Lead frame pressing mechanism

Abstract

The utility model belongs to the technical field of semiconductor lead frame film pasting, and relates to a lead frame pressing mechanism which comprises a carrying assembly, a lifting assembly, a pressing assembly and a pressing plate, the carrying assembly is connected with the lifting assembly, the pressing assembly is movably connected to the bottom of the lifting assembly, and the pressing plate is arranged at the bottom of the pressing assembly. After the structure is adopted, the lead frame laminating machine has the beneficial effects that the lead frame is laminated to the film laminating platform from top to bottom, the clamping jaw only has an upward lifting acting force on the lead frame, the film laminating is realized by utilizing the self gravity of the lead frame, and the lead frame laminating efficiency is greatly improved. A traditional mode that a yellow film is attached to a lead frame through a roller is changed, extrusion of film attaching equipment on the lead frame is reduced, the periphery of the lead frame serves as a pressure stress face, a middle chip and a lead part are not subjected to external force, and therefore the adverse effect of the film attaching procedure on the chip can be effectively avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor lead frame film pasting, in particular to a lead frame pressing mechanism. Background Art

[0002] In the existing lead frame laminating process, the lead frame is fixed on the frame fixing mechanism during the laminating process, and the roller of the laminating mechanism rolls the yellow film from top to bottom to fit the lead frame. With such a structure, the roller will inevitably put pressure on the chip on the lead frame, which will have a certain probability of damaging the chip in the frame and reducing the yield rate. Therefore, it is necessary to improve the problems of the laminating process in the lead frame laminating process. Utility Model Content

[0003] The utility model aims to provide a lead frame pressing mechanism to solve the problem that the existing film laminating equipment squeezes the lead frame and causes a high chip defect rate.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A lead frame pressing mechanism, comprising:

[0006] A conveying mechanism, the conveying mechanism comprising a transport assembly and a lifting assembly, the transport assembly being connected to the lifting assembly;

[0007] A pressing assembly, the pressing assembly being movably connected to the lifting assembly;

[0008] A pressing plate is arranged at the bottom of the pressing assembly.

[0009] In this solution, by setting a pressing mechanism, the lead frame is attached to the film attaching platform from top to bottom, and the interaction force between the pressing plate and the film attaching platform is adjustable, because the descent of the pressing plate is controlled by the lifting component, and the pressure can be controlled by adjusting the lifting component. This overcomes the defect of the prior art that the film attaching roller squeezes the lead frame, resulting in a high chip defect rate.

[0010] Preferably, the conveying assembly includes a supporting portion, a first driving component, a synchronous belt, two synchronous wheels, a guide rail and a first mounting base plate, the two synchronous wheels are connected to the supporting portion for rotation at intervals; the synchronous belt is sleeved between the two synchronous wheels, one of the synchronous wheels is connected to an output end of the first driving component provided on the supporting portion, the guide rail is provided on the supporting portion, the guide rail is slidably provided with a slider, the slider is connected to the synchronous belt, and the first mounting base plate is connected to the slider.

[0011] Preferably, the lifting assembly includes a base plate, a second driving component, a first substrate, a second substrate and a first guide shaft, the base plate is connected to the first mounting substrate, the output end of the second driving component is connected to the second substrate, and the fixed end of the second driving component is connected to the base plate; one end of the first guide shaft is connected to the first substrate, and the other end is connected to the second substrate.

[0012] In this solution, since the bottom plate is connected to the first mounting substrate, and the first mounting substrate is connected to the slider, the sliding of the slider drives the lifting assembly to move, thereby indirectly driving the lead frame to move. Since the output end of the second driving component is connected to the second substrate, one end of the first guide shaft is connected to the first substrate, and the other end is connected to the second substrate, the second driving component drives the first substrate to move up and down, thereby realizing the lifting and lowering of the pressing mechanism.

[0013] Preferably, the lifting assembly further includes a rotating mechanism, and the other end of the first guide shaft is connected to the first substrate via the rotating mechanism.

[0014] In this solution, the rotating mechanism is connected to the first substrate and can be used to adjust the head and tail positions of the lead frame.

