Wafer visual positioning detection positioning centering device

Abstract

The utility model relates to a wafer visual positioning detection positioning centering device, which comprises a wafer supporting mechanism, a translation mechanism and a rotating mechanism which are sequentially connected from top to bottom, the translation mechanism is fixedly connected with the wafer supporting mechanism above, and the translation mechanism is synchronously and rotatably connected with the rotating mechanism below; the translation mechanism is used for driving the wafer supporting mechanism to move along the X-axis direction and / or the Y-axis direction, and the rotating mechanism is used for driving the wafer supporting mechanism above and the translation mechanism to rotate around the rotating center of the rotating mechanism together. According to the utility model, the translation mechanism is arranged between the wafer supporting mechanism and the rotating mechanism; therefore, before visual positioning detection is carried out on the wafer, the translation mechanism is driven to carry out adjustment according to the calculated offset, so that positioning and centering of the wafer can be completed; the whole positioning and centering process is easy to operate, high-precision centering is achieved, and errors of follow-up visual positioning detection are greatly reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor detection, and in particular relates to a wafer visual positioning detection and centering device. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] The manufacturing of silicon wafers requires processes such as crystal growth, cutting, grinding, and polishing. After each process is completed, visual positioning inspection is also required. Visual positioning inspection mainly involves the use of optical sensors and image processing algorithms to accurately locate and detect features or defects on the wafer. The wafer is usually placed on a controllable rotating table so that the wafer can be inspected in a rotating state to ensure that the inspection system captures all areas of the wafer surface as much as possible, thereby improving the accuracy of the inspection.

[0004] During detection, since it is difficult to ensure that the center of the wafer coincides with the rotation center of the detection system, it is necessary to compensate and correct the position of the wafer. Specifically, as shown in the wafer edge detection device disclosed in CN117855125A, the rotating component needs to rotate around the C axis (the rotating axis of the rotating component) for one circle to obtain the occlusion distance of the wafer edge corresponding to each rotation angle, and the three-point method, matrix fitting method, least squares circle fitting method and other methods are used to calculate the center of the wafer and the direction of the wafer; then the rotating component is controlled to continue rotating so that the wafer rotates around the C axis until the center of the wafer is on the Y axis, and then the suction cup is controlled to release vacuum adsorption, and the Z-axis motor of the lifting component descends to place the wafer on the support column; the Y-axis motor of the translation component drives the rotating component to move along the Y-axis direction so that the C axis is concentric with the center of the wafer, the suction cup starts vacuum adsorption, and the Z-axis motor of the lifting component rises to lift the wafer, completing the positioning and centering of the wafer center. In this technical solution, from top to bottom are the wafer, the rotating assembly, and the compensating adjustment assembly (including the translation assembly and the lifting assembly). The mechanism adjustment action required to complete the alignment is relatively complex, and the adjustment requires a combination of rotation and translation. If the rotation is not in place, it will affect the alignment effect.

[0005] During the inspection process, the wafer needs to be clamped and fixed. The existing technology usually adopts mechanical clamping, which directly contacts the edge of the wafer, which will cause damage to the edge of the wafer. This is also a problem that needs to be solved during the wafer visual positioning inspection process. Utility Model Content

[0006] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a wafer visual positioning detection and centering device, so as to avoid the problems of complex adjustment actions and difficulty in ensuring centering accuracy during wafer visual positioning detection, and to achieve the effect of high-precision wafer centering adjustment.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A wafer visual positioning detection and centering device comprises a wafer support mechanism, a translation mechanism and a rotation mechanism connected in sequence from top to bottom, wherein the translation mechanism is fixedly connected to the upper wafer support mechanism, and the translation mechanism is synchronously rotationally connected to the lower rotation mechanism; the translation mechanism is used to drive the wafer support mechanism to move along the X-axis direction and / or the Y-axis direction, and the rotation mechanism is used to drive the upper wafer support mechanism and the translation mechanism to rotate together around the rotation center of the rotation mechanism.

