Light and thin display assembly for wearable device

Abstract

The utility model discloses a light and thin type display assembly used for wearable equipment, comprising a cover plate, the cover plate is provided with a main screen FPC and a TP FPC, the main screen FPC comprises a main screen FPC main body, the main screen FPC main body is provided with a pair of main screen positioning holes, the main screen FPC main body is provided with a main screen binding area, the main screen binding area is provided with a plurality of main screen binding gold fingers, the TP FPC comprises a TP FPC main body, and the TP FPC main body is provided with a plurality of main screen binding gold fingers. A pair of TP positioning holes are formed in the TP FPC main body, a TP binding area is arranged on the TP FPC main body, a plurality of TP binding gold fingers are arranged on the TP binding area, and the TP binding gold fingers and the main screen binding gold fingers are bound through an ACF layer. As the TP binding gold finger and the main screen binding gold finger are bound through the ACF layer, compared with the maximum thickness of 0.3 mm in a conventional soldering tin connection scheme, the maximum thickness can be controlled to be 0.1 mm, so that the thickness can be reduced by 0.2 mm, and the stacking thickness of the whole module is effectively reduced.

Description

Technical Field

[0001] The utility model relates to a wearable display device, more specifically, to a light and thin display component for wearable devices. Background Art

[0002] With the improvement of living standards, smart wearable devices such as bracelets / watches are becoming more and more common, product competition is becoming more and more fierce, consumers are pursuing more and more extreme product thickness, and lightweight design is an inevitable trend for products.

[0003] The main screen FPC and TP FPC of the display devices on existing wearable products are generally welded with solder, and the thickness usually reaches 0.3 mm, which is still too thick.

[0004] Chinese utility model patent document CN213130270U discloses a wearable device, including an eye mask body, two massage modules arranged on the inner side of the eye mask body, and a power assembly arranged in the eye mask body for driving the two massage modules, characterized in that: it also includes a transmission structure arranged in the eye mask body to connect the power assembly and the two massage modules, the transmission structure includes a rotating cover installed on the eye mask body, the power assembly has an eccentric output shaft, the rotating cover is provided with a strip hole, the eccentric output shaft extends into the strip hole to drive the rotating cover to rotate within a certain angle range, and the rotating cover is rotatably connected to the two massage modules on the side away from the power assembly. The transmission structure also includes a pressing plate, which is arranged between the power assembly and the rotating cover for installing the rotating cover on the eye mask body. The transmission structure also includes a wear-resistant ring arranged between the rotating cover and the eye mask body, the rotating cover has a center hole, and the inner ring wall of the wear-resistant ring extends a protrusion toward the rotating cover, and the protrusion extends into the center hole.

[0005] Obviously, this patent can only solve the oppressive feeling of wearable devices, but cannot solve the existing problem of thinness and lightness. Utility Model Content

[0006] Based on this, it is necessary to provide a thin and light display component for wearable devices in response to the above-mentioned technical problems. The thin and light display component for wearable devices includes a cover plate, a main screen FPC and a TPFPC are provided on the cover plate, the TP FPC is superimposed and connected with the main screen FPC, the main screen FPC includes a main screen FPC body, a pair of main screen positioning holes are provided on the main screen FPC body, a main screen binding area is provided on the main screen FPC body, and a number of main screen binding gold fingers are provided on the main screen binding area. The TP FPC includes a TP FPC body, a pair of TP positioning holes are provided on the TP FPC body, a TP binding area is provided on the TP FPC body, and a number of TP binding gold fingers are provided on the TP binding area, wherein the position of the TP positioning hole corresponds to the main screen positioning hole, the position of the TP binding area corresponds to the main screen binding area, and the TP binding gold fingers are bound to the main screen binding gold fingers through an ACF layer. Since the TP binding gold finger and the main screen binding gold finger are bound through the ACF layer, the maximum thickness can be controlled at 0.1 mm compared to the maximum thickness of 0.3 mm of the conventional solder connection solution. Therefore, the thickness can be reduced by 0.2 mm, effectively reducing the overall stacking thickness of the module, making the overall design of the machine lighter and thinner, which is especially suitable for use on wearable devices.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A thin and light display assembly for a wearable device, characterized in that the thin and light display assembly for a wearable device comprises a cover plate, a main screen FPC and a TP FPC are arranged on the cover plate, and the TP FPC is superimposed and connected with the main screen FPC.

