CPU radiator

By designing a CPU radiator that combines a retaining frame, a square frame, an exhaust fan, an intake fan, a copper tube and a heat dissipation fin, the problem of poor heat dissipation effect of traditional radiators in high temperature environments is solved, and a more efficient CPU heat dissipation effect is achieved.

CN222672278UActive Publication Date: 2025-03-25SHENZHEN BOEN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421481303.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-25
Publication Date
2025-03-25
Estimated Expiration
2034-06-25

AI Technical Summary

Technical Problem

In high-temperature environments or when the CPU load is heavy, the heat dissipation effect of traditional CPUs is not satisfactory and cannot meet the heat dissipation needs of high-performance CPUs.

Method used

A CPU radiator is designed, using a combination of a retaining frame, a square frame, an exhaust fan, an intake fan, a copper tube and a heat dissipation fin, which improves the heat dissipation efficiency by increasing the heat dissipation area and air flow rate.

Benefits of technology

By increasing the heat dissipation area and air flow rate, the CPU heat dissipation efficiency is significantly improved, the CPU temperature is reduced, and the CPU service life is extended.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a central processing unit (CPU) radiator, which relates to the technical field of CPU radiators and comprises a retention frame, a limit frame is integrally formed on the outer wall of the retention frame, a square frame is mounted in the limit frame, a rotatable exhaust fan is mounted on one side of the square frame and is positioned on the front side of the retention frame, and an exhaust fan is mounted on the other side of the square frame. An air inlet fan is arranged on the rear side of the retention frame, a mounting bottom block is arranged below the air inlet fan, and a copper pipe is fixedly connected to the top end of the mounting bottom block; according to the heat dissipation device, the heat dissipation fins are arranged, the exhaust fan and the air inlet fan are arranged on the two sides of the heat dissipation fins respectively, heat of a CPU can be transmitted into the heat dissipation fins in the operation process of the heat dissipation device, and therefore the heat dissipation area of the heat dissipation device is increased; the flow speed of air in the heat dissipation fins is increased, and the heat dissipation efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of CPU radiators, in particular to a CPU radiator. Background Art

[0002] With the rapid development of information technology, the performance of computers has been significantly improved, especially the integration and computing speed of the central processing unit (CPU). However, a high-performance CPU will generate a lot of heat during operation. If the heat cannot be dissipated in time and effectively, the CPU temperature will be too high, which will affect its performance and stability, and may even cause hardware damage.

[0003] Although the traditional radiator has a simple structure and low cost, its heat dissipation effect is often unsatisfactory in high temperature environments or when the CPU load is heavy. Especially in the context of rapid technological development, the CPU is developing faster and faster, and the requirements for radiators are getting higher and higher. As a result, relevant users need to install multiple auxiliary fans inside the chassis to form an entire air duct with the radiator to achieve efficient heat dissipation of the CPU. However, even if the air duct is formed, it can only reduce the temperature inside the chassis, and the auxiliary effect on CPU heat dissipation is limited.

[0004] In view of this, a CPU heat sink is provided to overcome the above-mentioned defects. Utility Model Content

[0005] The purpose of the utility model is to provide a CPU radiator to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the utility model provides a CPU radiator, including a retaining frame, a limiting frame integrally formed on the outer wall of the retaining frame, a square frame installed inside the limiting frame, a rotatable exhaust fan installed on one side of the square frame, the exhaust fan is located on the front side of the retaining frame, an intake fan is arranged on the rear side of the retaining frame, a mounting base block is arranged below the intake fan, and a copper pipe is fixedly connected to the top of the mounting base block.

[0007] Furthermore, the specific number of the copper tubes is four, and heat sink fins are arranged above the copper tubes, and the four copper tubes are all inside the heat sink fins.

[0008] Furthermore, a mounting block is arranged above the mounting base block, a plurality of partition plates are fixedly mounted on one side of the mounting block, and the heat dissipation fins are mounted between the plurality of partition plates.

