Wafer centering and edge identifying mechanism and chip mounter with same

Abstract

The utility model provides a wafer centering and edge identifying mechanism, and belongs to the technical field of wafer processing, the wafer centering and edge identifying mechanism comprises a centering mechanism and an edge identifying mechanism, the centering mechanism comprises a first centering plate, a second centering plate and a driving device; wherein the first centering plate and the second centering plate are located in the same horizontal plane, and a first arc-shaped groove is formed in the upper surface of the first centering plate; a first arc-shaped groove is formed in the upper surface of the first centering plate, a second arc-shaped groove is formed in the upper surface of the second centering plate, the concave surface of the first arc-shaped groove and the concave surface of the second arc-shaped groove are oppositely arranged, and a centering base circle used for centering a wafer is formed between the first arc-shaped groove and the second arc-shaped groove; the driving device is arranged to be capable of driving the first centering plate and the second centering plate to be close to each other or away from each other by the same distance at the same time, and when the driving device drives the first centering plate and the second centering plate to be close to each other at the same time, the circle center of the wafer coincides with the circle center of the formed centering base circle.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a wafer centering and edge recognition mechanism and a placement machine having the same. Background Art

[0002] Wafer refers to the substrate for manufacturing semiconductor transistors or integrated circuits. Wafer centering is to adjust the center of the circle to a specified position through a certain method to meet the requirements for wafer post-processing accuracy.

[0003] The traditional centering and recognition mechanism includes wafer adsorption and rotation, wafer centering, mobile camera recognition and other structures. All three structures are driven by servo motors and have complex structures.

[0004] The inventor believes that in the existing wafer centering and edge recognition mechanism, the equipment structure is complex, the cost is high, and the debugging process during use is also very cumbersome and time-consuming. Utility Model Content

[0005] The purpose of the present application is to provide a wafer centering and edge recognition mechanism and a placement machine having the same, aiming to solve the problems in the related technology of complex equipment structure, high cost, cumbersome debugging process and time-consuming operation.

[0006] Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

[0007] According to a first aspect of the present application, a wafer centering and edge recognition mechanism is provided, comprising a centering mechanism and an edge recognition mechanism, the centering mechanism comprising: a first centering plate, a second centering plate and a driving device; wherein: the first centering plate and the second centering plate are located in the same horizontal plane, the upper surface of the first centering plate is provided with a first arc-shaped groove; the upper surface of the second centering plate is provided with a second arc-shaped groove, the concave surface of the first arc-shaped groove and the concave surface of the second arc-shaped groove are arranged opposite to each other, and a centering base circle for centering the wafer is formed between the first arc-shaped groove and the second arc-shaped groove; the driving device is configured to be able to drive the first centering plate and the second centering plate to approach or move away from the same distance at the same time, and when the driving device drives the first centering plate and the second centering plate to approach at the same time, the center of the wafer coincides with the center of the formed centering base circle.

[0008] In an exemplary embodiment of the present application, a plurality of first arc-shaped grooves are provided on the upper surface of the first centering plate, and the plurality of first arc-shaped grooves gradually decrease in curvature from top to bottom in the vertical direction and form steps; a plurality of second arc-shaped grooves are provided on the upper surface of the second centering plate, and the plurality of second arc-shaped grooves gradually decrease in curvature from top to bottom in the vertical direction and form steps; each layer of steps formed by the first arc-shaped grooves corresponds to each layer of steps formed by the second arc-shaped grooves, and form a plurality of centering base circles with gradually decreasing diameters from top to bottom, and the centers of the plurality of centering base circles are all located on the same axis.

[0009] In an exemplary embodiment of the present application, a first connecting plate is fixedly provided on the side of the first centering plate facing the driving device, and a second connecting plate is fixedly provided on the side of the second centering plate facing the driving device. The driving device is a centering cylinder and is located between the first connecting plate and the second connecting plate. The centering cylinder has two piston rods, and the two piston rods extend from both sides of the cylinder body of the centering cylinder and are fixedly connected to the first connecting plate and the second connecting plate respectively.

