Wafer taking vacuum pipeline equipment of wafer bearing table

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to wafer taking vacuum pipeline equipment for a wafer bearing table. The wafer taking vacuum pipeline equipment of the wafer bearing platform comprises a bearing platform, a first pipeline, a second pipeline, a third pipeline, a vacuum control valve and a three-way control valve, the second pipeline can be used as a pipeline for vacuum transportation, so that a vacuum adsorption pipeline is formed by the bearing platform, the first pipeline, the three-way control valve and the second pipeline, and the wafer can be adsorbed on the bearing platform; one end of the third pipeline is connected with the three-way control valve; and the other end of the third pipeline is configured to serve as an input pipeline of inert gas, so that a neutralization pipeline is formed by the third pipeline, the three-way control valve, the first pipeline and the bearing platform, and the negative pressure in the bearing platform and the first pipeline is reduced. Therefore, the wafer on the bearing platform can be simply and quickly taken down, and the wafer bearing platform and the wafer are prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer carrying table wafer taking vacuum pipeline equipment. Background Art

[0002] In photolithography equipment, the wafer is vacuum-adsorbed on the wafer carrier for precision alignment and exposure. Figure 1 As can be seen in the figure, the sealing pipe 13 under the carrier 12 can provide a continuous vacuum, so that the wafer 11 can be adsorbed on the carrier 12. A vacuum solenoid valve 14 is provided on the sealing pipe 13 to cut off or open the negative adsorption pressure on the carrier 12.

[0003] During the wafer processing, abnormal conditions may cause particle contamination on the back of the wafer or wafer warping. Particle contamination on the back of the wafer and wafer warping will cause the vacuum value of the wafer on the wafer carrier of the lithography machine to be less than the machine setting value, which will cause the processing machine to alarm and stop running. At this time, the vacuum solenoid valve that provides vacuum to the wafer carrier is in the off state, and there is vacuum in the sealed pipe so that the wafer can continue to be adsorbed on the wafer carrier. In order to resume operation, it is necessary to check and / or replace the wafer on the carrier.

[0004] In the prior art, when manually removing a wafer, the wafer is tightly attached to the carrier due to vacuum adsorption force, so a blade-like tool is needed to pry the wafer open to release the vacuum before manually removing it. Such operation easily causes the risk of sharp objects damaging the wafer carrier and causing damage to the wafer. Utility Model Content

[0005] The purpose of the utility model includes, for example, providing a wafer carrier platform film removal vacuum pipeline device, which can simply and quickly realize the removal operation of the wafer on the carrier platform and avoid damage to the wafer carrier platform and the wafer.

[0006] The embodiments of the present invention can be implemented as follows:

[0007] In a first aspect, the utility model provides a wafer carrying table fetching vacuum pipeline device, comprising:

[0008] A carrying platform, a first pipeline, a second pipeline, a third pipeline, a vacuum control valve and a three-way control valve;

[0009] The carrying platform is connected to the three-way control valve via a first pipeline;

[0010] One end of the second pipeline is connected to the three-way control valve; the other end is configured as a pipeline that can be used as a vacuum transport, so that a vacuum adsorption pipeline is formed from the carrying platform, the first pipeline, the three-way control valve, and the second pipeline, and the wafer can be adsorbed on the carrying platform;

[0011] One end of the third pipeline is connected to the three-way control valve; the other end is configured to be able to serve as an input pipeline for inert gas, so that a neutralization pipeline is formed from the third pipeline, the three-way control valve, the first pipeline, and the supporting platform to reduce the negative pressure in the supporting platform and the first pipeline.

[0012] In an optional embodiment, the three-way control valve includes a valve body, a valve core, a first port, a second port and a third port;

[0013] The first port is connected to the first pipeline, the second port is connected to the second pipeline, and the third port is connected to the third pipeline;

[0014] The valve core is movably disposed in the valve body to connect the first port with the second port, or to connect the first port with the third port.

