from the rear in a timely manner, thereby maintaining the stability of the internal temperature of the server. Secondly, the left-to-right circulation refers to the establishment of an air flow path between the left and right sides of the server. This circulation method helps to balance the temperature distribution on the left and right sides of the server, ensuring that heat does not accumulate excessively on one side. Through the left-to-right circulation, cold air can enter the server from one side, and be discharged from the other side after passing through the internal components, forming a left-to-right blowing, thereby achieving a more uniform and efficient heat dissipation effect. The front-to-back circulation channel and the left-to-right circulation channel are two different ways of the internal circulation air duct, each with its own specific application scenarios and advantages. In most cases, the server will choose which circulation method to use based on the layout of its internal components and the heat dissipation requirements. Front-to-back circulation is suitable for situations where the internal components of the server are arranged in the front-to-back direction. By introducing cold air at the front and exhausting hot air at the rear, the heat can be effectively discharged from the inside of the server to keep the operating temperature of the server stable. Side-to-side circulation is more suitable for situations where the internal components of the server are arranged in the left-to-right direction. By introducing cold air on one side of the server and exhausting hot air from the other side, the temperature distribution on the left and right sides of the server can be balanced to ensure that heat does not accumulate excessively on one side. In some special cases, such as when the layout of the internal components of the server is complex or the heat dissipation demand is high, the front-to-back circulation and the side-to-side circulation will be considered to form a more comprehensive and efficient heat dissipation network. However, this simultaneous use requires more precise duct design and control to ensure the reasonable distribution of airflow and maximize the heat dissipation effect.

[0069] Furthermore, the directions of the heat dissipation passages of the shell include front-to-back blowing and left-to-right blowing.

[0070] In the present invention, front-to-back blowing and left-to-right blowing are different directional manifestations of the heat dissipation path of the shell. The circulation mode and blowing direction of the internal circulation air duct are interrelated and influence each other. The front-to-back circulation is used in conjunction with the front-to-back blowing, and the left-to-right circulation is used in conjunction with the left-to-right blowing, so that the cold air can enter the external heat dissipation path according to a predetermined path, and is discharged smoothly after passing through the heating element, forming an effective heat dissipation cycle. However, this coordination is not static. According to the heat dissipation requirements, component layout and environmental conditions of the server, different circulation modes and blowing directions can be flexibly adjusted or combined to adapt to various complex heat dissipation scenarios. These two circulation modes and blowing directions work together to ensure that the server can operate stably and efficiently. By selecting a circulation mode and a corresponding blowing direction, cold air can be effectively introduced into the external heat dissipation path, heat can be taken away, and heat can be prevented from accumulating inside the server. This can not only maintain the stable operating temperature of the server, avoid performance degradation and failure risks, but also extend the service life of the server and improve the overall heat dissipation efficiency. In special cases, when the server faces higher cooling requirements or complex cooling environments, you can use both front-to-back circulation and left-to-right circulation, or combine front-to-back blowing with left-to-right blowing to form a more comprehensive and efficient cooling network. This flexible cooling strategy enables the server to better cope with various challenges and ensure excellent cooling performance under various conditions.

[0071] Furthermore, both ends of the upper cover 11 and the base 13 have arc-shaped protrusions, and the arc-shaped protrusions of the upper cover 11 and the base 13 cooperate with each other to form internal arc-shaped U-turns at both ends of the enclosed accommodation space.

[0072] In the utility model, both ends of the upper cover 11 and the base 13 are designed with arc-shaped protrusions. These arc-shaped protrusions cooperate with each other during assembly, that is, one arc-shaped protrusion of the upper cover 11 cooperates with one arc-shaped protrusion of the base 13, and the other arc-shaped protrusion is also the same. Through this cooperation, they together constitute the internal arc-shaped U-turns at both ends of the enclosed storage space. This not only enhances the stability of the connection between the upper cover 11 and the base 13, making the entire structure more stable and reliable, but also optimizes the structure of the enclosed storage space. The formation of the internal arc-shaped U-turn contributes to the smooth flow of airflow, reduces the obstruction and turbulence of airflow at both ends of the storage space, and thus improves the heat dissipation efficiency. In addition, the arc can also reduce structural stress to a certain extent and increase the durability of the entire structure.

