Wafer centering turnover device with supporting position

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer centering turnover device with a supporting position, which comprises a supporting assembly, a lifting mechanism, a turnover mechanism and a centering clamping mechanism, the supporting assembly consists of a bottom plate and a vertical plate, the lifting mechanism is arranged on the bottom plate and comprises a lifting cylinder and a fixed chuck piece, and the lifting cylinder is arranged on the vertical plate. A positioning block and a stopper are arranged on the fixed chuck piece and are used for supporting and fixing a wafer and preventing shaking and dislocation; the overturning mechanism is composed of a rotating air cylinder and a rotating main shaft, and overturning is achieved through belt transmission. The centering clamping mechanism is composed of a clamping air cylinder, a base plate and a clamping jaw, the clamping jaw is provided with a clamping head and a limiting groove, and it is ensured that the wafer is stably clamped in the overturning process; by optimizing the structural design, stable clamping and efficient overturning of the wafer are achieved, the operation process is simplified, the waiting time of a mechanical arm is shortened, and the production efficiency and the product quality are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a wafer centering and flipping device with a supporting position. Background Art

[0002] With the continuous advancement of semiconductor manufacturing technology, the requirements for wafer processing accuracy and processing efficiency are getting higher and higher. Both the front and back sides of the wafer need to be cleaned, so wafer centering and flipping are important processes in the semiconductor manufacturing process.

[0003] Traditional wafer centering and flipping devices have problems such as complex action procedures, long waiting time for the robot, and easy shaking and misalignment of the wafer during processing. These problems not only reduce production efficiency, but may also cause damage to the wafer and affect the product yield.

[0004] Existing wafer centering and flipping devices usually use a combination of a centering clamping mechanism and a flipping mechanism, and the wafer is flipped after being clamped by the centering clamping mechanism.

[0005] However, the traditional operation process is complicated. The centering clamping mechanism needs to be opened and closed many times before and after flipping, and the robot needs to frequently place and take out the film, which makes the whole process time-consuming and inefficient. Utility Model Content

[0006] In view of the problems existing in the prior art, the purpose of the utility model is to provide a wafer centering and flipping device with a support position, which can reduce the waiting time of the robot, improve the turnover efficiency of the wafer, and maintain the stability of the wafer during the flipping process.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A wafer centering and flipping device with a support position comprises a support assembly, wherein the support assembly comprises a bottom plate, and a vertical plate is fixedly connected to the top of one end of the bottom plate;

[0009] A lifting mechanism is provided at the bottom of the base plate, and the lifting mechanism is used to adjust the height of the wafer to be flipped;

[0010] The lifting mechanism comprises a lifting cylinder, the telescopic end of the lifting cylinder penetrates the bottom plate, and the telescopic end of the lifting cylinder is connected to a fixed chuck member;

[0011] The upper end surface of the fixed chuck is provided with a positioning block, and the positioning block is used to limit the position of the wafer;

[0012] A turning mechanism is arranged on the outer side of the vertical plate;

[0013] The flip mechanism comprises a rotating cylinder and a rotating spindle mounted on the outside of the vertical plate, the rotating spindle is located above the rotating cylinder, and a belt is arranged between the rotating cylinder and the rotating spindle;

[0014] One end of the rotating spindle is provided with a centering clamping mechanism, and the centering clamping mechanism is used for clamping the wafer.

[0015] Furthermore, the centering clamping mechanism includes a clamping cylinder connected to one end of the rotating spindle, both telescopic ends of the clamping cylinder are connected to a base plate, the side of the base plate is connected to a clamping claw, and the clamping claw is arranged in an arc shape.

[0016] Furthermore, a clamping head is fixedly connected to the upper end surface of the clamping jaw.

[0017] Furthermore, a limiting groove is provided on the outer side of the clamp, and when the wafer is clamped, the wafer is inserted into the limiting groove.

[0018] Furthermore, the shape of the fixed chuck is set to be an isosceles trapezoid, and a positioning block is provided on the fixed chuck.

[0019] Furthermore, the number of the positioning blocks is set to three, and the connecting lines of the three positioning blocks form an isosceles triangle.

[0020] Furthermore, a stopper is fixedly connected to the upper end surface of the positioning block.

[0021] Compared with the prior art, the beneficial effects of the utility model are:

[0022] First, by setting the positioning block and the stopper on the fixed chuck, the wafer is supported and fixed during the wafer rising process, which effectively prevents the wafer from shaking and misalignment; improves the stability of the wafer and avoids the damage and position displacement caused by the shaking of the wafer in the traditional device.

[0023] Secondly, the lifting mechanism includes a lifting cylinder, through the drive of the lifting cylinder, the fixed chuck can move up and down, so as to accurately transfer the wafer between the claws of the centering clamping mechanism; this design simplifies the operation process, reduces the waiting time of the robot, and helps to improve the overall efficiency of the production line; compared with traditional devices, the operation process of the utility model is more concise and efficient, which helps to reduce the production cycle and improve the wafer turnover efficiency.