[0010] In an exemplary embodiment of the present application, it also includes a mounting plate, the driving device is mounted on the mounting plate, a sliding rail is laid on the mounting plate along the moving direction of the first centering plate and the second centering plate, and a sliding block is fixed at the bottom of the first connecting plate and the second connecting plate, and the sliding block is slidably connected to the sliding rail.

[0011] In an exemplary embodiment of the present application, it also includes: a vacuum suction cup, located between the first centering plate and the second centering plate, the center of the vacuum suction cup and the center of the centering base circle are located on the same axis; a lifting device, used to drive the vacuum suction cup to move in a vertical direction.

[0012] In an exemplary embodiment of the present application, the edge recognition mechanism includes: an optical fiber sensor, which is used to emit a light source to the surface of the wafer and to receive the light source reflected by the wafer. The positioning edge of the wafer is rotated to the optical fiber sensor so as not to block the light source emitted by the optical fiber sensor. When the optical fiber sensor receives the light source reflected by the wafer, it outputs an optical signal; an execution unit, whose input end is connected to the output end of the optical fiber sensor. In response to the optical signal, the execution unit sends an execution signal when receiving the light signal; a rotating device, which is used to output rotational power and respond to the execution signal. When the rotating device receives the execution signal, it starts to work; a transmission device, which is used to transmit the rotational power to the vacuum suction cup and drive the vacuum suction cup to rotate.

[0013] In an exemplary embodiment of the present application, it also includes a fixed frame and a movable frame, the lifting device is a lifting cylinder, the cylinder body of the lifting cylinder is fixedly mounted on the fixed frame, and the piston rod end of the lifting cylinder is fixedly mounted on the movable frame; the vacuum suction cup, the rotating device and the transmission device are all mounted on the movable frame.

[0014] In an exemplary embodiment of the present application, a vacuum connecting shaft is installed on the upper surface of the movable frame, an air channel is formed inside the vacuum connecting shaft, and the air channel is connected to the vacuum suction cup.

[0015] In an exemplary embodiment of the present application, the rotating device and the transmission device are both located in the mobile frame, the rotating device is a motor; the transmission device includes a driving wheel, a driven wheel and a synchronous belt, the driving wheel is located directly above the rotating device, and the output shaft of the rotating device is fixedly connected to the center of the driving wheel; the driven wheel and the driving wheel are located at the same horizontal height, the driven wheel is fixedly connected to the vacuum connecting shaft via a connecting shaft, the connecting shaft passes through the upper surface of the mobile frame, and the synchronous belt is wrapped around the driving wheel and the driven wheel.

[0016] According to a second aspect of the present application, there is provided a chip mounter comprising the wafer centering and edge recognition mechanism described above.

[0017] The exemplary embodiments of the present application may have some or all of the following beneficial effects:

[0018] 1. A wafer centering and edge recognition mechanism provided in the exemplary embodiment of the present application, by placing a wafer on a first centering plate and a second centering plate, so that the wafer is located between a first arc-shaped groove and a second arc-shaped groove, and then driving the first centering plate and the second centering plate to move the same distance toward each other through a driving device, so that the center of the wafer is located at the center of a centering base circle formed by the first arc-shaped groove and the second arc-shaped groove; the structure is simple, the cost is low, and no debugging is required during use, which provides convenience for the staff to operate and improves the wafer centering efficiency;

[0019] 2. By forming a multi-step structure, a plurality of different sizes of centering base circles can be formed, so that wafers of different sizes can be placed on the steps corresponding to different centering base circles, so that wafers of different sizes can be centered by the mechanism, thereby improving the applicability and compatibility of the mechanism;

[0020] 3. The optical fiber sensor emits light, and when the optical fiber sensor cannot receive the light, the position of the positioning edge can be determined. The device is easy to operate and has a lower cost than a mobile camera, thus achieving a cost-saving effect;

[0021] 4. When the optical fiber sensor can detect the light source, the rotating device drives the vacuum suction cup and the wafer to rotate through the transmission device. When the optical fiber sensor cannot detect the light source, it means that the position of the positioning edge has been determined, and the rotation will stop automatically, which provides convenience for the staff's operation.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic structural diagram of a wafer centering and edge recognition mechanism in an embodiment of the present application is shown;

[0025] Figure 2 A schematic structural diagram of a wafer centering mechanism in an embodiment of the present application is shown;

[0026] Figure 3 A schematic diagram of the structure of the lifting device and the vacuum suction cup in the embodiment of the present application is shown;

[0027] Figure 4 A structural explosion diagram of the optical fiber sensor in an embodiment of the present application is shown.

