Display device and vehicle

Abstract

The utility model provides a display device and a vehicle, and the display device comprises a display module which comprises a circuit board, a cover plate and a display panel, the display panel is provided with a display side, the cover plate is arranged on the display side, the circuit board is arranged on the side, away from the cover plate, of the display panel, and the circuit board is electrically connected to the display panel; the heat dissipation structure comprises a first heat dissipation part and a second heat dissipation part, the first heat dissipation part is arranged in the first area of the circuit board, a containing cavity and a heat conduction wall are formed in the first heat dissipation part, a heating device in the first area is contained in the containing cavity, the heat conduction wall is connected to the heating device in the first area, and the second heat dissipation part is attached to the second area of the circuit board; the second heat dissipation part is connected with the first heat dissipation part; wherein when the display device is in a running state, the heating value of the first area is greater than that of the second area. According to the display device provided by the embodiment of the invention, the heat dissipation efficiency of the circuit board can be improved, and safe and stable operation of the display device is guaranteed.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display equipment, and in particular to a display device and a vehicle. Background Art

[0002] With the continuous development of display technology, the display specifications of display devices in various industries are also increasing. However, the performance of display devices is often related to their power consumption. Devices with stronger display performance usually have higher power consumption, which leads to serious heating during operation of the device, which is not conducive to the safe and stable operation of the product and limits the practical application of the product. Utility Model Content

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] To this end, a first aspect of the present disclosure provides a display device.

[0005] A second aspect of the present disclosure provides a vehicle.

[0006] In view of this, according to a first aspect of an embodiment of the present disclosure, a display device is provided, comprising:

[0007] The display module comprises a circuit board, a cover plate and a display panel, wherein the display panel has a display side, the cover plate is arranged on the display side, the circuit board is arranged on a side of the display panel away from the cover plate, and the circuit board is electrically connected to the display panel;

[0008] The heat dissipation structure includes a first heat dissipation portion and a second heat dissipation portion, wherein the first heat dissipation portion is arranged in a first area of ​​the circuit board, the first heat dissipation portion is formed with a receiving cavity and a heat-conducting wall, the receiving cavity receives a heating device in the first area, the heat-conducting wall is connected to the heating device in the first area, the second heat dissipation portion is attached to the second area of ​​the circuit board, and the second heat dissipation portion is connected to the first heat dissipation portion;

[0009] When the display device is in operation, the heat generated by the first area is greater than the heat generated by the second area.

[0010] In a feasible implementation manner, the first heat dissipation unit includes:

[0011] A heat dissipation cover is formed with a receiving cavity;

[0012] A heat conducting member is disposed on the heat dissipation cover and is located in the accommodating cavity, and the heat conducting member is formed with a heat conducting wall;

[0013] The heat dissipation cover is made of metal material, and the hardness of the heat conducting member is smaller than the hardness of the heat dissipation cover.

[0014] In a feasible implementation manner, the heat conducting element is made of silicone material.

[0015] In a feasible implementation manner, the heat conducting member is sticky, the heat conducting member is bonded to the heat dissipation cover, and the heat conducting wall is used to bond to the heating device in the first area.

[0016] In a feasible implementation manner, the display device further includes:

[0017] The casing is formed with a connecting installation space and ventilation holes, and the circuit board and the heat dissipation structure are both arranged in the installation space.

[0018] In a feasible implementation manner, there are multiple ventilation holes, and at least part of the multiple ventilation holes are arranged corresponding to the first heat dissipation portion.

[0019] In a feasible implementation manner, the first heat dissipation unit further includes:

[0020] An elastic member, one end of the elastic member is connected to the heat dissipation cover, and the other end of the elastic member is connected to the housing;

[0021] Wherein, the elastic member is made of heat-conducting material.

[0022] In a feasible implementation manner, the elastic member includes:

[0023] A wave spring, one end of the wave spring is connected to the heat dissipation cover, and the other end is connected to the casing.

[0024] In a feasible implementation manner, the first heat dissipation unit further includes:

[0025] A plurality of protrusions are arranged on the heat dissipation cover and outside the accommodating cavity, and the protrusions are made of heat-conducting material.

[0026] In a feasible embodiment, at least part of the outer wall of the heat dissipation cover is an oxidized wall that has been oxidized; or

[0027] At least part of the outer wall of the heat dissipation cover is provided with a sandblasting film layer; or

[0028] At least a portion of the outer wall of the heat dissipation cover is plated with a heat dissipation coating.

[0029] In a feasible implementation manner, the second heat dissipation unit includes:

[0030] Adhesive layer;

[0031] The heat dissipation layer is bonded to one side of the adhesive layer, and the side of the adhesive layer facing away from the heat dissipation layer is bonded to the first heat dissipation portion and the second area;

[0032] The heat dissipation layer covers at least part of the heat generating components in the second area.

[0033] In a feasible implementation manner, the adhesive layer is made of thermal conductive adhesive or PET (polyethylene terephthalate) material.

[0034] In a feasible implementation manner, the heat dissipation layer includes a graphite layer and / or a metal layer.

[0035] According to a second aspect of an embodiment of the present disclosure, a vehicle is provided, comprising:

[0036] A display device as set forth in any one of the first aspects above.

