Wafer limiting device and wafer limiting kit

Abstract

The utility model relates to the technical field of semiconductor manufacturing and processing, and provides a wafer limiting device and a wafer limiting suite, and the device comprises a wafer baffle ring which forms an annular region for accommodating a wafer body; the baffle ring fixing piece and the wafer baffle ring are of an annular structure which is arranged in an overlapped mode in the axial direction; and the plurality of elastic parts are uniformly distributed in the circumferential direction of the wafer baffle ring, are respectively connected with the wafer baffle ring and the baffle ring fixing piece, and are used for adjusting the relative position between the wafer baffle ring and the baffle ring fixing piece in the axial direction. According to the wafer limiting device, the plurality of elastic parts are arranged between the wafer baffle ring and the baffle ring fixing piece, so that the compatibility of the wafer limiting device is improved, the service life of the wafer carrier applying the wafer limiting device is prolonged, the risk of damage caused by radial slippage of the wafer is reduced, and the self-adaption to the thickness of the wafer carrier is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing and processing, in particular to a wafer limiting device and a wafer limiting kit. Background Art

[0002] In the semiconductor manufacturing process, in wafer transmission, laser heat treatment, laser cutting and other occasions involving wafer carriers, in order to prevent the wafer from being damaged due to radial slippage, a wafer limiter is required on the carrier to protect the wafer. On the one hand, due to the manufacturing error of the carrier thickness, the applicability of the wafer limiter is not strong; on the other hand, as the carrier is used for a longer time, in order to meet the requirements of the wafer processing process and increase the service life of the carrier, the carrier needs to be re-cleaned, polished and other refurbished operations, which also causes the carrier to be unable to fit with the carrier due to thickness deviation. Utility Model Content

[0003] The utility model provides a wafer limiting device and a wafer limiting kit, which are used to solve the problem that in the existing wafer limiting device, a wafer retaining ring and a retaining ring fixing part are fitted and connected by screws, but due to the deviation in thickness of different wafer carriers, it is impossible to ensure that the retaining ring and the wafer carrier are fully fitted; even if the retaining ring and the wafer carrier are fitted, when the wafer carrier is replaced or the existing wafer carrier is refurbished, the retaining ring and the wafer carrier cannot be guaranteed to fit.

[0004] According to the first aspect of the utility model, a wafer limiting device is provided, comprising: a wafer retaining ring, forming an annular area for accommodating a wafer body; a retaining ring fixing member, an annular structure axially superimposed on the wafer retaining ring; a plurality of elastic parts, the plurality of elastic parts are evenly distributed around the circumference of the wafer retaining ring, and are respectively connected to the wafer retaining ring and the retaining ring fixing member, so as to adjust the relative position between the wafer retaining ring and the retaining ring fixing member in the axial direction.

[0005] According to one embodiment of the utility model, the elastic part includes: a first fixing pin, a second fixing pin and an elastic member; the first fixing pin and the second fixing pin are arranged at intervals and connected by the elastic member; wherein the first fixing pin is detachably connected to the wafer retaining ring; and the second fixing pin is detachably connected to the retaining ring fixing member.

[0006] Specifically, this embodiment provides an implementation of a first fixing pin, a second fixing pin and an elastic member.

[0007] According to an embodiment of the utility model, a first accommodating groove is provided on a side of the wafer retaining ring away from the retaining ring fixing member, and a shape of the first accommodating groove is consistent with a shape of the first fixing pin.

[0008] Specifically, this embodiment provides an implementation of a first containing groove.

[0009] According to an embodiment of the utility model, a second accommodating groove is provided on a side of the retaining ring fixing member away from the wafer retaining ring, and the shape of the second accommodating groove is consistent with the shape of the second fixing pin.

[0010] Specifically, this embodiment provides an implementation of a second containing groove.

[0011] According to an embodiment of the utility model, the elastic part includes: an adjusting member and an elastic member; the adjusting member passes through the wafer retaining ring and the retaining ring fixing member in sequence, and is detachably connected to the retaining ring fixing member; the elastic member is sleeved on the outside of the adjusting member, and is respectively in contact with the adjusting member and the retaining ring fixing member.

[0012] Specifically, this embodiment provides an implementation of an elastic portion.

[0013] According to an embodiment of the utility model, it also includes: a positioning pin, which is arranged on a side of the retaining ring fixing member facing the wafer retaining ring and is plugged and matched with the positioning hole of the wafer retaining ring.