[0015] Preferably, the lifting assembly further comprises an adjusting block, the adjusting block is detachably arranged on the first substrate, a mounting hole is arranged on the adjusting block, and the pressing assembly is connected to the adjusting block.

[0016] Preferably, the pressing assembly includes a third driving unit, a mounting base, a second mounting substrate, a plurality of second guide shafts, a connecting rod and a clamping jaw, the second mounting substrates are respectively connected to two sides of the mounting base, the bottom of the mounting base is connected to the pressing plate, and the second mounting substrate is connected to the first substrate of the lifting assembly; the third driving unit is connected to the mounting base or the first substrate of the lifting assembly; two symmetrical mounting cavities are formed between the second mounting substrate and the mounting base, a plurality of second guide shafts are arranged in the corresponding mounting cavities at intervals, the connecting rod is movably inserted into the corresponding second guide shaft, the clamping jaw is connected to the connecting rod, the connecting rod is provided with a connecting column, and the connecting column is connected to the output end of the third driving unit.

[0017] In this solution, the third driving unit drives the connecting rod, and the connecting rod drives the clamping claw to open and close the clamping claw, thereby enabling the clamping claw to clamp the lead frame.

[0018] Preferably, the pressing assembly further comprises a first elastic member, one end of the first elastic member is connected to the corresponding second mounting substrate, and the other end of the first elastic member is connected to the corresponding connecting rod.

[0019] Preferably, the pressing assembly also includes a frame positioning rod, the pressing assembly also includes a frame positioning rod, the frame positioning rod is movably inserted into the pressure plate, a protrusion is provided on the frame positioning rod, a second elastic member is movably inserted into the frame positioning rod, and the second elastic member cooperates with the protrusion.

[0020] In this solution, the frame positioning rod cooperates with the first positioning hole on the lead frame to achieve high-precision positioning of the press-fit assembly on the lead frame.

[0021] Preferably, the pressing assembly further comprises a guiding mechanism, and the guiding mechanism is arranged on the corresponding second mounting substrate.

[0022] In this solution, the guide mechanism cooperates with the guide positioning groove on the film pasting platform to achieve high-precision positioning of the pressing mechanism and the film pasting platform.

[0023] Preferably, the pressing assembly further comprises a first positioning hole, which is arranged on the mounting base and is adapted to the mounting hole.

[0024] Preferably, a mounting groove is provided on the mounting substrate, and the first substrate is connected to the second mounting substrate through the mounting groove.

[0025] In this solution, the first substrate of the lifting assembly is inserted into the installation groove of the pressing assembly, so that the pressing assembly can be replaced quickly.

[0026] Preferably, a limiting block is provided at one end of the second mounting substrate, and the limiting block is detachably connected to the one end of the second mounting substrate.

[0027] In this solution, the first substrate of the lifting assembly is inserted into the mounting groove of the pressing assembly, the mounting hole on the adjusting block of the lifting assembly is aligned with the first positioning hole of the pressing assembly, and a pin or screw is inserted. At this time, the limit block is installed on the second mounting substrate, and the matching clearance between the positioning block and the first substrate of the lifting assembly is confirmed. If there is a gap, adjust the gap between the adjusting block and the first substrate. After confirmation, fix the adjusting block to complete the installation and matching.

[0028] The beneficial effects of the pressing mechanism of the utility model are specifically embodied in:

[0029] In this solution, the yellow film does not move, and the lead frame is attached to the film attaching platform from top to bottom. The clamp only has an upward lifting force on the lead frame, and the lead frame's own gravity is used to achieve film attaching, which changes the traditional method of keeping the lead frame stationary and using rollers to attach the yellow film to the lead frame, thereby reducing the squeezing of the lead frame by the film attaching equipment.