[0037] Compared with the prior art, the present disclosure includes at least the following beneficial effects: the display device provided by the embodiment of the present disclosure includes a display module and a heat dissipation structure, the heat dissipation structure includes a first heat dissipation portion arranged in a first area of ​​a circuit board and a second heat dissipation portion arranged in a second area of ​​the circuit board, the heat generated by the first area during operation is higher than the heat generated by the second area during operation, wherein the first heat dissipation portion is formed with a accommodating cavity and a heat-conducting wall, the accommodating cavity and the heat-conducting wall respectively accommodate and connect the heat-generating device in the first area, so that when the display device is running, the first heat dissipation portion can, on the one hand, absorb the heat of the heat-generating device in the first area through the heat-conducting wall and transfer it to the outside, and on the other hand, can also By utilizing the accommodation cavity to cover the heating device in the first area, the heat transfer area between the heating device in the first area is increased, and the heat dissipation efficiency of the heating device in the first area is improved. The aforementioned second heat dissipation portion can be attached to the aforementioned second area, so as to exchange heat with the second area to improve the heat dissipation efficiency of the second area, and the second heat dissipation portion is connected to the first heat dissipation portion, so that heat exchange can also be performed between the first heat dissipation portion and the second heat dissipation portion, which is beneficial to improving the overall heat dissipation efficiency of the circuit board and ensuring the operating performance of the circuit board, can reduce the temperature rise of the display device, and can specifically improve the heat dissipation effect of the area of ​​the circuit board with higher heat generation, providing reliable guarantee for the safe and stable operation of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the exemplary embodiments below. The accompanying drawings are only for the purpose of illustrating exemplary embodiments and are not to be considered as limiting the present disclosure. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0039] Figure 1 A schematic structural diagram of a heat dissipation structure of an embodiment provided by the present disclosure;

[0040] Figure 2 A schematic structural diagram of a heat dissipation structure of another embodiment provided by the present disclosure;

[0041] Figure 3 A schematic structural diagram of a heat dissipation structure of another embodiment provided by the present disclosure;

[0042] Figure 4A schematic structural diagram of a heat dissipation structure of another embodiment provided by the present disclosure;

[0043] Figure 5 A schematic structural diagram of an elastic member according to another embodiment of the present disclosure;

[0044] Figure 6 A schematic structural diagram of a display device at a first viewing angle according to an embodiment of the present disclosure;

[0045] Figure 7 A schematic structural diagram of a display device according to an embodiment of the present disclosure at a second viewing angle;

[0046] Figure 8 A schematic structural diagram of a display device according to another embodiment of the present disclosure;

[0047] Fig. 9 A schematic structural diagram of a display device according to another embodiment of the present disclosure.

[0048] in, Figures 1 to 9 The corresponding relationship between the reference numerals and the component names is as follows:

[0049] 100 heat dissipation structure; 200 display module; 300 housing;

[0050] 110 first heat dissipation unit; 120 second heat dissipation unit;

[0051] 210 circuit board; 220 cover plate; 230 display panel; 240 support member;

[0052] 111 heat dissipation cover; 112 heat conducting member; 113 elastic member; 115 protruding member; 117 sandblasting film layer;

[0053] 1131 wave spring;

[0054] 301 installation space;

[0055] 1101 accommodating cavity; 1102 heat conducting wall;

[0056] 2101first area; 2102second area. DETAILED DESCRIPTION

[0057] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0058] like Figures 1 to 9As shown, according to the first aspect of the embodiment of the present disclosure, a display device is proposed, including: a display module 200, including a circuit board 210, a cover plate 220 and a display panel 230, the display panel 230 has a display side, the cover plate 220 is arranged on the display side, the circuit board 210 is arranged on a side of the display panel 230 away from the cover plate 220, and the circuit board 210 is electrically connected to the display panel 230; a heat dissipation structure 100, including a first heat dissipation portion 110 and a second heat dissipation portion 120, the first heat dissipation portion 110 is arranged on the circuit board 210 The first area 2101 of the circuit board 210 is formed with a first heat dissipation portion 110 having a receiving cavity 1101 and a heat-conducting wall 1102. The receiving cavity 1101 receives the heating device of the first area 2101. The heat-conducting wall 1102 is connected to the heating device of the first area 2101. The second heat dissipation portion 120 is attached to the second area 2102 of the circuit board 210. The second heat dissipation portion 120 is connected to the first heat dissipation portion 110. When the display device is in operation, the heat generated by the first area 2101 is greater than the heat generated by the second area 2102.

[0059] The display device provided in the embodiment of the present disclosure can be used to display image information. In practical applications, the display device can be used as but not limited to mobile phones, laptop computers, televisions, displays of vehicles and other devices. The vehicles can be but not limited to vehicles, ships and the like.

[0060] The display device provided by the embodiment of the present disclosure includes a display module 200 and a heat dissipation structure 100, wherein the display module 200 includes a circuit board 210, a cover plate 220 and a display panel 230 arranged in a stacked manner, the display panel 230 is located between the circuit board 210 and the cover plate 220, and the cover plate 220 is located on the display side of the display panel 230, thereby improving the structural compactness of the display module 200, preventing the circuit board 210 from blocking the display side of the display panel 230, and facilitating the display module 200 to display image information; at the same time, the circuit board 210 and the display panel 230 are electrically connected, so that signals can be transmitted between the circuit board 210 and the display panel 230.