[0073] Furthermore, the internal circulation power component 22 is disposed at a position including any one or more combinations of the front, middle, and rear of the computing module 23 .

[0074] In the utility model, the internal circulation power component 22 can be connected and combined with any one or more positions in the front, middle, and rear of the computing module 23, which can provide flexibility and diversity, so that the internal circulation power component 22 can be flexibly configured according to actual needs and the internal structure of the server. Among them, the setting position of the internal circulation power component 22 is crucial to the heat dissipation performance of the server. Placing the internal circulation power component 22 in the front of the computing module 23 can ensure that the heat in the front area is effectively dissipated and prevent heat from accumulating at the front end. Placing it in the middle can balance the heat dissipation requirements in the front and rear directions and ensure that the temperature distribution of the entire computing module 23 area is uniform. Placing it in the rear can enhance the heat dissipation effect of the rear area and prevent heat from accumulating at the rear end. By selecting different positions or a combination of multiple positions, it can be optimized according to the heat dissipation requirements and spatial layout of the server to achieve a more efficient heat dissipation effect.

[0075] Furthermore, the server comprises:

[0076] A front panel 24, wherein the front panel 24 is disposed at one end of the housing and an air inlet 31 is disposed on the front panel 24;

[0077] The rear panel 17 is arranged at the other end of the shell opposite to the front panel 24. The rear panel 17 has multiple interface openings, and the computing module 23 interface is connected to the outside through the interface openings, wherein the computing module 23 interface includes an IO interface 15 and a power interface 16.

[0078] In the utility model, the front panel 24 is arranged at one end of the shell, and the front panel 24 is fixedly connected to the shell. The front panel 24 and the shell are fixedly connected by fasteners or connection methods, thereby ensuring the stability and integrity of the structure. Among them, the fasteners or connection methods include riveting, brazing, expansion connection, etc. At the same time, the close combination of the front panel 24 and the shell also helps to improve the overall sealing, preventing dust and debris from entering the external power component 25 and affecting the operation stability. The front panel is also provided with an air inlet 31 to allow external air to enter the external heat dissipation path and participate in the heat dissipation cycle. When the server is running, the heating element will generate heat. If there is no appropriate heat dissipation measure, this heat will cause the server temperature to rise and even cause a malfunction. The air inlet 31 allows external cold air to enter the external heat dissipation path, and after passing through the heating element, the heat is taken away and discharged, thereby maintaining the suitability of the internal temperature of the server. In addition, the air inlet 31 can also be adjusted in size and position according to the heat dissipation requirements to optimize the heat dissipation effect. For example, the air inlet can be set close to the component with a large heat generation so that cold air can be introduced more effectively for heat dissipation.

[0079] The rear panel 17 is arranged at the other end of the shell, opposite to the front panel 24, and a fixed connection is formed between the rear panel and the shell by fasteners or connection methods, thereby ensuring the stability and integrity of the structure. As an important component of the server, the rear panel 17 is closely combined with the shell to form the external structure of the server. A plurality of interface openings are arranged on the rear panel 17, which allow the computing module 23 interface to communicate with the outside world. The computing module 23 interface includes an IO interface 15 and a power interface 16, which are connected to an external device or power supply through the interface openings. The IO interface 15 is used for data transmission and signal interaction, so that the server can communicate and interact with external devices. The power interface 16 is used to provide power supply for the server to ensure the normal operation of the server. Through the interface openings on the rear panel 17 and the computing module 23 interface, the server can connect and interact with the outside world to realize data transmission, signal reception and power supply. The server is equipped with the ability to communicate and cooperate with external devices, thus expanding the functions and application scope of the server.