[0009] To further improve the above technical solution, the translation mechanism includes an X-axis moving component and a Y-axis moving component, the X-axis moving component is used to achieve movement in the X-axis direction, and the Y-axis moving component is used to achieve movement in the Y-axis direction;

[0010] The X-axis moving assembly includes an X-axis power slide, an X-axis power slider and an X-axis motor, and the X-axis power slider is slidably connected to the X-axis power slide so that the X-axis power slider slides along the length direction of the X-axis power slide; the Y-axis moving assembly includes a Y-axis power slide, a Y-axis power slider and a Y-axis motor, the Y-axis power slide is fixedly connected to the upper surface of the X-axis power slider, and the Y-axis power slider is slidably connected to the Y-axis power slide so that the Y-axis power slider slides along the length direction of the Y-axis power slide; the sliding direction of the Y-axis power slider is perpendicular to the sliding direction of the X-axis power slider;

[0011] The X-axis motor is installed on the X-axis power slide, and the output shaft of the X-axis motor is connected to the X-axis power slider to drive the X-axis power slider to slide along the length direction of the X-axis power slide; the Y-axis motor is installed on the Y-axis power slide, and the output shaft of the Y-axis motor is connected to the Y-axis power slider to drive the Y-axis power slider to slide along the length direction of the Y-axis power slide;

[0012] The wafer supporting mechanism is fixedly connected to the Y-axis power slider.

[0013] Furthermore, the rotating mechanism includes a mounting plate, a base is provided on the mounting plate, a rotating motor is provided in the base, the output shaft of the rotating motor is vertically arranged upward, and the X-axis power slide is fixedly installed on the upper end of the output shaft to rotate synchronously with the output shaft; the axial direction of the output shaft forms the rotation center of the rotating mechanism.

[0014] Furthermore, a supporting base plate is provided below the mounting plate, an electric slip ring is provided between the mounting plate and the supporting base plate, and the X-axis motor and the Y-axis motor are connected to an external power supply via the electric slip ring.

[0015] Furthermore, the wafer support mechanism comprises a circular turntable, the edge of which is evenly spaced along the circumference and connected to a plurality of support bases, the support bases are connected to a bearing member, and the bearing member is used to cooperate with the wafer;

[0016] The bearing member extends outwardly in the radial direction of the rotating disk, and a rubber ring is arranged on the upper surface of the free end of the bearing member.

[0017] Furthermore, the wafer support mechanism also includes a rotating support column, the lower end of the rotating support column is fixedly connected to the Y-axis power slider, and the upper end of the rotating support column is fixedly connected to the lower surface of the turntable.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] 1. A wafer visual positioning detection and centering device of the utility model sets a translation mechanism for adjusting and compensating the wafer position between a wafer support mechanism and a rotation mechanism, so that the translation mechanism rotates together with the wafer support mechanism above around the rotation center of the rotation mechanism; in this way, before visual positioning detection of the wafer is performed, the rotation mechanism is driven to drive the wafer placed on the wafer support mechanism to rotate, and the offset of each angle of the wafer rotation is detected by an external laser sensor, and then the offset in the X-axis direction and the Y-axis direction is calculated by an algorithm, and the translation mechanism is driven to move and adjust in the X-axis direction and / or the Y-axis direction according to the calculated offset to complete the positioning and centering of the wafer; when performing subsequent detection, it is only necessary to drive the rotation mechanism without driving the translation mechanism at the same time, and the entire positioning and centering process is simple to operate, and high-precision centering is achieved, which greatly reduces the error of subsequent visual positioning detection.

[0020] 2. The utility model provides a wafer visual positioning, detection, positioning and centering device, in which the wafer is placed on each carrier, and the lower surface of the wafer contacts each rubber ring to fix the wafer through the friction force of the rubber ring. No other mechanical clamping mechanism is needed to fix the wafer, thus avoiding damage caused by clamping the edge of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic structural diagram of a wafer visual positioning detection positioning and centering device according to an embodiment;

[0022] Among them, there are a support base 11, a bearing 12, a rubber ring 13, a rotating support column 14, an X-axis power slide 21, an X-axis power slider 22, an X-axis motor 23, a Y-axis power slide 24, a Y-axis power slider 25, a Y-axis motor 26, a mounting plate 31, a base 32, an electric slip ring 33, and a support bottom plate 34. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents the selected embodiment of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0024] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In the description of the utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the utility model product is usually placed when used, which is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In addition, the terms "horizontal", "vertical", etc. do not mean that the components are absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] The specific implementation of the utility model is further described in detail below in conjunction with the accompanying drawings.

[0026] See also Figure 1 A wafer visual positioning, detection, and centering device in a specific embodiment includes a wafer support mechanism, a translation mechanism, and a rotation mechanism connected in sequence from top to bottom, the translation mechanism is fixedly connected to the upper wafer support mechanism, and the translation mechanism is synchronously connected to the lower rotation mechanism; the translation mechanism is used to drive the wafer support mechanism to move along the X-axis direction and / or the Y-axis direction, and the rotation mechanism is used to drive the upper wafer support mechanism and the translation mechanism to rotate together around the rotation center of the rotation mechanism.