[0061] The above-mentioned heat dissipation structure 100 includes a first heat dissipation portion 110 arranged in a first area 2101 of the circuit board 210 and a second heat dissipation portion 120 arranged in a second area 2102 of the circuit board 210. The heat generated by the above-mentioned first area 2101 during operation is higher than the heat generated by the above-mentioned second area 2102 during operation, that is, the above-mentioned first area 2101 can be a high-temperature area or a heat-concentrated area when the circuit board 210 is in operation, and the above-mentioned second area 2102 can be a low-temperature area or a low-heat area when the circuit board 210 is in operation.

[0062] The first heat dissipation part 110 is formed with a receiving cavity 1101 and a heat-conducting wall 1102. The receiving cavity 1101 and the heat-conducting wall 1102 respectively receive and connect the heating device in the first area 2101. Thus, when the display device is running, the first heat dissipation part 110 can absorb the heat of the heating device in the first area 2101 through the heat-conducting wall 1102 and transfer it to the outside. On the other hand, the first heat dissipation part 110 can also cover the heating device in the first area 2101 with the receiving cavity 1101, thereby increasing the heat transfer area between the heating device in the first area 2101 and improving the heat dissipation efficiency of the heating device in the first area 2101. 0 can be attached to the aforementioned second area 2102, so that heat can be exchanged with the second area 2102 by covering the second area 2102, which can increase the heat dissipation area and heat dissipation efficiency of the second area 2102, and the second heat dissipation portion 120 is connected to the first heat dissipation portion 110, so that heat can be exchanged between the first heat dissipation portion 110 and the second heat dissipation portion 120, which is beneficial to improve the overall heat dissipation efficiency of the circuit board 210 and ensure the operating performance of the circuit board 210, can reduce the temperature rise of the display device, and can specifically improve the heat dissipation effect of the area of ​​the circuit board 210 with higher heat generation, providing reliable guarantee for the safe and stable operation of the display device.

[0063] It is understandable that the circuit board 210 usually has many electronic components. The aforementioned electronic components will generate heat when powered on, and the heat generation is related to their power consumption. Since different types of electronic components have different power consumption during operation, electronic components with higher power consumption will cause the area of ​​the circuit board 210 where they are located to generate higher heat during operation. Since different components are arranged at different positions on the circuit board 210, there will be a first area 2101 with higher heat generation and a second area 2102 with lower heat generation on the circuit board 210.

[0064] It can be understood that the aforementioned display module 200 can be but not limited to an OLED (Organic Light-Emitting Diode; organic light-emitting diode) module, an LED (Light-Emitting Diode; light-emitting diode) module, an LCD (Liquid Crystal Display; liquid crystal display) module, etc., and the aforementioned circuit board 210 can be but not limited to a PCB (Printed Circuit Board; printed circuit board 210), a flexible circuit board 210, etc.; the heating device of the aforementioned circuit board 210 may include the aforementioned electronic components, and the aforementioned electronic components may include but not limited to IC (Integrated Circuit; integrated circuit), resistors, capacitors, inductors, etc., and the aforementioned electronic components with higher power consumption may be but not limited to IC, and accordingly, the aforementioned first area 2101 may be but not limited to the area where the IC is provided on the circuit board 210.

[0065] It is understandable that the number of the first heat dissipation unit 110 and the second heat dissipation unit 120 can be more than one, and the specific number can be set according to actual needs, and no excessive restrictions are made here. Figures 6 to 9 As shown, in actual applications, the number of first areas 2101 and the number of second areas 2102 of the circuit board 210 may be more than one. Figure 6 , Figure 8 and Fig. 9 The marks A and B are used to indicate the heating devices of different first regions 2101, respectively. Accordingly, the number of the first heat dissipation parts 110 can correspond to the number of the aforementioned first regions 2101, so as to utilize the plurality of first heat dissipation parts 110 to dissipate heat of the heating devices of different first regions 2101 respectively. When the number of heating devices of the same first region 2101 is more than one, the aforementioned accommodating cavity 1101 can be used to accommodate at least one heating device in the corresponding first region 2101, and the heat-conducting wall 1102 can be used to connect to at least one heating device in the corresponding first region 2101. Similarly, when there are multiple second regions 2102, the number of the aforementioned second heat dissipation parts 120 can correspond to the number of the second regions 2102, so as to utilize the plurality of second heat dissipation parts 120 to dissipate heat of each second region 2102 respectively, and the second heat dissipation parts 120 can be connected to the adjacent first heat dissipation parts 110.