[0009] Furthermore, a buckle is fixedly mounted on the outer wall of the partition plate, a through hole is opened on the outer wall of the buckle, and a retaining hole is opened through the outer wall of the square frame, and the retaining hole is adapted to the through hole.

[0010] Furthermore, a wire management groove is provided on the outer wall of the square frame, and a square block is installed inside the wire management groove.

[0011] Furthermore, a contact block is fixedly installed below the mounting base block, heat dissipation silicone grease is bonded to the bottom surface of the contact block, and plastic sealing paper is bonded to the outer wall of the heat dissipation silicone grease in an initial state.

[0012] Furthermore, the specific number of the retaining frames is two, the two retaining frames are attached to the outer wall of the partition plate, and a limiting piece is integrally formed on the inner wall of the retaining frame, and a circular hole matching the retaining hole is also opened on the surface of the limiting piece.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] By setting up heat sink fins and respectively setting up exhaust fans and intake fans on both sides of the heat sink fins, the heat of the CPU can be transferred to the heat sink fins during operation of the device, thereby increasing the heat dissipation area of ​​the device. The exhaust fan and the intake fan form an air duct on the device body, which speeds up the flow rate of air in the heat sink fins and increases the heat dissipation efficiency.

[0015] By opening a through hole on the outer wall of the fastener, and opening a circular hole on the surface of the limiting plate that matches the retaining hole, the retaining hole is configured to match the through hole and the circular hole, so that when the device needs to be disassembled or installed, it can be completed by tightening the bolt, reducing the difficulty of device inspection and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the front side of the utility model;

[0017] Figure 2 It is a schematic diagram of the three-dimensional structure of the rear side of the utility model;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the bottom of the utility model;

[0019] Figure 4 It is a schematic diagram of the internal structure of the utility model.

[0020] In the figure: 1. Retaining frame; 2. Limiting frame; 3. Mounting base block; 4. Contact block; 5. Copper tube; 6. Square frame; 7. Wire management slot; 8. Retaining hole; 9. Exhaust fan; 10. Intake fan; 11. Air outlet mark; 12. Heat sink fins; 13. Fastener; 14. Mounting block; 15. Partition plate; 16. Heat dissipation silicone grease. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1

[0023] See also Figure 1-4 A CPU radiator comprises a retaining frame 1, a limiting frame 2 is integrally formed on the outer wall of the retaining frame 1, a square frame 6 is installed inside the limiting frame 2, a rotatable exhaust fan 9 is installed on one side of the square frame 6, the exhaust fan 9 is located at the front side of the retaining frame 1, an intake fan 10 is arranged on the rear side of the retaining frame 1, a mounting bottom block 3 is arranged below the intake fan 10, and a copper tube 5 is fixedly connected to the top of the mounting bottom block 3.

[0024] For further information, see Figure 4 The specific number of the copper tubes 5 is four. A heat sink fin 12 is arranged above the copper tube 5. The four copper tubes 5 are all inside the heat sink fin 12. A mounting block 14 is arranged above the mounting base block 3. A plurality of partition plates 15 are fixedly mounted on one side of the mounting block 14. The heat sink fins 12 are mounted between the plurality of partition plates 15. By arranging the mounting block 14 and the partition plates 15, the heat sink fins 12 can be stably mounted while not being easily affected by the external environment, and can maintain their own shape for a long time. The presence of the heat sink fins 12 enables the device to transfer the heat of the copper tube 5 to the heat sink fins 12 during use, so that the heat can be discharged more quickly.

[0025] For further information, see Figure 3 A contact block 4 is fixedly installed below the mounting base block 3, and a heat dissipation silicone grease 16 is bonded to the bottom surface of the contact block 4. In the initial state, a plastic sealing paper is bonded to the outer wall of the heat dissipation silicone grease 16. By providing the heat dissipation silicone grease 16 and bonding the plastic sealing paper below the heat dissipation silicone grease 16, the device does not need to perform unnecessary operations and can also fill the small gap between the contact block 4 and the heat source, reduce the contact thermal resistance, open up the entire heat flow channel, thereby ensuring that the heat can be efficiently transferred to the contact block 4 and reduce the working temperature of the heat source.