[0014] Specifically, this embodiment provides an implementation of a positioning pin.

[0015] According to an embodiment of the present utility model, at least three elastic parts are evenly distributed around the circumference between the wafer retaining ring and the retaining ring fixing member.

[0016] Specifically, this embodiment provides an implementation of an elastic portion.

[0017] According to the second aspect of the utility model, a wafer limiting kit is provided, comprising the above-mentioned wafer limiting device.

[0018] According to one embodiment of the utility model, it also includes: a wafer carrier and a carrier boss; the wafer carrier is arranged on a side of the retaining ring fixing member away from the wafer retaining ring; the carrier boss and the wafer carrier are integrally formed, at least part of the carrier boss passes through the retaining ring fixing member and abuts against the wafer retaining ring for placing the wafer body.

[0019] Specifically, this embodiment provides an implementation of a wafer carrier and a carrier boss.

[0020] According to one embodiment of the utility model, the outer diameter of the wafer retaining ring is larger than the diameter of the carrier boss; and / or the inner diameter of the wafer retaining ring is larger than the outer diameter of the wafer body, and the inner diameter of the wafer retaining ring is smaller than the diameter of the carrier boss.

[0021] Specifically, this embodiment provides an implementation of a wafer retaining ring.

[0022] According to one embodiment of the utility model, it also includes: a plurality of connecting parts, which are evenly distributed around the circumference of the wafer carrier, and sequentially pass through the wafer retaining ring, the retaining ring fixing part and a part of the wafer carrier, so as to realize a detachable connection between the retaining ring fixing part and the wafer carrier.

[0023] Specifically, this embodiment provides an implementation of a connecting piece.

[0024] The above one or more technical solutions in the present invention have at least one of the following technical effects: the utility model provides a wafer limiting device, which realizes the adjustment of the axial position by arranging multiple elastic parts between the wafer retaining ring and the retaining ring fixing part, eliminates the fitting gap between the wafer retaining ring and the carrier caused by manufacturing or loss errors, and can prevent the wafer from slipping into the gap of the wafer retaining ring or getting stuck in the gap, thereby improving the compatibility of the wafer limiting device and the service life of the wafer carrier using the wafer limiting device, reducing the risk of damage to the wafer due to radial slippage, and realizing adaptive wafer carrier thickness.

[0025] The utility model provides a wafer limiting device and a wafer limiting kit, which extend the service life of the wafer carrier by applying the wafer limiting device, and at the same time improve the compatibility of the wafer limiting device, reduce the types of wafer limiting devices, reduce the shape and position requirements of the wafer limiting device, simplify the production of the wafer limiting device, and eliminate the risks caused by thickness errors of different wafer carriers.

[0026] Furthermore, during use, the wafer carrier can undergo multiple refurbishment operations such as cleaning and grinding, which not only increases the service life of the wafer carrier, but also reduces maintenance costs and reduces damage to the wafer, such as the risk of wafer edge crushing, squeezing, pinching, squeezing and abrasions. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 This is one of the schematic diagrams of the assembly relationship of the wafer limiting device provided by the utility model;

[0029] Figure 2 This is the second schematic diagram of the assembly relationship of the wafer limiting device provided by the utility model;

[0030] Figure 3 This is the third schematic diagram of the assembly relationship of the wafer limiting device provided by the utility model;

[0031] Figure 4 This is the fourth schematic diagram of the assembly relationship of the wafer limiting device provided by the utility model;

[0032] Figure 5 This is the fifth schematic diagram of the assembly relationship of the wafer limiting device provided by the utility model;

[0033] Figure 6 It is a structural schematic diagram of a retaining ring fixing member in a wafer limiting device provided by the utility model.

[0034] Reference numerals:

[0035] 10. wafer retaining ring; 11. annular area; 12. first receiving groove; 13. positioning hole;

[0036] 20. retaining ring fixing member; 21. second receiving groove;

[0037] 30. elastic part; 31. first fixing pin; 32. second fixing pin; 33. elastic member; 34. adjusting member;

[0038] 40. Positioning pin;

[0039] 50. Wafer body;

[0040] 60. Wafer carrier;

[0041] 70. Carrier boss;

[0042] 80. Connectors. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0045] The present invention will be described in detail below in conjunction with specific implementation methods.