[0030] In this solution, the four sides of the lead frame serve as pressure-bearing surfaces, and the middle chip and lead parts are not subjected to external forces, which can effectively avoid the adverse effects of the film bonding process on the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the lead frame pressing mechanism of the utility model;

[0032] Figure 2 It is a structural schematic diagram of the lifting assembly of the utility model;

[0033] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0034] Figure 4 It is a schematic diagram of the first three-dimensional structure of the pressing assembly of the utility model;

[0035] Figure 5 It is a second three-dimensional structural schematic diagram of the pressing assembly of the utility model;

[0036] Figure 6 It is a structural schematic diagram of the film sticking platform of the utility model;

[0037] Figure 7 It is a schematic diagram of positioning and clamping the lead frame of the utility model;

[0038] Figure 8 It is a cross-sectional view of the position of the frame positioning rod of the utility model;

[0039] Fig. 9 The structure of the pressing plate of the utility model is shown in FIG. Figure 1 ;

[0040] Fig.10 for Fig. 9 Middle AA section view;

[0041] Fig.11 The structure of the pressing plate of the utility model is shown in FIG. Figure 2 ;

[0042] Fig.12 for Fig.11 EE section view. DETAILED DESCRIPTION

[0043] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It is also necessary to explain that, for ease of description, only the parts related to the utility model are illustrated in the accompanying drawings.

[0044] like Figure 1-Figure 5As shown, the lead frame pressing mechanism provided by the present application includes:

[0045] A transport component 1, a lifting component 2, a pressing component 3 and a pressing plate 4.

[0046] Specifically, the lifting assembly 2 is connected to the conveying assembly 1, the pressing assembly 3 is detachably connected to the bottom of the lifting assembly 2, and the pressing plate 4 is arranged at the bottom of the pressing assembly 3. The pressing assembly 3 grabs the lead frame, the conveying assembly 1 conveys the lead frame to the top of the film laminating platform, and the lifting assembly 2 laminates the lead frame with the yellow film on the film laminating platform from top to bottom. After the film laminating is completed, the lifting assembly 2 is lifted, and the conveying assembly 1 conveys the lead frame to the next process.

[0047] In one embodiment, the transport assembly 1 includes a first drive component 11, a synchronous belt 12, a synchronous wheel 13, a guide rail 14 and a first mounting substrate 15. The first drive component 11 can be a motor, the synchronous belt 12 is wound around two synchronous wheels 13, the output end of the first drive component 11 is connected to one of the synchronous wheels, the guide rail 14 is arranged on the equipment mounting bracket, a slider 16 is slidably arranged on the guide rail 14, the first mounting substrate 15 is connected to the slider 16, the synchronous belt 12 is connected to the slider 16, the first drive component 11 drives the corresponding synchronous wheel to rotate, and then drives the synchronous belt 12 to move, and then drives the slider 16 to slide back and forth on the guide rail 14, and drives the first mounting substrate 15 to move back and forth, so as to realize the transportation of the lead frame. In one embodiment, as Figure 2-Figure 3 As shown, the lifting assembly 2 includes a second driving component 21, a first substrate 22, a second substrate 23 and a first guide shaft 25. The second driving component 21 can be a cylinder. The output end of the second driving component 21 is connected to the second substrate 23, and the fixed end of the second driving component 21 is connected to the bottom plate 26 of the lifting assembly 2. One end of the first guide shaft 25 is connected to the second substrate 23, and the other end is connected to the first substrate 22. The lead frame is lifted up and down by the extension and retraction of the second driving component 21.

[0048] Preferably, the lifting assembly 2 also includes a guide sleeve 24, which is disposed on a bottom plate 26 of the lifting assembly 2, and a first guide shaft 25 is slidably connected to the guide sleeve 24, so that the lifting assembly 2 can achieve linear up and down motion by guiding the first guide shaft 25 by the guide sleeve 24.

[0049] Furthermore, it also includes a rotating mechanism 27, which includes a rotating motor (not shown in the figure), a fixed end 271 and a rotating end 272. The rotating motor is arranged on the other end of the first guide shaft through the fixed end 271, and the rotating end 272 is connected to the output end of the rotating motor, and the rotating end 272 is connected to the first substrate 22; the rotating motor works to drive the rotating disk 272 to rotate; the rotating mechanism 27 is used to adjust the head and tail position of the lead frame, that is, to rotate the lead frame 180°.