[0026] In addition, a wire management groove 7 is provided on the outer wall of the square frame 6 , and a square block is installed inside the wire management groove 7 . The wire management groove 7 facilitates the user to put the wire body inside, and the square block prevents the wire body from easily falling out of the wire management groove 7 .

[0027] During the specific implementation, the user first tears off the plastic wrapping paper at the bottom of the intake fan 10, and then installs the device above the CPU. During the operation of the device, the heat generated by the CPU will be transmitted to the copper tube 5 by the contact block 4, and then transmitted to the heat dissipation fins 12 at the center of the device by the four copper tubes 5. At this time, the exhaust fan 9 and the intake fan 10 rotating at the same time form an air duct on the device body. The air enters from the intake fan 10 and is then discharged from the exhaust fan 9. During the flow process, the heat on the surface of the heat dissipation fins 12 is taken away, thereby achieving a cooling effect on the CPU. In addition, due to the simultaneous action of the intake fan 10 and the exhaust fan 9, the flow rate of the air at the heat dissipation fins 12 is increased, so that the heat dissipation effect of the device is better.

[0028] By providing a heat sink fin 12 and arranging an exhaust fan 9 and an intake fan 10 on both sides of the heat sink fin 12, the heat of the CPU can be transferred to the heat sink fin 12 during the operation of the device, thereby increasing the heat dissipation area of ​​the device, and the exhaust fan 9 and the intake fan 10 form an air duct on the device body, which speeds up the flow rate of the air in the heat sink fin 12 and increases the heat dissipation efficiency.

[0029] In addition, an air outlet mark 11 is provided at the edge of the square frame 6. The existence of the air outlet mark 11 can help the user find the air outlet direction during the installation of the device to avoid incorrect installation.

[0030] Embodiment 2

[0031] Based on Example 1, please refer to Figure 1-4 A CPU radiator, wherein a buckle 13 is fixedly installed on the outer wall of a partition plate 15, a through hole is opened on the outer wall of the buckle 13, a retaining hole 8 is opened through the outer wall of a square frame 6, the retaining hole 8 is adapted to the through hole, the specific number of retaining frames 1 is two, the two retaining frames 1 are attached to the outer wall of the partition plate 15, a limiting piece is integrally formed on the inner wall of the retaining frame 1, and a circular hole adapted to the retaining hole 8 is also opened on the surface of the limiting piece.

[0032] During specific implementation, when the user needs to install or disassemble the device for maintenance, the user can directly tighten the bolts in the retaining holes 8. When all the bolts in the retaining holes 8 are removed, the user can remove the exhaust fan 9 and the retaining frame 1 in turn. When the exhaust fan 9 and the retaining frame 1 are removed, the heat dissipation fins 12 and the partition plate 15 will be directly exposed to the user. At this time, the device can be directly maintained. When installation is required, it is only necessary to align the circular hole of the limit plate on the inner wall of the retaining frame 1 with the through hole and the retaining hole 8, and then screw in the bolts again to complete the installation of the device.

[0033] By opening a through hole on the outer wall of the fastener 13, and opening a circular hole on the surface of the limiting plate that matches the retaining hole 8, the retaining hole 8 is configured to match the through hole and the circular hole, so that when the device needs to be disassembled or installed, it can be completed by tightening the bolts, reducing the difficulty of inspection and maintenance of the device.

[0034] Working principle: The user first tears off the plastic wrapping paper at the bottom of the intake fan 10, and then installs the device above the CPU. During the operation of the device, the heat generated by the CPU will be transmitted to the copper tube 5 by the contact block 4, and then transmitted to the heat sink fins 12 at the center of the device by the four copper tubes 5. At this time, the exhaust fan 9 and the intake fan 10 rotating at the same time form an air duct on the device body. The air enters from the intake fan 10 and is then discharged from the exhaust fan 9. During the flow, the heat on the surface of the heat sink fins 12 is taken away, thereby achieving a cooling effect on the CPU. In addition, due to the simultaneous action of the intake fan 10 and the exhaust fan 9, the air flow rate at the heat sink fins 12 is increased, making the heat dissipation effect of the device better.