[0009] The main screen FPC comprises a main screen FPC body, a pair of main screen positioning holes are arranged on the main screen FPC body, a main screen binding area is arranged on the main screen FPC body, and a plurality of main screen binding gold fingers are arranged on the main screen binding area.

[0010] The TP FPC comprises a TP FPC body, a pair of TP positioning holes are arranged on the TP FPC body, a TP binding area is arranged on the TP FPC body, and a plurality of TP binding gold fingers are arranged on the TP binding area.

[0011] Among them, the position of the TP positioning hole corresponds to the main screen positioning hole, the position of the TP binding area corresponds to the main screen binding area, and the TP binding gold finger is bound to the main screen binding gold finger through an ACF layer.

[0012] As a preferred implementation of the thin and light display assembly for wearable devices provided by the utility model, conductive gold balls are provided in the ACF layer.

[0013] As a preferred implementation of the thin and light display component for wearable devices provided by the utility model, the spacing between the main screen binding gold fingers is 0.7 mm, and the spacing between the TP binding gold fingers is 0.7 mm.

[0014] As a preferred implementation of the thin and light display assembly for wearable devices provided by the utility model, the position of the TP positioning hole is matched with the main screen positioning hole through a positioning pin.

[0015] As a preferred implementation of the thin and light display assembly for wearable devices provided by the utility model, the position of the TP positioning hole and the main screen positioning hole are both round holes.

[0016] As a preferred implementation of the thin and light display assembly for wearable devices provided by the utility model, the position of the TP positioning hole and the main screen positioning hole are both square holes.

[0017] As a preferred implementation of the thin and light display assembly for wearable devices provided by the utility model, an insulating paper is attached to both the main screen binding area and the TP binding area.

[0018] As a preferred embodiment of the thin and light display assembly for wearable devices provided by the utility model, the insulating paper is yellow.

[0019] As a preferred implementation of the thin and light display assembly for wearable devices provided by the utility model, the insulating paper is provided with an anti-slip grid pattern.

[0020] As a preferred embodiment of the thin and light display assembly for wearable devices provided by the utility model, the area of ​​the insulating paper is larger than the main screen binding area and the TP binding area, and the thickness of the insulating paper is 0.05 mm.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] The utility model provides a thin and light display component for wearable devices. The position of the TP positioning hole and the main screen positioning hole are used to align the positioning pins on the binding fixture with the alignment holes on the FPC. The ACF layer is used as a conductive medium between the two gold fingers on the FPC, that is, the main screen binding gold finger and the TP binding gold finger. Through the hot pressing binding process, the conductive gold balls in the ACF layer are exploded, so that the upper / lower two layers of FPC gold fingers are connected through the conductive gold balls. Since the TP binding gold finger and the main screen binding gold finger are bound through the ACF layer, the maximum thickness can be controlled to 0.1 mm compared to the maximum thickness of 0.3 mm of the conventional solder connection solution. Therefore, the thickness can be reduced by 0.2 mm, which effectively reduces the overall stacking thickness of the module, and realizes a lighter and thinner design of the whole machine, which is particularly suitable for use on wearable devices.

[0023] In addition, the position of the TP positioning hole and the main screen positioning hole can be made square holes. By using the position of the TP positioning hole and the main screen positioning hole, the binding fixture can be aligned by fitting the positioning pins into the alignment holes on the FPC. Since the position of the TP positioning hole and the main screen positioning hole are both square holes, the FPC can be positioned and can also be effectively prevented from rotating at will.

[0024] In addition, an insulating paper can be applied to both the main screen binding area and the TP binding area. The insulating paper is yellow. In addition, an anti-slip grid pattern is provided on the insulating paper. The area of ​​the insulating paper is larger than the main screen binding area and the TP binding area. By applying insulating paper, foreign matter can be effectively prevented from contaminating the ACF layer at the binding position, or water vapor can enter the binding position and cause the ACF layer to fail. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is a schematic diagram of the structure of a thin and light display assembly for a wearable device of the present utility model;

[0027] Figure 2 for Figure 1 A schematic diagram of the structure of the main screen FPC of the thin and light display component for wearable devices;

[0028] Figure 3 for Figure 1 A schematic diagram of the structure of a TP FPC for a thin and light display component of a wearable device;

[0029] Figure 4for Figure 1 A schematic diagram of a binding structure of a thin and light display component for a wearable device;

[0030] Figure 5 This is a schematic structural diagram of a thin and light display assembly for a wearable device of the utility model, which is another embodiment;