[0028] Description of reference numerals:

[0029] 1. First centering plate; 11. First arc-shaped groove; 12. First connecting plate; 2. Second centering plate; 21. Second arc-shaped groove; 22. Second connecting plate; 3. Driving device; 4. Mounting plate; 41. Slide rail; 42. Sliding block; 43. Through hole; 44. Optical fiber sensor; 45. Base; 5. Vacuum suction cup; 51. Vacuum connecting shaft; 6. Lifting device; 7. Fixed frame; 71. Fixed side plate; 72. Fixed bottom plate; 8. Moving frame; 81. Moving side plate; 82. Upper moving plate; 83. Lower moving plate; 9. Rotating device; 10. Transmission device; 101. Driving wheel; 102. Driven wheel; 103. Synchronous belt. DETAILED DESCRIPTION

[0030] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present application will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to scale.

[0031] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the diagram to another component, these terms are used in this specification only for convenience, such as according to the direction of the examples in the drawings. It is understood that if the device of the diagram is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0032] The terms "a", "an", "the" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0033] In the related art, the cross section of the wafer is usually circular, and a positioning edge is formed during the cutting process, which is used for subsequent processing alignment. The purpose of the edge-finding mechanism is to automatically detect and identify this positioning edge to ensure that various micro-machining operations on the wafer (such as lithography, etching or deposition) can be accurately aligned. Through precise positioning, the manufacturing quality of each chip and the utilization rate of the entire wafer can be improved, thereby optimizing the production efficiency and performance of semiconductor devices.

[0034] Example 1

[0035] like Figure 1 and Figure 2 As shown, this embodiment provides a wafer centering and edge recognition mechanism, including a centering mechanism and an edge recognition mechanism, wherein the centering mechanism includes: a first centering plate 1, a second centering plate 2 and a driving device 3; wherein:

[0036] The first centering plate 1 and the second centering plate 2 are located in the same horizontal plane, the first centering plate 1 is provided with a first arc-shaped groove 11 on its upper surface; the second centering plate 2 is provided with a second arc-shaped groove 21 on its upper surface, the concave surface of the first arc-shaped groove 11 and the concave surface of the second arc-shaped groove 21 are arranged opposite to each other, and a centering base circle for centering a wafer is formed between the first arc-shaped groove 11 and the second arc-shaped groove 21;

[0037] The driving device 3 is configured to be able to drive the first centering plate 1 and the second centering plate 2 to approach or move away from the same distance at the same time. When the driving device 3 drives the first centering plate 1 and the second centering plate 2 to approach at the same time, the center of the wafer coincides with the center of the centering base circle.

[0038] The driving device 3 first slowly guides the first centering plate 1 and the second centering plate 2 away from each other, creating space for the operator so that the wafer can be accurately placed between the first centering plate 1 and the second centering plate 2, ensuring that the wafer is exactly between the positions that the first arc-shaped groove 11 and the second arc-shaped groove 21 can clamp. Subsequently, the driving device 3 synchronously closes the first centering plate 1 and the second centering plate 2 inward, and the first arc-shaped groove 11 and the second arc-shaped groove 21 jointly form a precise positioning base circle. At this time, the edge of the wafer fits perfectly with the circumferential inner wall of the formed positioning base circle, and the center of the positioning base circle is precisely coincident with the center of the wafer, thereby achieving efficient and precise wafer centering.