[0035] When the user needs to install or disassemble the device for maintenance, the user can directly tighten the bolts in the retaining holes 8. When all the bolts in the retaining holes 8 are removed, the user can remove the exhaust fan 9 and the retaining frame 1 in turn. When the exhaust fan 9 and the retaining frame 1 are removed, the heat dissipation fins 12 and the partition plate 15 will be directly exposed to the user. At this time, the device can be directly maintained. When installation is required, it is only necessary to align the circular hole of the limit plate on the inner wall of the retaining frame 1 with the through hole and the retaining hole 8, and then screw in the bolts again to complete the installation of the device.

[0036] By providing a heat sink fin 12 and arranging an exhaust fan 9 and an intake fan 10 on both sides of the heat sink fin 12, the heat of the CPU can be transferred to the heat sink fin 12 during the operation of the device, thereby increasing the heat dissipation area of ​​the device, and the exhaust fan 9 and the intake fan 10 form an air duct on the device body, which speeds up the flow rate of the air in the heat sink fin 12 and increases the heat dissipation efficiency.

[0037] By opening a through hole on the outer wall of the fastener 13, and opening a circular hole on the surface of the limiting plate that matches the retaining hole 8, the retaining hole 8 is configured to match the through hole and the circular hole, so that when the device needs to be disassembled or installed, it can be completed by tightening the bolts, reducing the difficulty of inspection and maintenance of the device.

Claims

1. A CPU heat sink, comprising a retaining frame (1), characterized in that: A limiting frame (2) is integrally formed on the outer wall of the retaining frame (1); a square frame (6) is installed inside the limiting frame (2); a rotatable exhaust fan (9) is installed on one side of the square frame (6); the exhaust fan (9) is located at the front side of the retaining frame (1); an air intake fan (10) is arranged on the rear side of the retaining frame (1); a mounting base block (3) is arranged below the air intake fan (10); and a copper tube (5) is fixedly connected to the top of the mounting base block (3).

2. A CPU radiator as claimed in claim 1, characterized in that: The specific number of the copper tubes (5) is four. A heat dissipation fin (12) is arranged above the copper tubes (5), and the four copper tubes (5) are all located inside the heat dissipation fin (12).

3. A CPU radiator as claimed in claim 2, characterized in that: A mounting block (14) is arranged above the mounting base block (3), a plurality of partition plates (15) are fixedly mounted on one side of the mounting block (14), and the heat dissipation fins (12) are mounted between the plurality of partition plates (15).

4. A CPU radiator as claimed in claim 3, characterized in that: A buckle (13) is fixedly mounted on the outer wall of the partition plate (15), a through hole is opened on the outer wall of the buckle (13), and a retaining hole (8) is opened through the outer wall of the square frame (6), and the retaining hole (8) is adapted to the through hole.

5. A CPU radiator as claimed in claim 1, characterized in that: A wire management groove (7) is provided on the outer wall of the square frame (6), and a square block is installed inside the wire management groove (7).

6. A CPU radiator as claimed in claim 1, characterized in that: A contact block (4) is fixedly mounted below the mounting base block (3), a heat dissipation silicone grease (16) is bonded to the bottom surface of the contact block (4), and a plastic sealing paper is bonded to the outer wall of the heat dissipation silicone grease (16) in an initial state.

7. A CPU radiator as claimed in claim 4, characterized in that: The specific number of the retaining frames (1) is two. The two retaining frames (1) are attached to the outer wall of the partition plate (15). A limiting plate is integrally formed on the inner wall of the retaining frame (1), and a circular hole matching the retaining hole (8) is also provided on the surface of the limiting plate.