[0015] In an optional embodiment, the third pipe is configured as an input channel for nitrogen.

[0016] In an optional embodiment, a vacuum pump is further included, and the vacuum pump is arranged at the end of the second pipeline away from the three-way control valve.

[0017] In an optional embodiment, it further includes a storage tank and an air pump; the storage tank is disposed at the end of the third pipeline away from the three-way control valve through the air pump; the storage tank is configured to store the inert gas.

[0018] In an optional embodiment, a flow regulating valve is further included, and the flow regulating valve is arranged on the third pipeline.

[0019] In an optional embodiment, the first pipeline and the second pipeline have the same diameter.

[0020] In an optional embodiment, the first pipe and the second pipe are both 1 / 4 pipes.

[0021] In an optional embodiment, the diameter of the third pipeline is smaller than the diameter of the first pipeline.

[0022] In an optional embodiment, the third pipe is a 1 / 8 pipe.

[0023] The beneficial effects of the embodiments of the present utility model include, for example:

[0024] The wafer carrier table fetching vacuum pipeline equipment of this scheme includes a carrier platform, a first pipeline, a second pipeline, a third pipeline, a vacuum control valve and a three-way control valve. Among them, the second pipeline can be used as a pipeline for vacuum transportation, so that a vacuum adsorption pipeline is formed from the carrier platform, the first pipeline, the three-way control valve, and the second pipeline, so as to ensure that the wafer adsorption operation of the carrier platform can operate stably. At the same time, the third pipeline can be used as an input pipeline for inert gas, so that a neutralization pipeline is formed from the third pipeline, the three-way control valve, the first pipeline, and the carrier platform to reduce the negative pressure in the carrier platform and the first pipeline. When the third pipeline is connected to the first pipeline through the three-way control valve, the vacuum adsorption force in the first pipeline is released, that is, the first pipeline and the carrier platform are both in a vacuum release state, which allows the wafer to be directly removed from the carrier platform. Thereby improving the situation in the prior art that a blade-like tool is needed to pry open the wafer to release the vacuum and then manually remove it, and it is easy to cause damage to the wafer and the carrier platform, and ensure the integrity of the carrier platform and the wafer. In summary, such wafer carrier table wafer taking vacuum pipeline equipment has a simple structure, is easy to operate, and has better stability and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of an existing vacuum pipeline;

[0027] Figure 2 This is a schematic diagram of the structure of the wafer loading platform vacuum pipeline equipment of the embodiment of the utility model;

[0028] Figure 3 This is a schematic diagram of the structure of a three-way control valve of a wafer loading platform fetching vacuum pipeline device according to an embodiment of the utility model;

[0029] Figure 4 This is a schematic structural diagram of another state of the three-way control valve of the wafer loading platform vacuum pipeline equipment of the embodiment of the utility model.

[0030] Icons: 11-wafer; 12-carrying platform; 13-sealed pipe; 14-vacuum solenoid valve; 21-wafer; 100-carrying platform; 210-first pipe; 220-second pipe; 230-third pipe; 300-vacuum control valve; 400-three-way control valve; 401-valve body; 402-valve core; 410-first port; 420-second port; 430-third port; 500-flow regulating valve. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.

[0035] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0036] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0037] Please refer to Figure 2The present embodiment provides a wafer carrying platform fetching vacuum pipeline device, including a carrying platform 100, a first pipeline 210, a second pipeline 220, a third pipeline 230, a vacuum control valve 300 and a three-way control valve 400.