[0031] The markings in the figure are as follows: 1. Main screen FPC; 10. Main screen FPC body; 11. Main screen positioning hole; 12. Main screen binding area; 121. Main screen binding gold finger; 2. TP FPC; 20. TP FPC body; 21. TP positioning hole; 22. TP binding area; 221. TP binding gold finger; 3. ACF layer; 31. Conductive gold ball; 4S, cover plate; 41. Anti-slip grid pattern. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0033] As described in the background technology, with the improvement of living standards, smart wearable devices such as bracelets / watches are becoming more and more common, and product competition is becoming more and more fierce. Consumers are pursuing more and more extreme product thickness, and thin and light design is an inevitable trend for products. The main screen FPC and TP FPC of the display device on the existing wearable products are generally welded with solder, and the thickness is usually 0.3 mm, which is still too thick.

[0034] In order to solve this technical problem, the utility model provides a thin and light display component for wearable devices, including a cover plate 4S, on which a main screen FPC1 (FPC, i.e., flexible circuit board) and a TP FPC2 are provided, and the TP FPC2 is superimposed and connected with the main screen FPC1. The main screen FPC1 includes a main screen FPC body 10, on which a pair of main screen positioning holes 11 are provided, and a main screen binding area 12 is provided on the main screen FPC body 10, and a plurality of main screen binding gold fingers 121 are provided on the main screen binding area 12. The TP FPC2 includes a TP FPC body 20, on which a pair of TP positioning holes 21 are provided, and a TP binding area 22 is provided on the TP FPC body 20, and a plurality of TP binding gold fingers 221 are provided on the TP binding area 22. The position of the TP positioning hole 21 corresponds to the main screen positioning hole 11 , the position of the TP binding area 22 corresponds to the main screen binding area 12 , and the TP binding gold finger 221 is bound to the main screen binding gold finger 121 through an ACF layer (ACF, i.e. anisotropic conductive film) 3 .

[0035] Through the above structural design, since the TP binding gold finger 221 and the main screen binding gold finger 121 are bound through the ACF layer 3, the maximum thickness can be controlled at 0.1 mm compared to the maximum thickness of 0.3 mm of the conventional solder connection solution. Therefore, the thickness can be reduced by 0.2 mm, effectively reducing the overall stacking thickness of the module, making the overall machine design lighter and thinner, which is particularly suitable for use on wearable devices.

[0036] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0037] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] like Figure 1 As shown, the thin and light display assembly for wearable devices includes a cover plate 4S, on which a main screen FPC1 (FPC, i.e., flexible circuit board) and a TP FPC2 are provided, and the TP FPC2 is superimposed and connected with the main screen FPC1.

[0040] like Figure 2 As shown, the main screen FPC1 includes a main screen FPC body 10, a pair of main screen positioning holes 11 are provided on the main screen FPC body 10, a main screen binding area 12 is provided on the main screen FPC body 10, and a plurality of main screen binding gold fingers 121 are provided on the main screen binding area 12.

[0041] like Figure 3 As shown, the TP FPC 2 includes a TP FPC body 20 , a pair of TP positioning holes 21 are disposed on the TP FPC body 20 , a TP binding area 22 is disposed on the TP FPC body 20 , and a plurality of TP binding gold fingers 221 are disposed on the TP binding area 22 .

[0042] It should be noted that the position of the TP positioning hole 21 corresponds to the main screen positioning hole 11, the position of the TP binding area 22 corresponds to the main screen binding area 12, and the TP binding gold finger 221 is bound to the main screen binding gold finger 121 through an ACF layer (ACF, i.e., anisotropic conductive film) 3.

[0043] In addition, conductive gold balls 31 are disposed in the ACF layer 3 .

[0044] The spacing between the main screen binding gold fingers 121 is 0.7 mm, and the spacing between the TP binding gold fingers 221 is 0.7 mm.

[0045] It should be noted that the position of the TP positioning hole 21 is matched with the main screen positioning hole 11 through a positioning pin. The position of the TP positioning hole 21 and the main screen positioning hole 11 are both round holes.

[0046] The working mode of this embodiment is described below.

[0047] By using the position of the TP positioning hole 21 and the main screen positioning hole 11, the binding fixture can be aligned by fitting the positioning pins on the FPC. The ACF layer 3 (usually with a thickness of less than 25.4um) is used as a conductive medium between the two gold fingers on the FPC, namely the main screen binding gold finger 121 and the TP binding gold finger 221. Through the hot pressing binding process, the conductive gold ball 31 in the ACF layer 3 is exploded, so that the upper / lower FPC gold fingers are connected through the conductive gold ball 31.