[0039] Furthermore, in the embodiment of the present application, a plurality of first arc-shaped grooves 11 are constructed on the upper surface of the first centering plate 1, and the curvature is larger at the top and smaller at the bottom, forming a stepped structure; similarly, a plurality of second arc-shaped grooves 21 are constructed on the upper surface of the second centering plate 2 in a symmetrical manner, and the second arc-shaped grooves 21 also present a stepped structure with a curvature gradually decreasing from top to bottom; there is no rigid regulation on the number of the first arc-shaped grooves 11 and the second arc-shaped grooves 21, but the key is that the number of the first arc-shaped grooves 11 and the second arc-shaped grooves 21 must match, and form a plurality of centering base circles with different radii. The centers of all the centering base circles are located on the same vertical axis, and the radius of all the centering base circles gradually decreases from top to bottom.

[0040] Each centering base circle of unique size corresponds to a wafer of one size, so that the centering mechanism can perform centering work on wafers of multiple different sizes. When switching wafers of different sizes, simply place the wafer on the step where the centering base circle that matches it is located to easily achieve accurate centering, thereby improving the compatibility and applicability of the device.

[0041] In the embodiment of the present application, on the side facing the driving device 3, the first centering plate 1 is fixedly connected to the first connecting plate 12, and the second centering plate 2 is fixedly connected to the second connecting plate 22. The first connecting plate 12 and the second connecting plate 22 are arranged opposite to each other. The driving device 3 uses a centering cylinder, which is cleverly placed between the first connecting plate 12 and the second connecting plate 22. The double piston rods equipped with the centering cylinder extend from both sides of the cylinder and are respectively connected and fixed to the first connecting plate 12 and the second connecting plate 22. Of course, the design of the driving device 3 is not limited to this, and a configuration in which a motor is equipped with a bidirectional screw can also be adopted. In this alternative, the thread direction of the bidirectional screw is opposite from the middle to the two ends, and the two sections of the thread are respectively threaded with the first fixed plate and the second fixed plate. The motor is installed at one end of the bidirectional screw to drive the bidirectional screw to rotate, which can also effectively regulate the relative position of the first centering plate 1 and the second centering plate 2.

[0042] In the embodiment of the present application, the wafer centering and edge recognition mechanism further includes a mounting plate 4 for integration, on which the driving device 3 is firmly fixed, and a slide rail 41 is fixedly provided on the upper surface of the mounting plate 4 along the moving direction of the first connecting plate 12 and the second connecting plate 22, and a slider 42 is fixedly provided at the bottom of the first connecting plate 12 and the second connecting plate 22, and the bottom of the slider 42 is slidably adapted to the slide rail 41, and the slider 42 is slidably connected to the slide rail 41 along the length direction of the slide rail 41. The mounting plate 4 not only provides good support for the driving device 3 and ensures the stability of operation, but also when adjusting the position of the first centering plate 1 and the second centering plate 2, the sliding design of the slider 42 on the slide rail 41 gives the first connecting plate 12 and the second connecting plate 22 a good support effect and stability during movement.

[0043] like Figure 1 and Figure 3 As shown, in the embodiment of the present application, the wafer centering and edge recognition mechanism also includes a vacuum suction cup 5 and a lifting device 6. The vacuum suction cup 5 is cleverly arranged between the first centering plate 1 and the second centering plate 2, and the center of the vacuum suction cup 5 and the center of the centering base circle are located on the same vertical axis. In the operation process, the lifting device 6 first drives the vacuum suction cup 5 to rise upward to create space for the placement of the wafer. Subsequently, the wafer is placed on the vacuum suction cup 5, and the vacuum suction cup 5 is tightly adsorbed to the lower surface of the wafer through the vacuum effect. Then, as the lifting device 6 slowly descends, the wafer is accurately placed in the centering base circle formed by the first arc-shaped groove 11 and the second arc-shaped groove 21. Finally, the vacuum suction cup 5 resumes the air supply and releases the adsorption of the wafer, thereby completing the centering preparation. This process greatly simplifies the positioning operation of the wafer and improves work efficiency.