[0038] The carrying platform 100 is connected to the three-way control valve 400 through the first pipeline 210;

[0039] One end of the second pipeline 220 is connected to the three-way control valve 400; the other end is configured as a pipeline that can be used as a vacuum transport, so that a vacuum adsorption pipeline is formed from the carrying platform 100, the first pipeline 210, the three-way control valve 400, and the second pipeline 220, and the wafer 21 can be adsorbed on the carrying platform 100;

[0040] One end of the third pipeline 230 is connected to the three-way control valve 400; the other end is configured to be able to serve as an input pipeline for inert gas, so that a neutralization pipeline is formed from the third pipeline 230, the three-way control valve 400, the first pipeline 210, and the supporting platform 100 to reduce the negative pressure in the supporting platform 100 and the first pipeline 210.

[0041] The second pipeline 220 of the wafer carrier table fetching vacuum pipeline equipment of this solution can be used as a pipeline for vacuum transportation, so that a vacuum adsorption pipeline is formed from the carrier platform 100, the first pipeline 210, the three-way control valve 400, and the second pipeline 220, so as to ensure that the adsorption operation of the wafer 21 of the carrier platform 100 can be stably operated. The third pipeline 230 can be used as an input pipeline for inert gas, so that a neutralization pipeline is formed from the third pipeline 230, the three-way control valve 400, the first pipeline 210, and the carrier platform 100 to reduce the negative pressure in the carrier platform 100 and the first pipeline 210. When the third pipeline 230 is connected to the first pipeline 210 through the three-way control valve 400, the vacuum adsorption force in the first pipeline 210 is released, that is, the first pipeline 210 and the carrier platform 100 are both in a vacuum release state, which allows the wafer 21 to be directly removed from the carrier platform 100.

[0042] An optional operation mode is: when manual film removal is required, the three-way valve is manually opened and closed;

[0043] In the open state, positive pressure nitrogen is introduced into the first pipe 210 to quickly achieve vacuum neutralization in the first pipe 210, and the vacuum of the wafer 21 carrying platform 100 and the wafer 21 is released;

[0044] When turned off, it switches back to the initial normal state. At this time, the wafer 21 carrier platform 12 and the wafer 21 are still in a vacuum release state, and the wafer 21 on the carrier platform 100 can be directly taken away.

[0045] This improves the existing technology, which requires the use of blade tools to pry the wafer 21 open to release the vacuum and then manually remove it, which is easy to cause damage to the wafer 21 and the carrier platform 100, and ensures the integrity of the carrier platform 100 and the wafer 21. At the same time, such a wafer carrier table film removal vacuum pipeline equipment can add a three-way valve and a flow control valve 500 to the existing structure without changing the original pipeline direction, with relatively small changes and low costs; the operation of film removal is simple and convenient, greatly improving the safety of film removal; it is suitable for all manual film removal pipeline modifications in the case of vacuum not being released.

[0046] Please continue reading Figure 2 , Figure 3 and Figure 4 , more structural details of the wafer loading platform vacuum pipeline equipment can be seen from the figure. Optionally, the three-way control valve 400 is a manual valve with a switch handle that can realize manual switching of the opening. The vacuum control valve 300 is a solenoid valve.

[0047] Further, in this embodiment of the utility model, the three-way control valve 400 includes a valve body 401, a valve core 402, a first port 410, a second port 420 and a third port 430; the first port 410 is connected to the first pipeline 210, the second port 420 is connected to the second pipeline 220, and the third port 430 is connected to the third pipeline 230; the valve core 402 is movably arranged in the valve body 401 to connect the first port 410 with the second port 420, or to connect the first port 410 with the third port 430. That is, the three-way control valve 400 is only used to switch the first port 410 to be connected to any one of the second port 420 and the third port 430. In this way, it is ensured that the first channel can be connected to the second pipeline 220 or the third pipeline 230 respectively.

[0048] Optionally, in this embodiment of the present invention, the third pipeline 230 is configured as an input channel for nitrogen. It is not difficult to understand that in other embodiments of the present invention, the third pipeline 230 can also input other types of inert gases, which is just an example.