[0048] Since the TP binding gold finger 221 and the main screen binding gold finger 121 are bound through the ACF layer 3, the maximum thickness can be controlled at 0.1 mm compared to the maximum thickness of 0.3 mm of the conventional solder connection solution. Therefore, the thickness can be reduced by 0.2 mm, effectively reducing the overall stacking thickness of the module, making the overall design of the machine lighter and thinner, which is particularly suitable for use on wearable devices.

[0049] The thin and light display assembly for wearable devices provided in Example 1 is further optimized. Specifically, the position of the TP positioning hole 21 and the main screen positioning hole 11 are both square holes.

[0050] The working mode of this embodiment is described below.

[0051] By using the position of the TP positioning hole 21 and the main screen positioning hole 11, the binding fixture can be aligned by fitting the positioning pins into the alignment holes on the FPC. Since the position of the TP positioning hole 21 and the main screen positioning hole 11 are both square holes, the FPC can be positioned and the FPC can be effectively prevented from rotating at will.

[0052] The thin and light display assembly for wearable devices provided in Example 1 or 2 is further optimized. Specifically, an insulating paper 4 is attached to both the main screen binding area 12 and the TP binding area 22 .

[0053] It should be noted that the insulating paper 4 is yellow. In addition, an anti-slip grid pattern 41 is provided on the insulating paper 4. The area of ​​the insulating paper 4 is larger than the main screen binding area 12 and the TP binding area 22. The thickness of the insulating paper 4 is 0.05 mm.

[0054] The working mode of this embodiment is described below.

[0055] By applying the insulating paper 4 , it is possible to effectively prevent foreign matter from contaminating the ACF layer 3 at the binding position, or prevent water vapor from entering the binding position and causing the ACF layer 3 to fail.

[0056] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A thin and light display assembly for a wearable device, characterized in that: The thin and light display assembly for wearable devices comprises a cover plate (4S), the cover plate (4S) is provided with a main screen FPC (1) and a TP FPC (2), the TPFPC (2) is superimposed and connected with the main screen FPC (1), the main screen FPC (1) comprises a main screen FPC body (10), the main screen FPC body (10) is provided with a pair of main screen positioning holes (11), the main screen FPC body (10) is provided with a main screen binding area (12), the main screen binding area (12) is provided with a plurality of main screen binding gold fingers (121), the TP FPC (2) comprises a TP FPC body (20), the TP FPC body (20) is provided with a pair of TP positioning holes (21), the TP A TP binding area (22) is provided on the FPC body (20), and a plurality of TP binding gold fingers (221) are provided on the TP binding area (22), wherein the position of the TP positioning hole (21) corresponds to the main screen positioning hole (11), the position of the TP binding area (22) corresponds to the main screen binding area (12), and the TP binding gold fingers (221) are bound to the main screen binding gold fingers (121) via an ACF layer (3).

2. The thin and light display assembly for wearable devices according to claim 1, characterized in that: Conductive gold balls (31) are provided in the ACF layer (3).

3. The thin and light display assembly for wearable devices according to claim 1, characterized in that: The spacing between the main screen binding gold fingers (121) is 0.7 mm, and the spacing between the TP binding gold fingers (221) is 0.7 mm.

4. The thin and light display assembly for wearable devices according to claim 1, characterized in that: The position of the TP positioning hole (21) is matched with the main screen positioning hole (11) through a positioning pin.

5. The thin and light display assembly for wearable devices according to claim 1, characterized in that: The TP positioning hole (21) and the main screen positioning hole (11) are both circular holes.

6. The thin and light display assembly for wearable devices according to claim 1, characterized in that: The position of the TP positioning hole (21) and the main screen positioning hole (11) are both square holes.

7. The thin and light display assembly for wearable devices according to claim 1, characterized in that: An insulating paper (4) is attached to both the main screen binding area (12) and the TP binding area (22).

8. The thin and light display assembly for wearable devices according to claim 7, characterized in that: The insulating paper (4) is yellow.

9. The thin and light display assembly for wearable devices according to claim 8, characterized in that: The insulating paper (4) is provided with an anti-slip grid pattern (41).

10. The thin and light display assembly for wearable devices according to claim 7, characterized in that: The area of ​​the insulating paper (4) is larger than the main screen binding area (12) and the TP binding area (22), and the thickness of the insulating paper (4) is 0.05 mm.

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