[0050] Furthermore, the lifting assembly 2 also includes an adjustment block 29, which is detachably disposed at one end of the first substrate 22. The adjustment block 29 is provided with a mounting hole, and an elastic pin or screw can be fixedly installed with the pressing assembly 3 through the mounting hole.

[0051] In one embodiment, Figure 4 As shown, the pressing assembly 3 includes a third driving unit 28, a mounting base 31, a second mounting substrate 32, a plurality of second guide shafts 33, a connecting rod 34 and a clamping claw 35. Both sides of the mounting base 31 are respectively connected to the second mounting substrate 32, and the bottom of the mounting base 31 is connected to the pressing plate 4.

[0052] The third drive unit 28 is arranged at the bottom of the first substrate 22 or on the pressing assembly 3. The third drive unit 28 can be a cylinder. Preferably, the third drive unit 28 is a finger cylinder. It should be noted that the third drive unit 28 can be installed on the lifting assembly 2 or on the pressing assembly 3. The installation position of the third drive unit 28 does not affect the problem solved and the effect achieved in this solution.

[0053] Furthermore, a mounting groove 36 is further provided on the second mounting substrate 32 , and the first substrate 22 can be inserted into the mounting groove 36 , so as to realize quick-release installation and removal of the lifting assembly 2 and the pressing assembly 3 .

[0054] Two symmetrically arranged mounting cavities are formed between the mounting base 31 and the second mounting substrate 32. The second guide shaft 33 is arranged in the corresponding mounting cavity at intervals. The connecting rod 34 is movably arranged on the second guide shaft 33 and can slide along the guide shaft 33. Two connecting rods 34 are arranged symmetrically. A connecting column 37 is also arranged on the connecting rod 34. The output end of the third driving unit 28 clamps the connecting column 37. When the third driving unit 28 is a finger cylinder, the two output ends of the finger cylinder move to both sides respectively, driving the corresponding connecting rod to move to both sides. The clamp 35 is connected to the connecting rod 34, and then drives the clamp 35 to open and close, so as to grasp the lead frame. When the third driving unit 28 is installed on the first substrate 22 of the lifting assembly 2, during the process of inserting the first substrate 22 into the mounting groove 36, the output end of the third driving unit 28 clamps the connecting column 37 along the direction of movement of the first substrate 22.

[0055] Furthermore, the pressing assembly 3 also includes a first elastic member 38, which can be a spring. One end of the first elastic member 38 is connected to the corresponding connecting rod 34, and the other end is connected to the corresponding second mounting substrate 32. During the opening and closing process of the clamping jaws 35, the first elastic member 38 can effectively limit and buffer, so that the clamping jaws 35 can grasp the lead frame more compactly.

[0056] Furthermore, a first positioning hole 301 is provided on the mounting base 31, and the first positioning hole 301 is adapted to the mounting hole on the adjusting block 29. The first substrate 22 of the lifting assembly 2 is inserted into the mounting groove 36 of the pressing assembly, and the mounting hole on the adjusting block 29 of the lifting assembly 2 is aligned with the first positioning hole 301 of the pressing assembly 3, and a pin or screw is inserted for fixed installation.

[0057] Furthermore, a limit block 302 is detachably provided at one end of the second mounting substrate 32. First, the limit block 302 is removed, the first substrate 22 is inserted into the mounting groove 36, the mounting hole on the adjustment block 29 is aligned with the first positioning hole 301, and a pin or a screw is inserted. At this time, the limit block 302 is installed on the second mounting substrate 32, and the matching clearance between the limit block 302 and the first substrate 22 is confirmed. If there is a clearance, the clearance between the adjustment block 29 and the first substrate 22 is adjusted. After confirmation, the adjustment block 29 is fixed to complete the installation and matching.