[0046] In some specific embodiments of the present invention, Figures 1 to 6 As shown, the present scheme provides a wafer limiting device, comprising: a wafer retaining ring 10, forming an annular area 11 for accommodating a wafer body 50; a retaining ring fixing part 20, an annular structure axially superimposed with the wafer retaining ring 10; a plurality of elastic parts 30, the plurality of elastic parts 30 are evenly distributed around the circumference of the wafer retaining ring 10, and are respectively connected to the wafer retaining ring 10 and the retaining ring fixing part 20, for adjusting the relative position between the wafer retaining ring 10 and the retaining ring fixing part 20 in the axial direction.

[0047] It should be noted that the utility model solves the problem of wafer damage risk in the existing device, which may cause the wafer carrier 60 to be unusable and reduce the service life of the wafer carrier 60, by providing multiple elastic parts 30 between the wafer retaining ring 10 and the retaining ring fixing member 20.

[0048] In some possible embodiments of the present invention, the elastic part 30 includes: a first fixing pin 31, a second fixing pin 32 and an elastic member 33; the first fixing pin 31 and the second fixing pin 32 are arranged at intervals and connected by the elastic member 33; wherein the first fixing pin 31 is detachably connected to the wafer retaining ring 10; and the second fixing pin 32 is detachably connected to the retaining ring fixing member 20.

[0049] Specifically, this embodiment provides an implementation method of a first fixing pin 31, a second fixing pin 32 and an elastic member 33, in which the first fixing pin 31 and the second fixing pin 32 are spaced apart and respectively connected to the first fixing pin 31 and the second fixing pin 32 through the elastic member 33, and then the first fixing pin 31 is detachably connected to the wafer retaining ring 10, and the second fixing pin 32 is detachably connected to the retaining ring fixing member 20, so that the wafer retaining ring 10 and the retaining ring fixing member 20 can maintain an axial preload with the help of the elastic force of the elastic member 33, and at the same time, the axial relative position can be adjusted within the elastic deformation range of the elastic member 33.

[0050] In a possible embodiment, the elastic member 33 is a tension spring.

[0051] In some possible implementations of the present invention, a first accommodating groove 12 is provided on a side of the wafer retaining ring 10 away from the retaining ring fixing member 20 , and the shape of the first accommodating groove 12 is consistent with the shape of the first fixing pin 31 .

[0052] Specifically, this embodiment provides an implementation of a first accommodating groove 12. The setting of the first accommodating groove 12 enables the first fixing pin 31 to be positioned on a side of the wafer retaining ring 10 away from the retaining ring fixing member 20, and the first fixing pin 31 is embedded in the first accommodating groove 12, thereby achieving a detachable connection between the first fixing pin 31 and the wafer retaining ring 10.

[0053] In a possible embodiment, the first accommodating groove 12 is a recessed groove arranged on the surface of the wafer retaining ring 10. While accommodating the first fixing pin 31, the first accommodating groove 12 and the elastic member 33 are also arranged to be circular in the mating portion to reduce the friction between the elastic member 33 and the surface of the wafer retaining ring 10.

[0054] In some possible implementations of the present invention, a second accommodating groove 21 is provided on a side of the retaining ring fixing member 20 away from the wafer retaining ring 10 , and the shape of the second accommodating groove 21 is consistent with the shape of the second fixing pin 32 .

[0055] Specifically, this embodiment provides an implementation of a second accommodating groove 21. The setting of the second accommodating groove 21 enables the second fixing pin 32 to be positioned on the side of the retaining ring fixing member 20 away from the wafer retaining ring 10, and the second fixing pin 32 is embedded in the second accommodating groove 21, thereby achieving a detachable connection between the second fixing pin 32 and the retaining ring fixing member 20.

[0056] In a possible embodiment, the second accommodating groove 21 is a recessed groove arranged on the surface of the retaining ring fixing member 20. While accommodating the second fixing pin 32, the matching part between the second accommodating groove 21 and the elastic member 33 is also set to be circular to reduce the friction between the elastic member 33 and the surface of the retaining ring fixing member 20.

[0057] In some possible implementations of the present invention, Figure 4 and Figure 5 As shown, the elastic part 30 includes: an adjusting member 34 and an elastic member 33; the adjusting member 34 passes through the wafer retaining ring 10 and the retaining ring fixing member 20 in sequence, and is detachably connected to the retaining ring fixing member 20; the elastic member 33 is sleeved on the outside of the adjusting member 34, and abuts against the adjusting member 34 and the retaining ring fixing member 20 respectively.