[0066] Taking the display device provided in the embodiment of the present disclosure as an OLED vehicle-mounted display device as an example, it should be noted that with the development of vehicle-mounted display technology, the vehicle industry has also increased its requirements for display specifications. For example, there is a need for multi-screen, multi-format, large-screen, and intelligent vehicle-mounted displays. Based on the advantages of OLED displays, more and more vehicles are beginning to adopt OLED vehicle-mounted display devices. Correspondingly, the heat dissipation requirements for components of OLED vehicle-mounted display devices are also increased. In this case, the display module 200 can be an OLED module, the circuit board 210 can be a PCB, and includes a TCON IC (Timing Controller IC; timing controller integrated circuit) and a Power IC (power management integrated circuit). In this example, Figure 6 , Figure 8 and Fig. 9 Marks A and B are used to illustrate the aforementioned TCON IC and Power IC, respectively. It can be understood that the power consumption and heat generation of the TCON IC and Power IC are often higher than other electronic components, so the PCB area corresponding to the TCON IC and Power IC can be regarded as the aforementioned first area 2101, and other areas of the PCB can be regarded as the second area 2102. The aforementioned heat dissipation structure 100 can be arranged on the aforementioned PCB and includes two aforementioned first heat dissipation parts 110. The accommodating cavities 1101 of the two first heat dissipation parts 110 can respectively accommodate the aforementioned TCON IC and Power IC, and the heat-conducting walls 1102 of the two first heat dissipation parts 110 can be respectively connected to the aforementioned TCON IC and Power IC, so as to improve the heat dissipation efficiency of the TCON IC and the PowerIC in a targeted manner, facilitate the heat transfer of the OLED module to the outside, improve the working environment of the TCON IC and the Power IC, and improve the OLED module's support capability for more IP (Instrument Panel) functions and highly integrated SOC (System on Chip) technology, thereby ensuring the display performance of the OLED module; accordingly, the aforementioned second heat dissipation part 120 can be used to be attached to the second area 2102 of the PCB and connected to the adjacent first heat dissipation part 110, so as to exchange heat between the aforementioned second area 2102 and the first heat dissipation part 110, so as to improve the overall heat dissipation effect of the PCB, and provide reliable protection for the safe and stable operation of the OLED vehicle-mounted display device.

[0067] like Figures 6 to 9As shown, in some feasible examples, the heat dissipation structure 100 can be arranged on the side of the circuit board 210 away from the display panel 230, so that based on the above-mentioned arrangement, the heat dissipation effect of the back side of the display module 200 can be improved, and the heat generating components of the circuit board 210 can be facilitated to diffuse the generated heat to the outside of the module through the heat dissipation structure 100, thereby avoiding the degradation or damage of the module performance due to heat accumulation of the heat generating components.

[0068] In some feasible examples, the heat dissipation structure 100 is used to be detachably arranged on the circuit board 210, so as to facilitate the maintenance and replacement of the heat dissipation structure 100, which is beneficial to reducing the repair and maintenance costs of the heat dissipation structure 100 and the display device; the first heat dissipation part 110 and the second heat dissipation part 120 can also be connected in a detachable manner, so as to facilitate the independent maintenance or replacement of the first heat dissipation part 110 and the second heat dissipation part 120, which is beneficial to reducing the impact of the maintenance work of the heat dissipation structure 100 on the normal operation of the display device in actual applications, and reducing the repair and maintenance costs of the heat dissipation structure 100 and the display device.

[0069] In some feasible examples, the second heat dissipation portion 120 is used to cover at least one heat-generating device in the second region 2102 , thereby facilitating further enhancing the heat dissipation efficiency of the second heat dissipation portion 120 to the second region 2102 .

[0070] In some feasible examples, the aforementioned second heat dissipation part 120 can be made of flexible material so that it can be attached to the second area 2102 of the circuit board 210 in actual applications, thereby improving the connection reliability between the second heat dissipation part 120 and the circuit board 210, and ensuring the coverage effect of the second heat dissipation part 120 on the second area 2102, which is beneficial to reducing the contact stress between the second heat dissipation part 120 and the circuit board 210, and reducing the risk of structural damage to the circuit board 210.

[0071] like Figures 6 to 9 As shown, in some feasible examples, the display module 200 further includes: a support member 240, which is disposed between the display panel 230 and the circuit board 210. It is understandable that the support member 240 can support the display panel 230 and assist in the heat dissipation of the display panel 230 and the circuit board 210, thereby improving the heat dissipation effect of the back of the display module 200 and preventing the heat-generating components from being degraded or damaged due to heat accumulation.

[0072] like Figures 1 to 4 , Figures 6 to 9 As shown, in some examples, the first heat dissipation part 110 includes: a heat dissipation cover 111, which is formed with a accommodating cavity 1101; a heat conductive member 112, which is arranged on the heat dissipation cover 111 and is located in the accommodating cavity 1101, and the heat conductive member 112 is formed with a heat conductive wall 1102; wherein, the heat dissipation cover 111 is made of metal material, and the hardness of the heat conductive member 112 is less than the hardness of the heat dissipation cover 111.

[0073] In this technical solution, the first heat dissipation part 110 may include a heat dissipation cover 111 and a heat conducting member 112, wherein the heat dissipation cover 111 is formed with the aforementioned accommodating cavity 1101, that is, the heat dissipation cover 111 may be a cover-shaped structure with at least one end open and a hollow interior, so that the heat dissipation cover 111 is conveniently arranged on the heating device in the first area 2101, so that the heating device in the first area 2101 is located in the accommodating cavity 1101, and a larger heat exchange area can be provided between the heat dissipation cover 111 and the outside world, thereby improving the heat dissipation efficiency of the first heat dissipation part 110; the heat conducting member 112 is arranged on the heat dissipation cover 111 and is formed with the aforementioned heat conducting wall 1102, and the heat conducting wall 1102 is provided on the heat dissipation cover 111. The thermal element 112 is located inside the accommodating cavity 1101, so that when the heat dissipation cover 111 covers the heating device in the first area 2101, the first heat dissipation portion 110 can be connected to the heating device in the first area 2101 through the thermal conductive element 112 and quickly transfer the heat generated by the heating device in the first area 2101 to the heat dissipation cover 111; based on the above-mentioned arrangement, the first heat dissipation portion 110 can quickly absorb the heat generated by the heating device in the first area 2101 in actual applications, and diffuse the heat to the outside more efficiently, which is beneficial to avoid the probability of overheating of the display device when running at high load, and ensure the safe and stable operation of the display device.