[0058] In one embodiment, Figure 5-Figure 8 As shown, the pressing assembly 3 also includes a plurality of frame positioning rods 303. Specifically, a protrusion 3031 is provided on the positioning rod 303, and a second elastic member 3032 is also penetrated on the positioning rod 303, and the second elastic member 3032 can be a spring. A mounting seat 307 for the positioning rod is provided on the pressing plate 4, and the positioning rod 303 is movably penetrated between the pressing plate 4 and the mounting seat 307, and the protrusion 3031 is in movably contact with the bottom of the mounting seat 307, and a cavity is provided in the mounting seat 307, and the cavity can accommodate the second elastic member 3032, and the second elastic member 3032 is located at the inner top of the protrusion 3031 and the cavity, and the second elastic member 3032 is used for elastic reset of the positioning rod 303; a limiting groove adapted to the positioning rod 303 is also provided on the pressing plate 4, and the limiting groove allows the lower part of the protrusion 3031 of the positioning rod 303 to pass through. The positioning rod 303 is adapted to the second positioning hole 304 on the lead frame. When the clamping jaw 35 clamps the lead frame, if the lead frame is in the correct position, the positioning rod 303 will pass through the second positioning hole 304 of the lead frame. If the lead frame is offset, the positioning rod 303 will be lifted up and limited by the upper end of the mounting seat 307. When the grasping position or angle is readjusted, the positioning rod 303 can be reset with the cooperation of the protrusion 3031, the second elastic member 3032 and the mounting seat 307 until the positioning rod 303 passes through the second positioning hole 304, thereby achieving high-precision positioning of the lead frame by the pressing assembly 3.

[0059] Furthermore, a guiding mechanism is provided on the second mounting substrates 32 on both sides, and the guiding mechanism includes a plurality of guiding blocks 306, and the guiding blocks 306 are adapted to the guiding positioning grooves 305 on the lead frame. When the pressing assembly 3 attaches the lead frame to the film-sticking platform from top to bottom, the guiding blocks 306 and the guiding positioning grooves 305 cooperate to achieve high-precision positioning and hard limiting of the pressing mechanism and the film-sticking platform.

[0060] Further, such as Figure 9-12 As shown, the pressing plate 4 arranged at the bottom of the mounting base 31 has four surrounding frames 42 higher than the pressing plate surface 41. After the clamping claws 35 clamp the lead frame, only the four surrounding frames of the pressing plate 4 are in contact with the lead frame frame, and a cavity is formed between the pressing plate 4 and the lead frame. When the lead frame is pressed onto the film laminating platform, only the four surrounding frames exert force on the lead frame frame, and the chip portion in the middle of the lead frame is not subjected to any force.

[0061] When in use, first, remove the limit block 302, insert the first substrate 22 into the mounting groove 36, align the mounting hole on the adjustment block 29 with the first positioning hole 301, insert a pin or a screw, and then install the limit block 302 on the second mounting substrate 32, confirm the matching clearance between the limit block 302 and the first substrate 22, if there is a gap, adjust the gap between the adjustment block 29 and the first substrate 22, and after confirmation, fix the adjustment block 29 to complete the installation. The pressing mechanism 3 clamps the lead frame from the feeding mechanism, the two output ends of the finger cylinder open, driving the connecting rod 34 to open the clamping claw 35, the movable end of the second driving component 21 of the lifting assembly 2 shrinks, driving the pressing assembly 3 to descend to the frame position, the two output ends of the finger cylinder tighten, driving the connecting rod 34 to close the clamping claw 35, at this time, the positioning rod 303 completes the positioning of the lead frame, the movable end of the second driving component 21 extends, driving the pressing assembly 3 to rise to the set position; the first driving component 11 of the conveying assembly 1 transports the pressing assembly 3 to the set film pasting position. After the lead frame is transported to the film pasting position, the movable end of the second driving component 21 shrinks, driving the pressing assembly 3 to descend, and the clamping claw 35 does not open during the process. After the frame is lowered to the film pasting platform, the positioning and limiting of the pressing assembly 3 and the film pasting platform are completed by the guide block 306, and the interaction force between the pressing plate 4 and the film pasting platform completes the film pasting of the frame; after the film pasted lead frame is lifted, it is transported to the subsequent process by the conveying assembly 1.

[0062] During the transportation of the lead frame, the only external force on the lead frame is the lifting force of the clamp 35, so the frame itself will not be squeezed by external force. In the laminating design of the laminating mechanism, the pressing plate 4 only serves as the pressure-bearing surface for the four sides of the frame, and the middle chip and lead wire are not subjected to external force, which can effectively avoid the adverse effects of the laminating process on the chip.