[0044] like Figure 1 Hehe Figure 3 As shown, in the embodiment of the present application, the edge recognition mechanism includes:

[0045] The optical fiber sensor 44 is used to emit a light source to the surface of the wafer and to receive the light source reflected by the wafer. The positioning edge of the wafer is rotated to the optical fiber sensor 44 so as not to block the light source emitted by the optical fiber sensor 44. When the optical fiber sensor 44 receives the light source reflected by the wafer, it outputs an optical signal.

[0046] An execution unit, the input end of which is connected to the output end of the optical fiber sensor 44, and in response to the optical signal, the execution unit does not issue an execution instruction when receiving the optical signal, and issues an execution signal when the execution unit fails to receive the optical signal;

[0047] The rotating device 9 is used to output the rotating power and respond to the execution signal. When the rotating device 9 receives the execution signal, it starts to work;

[0048] The transmission device 10 is used to transmit the rotational power to the vacuum suction cup 5 and drive the vacuum suction cup 5 to rotate.

[0049] like Figure 1 and Figure 4 As shown, further, the number of fiber optic sensors 44 is equal to the number of centering base circles formed between the first pair of centering plates 1 and the second pair of centering plates 2, and each centering base circle corresponds to a fiber optic sensor 44. A base 45 is fixedly connected to the upper surface of the mounting plate 4. These fiber optic sensors 44 are cleverly located below the first pair of centering plates 1 and the second pair of centering plates 2 through the base 45. The fiber optic sensor 44 can emit light upward. During the rotation of the wafer, if the positioning edge does not reach the fiber optic sensor 44, the light emitted by the fiber optic sensor 44 will hit the bottom of the wafer and be reflected back to the fiber optic sensor 44. When the positioning edge of the wafer rotates to the top of the fiber optic sensor 44, the light emitted by the fiber optic sensor 44 will rise straight through the positioning edge and will no longer be reflected back to the fiber optic sensor 44, thereby achieving accurate edge detection.

[0050] like Figure 1 and Figure 3 As shown, in the embodiment of the present application, the wafer centering and edge recognition mechanism further includes a fixing frame 7, which includes two symmetrical fixing side plates 71 and a fixing bottom plate 72, and the fixing bottom plate 72 is located below the mounting plate 4 and parallel to the mounting plate 4. The two fixing side plates 71 are respectively located on both sides of the fixing bottom plate 72, and the bottom of the fixing side plate 71 is connected and fixed to the fixing bottom plate 72, and the top of the fixing side plate 71 is fixedly connected to the mounting plate 4.

[0051] In the embodiment of the present application, the wafer centering and edge recognition mechanism also includes a moving frame 8, which is located inside the fixed frame 7, and includes a moving side plate 81, an upper moving plate 82 and a lower moving plate 83, the upper moving plate 82 is located directly above the lower moving plate 83, and two moving side plates 81 are provided, and the two moving side plates 81 are respectively located on both sides of the upper moving plate 82 and the lower moving plate 83, and the top of the moving side plate 81 is fixedly connected to the upper moving plate 82, and the bottom of the moving side plate 81 is fixedly connected to the lower moving plate 83. The mounting plate 4 is penetrated and provided with a through hole 43 for the moving frame 8 to pass through directly above the moving frame 8.

[0052] In the embodiment of the present application, a vacuum connecting shaft 51 is connected to the bottom of the vacuum suction cup 5, and an air channel is formed inside the vacuum connecting shaft 51, and the two ends of the air channel are respectively connected to the vacuum suction cup 5 and the air pump (not shown in the figure). When the air pump is started, the vacuum connecting shaft 51 will guide the airflow to be extracted, eliminate the air between the wafer and the vacuum suction cup 5, and then realize the vacuum adsorption and fixation of the two. Conversely, in order to release the wafer, the air pump introduces gas between the vacuum suction cup 5 and the wafer through the vacuum connecting shaft 51, thereby releasing the adsorption state between them.

[0053] In the embodiment of the present application, the lifting device 6 is a lifting cylinder, whose cylinder body is located below the fixed bottom plate 72 in the fixed frame 7 and is fixedly connected to the fixed bottom plate 72, and whose piston rod passes through the fixed bottom plate 72 and is fixedly connected to the lower moving plate 83 in the moving frame 8. It is worth noting that the structure of the lifting device 6 allows for a variety of implementations, and is not limited to this description.