[0074] At the same time, the heat dissipation cover 111 can be made of metal material, so that on the one hand, it can ensure that the heat dissipation cover 111 has a high heat transfer efficiency and improve the heat dissipation performance of the first heat dissipation part 110; on the other hand, the first heat dissipation part 110 can use the heat dissipation cover 111 in actual applications to electromagnetically shield the heating device in the accommodating cavity 1101, which can block and absorb electromagnetic waves, which is beneficial to improving the EMI (Electromagnetic Interference) protection capability of the display device, reducing the interference of external equipment on the display device, reducing the self-sensitivity of the display device, and providing more reliable guarantee for the stable operation of the display device; on the other hand, the heat dissipation cover 111 made of metal material can have good structural strength, and can provide reliable structural protection for the heating device in the accommodating cavity 1101, further reducing the probability of damage to the heating device.

[0075] Furthermore, the hardness of the heat conducting member 112 may be set to be smaller than the hardness of the heat dissipation cover 111 , thereby reducing the contact stress between the heat conducting member 112 and the heating device in the first area 2101 and reducing the risk of damage to the heating device.

[0076] In some feasible examples, the heat dissipation cover 111 may be made of aluminum, copper or stainless steel, so that the heat dissipation cover 111 has good thermal conductivity and strong mechanical strength.

[0077] In some examples, the heat conductive member 112 is made of a silicone material.

[0078] In this technical solution, the aforementioned heat conductive member 112 can be made of silicone material, so that the heat conductive member 112 can have a relatively low hardness and good thermal conductivity, which is beneficial for the first heat conductive part to quickly absorb and transfer heat through the heat conductive member 112 in actual applications, thereby improving the heat dissipation efficiency of the first heat conductive part. At the same time, the heat conductive member 112 can also have good electrical insulation, which is beneficial for further ensuring the safe operation of the display device.

[0079] It can be understood that the aforementioned silicone material may include a base material and a filler with good thermal conductivity. The aforementioned base material may be but is not limited to silicone rubber, and the aforementioned filler may be but is not limited to aluminum oxide, zinc oxide, and the like.

[0080] In some examples, the heat conductive member 112 is sticky, the heat conductive member 112 is bonded to the heat dissipation cover 111 , and the heat conductive wall 1102 is used to bond to the heat generating device in the first area 2101 .

[0081] In this technical solution, the aforementioned heat conductor 112 can be sticky, so that the heat conductor 112 can be adhered to the heat dissipation cover 111 and the heating device in the first area 2101, which can facilitate the assembly and installation of the heat dissipation device and improve the connection reliability between the heat conductor 112 and the heat dissipation cover 111 and the heating device in the first area 2101, providing reliable guarantee for the efficient heat dissipation of the heating device in the first area 2101.

[0082] like Figures 6 to 9 As shown, in some examples, the display device further includes: a housing 300 , which is formed with a connecting installation space 301 and ventilation holes, and the circuit board 210 and the heat dissipation structure 100 are both arranged in the installation space 301 .

[0083] In this technical solution, the display device may further include a housing 300, and the circuit board 210 and the heat dissipation structure 100 may be within the installation space 301 of the housing 300, thereby improving the protection effect of the circuit board 210 and the heat dissipation device, and the housing 300 is provided with ventilation holes, thereby facilitating heat exchange between the installation space 301 and the outside through gas, which is beneficial to further improving the heat dissipation efficiency of the circuit board 210 and the heat transfer efficiency of the heat dissipation structure 100.

[0084] It should be noted that for the sake of convenience, Figure 7 The housing 300 is hidden in the figure, and the ventilation holes are not Figures 6 to 9 Shown in.

[0085] In some examples, there are multiple ventilation holes, and at least part of the multiple ventilation holes are arranged corresponding to the first heat dissipation portion 110 .

[0086] In this technical solution, the housing 300 may be provided with a plurality of ventilation holes, and at least some of the ventilation holes may be arranged corresponding to the aforementioned first heat dissipation portion 110, thereby facilitating improving the convective heat transfer efficiency of the first heat dissipation portion 110, improving the heat dissipation efficiency of the high-temperature area of ​​the circuit board 210, and providing more reliable protection for the safe and stable operation of the display device.

[0087] like Figure 2 , Figure 5 and Figure 6 As shown, in some examples, the first heat dissipation portion 110 further includes: an elastic member 113, one end of the elastic member 113 is connected to the heat dissipation cover 111, and the other end is connected to the housing 300; wherein the elastic member 113 is made of a thermally conductive material.

[0088] In this technical solution, the first heat dissipation part 110 may also include an elastic member 113 connected between the casing 300 and the heat dissipation cover 111. Based on the above-mentioned setting, in actual application, the heat dissipation structure 100 can be installed between the circuit board 210 and the casing 300, and the heat dissipation cover 111 is arranged between one end of the elastic member 113 and the circuit board 210, and the other end of the elastic member 113 is arranged to be connected to the casing 300. Then, the elastic force provided by the elastic member 113 can be utilized to ensure the tightness of the connection between the heat dissipation cover 111 and the circuit board 210, reduce the probability of the heat conductive member 112 being separated from the heating device in the first area 2101, and provide a guarantee for the first heat dissipation part 110 to stably exert its heat dissipation performance. In addition, since the elastic member 113 has good elastic deformation ability, the elastic member 113 has good adaptability to casings 300 of different shapes and sizes, which is conducive to improving the installation convenience and flexibility of the heat dissipation component. At the same time, the elastic member 113 can be made of a heat-conducting material, so that in practical applications, the heat transfer path between the heat dissipation cover 111 and the casing 300 can be further expanded, so that the heat dissipation structure 100 can transfer heat to the outside through the casing 300, thereby increasing the heat dissipation area and heat dissipation efficiency of the heating device in the first area 2101.