[0058] Specifically, this embodiment provides an implementation of the elastic part 30, wherein the connection between the wafer retaining ring 10 and the retaining ring fixing part 20 is realized through the adjusting part 34, and an elastic part 33 is sleeved on the outside of the adjusting part 34 to realize the adjustment of the relative axial position between the wafer retaining ring 10 and the retaining ring fixing part 20.

[0059] It should be noted that if Figure 4 and Figure 5 As shown, the utility model Figure 5 The section view of the section direction is Figure 3 The connecting direction of the two elastic parts 30 in FIG.

[0060] In a possible embodiment, the adjusting member 34 is provided with an external thread to achieve a detachable connection with the retaining ring fixing member 20 .

[0061] In some possible implementations of the present invention, the present invention further includes: a positioning pin 40 , which is disposed on a side of the retaining ring fixing member 20 facing the wafer retaining ring 10 and is plugged into and matched with the positioning hole 13 of the wafer retaining ring 10 .

[0062] Specifically, this embodiment provides an implementation of a positioning pin 40 . The provision of the positioning pin 40 facilitates the positioning between the wafer retaining ring 10 and the retaining ring fixing member 20 , and also avoids radial movement of the wafer retaining ring 10 .

[0063] In a possible embodiment, a plurality of positioning pins 40 are evenly distributed along the circumferential direction on a surface of the retaining ring fixing member 20 facing the wafer retaining ring 10 , so as to achieve positioning of the wafer retaining ring 10 .

[0064] It should be noted that if Figure 2 and Figure 3 As shown, the utility model Figure 3 The section view of the section direction is Figure 2 The connecting direction of the positioning pin 40 and the elastic part 30.

[0065] In some possible implementations of the present invention, at least three elastic parts 30 are evenly distributed around the circumference between the wafer retaining ring 10 and the retaining ring fixing member 20 .

[0066] Specifically, this embodiment provides an implementation of an elastic part 30, in which at least three elastic parts 30 are evenly distributed along the circumferential direction between the wafer retaining ring 10 and the retaining ring fixing part 20, so that the elastic force distribution between the wafer retaining ring 10 and the retaining ring fixing part 20 is more uniform, and the relative position adjustment of the wafer retaining ring 10 in the axial direction is more stable and uniform, thereby avoiding the problem of loose fit between the wafer retaining ring 10 and the wafer carrier 60 due to uneven distribution of elastic force, which in turn causes radial movement of the wafer body 50.

[0067] In some specific embodiments of the present invention, Figures 1 to 6 As shown, the present solution provides a wafer limiting kit, including the above-mentioned wafer limiting device.

[0068] In some possible implementations of the utility model, it also includes: a wafer carrier 60 and a carrier boss 70; the wafer carrier 60 is arranged on the side of the retaining ring fixing member 20 away from the wafer retaining ring 10; the carrier boss 70 and the wafer carrier 60 are integrally formed, at least part of the carrier boss 70 passes through the retaining ring fixing member 20 and abuts against the wafer retaining ring 10, for placing the wafer body 50.

[0069] Specifically, this embodiment provides an implementation of a wafer carrier 60 and a carrier boss 70 . The arrangement of the wafer carrier 60 and the carrier boss 70 provides an installation position between the wafer retaining ring 10 , the retaining ring fixing member 20 and the wafer body 50 .

[0070] In some possible embodiments of the present invention, the outer diameter of the wafer retaining ring 10 is greater than the diameter of the carrier boss 70 ; and / or, the inner diameter of the wafer retaining ring 10 is greater than the outer diameter of the wafer body 50 , and the inner diameter of the wafer retaining ring 10 is smaller than the diameter of the carrier boss 70 .

[0071] Specifically, this embodiment provides an implementation method of a wafer retaining ring 10, in which the outer diameter of the wafer retaining ring 10 is set to be larger than the diameter of the carrier boss 70, and the relationship between the inner diameter of the wafer retaining ring 10 and the diameters of the wafer body 50 and the carrier boss 70 is such that the bottom of the wafer retaining ring 10 can be fitted with the top surface of the wafer carrier 60, and the wafer body 50 can be positioned through the wafer carrier 60 and the annular area 11 of the wafer retaining ring 10.

[0072] In some possible embodiments of the present invention, it also includes: a plurality of connectors 80, which are evenly distributed around the circumference of the wafer carrier 60, and pass through the wafer retaining ring 10, the retaining ring fixing member 20 and part of the wafer carrier 60 in sequence, so as to realize a detachable connection between the retaining ring fixing member 20 and the wafer carrier 60.