[0027] A wafer visual positioning detection and centering device of an embodiment sets a translation mechanism for adjusting and compensating the wafer position between the wafer support mechanism and the rotation mechanism, so that the translation mechanism rotates around the rotation center of the rotation mechanism together with the wafer support mechanism above; in this way, before the wafer is visually positioned and detected, the rotation mechanism is driven to drive the wafer placed on the wafer support mechanism to rotate, and the offset of each angle of the wafer rotating one circle is detected by an external laser sensor, and then the offset in the X-axis and Y-axis directions is calculated by an algorithm, and the translation mechanism is driven to move and adjust in the X-axis and / or Y-axis directions according to the calculated offset to complete the positioning and centering of the wafer; when performing subsequent detection, it is only necessary to drive the rotation mechanism without driving the translation mechanism at the same time. The entire positioning and centering process is simple to operate, and high-precision centering is achieved, which greatly reduces the error of subsequent visual positioning detection.

[0028] Please continue to see Figure 1 , wherein the translation mechanism includes an X-axis moving component and a Y-axis moving component, the X-axis moving component is used to achieve movement in the X-axis direction, and the Y-axis moving component is used to achieve movement in the Y-axis direction;

[0029] The X-axis moving assembly includes an X-axis power slide 21 and an X-axis power slider 22, and the X-axis power slider 22 is slidably connected to the X-axis power slide 21 so that the X-axis power slider 22 slides along the length direction of the X-axis power slide 21; the Y-axis moving assembly includes a Y-axis power slide 24 and a Y-axis power slider 25, the Y-axis power slide 24 is fixedly connected to the upper surface of the X-axis power slider 22, and the Y-axis power slider 25 is slidably connected to the Y-axis power slide 24 so that the Y-axis power slider 25 slides along the length direction of the Y-axis power slide 24; the sliding direction of the Y-axis power slider 25 is perpendicular to the sliding direction of the X-axis power slider 22;

[0030] The wafer supporting mechanism is fixedly connected to the Y-axis power slider 25 .

[0031] During implementation, the X-axis moving component also includes an X-axis motor 23, and the Y-axis moving component also includes a Y-axis motor 26. Both the X-axis motor 23 and the Y-axis motor 26 are linear motors; the X-axis motor 23 is installed on the X-axis power slide 21, and the output shaft of the X-axis motor 23 is connected to the X-axis power slider 22 to drive the X-axis power slider 22 to slide along the length direction of the X-axis power slide 21; the Y-axis motor 26 is installed on the Y-axis power slide 24, and the output shaft of the Y-axis motor 26 is connected to the Y-axis power slider 25 to drive the Y-axis power slider 25 to slide along the length direction of the Y-axis power slide 24.

[0032] In this way, the wafer can be adjusted in the X-axis direction and the Y-axis direction by driving the X-axis motor 23 and the Y-axis motor 26 respectively.

[0033] During implementation, the rotating mechanism includes a mounting plate 31, a base 32 is provided on the mounting plate 31, a rotating motor (not shown in the figure) is provided inside the base 32, the output shaft of the rotating motor is vertically arranged upward, and the X-axis power slide 21 is fixedly mounted on the upper end of the output shaft to rotate synchronously with the output shaft; the axial direction of the output shaft forms the rotation center of the rotating mechanism.

[0034] A support base plate 34 is provided below the mounting plate 31 , and an electric slip ring 33 is provided between the mounting plate 31 and the support base plate 34 . The X-axis motor 23 and the Y-axis motor 26 are connected to an external power source via the electric slip ring 33 .

[0035] In this way, the voltage transmission of the aforementioned X-axis moving assembly and the Y-axis moving assembly is achieved through the electric slip ring 33 to control the X-axis motor 23 and the Y-axis motor 26 .

[0036] The wafer support mechanism comprises a circular turntable, the edge of which is evenly spaced along the circumference and connected to a plurality of support bases 11, the support bases 11 are connected to a carrier 12, and the carrier 12 is used to cooperate with the wafer;

[0037] The supporting member 12 extends outwardly in the radial direction of the rotating disk, and a rubber ring 13 is provided on the upper surface of the free end of the supporting member 12 .

[0038] In this way, the wafer is placed on each carrier 12, and the lower surface of the wafer contacts each rubber ring 13 to fix the wafer through the friction of the rubber ring 13. There is no need to use other mechanical clamping mechanisms to fix the wafer, thus avoiding damage caused by clamping the edge of the wafer. In specific implementation, the rotation speed of the turntable will be adapted to the camera frequency, and its linear speed can reach up to 400mm / s at the fastest. The friction of the rubber ring 13 is completely capable of fixing the wafer. At the same time, rubber rings are used here instead of rubber pads or rubber blocks because there are cleanliness requirements when inspecting wafers. Therefore, under the premise of ensuring that the wafer can be fixed by friction, the contact area between the wafer and the wafer support mechanism should be reduced as much as possible to avoid contamination of the wafer surface.