[0089] It can be understood that the bottom wall of the heat dissipation cover 111, i.e., the portion of the heat dissipation cover 111 opposite to the cover opening, is the inner bottom wall of the heat dissipation cover 111 on the side facing the accommodating cavity 1101, and the outer bottom wall of the heat dissipation cover 111 on the side facing away from the accommodating cavity 1101. Figure 6As shown, in actual application, the heat conductive member 112 can be arranged on the inner bottom wall of the heat dissipation cover 111, and the elastic member 113 can be arranged on the outer bottom wall of the heat dissipation cover 111; based on the above arrangement, when the heat dissipation cover 111 covers the heating device arranged in the first area 2101, it is convenient for the heat conductive member 112 to contact the heating device, and at the same time, under the elastic force generated by the elastic member 113, the heat conductive member 112 can be pressed more tightly against the heating device. Since the installation stability and convenience of the heat dissipation structure 100 are improved, the heat transfer efficiency between the first heat dissipation part 110 and the heating device in the first area 2101 is guaranteed, thereby ensuring the heat dissipation effect of the heat dissipation structure 100 on the heating device.

[0090] It is understandable that the elastic member 113 may be made of, but not limited to, metal material or silicone material.

[0091] like Figure 2 , Figure 5 and Figure 6 As shown, in some examples, the elastic member 113 includes: a wave spring 1131 , one end of the wave spring 1131 is connected to the heat dissipation cover 111 , and the other end is connected to the housing 300 .

[0092] In this technical solution, the elastic member 113 may include a wave spring 1131 connected between the housing 300 and the heat dissipation cover 111. Based on the above setting, in actual application, if the compression of the wave spring 1131 increases, the contact area between the wave spring 1131 and the housing 300 and the contact area between the wave spring 1131 and the heat dissipation cover 111 will be increased, thereby forming a stable thermal interface contact relationship, which can improve the heat transfer efficiency between the heat dissipation cover 111 and the housing 300, and the heat can be directly transferred through the contact surface, which is conducive to reducing the loss of heat during the transfer process, and can enhance the heat dissipation effect of the first heat dissipation part 110, providing a more reliable guarantee for the high-load stable operation of the display device. At the same time, the wave spring 1131 has a strong deformation capacity and mechanical strength, so that it can have good tolerance to pressure or temperature changes, can ensure efficient heat transfer, and is conducive to further improving the assembly and installation convenience of the heat dissipation structure 100.

[0093] It can be understood that since the wave spring 1131 has good structural adjustability, in the case of long-term use or changes in the use environment, the contact relationship between the wave spring 1131 and the heat dissipation cover 111 and the casing 300 can be ensured by adjusting the deformation of the wave spring 1131.

[0094] It is understandable that, considering the connection reliability between the wave spring 1131 and the heat dissipation cover 111, one end of the wave spring 1131 can be welded to the heat dissipation cover 111, which is beneficial to increase the contact area between the wave spring 1131 and the heat dissipation cover 111 and further improve the heat transfer efficiency between the wave spring 1131 and the heat dissipation cover 111.

[0095] In some feasible examples, the aforementioned wave spring 1131 can be made of stainless steel or nickel-plated steel sheet, which is beneficial to improving the elasticity and thermal conductivity of the wave spring 1131.

[0096] like Figure 3 and Figure 8 As shown, in some examples, the first heat dissipation portion 110 further includes: a plurality of protrusions 115 disposed on the heat dissipation cover 111 and outside the accommodating cavity 1101 , and the protrusions 115 are made of a thermally conductive material.

[0097] In this technical solution, the first heat dissipation part 110 may also include a plurality of protrusions 115 arranged on the outside of the heat dissipation cover 111, and the protrusions 115 are made of heat-conductive material. Based on the above-mentioned arrangement, the surface area of ​​the first heat dissipation part 110 can be further increased, thereby enhancing the convective heat dissipation efficiency between the first heat dissipation part 110 and the external environment, which is beneficial to further enhance the heat dissipation performance of the first heat dissipation part 110.

[0098] It is understandable that the protrusion 115 may be made of, but not limited to, a metal material. For example, the protrusion 115 and the heat dissipation cover 111 may be made of the same material and be an integrated structure.

[0099] In some feasible examples, the aforementioned protrusion 115 may include heat dissipation fins, which is helpful to increase the specific surface area of ​​the protrusion 115, while improving the heat dissipation efficiency of the first heat dissipation part 110, reducing the overall weight of the first heat dissipation part 110, which is helpful to ensure the lightweight level of the display device.

[0100] In some feasible examples, the plurality of protrusions 115 may be arranged in an array, which is beneficial to improving the distribution uniformity of the protrusions 115 on the heat dissipation cover 111 and further enhancing the heat dissipation effect of the first heat dissipation portion 110 .