[0024] The flipping mechanism adopts a combination of a rotating cylinder and a rotating spindle, and realizes the flipping of the centering clamping mechanism through belt drive. This design is not only simple in structure, but also can maintain the stability of the wafer during the flipping process. The cooperation between the rotating spindle and the centering clamping mechanism enables the wafer to remain stable during the flipping process, avoiding the problems of wafer misalignment and damage caused by the complex structure of traditional flipping devices.

[0025] The centering clamping mechanism drives the base plate and the clamping claws to approach each other through the clamping cylinder to achieve clamping of the wafer; the chuck fixedly connected to the upper end face of the clamping claw and the limit groove design on its outside further enhance the stability of the wafer; the limit groove can effectively prevent the wafer from shifting during the clamping and flipping process, ensuring the safety and accuracy of the flipping operation; this improvement not only improves the wafer clamping stability, but also improves the reliability and service life of the overall device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the utility model;

[0027] Figure 2 It is a structural schematic diagram of the centering clamping mechanism of the utility model;

[0028] Figure 3 This is a schematic diagram of the structure of the clamping jaws of the utility model;

[0029] Figure 4 This is a structural schematic diagram of the lifting mechanism of the utility model;

[0030] Figure 5 for Figure 4 The enlarged schematic diagram of point A in the middle;

[0031] Figure 6 for Figure 2 A magnified schematic diagram of point B in the middle.

[0032] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0033] 1. Support assembly; 11. Bottom plate; 12. Vertical plate;

[0034] 2. Lifting mechanism; 21. Lifting cylinder; 22. Fixed chuck; 23. Positioning block; 231. Stopper;

[0035] 3. Turning mechanism; 31. Rotating cylinder; 32. Rotating spindle; 33. Belt;

[0036] 4. Centering clamping mechanism; 41. Clamping cylinder; 42. Base plate; 43. Clamping claw; 44. Chuck; 441. Limiting groove. DETAILED DESCRIPTION

[0037] In order to make the purpose and advantages of the utility model more clear, the utility model is specifically described in combination with the following embodiments. It should be understood that the following text is only used to describe one or several specific implementations of the utility model, and does not strictly limit the protection scope of the specific request of the utility model.

[0038] See also Figure 1-6A wafer centering and flipping device with a support position includes a support assembly 1, the support assembly 1 includes a bottom plate 11, and a vertical plate 12 is fixedly connected to the top of one end of the bottom plate 11; a lifting mechanism 2 is arranged at the bottom of the bottom plate 11, and the lifting mechanism 2 is used to adjust the height of the wafer to be flipped; the lifting mechanism 2 includes a lifting cylinder 21, the telescopic end of the lifting cylinder 21 passes through the bottom plate 11, and the telescopic end of the lifting cylinder 21 is connected to a fixed chuck member 22; a positioning block 23 is arranged on the upper end surface of the fixed chuck member 22, and the positioning block 23 is used to limit the wafer Position; the upper end face of the positioning block 23 is fixedly connected with a stopper 231, which is used to fix the wafer during the rising process of the wafer to prevent the wafer from shaking; a flipping mechanism 3 is arranged on the outer side of the vertical plate 12; the flipping mechanism 3 includes a rotating cylinder 31 and a rotating spindle 32 installed on the outer side of the vertical plate 12, the rotating spindle 32 is located above the rotating cylinder 31, and a belt 33 is arranged between the rotating cylinder 31 and the rotating spindle 32; a centering clamping mechanism 4 is arranged at one end of the rotating spindle 32, and the centering clamping mechanism 4 is used to clamp the wafer.

[0039] See also Figure 2 The centering clamping mechanism 4 includes a clamping cylinder 41 connected to one end of the rotating spindle 32, and the two telescopic ends of the clamping cylinder 41 are connected to a base plate 42, and the side of the base plate 42 is connected to a clamping claw 43, and the clamping claw 43 is arranged in an arc shape; the clamping cylinder 41 drives the two base plates 42 to approach each other, thereby driving the clamping claws 43 to approach each other; when the clamping claws 43 clamp the wafer, the wafer will be firmly clamped between the chucks 44 to prevent the wafer from being misaligned during the flipping process.

[0040] See also Figure 2 and Figure 6 The upper end surface of the clamping jaw 43 is fixedly connected with a chuck 44; a limiting groove 441 is provided on the outer side of the chuck 44. When the wafer is clamped, the wafer is inserted into the limiting groove 441. The limiting groove 441 can make the wafer more stable during the clamping process and avoid misalignment between the wafer and the chuck 44 during the flipping process.

[0041] See also Figure 4 The shape of the fixed chuck member 22 is set to an isosceles trapezoid, and the number of the positioning blocks 23 is set to three; the connecting line of the three positioning blocks 23 forms an isosceles triangle. This design not only ensures more stable positioning and support for the wafer, but also effectively avoids interference with the fingers and claws 43 of the transfer robot.