[0039] The wafer support mechanism further includes a rotating support column 14, the lower end of the rotating support column 14 is fixedly connected to the Y-axis power slider 25, and the upper end of the rotating support column 14 is fixedly connected to the lower surface of the turntable.

[0040] In this way, the provision of the rotating support column 14 can provide support for the wafer support mechanism above, thereby improving the stability of the entire device structure.

[0041] The following is an introduction to the specific use process of a wafer visual positioning detection positioning and centering device of the utility model:

[0042] The wafer to be inspected is placed on each carrier 12 so that the lower surface of the wafer contacts each rubber ring 13; then the rotary motor is driven so that the rotary mechanism drives the wafer to rotate one circle, and the laser sensor detects the offset of each angle of the wafer during one rotation, and then the offset of the wafer in the X-axis direction and the Y-axis direction is calculated through an algorithm (this calculation process is prior art and will not be described here), and then the translation mechanism is driven to make corresponding adjustments according to the calculated offset to achieve the positioning and centering of the wafer, and finally the X-axis motor 23 and the Y-axis motor 26 of the translation mechanism are turned off, and the rotation mechanism is driven to perform visual positioning detection.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A wafer visual positioning detection and centering device, characterized in that: It includes a wafer support mechanism, a translation mechanism and a rotation mechanism connected in sequence from top to bottom, the translation mechanism is fixedly connected to the upper wafer support mechanism, and the translation mechanism is synchronously connected to the lower rotation mechanism; the translation mechanism is used to drive the wafer support mechanism to move along the X-axis direction and / or the Y-axis direction, and the rotation mechanism is used to drive the upper wafer support mechanism and the translation mechanism to rotate around the rotation center of the rotation mechanism.

2. According to claim 1, a wafer visual positioning detection positioning and centering device is characterized by: The translation mechanism includes an X-axis moving component and a Y-axis moving component, the X-axis moving component is used to achieve movement in the X-axis direction, and the Y-axis moving component is used to achieve movement in the Y-axis direction; The X-axis moving assembly includes an X-axis power slide, an X-axis power slider and an X-axis motor, and the X-axis power slider is slidably connected to the X-axis power slide so that the X-axis power slider slides along the length direction of the X-axis power slide; the Y-axis moving assembly includes a Y-axis power slide, a Y-axis power slider and a Y-axis motor, the Y-axis power slide is fixedly connected to the upper surface of the X-axis power slider, and the Y-axis power slider is slidably connected to the Y-axis power slide so that the Y-axis power slider slides along the length direction of the Y-axis power slide; the sliding direction of the Y-axis power slider is perpendicular to the sliding direction of the X-axis power slider; The X-axis motor is installed on the X-axis power slide, and the output shaft of the X-axis motor is connected to the X-axis power slider to drive the X-axis power slider to slide along the length direction of the X-axis power slide; the Y-axis motor is installed on the Y-axis power slide, and the output shaft of the Y-axis motor is connected to the Y-axis power slider to drive the Y-axis power slider to slide along the length direction of the Y-axis power slide; The wafer supporting mechanism is fixedly connected to the Y-axis power slider.

3. According to claim 2, a wafer visual positioning detection positioning and centering device is characterized by: The rotating mechanism includes a mounting plate, a base is provided on the mounting plate, a rotating motor is provided in the base, the output shaft of the rotating motor is vertically arranged upward, and the X-axis power slide is fixedly installed on the upper end of the output shaft to rotate synchronously with the output shaft; the axial direction of the output shaft forms the rotation center of the rotating mechanism.

4. According to claim 3, a wafer visual positioning detection positioning and centering device is characterized in that: A supporting base plate is arranged below the mounting plate, an electric slip ring is arranged between the mounting plate and the supporting base plate, and the X-axis motor and the Y-axis motor are connected to an external power supply through the electric slip ring.

5. A wafer visual positioning detection and centering device according to any one of claims 2 to 4, characterized in that: The wafer support mechanism comprises a circular turntable, the edge of which is evenly spaced along the circumference and connected to a plurality of support bases, the support bases are connected to a bearing member, and the bearing member is used to cooperate with the wafer; The bearing member extends outwardly in the radial direction of the rotating disk, and a rubber ring is arranged on the upper surface of the free end of the bearing member.

6. The wafer visual positioning detection and centering device according to claim 5, characterized in that: The wafer support mechanism also includes a rotating support column, the lower end of which is fixedly connected to the Y-axis power slider, and the upper end of which is fixedly connected to the lower surface of the turntable.

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