[0101] In some examples, at least a portion of the outer wall of the heat dissipation cover 111 is an oxidized wall that has been oxidized; or

[0102] At least part of the outer wall of the heat dissipation cover 111 is provided with a sandblasting film layer 117; or

[0103] At least a portion of the outer wall of the heat dissipation cover 111 is coated with a heat dissipation coating.

[0104] In this technical solution, at least part of the outer wall of the heat dissipation cover 111 may be subjected to surface treatment to improve the heat radiation capacity of the heat dissipation cover 111, thereby further improving the heat dissipation efficiency of the heat dissipation cover 111, and also helping to improve the corrosion resistance and aesthetics of the heat dissipation cover 111, extend the service life of the heat dissipation cover 111, and reduce the repair and maintenance cost of the heat dissipation structure 100. The surface treatment may be oxidation treatment, sandblasting treatment, or coating treatment.

[0105] Exemplarily, at least part of the outer wall of the aforementioned heat dissipation cover 111 is an oxidized wall that has been oxidized. The aforementioned oxidation treatment may be but is not limited to anodizing, which can enhance the thermal radiation capacity and heat dissipation effect of the heat dissipation cover 111, and is beneficial to improving the surface corrosion resistance and wear resistance of the heat dissipation cover 111, and is beneficial to extending the service life of the heat dissipation cover 111.

[0106] Alternatively, at least part of the outer wall of the heat dissipation cover 111 is provided with a sandblasting film layer 117, so as to enhance the heat radiation capacity and heat dissipation effect of the heat dissipation cover 111, improve the fatigue resistance of the heat dissipation cover 111, and extend the service life of the heat dissipation cover 111.

[0107] Alternatively, at least part of the outer wall of the heat dissipation cover 111 is coated with a heat dissipation coating, so as to enhance the heat radiation capacity and heat dissipation effect of the heat dissipation cover 111, and improve the surface performance of the heat dissipation cover 111 by using the coating, which is beneficial to extend the service life of the heat dissipation cover 111. It is understood that the heat dissipation coating can be, but is not limited to, an aluminum oxide coating or a titanium dioxide coating.

[0108] It is understandable that the aforementioned oxide wall or sandblasted wall or heat dissipation coating can be arranged corresponding to the heat conductive member 112, which is beneficial to shorten the heat transfer path between the oxide wall or sandblasted film layer 117 or the heat dissipation coating and the heat conductive member 112, and further improve the heat dissipation efficiency of the first heat dissipation part 110.

[0109] In some examples, the second heat dissipation portion 120 includes: an adhesive layer; a heat dissipation layer bonded to one side of the adhesive layer, and a side of the adhesive layer facing away from the heat dissipation layer bonded to the first heat dissipation portion 110 and the second area 2102; wherein the heat dissipation layer covers at least part of the heat generating device in the second area 2102.

[0110] In this technical solution, the aforementioned second heat dissipation part 120 may include a heat dissipation layer and an adhesive layer, wherein the adhesive layer is sticky, one side of the adhesive layer can be adhered to the heat dissipation layer, and the other side can be adhered to the first heat dissipation part 110 and the second area 2102 of the circuit board 210, and when the adhesive layer is adhered to the second area 2102, the heat dissipation layer covers at least part of the heating device in the second area 2102, so that based on the aforementioned setting, the connection reliability between the second heat dissipation part 120 and the circuit board 210 can be improved, which is beneficial for the second heat dissipation part 120 to stably absorb and transfer the heat generated by the second area 2102 to the outside, providing more reliable guarantee for the safe and stable operation of the display device.

[0111] It should be noted that the aforementioned heat dissipation portion covers at least part of the heating devices in the second region 2102, that is, when the adhesive layer is bonded to the second region 2102, the orthographic projection of at least part of the heating devices in the second region 2102 on the adhesive layer is located within the orthographic projection range of the heat dissipation layer on the adhesive layer, so that the heat dissipation layer can quickly absorb the heat generated by the second region 2102, which is beneficial to improving the heat dissipation effect of the second heat dissipation portion 120. It can be understood that in actual applications, the more heating devices covered by the heat dissipation layer, the higher the heat dissipation efficiency of the second region 2102.

[0112] It is understandable that the adhesive layer may be adhered to the outer wall of the first heat dissipation portion 110 .

[0113] In some examples, the adhesive layer is made of thermally conductive adhesive or PET material.

[0114] In this technical solution, the adhesive layer can be made of thermally conductive adhesive, thereby improving the heat transfer efficiency between the adhesive layer and the heat dissipation component and improving the heat absorption efficiency of the adhesive layer, which is beneficial to further enhance the heat dissipation effect of the second heat dissipation part 120.

[0115] Alternatively, the adhesive layer can be made of PET material, that is, the adhesive layer can be but not limited to PET tape, which is beneficial to enhance the adhesion of the adhesive layer and improve the connection reliability of the adhesive layer. PET has good heat dissipation properties, which is beneficial to ensure the heat dissipation effect of the second heat dissipation part 120.

[0116] In some examples, the heat dissipation layer includes a graphite layer and / or a metal layer.