[0049] In this embodiment of the utility model, the wafer loading platform fetching vacuum pipeline equipment further includes a vacuum pump, which is arranged at the end of the second pipeline 220 away from the three-way control valve 400. The vacuum pump is used to generate suction on the second pipeline 220 to form a negative pressure, thereby ensuring the continuity and stability of the vacuum adsorption pipeline.

[0050] In this embodiment of the utility model, the wafer loading platform fetching vacuum pipeline equipment further includes a storage tank and an air pump; the storage tank is disposed at the end of the third pipeline 230 away from the three-way control valve 400 through the air pump; the storage tank is configured to store inert gas. The air pump can quickly and efficiently input the inert gas in the storage tank into the first pipeline 210, thereby quickly releasing the vacuum in the first pipeline 210, thereby facilitating the removal of the wafer 21 on the loading platform 100.

[0051] In this embodiment of the utility model, the wafer carrier table fetching vacuum pipeline equipment also includes a flow control valve 500, and the flow control valve 500 is arranged on the third pipeline 230. The flow control valve 500 can meet the appropriate flow control, so as to ensure that the time difference of manual opening and closing by different personnel will not affect the machine (such as excessive flow pressure, the positive pressure after dilution of the vacuum will blow off the wafer 21 on the wafer carrier table 12). The positive pressure of the nitrogen flow itself realizes the rapid release of the vacuum negative pressure sealed in the pipeline after neutralization.

[0052] In this embodiment of the utility model, the first pipe 210 and the second pipe 220 have the same diameter. In this way, the negative pressure in the vacuum adsorption pipeline formed by the first pipe 210 and the second pipe 220 is smoother. Optionally, the first pipe 210 and the second pipe 220 are both 1 / 4 pipes. It should be noted that the 1 / 4 pipe is a pipe diameter commonly used in the art, that is, a 2-point pipe.

[0053] In this embodiment of the utility model, the diameter of the third pipeline 230 is smaller than the diameter of the first pipeline 210. This avoids the large diameter causing the inert gas to be filled into the first pipeline 210 too quickly, causing the wafer 21 to be blown off; and avoids the negative pressure in the first pipeline 210 to be released too quickly, and the negative pressure adsorption force is small when the three-way control valve 400 is switched to the second pipeline 220. Optionally, the third pipeline 230 is a 1 / 8 pipeline. It should be noted that the 1 / 8 pipeline is a commonly used pipeline caliber in this field, which is explained in detail in the industry specifications and will not be described in detail.

[0054] Here’s how it works:

[0055] Based on the prior art, a three-way control valve 400 is added to the vacuum pipeline connected to the receiving platform. The three-way control valve 400 has three openings, namely, a first opening 410, a second opening 420 and a third opening 430, each of which is connected to a pipeline.

[0056] When the machine is operating normally, the valve of the three-way control valve 400 makes the first port 410 and the second port 420 communicate with each other, so that the first pipeline 210 and the second pipeline 220 are connected to normally adsorb the wafer 21;

[0057] When the machine alarm is abnormal, the vacuum control valve 300 of the machine will be automatically closed, that is, the second pipeline 220 is disconnected at this time, and the first pipeline 210 and the carrying platform 100 cannot obtain continuous vacuum adsorption and cannot maintain negative pressure for a long time.

[0058] When a vacuum alarm occurs, you only need to manually open and then close the three-way control valve 400 (about 2-4 seconds). Specifically, the third port 430 is connected to the first port 410, and nitrogen enters the first channel from the third channel; the introduced nitrogen is connected for 1-2 seconds and then switched back to the second port 420 and the first port 410. During the switching process, the introduced nitrogen can quickly neutralize the vacuum negative pressure in the first channel in 1-2 seconds, and the three-way control valve 400 immediately switches back to the initial state where the first pipeline 210 and the second pipeline 220 are connected (because the vacuum control valve 300 and the three-way control valve 400 are very close, the vacuum pipeline between them is short, and the residual vacuum inside can be ignored). Through such manual continuous opening and closing switching actions of the three-way control valve 400, the vacuum release can be guaranteed, and it can be switched to the initial state at the same time, which is convenient for the automatic recovery of the vacuum after the wafer 21 is taken away and the machine is normal, without the need for switching actions.