[0042] See also Figure 4-5 The upper end surface of the positioning block 23 is fixedly connected with a stopper 231, which fixes the wafer when the wafer rises to prevent the wafer from shaking during the lifting process, thereby ensuring the stability and positioning accuracy of the wafer before and after flipping.

[0043] The working principle of the utility model is:

[0044] When in use, the robot places the wafer on the fixed chuck 22, supports the wafer through the positioning block 23 provided on the fixed chuck 22, and fixes the position of the wafer with the cooperation of the stopper 231 to prevent the wafer from shaking during the rising process;

[0045] Then, driven by the lifting cylinder 21, the fixed chuck 22 is pushed up, and the wafer placed on the fixed chuck 22 is transferred between the two clamping claws 43;

[0046] At this time, the two substrates 42 are driven to approach each other by the clamping cylinder 41, and then the clamping claws 43 installed on the substrates 42 are driven to approach each other. As the clamping claws 43 approach, the wafer between the clamping claws 43 will be clamped between the chucks 44, and the limiting grooves 441 provided on the chucks 44 can make the wafer be clamped more firmly, so as to avoid misalignment between the wafer and the chuck 44 during the wafer flipping process.

[0047] After the wafer is clamped, the turning mechanism 3 drives the centering clamping mechanism 4 to turn over, thereby driving the wafer to turn over.

[0048] The traditional operation process is: the centering clamping mechanism 4 opens - the robot puts the wafer in the waiting position - the centering clamping mechanism 4 clamps the wafer - the flipping mechanism 3 drives the centering clamping mechanism 4 to flip - the robot takes the wafer and waits - the centering clamping mechanism 4 opens - the robot takes the wafer and exits.

[0049] The improved operating process is: the robot goes to the fixed chuck 22 to take the flipped wafer - the robot puts the new wafer to be flipped on the lifting mechanism 2 and exits - the centering clamping mechanism 4 clamps the wafer - the fixed chuck 22 descends - the flipping mechanism 3 drives the centering clamping mechanism 4 to flip - the fixed chuck 22 rises - the centering clamping mechanism 4 opens and waits.

[0050] This will simplify the action process, reduce the waiting time of the robot, and improve the turnover efficiency of the wafer.

[0051] The above is only a preferred embodiment of the present invention. It should be noted that, for ordinary technicians in the technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A wafer centering and flipping device with a support position, comprising a support assembly (1), characterized in that: The support assembly (1) comprises a bottom plate (11), and a vertical plate (12) is fixedly connected to the top of one end of the bottom plate (11); A lifting mechanism (2) is provided at the bottom of the base plate (11), and the lifting mechanism (2) is used to adjust the height of the wafer to be flipped; The lifting mechanism (2) comprises a lifting cylinder (21), the telescopic end of the lifting cylinder (21) passes through the bottom plate (11), and the telescopic end of the lifting cylinder (21) is connected to a fixed chuck component (22); The upper end surface of the fixed chuck member (22) is provided with a positioning block (23), and the positioning block (23) is used to limit the position of the wafer; A turning mechanism (3) is arranged on the outer side of the vertical plate (12); The turning mechanism (3) comprises a rotating cylinder (31) and a rotating spindle (32) installed outside the vertical plate (12); the rotating spindle (32) is located above the rotating cylinder (31), and a belt (33) is provided between the rotating cylinder (31) and the rotating spindle (32); One end of the rotating spindle (32) is provided with a centering clamping mechanism (4), and the centering clamping mechanism (4) is used for clamping a wafer.

2. The wafer centering and flipping device with a support position according to claim 1, characterized in that: The centering clamping mechanism (4) comprises a clamping cylinder (41) connected to one end of a rotating main shaft (32), both telescopic ends of the clamping cylinder (41) are connected to a base plate (42), the side of the base plate (42) is connected to a clamping claw (43), and the clamping claw (43) is arranged in an arc shape.

3. The wafer centering and flipping device with a support position according to claim 2, characterized in that: The upper end surface of the clamping jaw (43) is fixedly connected with a clamping head (44).

4. The wafer centering and flipping device with a support position according to claim 3, characterized in that: A limiting groove (441) is provided on the outer side of the clamp (44), and when the wafer is clamped, the wafer is clamped into the limiting groove (441).

5. The wafer centering and flipping device with a support position according to claim 1, characterized in that: The shape of the fixed chuck component (22) is set to be an isosceles trapezoid, and a positioning block (23) is arranged on the fixed chuck component (22).

6. The wafer centering and flipping device with a support position according to claim 5, characterized in that: The number of the positioning blocks (23) is set to three, and the connecting line of the three positioning blocks (23) forms an isosceles triangle.

7. The wafer centering and flipping device with a support position according to claim 6, characterized in that: A stopper (231) is fixedly connected to the upper end surface of the positioning block (23).

Images