[0080] In summary, through the shell, a closed accommodation space is formed in the shell, and the outer surface of the shell is provided with a shell heat dissipation path; the power module is provided on the shell to provide power for gas convection; the computing module 23 is provided in the closed accommodation space, and the computing module 23 leaves a certain height space on the inner wall of the closed accommodation space to form an internal circulation air duct. Thus, better environmental adaptability and electromagnetic compatibility are achieved, water vapor, dust, impurities, etc. are prevented from entering, and the technical effect of improving the life of the equipment is achieved.

[0081] Although the utility model has been described in conjunction with specific features and embodiments thereof, it is obvious that various modifications and combinations may be made thereto without departing from the spirit and scope of the utility model. Accordingly, this specification and the accompanying drawings are merely exemplary illustrations of the utility model as defined therein and are deemed to have covered any and all modifications, variations, combinations or equivalents within the scope of the utility model. Obviously, those skilled in the art may make various modifications and variations to the utility model without departing from the scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the utility model and its equivalents, the utility model is intended to include these modifications and variations.

Claims

1. Fully enclosed air-cooled server, characterized by: include: A shell, wherein a closed accommodation space is formed in the shell, and a shell heat dissipation passage is provided on the outer surface of the shell; A power module, which is disposed on the housing and is used to provide power for gas convection; A computing module is arranged in the enclosed accommodation space, and a certain height space is left between the computing module and the inner wall of the enclosed accommodation space to form an internal circulation air duct.

2. The server according to claim 1, characterized in that The power module comprises: An internal circulation power component, which is disposed in the enclosed accommodation space and is used to provide circulation power for the gas in the internal circulation air duct; The external power component is used to provide power for the airflow flowing through the heat dissipation passage of the shell.

3. The server according to claim 2, characterized in that The housing comprises: A base, wherein the inner surface of the base is provided with heat dissipation fins to form a lower heat conduction air duct; An upper cover, the inner surface of which is provided with heat dissipation fins to form an upper heat conduction air duct; Among them, the base cooperates with the upper cover to form the enclosed accommodation space, and the inner surface of the enclosed accommodation space is provided with a mounting part, and the computing module is arranged in the enclosed accommodation space through the mounting part; the end surface after the base and the upper cover cooperate to form a half open space for setting the external power component.

4. The server according to claim 3, characterized in that The computing module includes: A computing chip, wherein a heat conducting member is provided on the computing chip; A peripheral chip, wherein a heat dissipation fin is provided on the peripheral chip; An expansion board, wherein the expansion board is provided with heat dissipation fins; The heat conducting component includes a heat conducting plate and a heat conducting copper tube. The heat conducting plate is bonded to the surface of the computing chip. One end of the heat conducting copper tube is connected to the heat conducting plate, and the other end of the heat conducting copper tube extends to bond to the inner surface of the upper cover.

5. The server according to claim 3, characterized in that The outer surfaces of the base and the upper cover are provided with heat dissipation fins to form the shell heat dissipation passage, wherein the shell heat dissipation passage includes an upper cover heat dissipation passage and a bottom shell heat dissipation passage.

6. The server according to claim 1, wherein: The internal circulation air duct includes front-to-back circulation and left-to-right circulation.

7. The server according to claim 1, wherein: The heat dissipation paths of the shell include front-to-back blowing and left-to-right blowing.

8. The server according to claim 3, characterized in that The upper cover and the base have arc-shaped protrusions at both ends, and the arc-shaped protrusions of the upper cover and the base cooperate with each other to form internal arc-shaped U-turns at both ends of the enclosed accommodation space.

9. The server according to claim 2, wherein: The internal circulation power component setting position includes any one or more combinations of the front, middle and rear of the computing module.

10. The server according to claim 1, wherein: include: A front panel, the front panel is arranged at one end of the shell, and an air inlet is arranged on the front panel; A rear panel is arranged at the other end of the shell opposite to the front panel, and a plurality of interface openings are provided on the rear panel, and the computing module interface is connected with the outside world through the interface openings, wherein the computing module interface includes an IO interface and a power interface.

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