[0073] Specifically, this embodiment provides an implementation of a connecting member 80 . By providing the connecting member 80 , the connection between the retaining ring fixing member 20 and the wafer carrier 60 is achieved, thereby providing a basis for the cooperation between the wafer retaining ring 10 and the carrier boss 70 .

[0074] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0075] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0076] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "mode", "specific mode", or "some modes" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or mode are included in at least one embodiment or mode of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or mode. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or modes in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or modes described in this specification and the features of the different embodiments or modes, without contradiction.

[0077] Finally, it should be noted that the above implementation modes are only used to illustrate the present invention, rather than to limit the present invention. Although the present invention is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present invention do not deviate from the spirit and scope of the technical solutions of the present invention, and should be included in the scope of the claims of the present invention.

Claims

1. A wafer limiting device, characterized in that: include: A wafer retaining ring (10) forms an annular area (11) for accommodating a wafer body (50); A retaining ring fixing member (20), a ring-shaped structure superimposed on the wafer retaining ring (10) along the axial direction; A plurality of elastic parts (30) are evenly distributed around the circumference of the wafer retaining ring (10), and are respectively connected to the wafer retaining ring (10) and the retaining ring fixing member (20), so as to adjust the relative position between the wafer retaining ring (10) and the retaining ring fixing member (20) in the axial direction.

2. The wafer limiting device according to claim 1, characterized in that: The elastic part (30) comprises: a first fixing pin (31), a second fixing pin (32) and an elastic member (33); The first fixing pin (31) and the second fixing pin (32) are arranged at intervals and connected via the elastic member (33); Wherein, the first fixing pin (31) is detachably connected to the wafer retaining ring (10); The second fixing pin (32) is detachably connected to the retaining ring fixing member (20).

3. The wafer limiting device according to claim 2, characterized in that: A first accommodating groove (12) is provided on a side of the wafer retaining ring (10) away from the retaining ring fixing member (20), and the shape of the first accommodating groove (12) is compatible with the shape of the first fixing pin (31).

4. The wafer limiting device according to claim 2, characterized in that: A second accommodating groove (21) is provided on a side of the retaining ring fixing member (20) away from the wafer retaining ring (10), and the shape of the second accommodating groove (21) is compatible with the shape of the second fixing pin (32).

5. The wafer limiting device according to claim 1, characterized in that: The elastic part (30) comprises: an adjusting member (34) and an elastic member (33); The adjusting member (34) passes through the wafer retaining ring (10) and the retaining ring fixing member (20) in sequence, and is detachably connected to the retaining ring fixing member (20); The elastic member (33) is sleeved on the outside of the adjusting member (34) and abuts against the adjusting member (34) and the retaining ring fixing member (20) respectively.

6. The wafer limiting device according to claim 1, characterized in that: Also includes: A positioning pin (40) is arranged on a side of the retaining ring fixing member (20) facing the wafer retaining ring (10) and is plugged into and matched with a positioning hole (13) of the wafer retaining ring (10).

7. The wafer limiting device according to any one of claims 1 to 6, characterized in that: At least three elastic parts (30) are evenly distributed around the circumference between the wafer retaining ring (10) and the retaining ring fixing member (20).

8. A wafer limiting kit, characterized in that: A wafer limiting device comprising any one of claims 1 to 7.

9. The wafer limiting kit according to claim 8, characterized in that: Also includes: A wafer carrier (60) and a carrier boss (70); The wafer carrier (60) is arranged on a side of the retaining ring fixing component (20) away from the wafer retaining ring (10); The carrier boss (70) is integrally formed with the wafer carrier (60), and at least a portion of the carrier boss (70) passes through the retaining ring fixing member (20) and abuts against the wafer retaining ring (10) for placing the wafer body (50).

10. The wafer limiting kit according to claim 9, characterized in that: The outer diameter of the wafer retaining ring (10) is greater than the diameter of the carrier boss (70); And / or, the inner diameter of the wafer retaining ring (10) is greater than the outer diameter of the wafer body (50), and the inner diameter of the wafer retaining ring (10) is smaller than the diameter of the carrier boss (70).

11. The wafer limiting kit according to claim 9 or 10, characterized in that: Also includes: A plurality of connecting members (80) are evenly distributed around the circumference of the wafer carrier (60), and sequentially pass through the wafer retaining ring (10), the retaining ring fixing member (20) and a portion of the wafer carrier (60), so as to realize a detachable connection between the retaining ring fixing member (20) and the wafer carrier (60).

Images