[0054] Further, in the embodiment of the present application, the rotating device 9 and the transmission device 10 are both located inside the mobile frame 8. The rotating device 9 is a motor, and the body of the rotating device 9 is fixedly mounted on the mobile frame 8. The transmission device 10 includes a driving wheel 101, a driven wheel 102 and a synchronous belt 103. The driving wheel 101 is located directly above the rotating device 9, and the output shaft of the rotating device 9 is fixedly connected to the center of the driving wheel 101. The driven wheel 102 and the driving wheel 101 are located in the same horizontal plane. The synchronous belt 103 surrounds the driving wheel 101 and the driven wheel 102. The driven wheel 102 is connected to the bottom of the vacuum connecting shaft 51 through a connecting shaft. The connecting shaft passes through the mounting plate 4 and allows relative rotation with the mounting plate 4, ensuring the smoothness of the overall operation.

[0055] During the edge recognition process, the air pump first creates a vacuum environment so that the vacuum suction cup 5 is adsorbed and fixed to the wafer. Subsequently, the lifting device 6 drives the vacuum suction cup 5 and the wafer to rise in height, so that the wafer leaves the first centering plate 1 and the second centering plate 2. Then, the optical fiber sensor 44 continuously projects a light source to the bottom of the wafer. When the optical fiber sensor 44 can receive the reflected light, it sends out a light signal. After receiving the light signal, the execution unit sends out an execution signal. When receiving the execution signal, the rotating device 9 immediately starts to output rotational power, and transmits the rotational power to the vacuum connecting shaft 51 through the transmission device 10, so that the vacuum connecting shaft 51 and the vacuum suction cup 5 drive the wafer to rotate. When the positioning edge of the wafer rotates to the top of the optical fiber sensor 44, the light source emitted by the optical fiber sensor 44 directly passes through the positioning edge and does not contact the lower surface of the wafer, resulting in the optical fiber sensor 44 being unable to receive the reflected light source, and then stops sending out light signals. When the execution unit fails to receive the light signal, it does not send out an execution signal. When the rotating device 9 fails to receive the execution signal, it stops rotating. Therefore, through the above structure, when the wafer stops rotating, the positioning edge is just located above the optical fiber sensor 44, thereby completing the edge recognition work of the wafer.

[0056] Example 2

[0057] This embodiment provides a placement machine, which includes the centering and edge recognition mechanism described in Example 1.

[0058] Those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the embodiments of the present application. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that the present application does not apply for. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the appended claims.

Claims

1. A wafer centering and edge recognition mechanism, comprising a centering mechanism and an edge recognition mechanism, characterized in that: The centering mechanism comprises: a first centering plate (1), a second centering plate (2) and a driving device (3); wherein: The first centering plate (1) and the second centering plate (2) are located in the same horizontal plane, the upper surface of the first centering plate (1) is provided with a first arc-shaped groove (11); the upper surface of the second centering plate (2) is provided with a second arc-shaped groove (21), the concave surface of the first arc-shaped groove (11) and the concave surface of the second arc-shaped groove (21) are arranged opposite to each other, and a centering base circle for centering a wafer is formed between the first arc-shaped groove (11) and the second arc-shaped groove (21); The driving device (3) is configured to be able to drive the first centering plate (1) and the second centering plate (2) to approach or move away from each other by the same distance at the same time, and when the driving device (3) drives the first centering plate (1) and the second centering plate (2) to approach each other at the same time, the center of the wafer coincides with the center of the centering base circle.

2. A wafer centering and edge recognition mechanism according to claim 1, characterized in that: A plurality of first arc-shaped grooves (11) are provided on the upper surface of the first centering plate (1), and the arc angles of the plurality of first arc-shaped grooves (11) gradually decrease from top to bottom along the vertical direction and form steps; A plurality of second arc-shaped grooves (21) are provided on the upper surface of the second centering plate (2), and the arc angles of the plurality of second arc-shaped grooves (21) gradually decrease from top to bottom along the vertical direction and form steps; Each step layer formed by the first arc-shaped groove (11) corresponds to each step layer formed by the second arc-shaped groove (21), and form a plurality of centering base circles with gradually decreasing diameters from top to bottom, and the centers of the plurality of centering base circles are all located on the same axis.