[0063] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0064] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0065] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0066] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A lead frame pressing mechanism, characterized in that: It includes: A conveying mechanism, the conveying mechanism comprising a transport assembly and a lifting assembly, the transport assembly being connected to the lifting assembly; A pressing assembly, wherein the pressing assembly is movably connected to the lifting assembly; A pressing plate is arranged at the bottom of the pressing assembly.

2. A lead frame pressing mechanism as claimed in claim 1, characterized in that: The conveying assembly includes a supporting part, a first driving component, a synchronous belt, two synchronous wheels, a guide rail and a first mounting base plate, the two synchronous wheels are connected to the supporting part and rotate at intervals; the synchronous belt is sleeved between the two synchronous wheels, one of the synchronous wheels is connected to the output end of the first driving component provided on the supporting part, the guide rail is provided on the supporting part, the guide rail is slidably provided with a slider, the slider is connected to the synchronous belt, and the first mounting base plate is connected to the slider.

3. A lead frame pressing mechanism as claimed in claim 2, characterized in that: The lifting assembly includes a base plate, a second driving component, a first substrate, a second substrate and a first guide shaft. The base plate is connected to the first mounting substrate, the output end of the second driving component is connected to the second substrate, and the fixed end of the second driving component is connected to the base plate; one end of the first guide shaft is connected to the first substrate, and the other end is connected to the second substrate.

4. A lead frame pressing mechanism as claimed in claim 3, characterized in that: The lifting assembly further includes a rotating mechanism, and the other end of the first guide shaft is connected to the first substrate through the rotating mechanism.

5. A lead frame pressing mechanism as claimed in claim 3, characterized in that: The lifting assembly further comprises an adjusting block, which is detachably arranged on the first substrate, and is provided with a mounting hole, and the pressing assembly is connected to the adjusting block.

6. A lead frame pressing mechanism as claimed in claim 5, characterized in that: The pressing assembly includes a third driving unit, a mounting base, a second mounting substrate, a plurality of second guide shafts, a connecting rod and a clamping jaw, the second mounting substrates are respectively connected to two sides of the mounting base, the bottom of the mounting base is connected to the pressing plate, and the second mounting substrate is connected to the first substrate of the lifting assembly; the third driving unit is connected to the mounting base or the first substrate of the lifting assembly; two symmetrical mounting cavities are formed between the second mounting substrate and the mounting base, a plurality of second guide shafts are arranged in the corresponding mounting cavities at intervals, the connecting rod is movably inserted into the corresponding second guide shaft, the clamping jaw is connected to the connecting rod, the connecting rod is provided with a connecting column, and the connecting column is connected to the output end of the third driving unit.

7. A lead frame pressing mechanism as claimed in claim 6, characterized in that: The pressing assembly further includes a first elastic member, one end of which is connected to the corresponding second mounting substrate, and the other end of which is connected to the corresponding connecting rod.

8. A lead frame pressing mechanism as claimed in claim 6, characterized in that: The pressing assembly also includes a frame positioning rod, which is movably inserted into the pressing plate, and is provided with a protrusion. A second elastic member is movably inserted into the frame positioning rod, and the second elastic member cooperates with the protrusion.

9. A lead frame pressing mechanism as claimed in claim 6, characterized in that: The pressing assembly further includes a guiding mechanism, and the guiding mechanism is arranged on the corresponding second mounting substrate.

10. The lead frame pressing mechanism according to claim 6, characterized in that: The pressing assembly further comprises a first positioning hole, which is arranged on the mounting base and is adapted to the mounting hole.

11. A lead frame pressing mechanism as claimed in claim 6, characterized in that: The second mounting substrate is provided with a mounting groove, and the first substrate is connected to the second mounting substrate through the mounting groove.

12. The lead frame pressing mechanism according to claim 6, characterized in that: A limiting block is disposed at one end of the second mounting substrate, and the limiting block is detachably connected to one end of the second mounting substrate.

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