[0059] In summary, the embodiment of the utility model provides a wafer loading platform fetching vacuum pipeline device, which has at least the following advantages:

[0060] 1. Fast speed: external positive pressure nitrogen can release the vacuum within seconds and then perform manual operation quickly.

[0061] 2. Easy to operate: Normal continuous manual opening and closing operation of the three-way control valve 400 realizes vacuum release, and the shut-off operation is performed when it is not needed.

[0062] 3. Large adjustability: If the vacuum is not fully released, the switch handle of the three-way control valve 400 can be rotated several times between the open and closed positions to fully release the vacuum.

[0063] 4. Low cost: A three-way control valve 400 and a flow regulating valve 500 can realize the above functions.

[0064] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A wafer loading platform vacuum pipeline equipment, characterized in that: include: A carrying platform (100), a first pipeline (210), a second pipeline (220), a third pipeline (230), a vacuum control valve (300) and a three-way control valve (400); The carrying platform (100) is connected to the three-way control valve (400) via a first pipeline (210); One end of the second pipeline (220) is connected to the three-way control valve (400); the other end is configured as a pipeline capable of being used as a vacuum transport pipeline, so that a vacuum adsorption pipeline is formed from the carrying platform (100), the first pipeline (210), the three-way control valve (400), and the second pipeline (220), and the wafer (21) can be adsorbed on the carrying platform (100); One end of the third pipeline (230) is connected to the three-way control valve (400); the other end is configured to be able to serve as an input pipeline for inert gas, so that a neutralization pipeline is formed from the third pipeline (230), the three-way control valve (400), the first pipeline (210), and the supporting platform (100) to reduce the negative pressure in the supporting platform (100) and the first pipeline (210).

2. The wafer loading platform vacuum pipeline equipment according to claim 1, characterized in that: The three-way control valve (400) comprises a valve body (401), a valve core (402), a first port (410), a second port (420) and a third port (430); The first port (410) is connected to the first pipe (210), the second port (420) is connected to the second pipe (220), and the third port (430) is connected to the third pipe (230); The valve core (402) is movably disposed in the valve body (401) to connect the first port (410) and the second port (420), or to connect the first port (410) and the third port (430).

3. The wafer loading platform vacuum pipeline equipment according to claim 1, characterized in that: The third pipe (230) is configured as an input channel for nitrogen.

4. The wafer loading platform vacuum pipeline equipment according to claim 1, characterized in that: It also includes a vacuum pump, which is arranged at the end of the second pipeline (220) away from the three-way control valve (400).

5. The wafer loading platform vacuum pipeline equipment according to claim 1, characterized in that: It also includes a storage tank and an air pump; the storage tank is arranged at the end of the third pipeline (230) away from the three-way control valve (400) through the air pump; the storage tank is configured to store the inert gas.

6. The wafer loading platform vacuum pipeline equipment according to claim 1, characterized in that: It also includes a flow regulating valve (500), wherein the flow regulating valve (500) is arranged on the third pipeline (230).

7. The wafer loading platform vacuum pipeline equipment according to claim 1, characterized in that: The first pipeline (210) and the second pipeline (220) have the same diameter.

8. The wafer loading platform vacuum pipeline equipment according to claim 7, characterized in that: The first pipe (210) and the second pipe (220) are both 1 / 4 pipes.

9. The wafer loading platform vacuum pipeline equipment according to claim 7, characterized in that: The diameter of the third pipeline (230) is smaller than the diameter of the first pipeline (210).

10. The wafer loading platform vacuum pipeline equipment according to claim 9, characterized in that: The third pipe (230) is a 1 / 8 pipe.

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