3. A wafer centering and edge recognition mechanism according to claim 1, characterized in that: The first centering plate (1) is fixedly provided with a first connecting plate (12) on the side facing the driving device (3), and the second centering plate (2) is fixedly provided with a second connecting plate (22) on the side facing the driving device (3). The driving device (3) is a centering cylinder and is located between the first connecting plate (12) and the second connecting plate (22). The centering cylinder has two piston rods, which extend from two sides of a cylinder body of the centering cylinder and are fixedly connected to the first connecting plate (12) and the second connecting plate (22) respectively.

4. A wafer centering and edge recognition mechanism according to claim 3, characterized in that: It also includes a mounting plate (4), the driving device (3) is mounted on the mounting plate (4), a slide rail (41) is laid on the mounting plate (4) along the moving direction of the first centering plate (1) and the second centering plate (2), and a slider (42) is fixed at the bottom of the first connecting plate (12) and the second connecting plate (22), and the slider (42) is slidably connected to the slide rail (41).

5. The wafer centering and edge recognition mechanism according to claim 1, characterized in that: Also includes: A vacuum suction cup (5) is located between the first centering plate (1) and the second centering plate (2), and the center of the vacuum suction cup (5) and the center of the centering base circle are located on the same axis; The lifting device (6) is used to drive the vacuum suction cup (5) to move in a vertical direction.

6. A wafer centering and edge recognition mechanism according to claim 5, characterized in that: The edge recognition mechanism comprises: An optical fiber sensor (44) is used to emit a light source to the surface of the wafer and to receive the light source reflected by the wafer. The positioning edge of the wafer is rotated to the optical fiber sensor (44) so ​​as not to block the light source emitted by the optical fiber sensor (44). When the optical fiber sensor (44) receives the light source reflected by the wafer, it outputs an optical signal. an execution unit, the input end of which is connected to the output end of the optical fiber sensor (44), and in response to the optical signal, the execution unit sends an execution signal when receiving the optical signal; A rotating device (9) is used to output a rotating power and respond to an execution signal. When the rotating device (9) receives the execution signal, it starts to work; The transmission device (10) is used to transmit the rotational power to the vacuum suction cup (5) and drive the vacuum suction cup (5) to rotate.

7. A wafer centering and edge recognition mechanism according to claim 6, characterized in that: It also includes a fixed frame (7) and a movable frame (8); the lifting device (6) is a lifting cylinder; the cylinder body of the lifting cylinder is fixedly mounted on the fixed frame (7); the piston rod end of the lifting cylinder is fixedly mounted on the movable frame (8); the vacuum suction cup (5), the rotating device (9) and the transmission device (10) are all mounted on the movable frame (8).

8. A wafer centering and edge recognition mechanism according to claim 7, characterized in that: A vacuum connection shaft (51) is installed on the upper surface of the movable frame (8), and an air channel is formed inside the vacuum connection shaft (51), and the air channel is connected to the vacuum suction cup (5).

9. A wafer centering and edge recognition mechanism according to claim 8, characterized in that: The rotating device (9) and the transmission device (10) are both located inside the moving frame (8); the rotating device (9) is a motor; the transmission device (10) comprises a driving wheel (101), a driven wheel (102) and a synchronous belt (103); the driving wheel (101) is located directly above the rotating device (9), and the output shaft of the rotating device (9) is fixedly connected to the center of the driving wheel (101); the driven wheel (102) and the driving wheel (101) are located at the same horizontal height; the driven wheel (102) is fixedly connected to the vacuum connecting shaft (51) via a connecting shaft; the connecting shaft passes through the upper surface of the moving frame (8); and the synchronous belt (103) surrounds the driving wheel (101) and the driven wheel (102).

10. A chip mounter, characterized in that: It includes the wafer centering and edge recognition mechanism as described in any one of claims 1-9.

Images