[0117] In this technical solution, the heat dissipation layer may include a graphite layer, so that in actual applications, the heat dissipation layer can have a good heat dissipation effect while having a strong electrostatic shielding performance and can block electromagnetic radiation. Furthermore, when the heat dissipation layer covers at least part of the heating device in the second area 2102, the corresponding heating device can be electromagnetically shielded, and electromagnetic waves can be blocked and absorbed, which is beneficial to improving the EMI protection capability of the display device, reducing the interference of external equipment on the display device, reducing the display device's own sensitivity, and providing more reliable guarantee for the smooth operation of the display device.

[0118] Alternatively, the heat dissipation layer may include a metal layer, so that in actual applications, the heat dissipation layer can have a good heat dissipation effect while having a strong electrostatic shielding performance and can block electromagnetic radiation. Furthermore, when the heat dissipation layer covers at least part of the heating device in the second area 2102, the corresponding heating device can be electromagnetically shielded, and electromagnetic waves can be blocked and absorbed, which is beneficial to improving the EMI protection capability of the display device, reducing the interference of external equipment on the display device, reducing the display device's own sensitivity, and providing more reliable guarantee for the smooth operation of the display device.

[0119] It can be understood that the heat dissipation layer may include a graphite layer and a metal layer at the same time. In this case, the graphite layer and the metal layer may be stacked.

[0120] According to a second aspect of an embodiment of the present disclosure, a vehicle is provided, comprising: a display device as provided in any one of the first aspects above.

[0121] It can be understood that the aforementioned vehicle may further include a cab, and the aforementioned display device may be disposed in the cab.

[0122] It can be understood that, in practical applications, the aforementioned transportation vehicles can be used as but not limited to vehicles or ships.

[0123] It can be understood that, since the aforementioned means of transport includes a display device as proposed in any one of the first aspects above, it possesses all the beneficial effects of the display device, which will not be elaborated here.

[0124] In the present disclosure, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise expressly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0125] In the description of the present disclosure, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, should not be understood as a limitation on the present disclosure.

[0126] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0127] The above are only preferred embodiments of the present disclosure and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A display device, characterized in that: include: A display module, comprising a circuit board, a cover plate and a display panel, wherein the display panel has a display side, the cover plate is arranged on the display side, the circuit board is arranged on a side of the display panel away from the cover plate, and the circuit board is electrically connected to the display panel; The heat dissipation structure includes a first heat dissipation portion and a second heat dissipation portion, wherein the first heat dissipation portion is arranged in a first area of ​​the circuit board, the first heat dissipation portion is formed with a receiving cavity and a heat-conducting wall, the receiving cavity receives a heating device in the first area, the heat-conducting wall is connected to the heating device in the first area, the second heat dissipation portion is attached to the second area of ​​the circuit board, and the second heat dissipation portion is connected to the first heat dissipation portion; Wherein, when the display device is in operation, the heat generated by the first area is greater than the heat generated by the second area.

2. The display device according to claim 1, characterized in that The first heat dissipation unit comprises: A heat dissipation cover, formed with the accommodating cavity; A heat conducting member, disposed on the heat dissipation cover and located in the accommodating cavity, wherein the heat conducting member is formed with the heat conducting wall; Wherein, the heat dissipation cover is made of metal material, and the hardness of the heat conducting member is smaller than the hardness of the heat dissipation cover.

3. The display device according to claim 2, characterized in that: The heat conducting element is made of silicone material.

4. The display device according to claim 2, characterized in that: The heat-conducting member is sticky, the heat-conducting member is bonded to the heat-dissipating cover, and the heat-conducting wall is bonded to the heat-generating device in the first area.

5. The display device according to claim 2, characterized in that: Also includes: The casing is formed with a connecting installation space and ventilation holes, and the circuit board and the heat dissipation structure are both arranged in the installation space.

6. The display device according to claim 5, characterized in that: There are multiple ventilation holes, and at least part of the multiple ventilation holes are arranged corresponding to the first heat dissipation portion.

7. The display device according to claim 5, characterized in that: The first heat dissipation unit further includes: an elastic member, one end of which is connected to the heat dissipation cover, and the other end of which is connected to the housing; Wherein, the elastic member is made of heat-conducting material.

8. The display device according to claim 7, characterized in that: The elastic member comprises: A wave spring, one end of which is connected to the heat dissipation cover, and the other end of which is connected to the housing.

9. The display device according to claim 2, characterized in that: The first heat dissipation unit further includes: A plurality of protrusions are arranged on the heat dissipation cover and outside the accommodating cavity, and the protrusions are made of heat-conducting material.

10. The display device according to claim 2, characterized in that: At least part of the outer wall of the heat dissipation cover is an oxidized wall that has been oxidized; or At least part of the outer wall of the heat dissipation cover is provided with a sandblasting film layer; or At least a portion of the outer wall of the heat dissipation cover is plated with a heat dissipation coating.

11. The display device according to any one of claims 1 to 10, characterized in that: The second heat dissipation unit includes: Adhesive layer; a heat dissipation layer, bonded to one side of the adhesive layer, and a side of the adhesive layer facing away from the heat dissipation layer is bonded to the first heat dissipation portion and the second region; Wherein, the heat dissipation layer covers at least part of the heat generating components in the second area.

12. The display device according to claim 11, characterized in that: The bonding layer is made of thermal conductive adhesive or PET material.

13. The display device according to claim 11, characterized in that The heat dissipation layer includes a graphite layer and / or a metal layer.

14. A means of transport, characterized in that: include: A display device as claimed in any one of claims 1 to 13.

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