Surface-mounted radio frequency chip

Abstract

The utility model relates to a paster type radio frequency chip, comprising a substrate and a housing, the substrate is provided with a heat radiation spacing assembly, the housing is provided with a protection assembly, the heat radiation spacing assembly comprises two installation blocks which are fixedly installed on the top of the substrate, and the installation blocks are arranged on the top of the substrate. Telescopic springs are fixedly mounted on the opposite sides of the two mounting blocks correspondingly, and limiting plates are fixedly mounted on the opposite sides of the two telescopic springs correspondingly. According to the surface-mounted radio frequency chip, by installing the heat dissipation limiting assembly, heat dissipation can be conducted on the chip body in the working process of the radio frequency chip, the situation that the chip body is damaged due to long-term accumulation of heat is reduced, the service life of the chip body is prolonged, chip bodies of different sizes can be limited and fixed, and the service life of the chip body is prolonged. The chip body is installed more firmly, and the protection assembly is installed, so that the shell has waterproof and wear-resistant performance, and elements in the shell can be protected.

Description

Technical Field

[0001] The utility model relates to the technical field of radio frequency chips, in particular to a patch type radio frequency chip. Background Art

[0002] RF chips are usually used for data storage, including chips and induction coils. The induction coils are connected to the chips by welding. RF chips generally use insulated enameled copper wire windings as induction coils. Enameled wire is a type of winding wire, consisting of a conductor and an insulating layer. The bare wire is annealed and softened, then painted and baked multiple times. The induction coil is soldered to the chip by tin soldering. This type of RF chipset is generally used below 60 degrees Celsius and unit pressure below 10KG / cm2. If this parameter value is exceeded, the enameled wire will lose its insulation effect, the solder will fall off, and the RF chip will be damaged.

[0003] Please refer to a patch-type radio frequency chip with announcement number CN216528852U, which includes a shell, and the shell is composed of a waterproof layer, a corrosion-resistant layer, a base layer and a high-temperature resistant layer. The inner surface of the waterproof layer is fixedly connected to the outer surface of the corrosion-resistant layer, the inner surface of the corrosion-resistant layer is fixedly connected to the outer surface of the base layer, the inner surface of the base layer is fixedly connected to the outer surface of the high-temperature resistant layer, and a ceramic antenna substrate is fixedly connected to the inside of the shell, a chip body is provided at the top right end of the ceramic antenna substrate, a protective layer is fixedly connected to the outer surface of the chip body, a connecting wire is fixedly connected to the pin of the chip body, and an induction coil is fixedly connected to the left end of the connecting wire; the utility model can make the shell have waterproof and corrosion-resistant properties by arranging a waterproof layer and a corrosion-resistant layer on the shell, so as to protect the electrical components inside the shell.

[0004] In the above patent, the lower surface of the chip body is in close contact with the substrate, which greatly reduces the heat dissipation space of the chip body, which is not conducive to the heat dissipation effect of the RF chip during operation. The accumulation of heat over a long period of time may have an adverse effect on the normal working performance of the RF chip. This application proposes another technical solution to solve this technical problem. Utility Model Content

[0005] In view of the shortcomings of the prior art, the utility model provides a patch-type RF chip with advantages such as clamping heat dissipation, which solves the problem of close contact between the lower surface of the chip body and the substrate, greatly reducing the heat dissipation space of the chip body, which is not conducive to the heat dissipation effect of the RF chip during operation. The accumulation of heat over a long period of time may have an adverse effect on the normal working performance of the RF chip.

[0006] To achieve the above object, the utility model provides the following technical solution: a surface mount radio frequency chip, comprising a substrate and a shell, a heat dissipation limiter component is installed on the substrate, and a protective component is installed on the shell;

[0007] The heat dissipation limiting assembly comprises two mounting blocks fixedly mounted on the top of the substrate, a telescopic spring is fixedly mounted on the opposite side of the two mounting blocks, and a limiting plate is fixedly mounted on the opposite side of the two telescopic springs;

[0008] A T-shaped pull rod is fixedly installed on the opposite sides of the two limit plates, a heat sink is fixedly installed on the top of the base plate, a heat sink is fixedly installed on the bottom of the heat sink, and an induction coil is fixedly installed on the top of the base plate.

[0009] Furthermore, a mounting groove is provided on one side opposite to the two mounting blocks, and the telescopic spring is fixedly connected to the mounting block through the mounting groove.

[0010] Furthermore, the two mounting blocks are each provided with an extension hole, and the T-shaped pull rod extends to the outside of the mounting block through the extension hole.

[0011] Furthermore, a placement groove is provided on the top of the substrate, and the heat sink is fixedly connected to the substrate through the placement groove.

[0012] Furthermore, a through hole is formed at the bottom of the substrate, and the heat sink extends to the outside of the substrate through the through hole.

[0013] Furthermore, the protective layer is a polysilicon coating, the wear-resistant layer is a polyurethane layer, and the waterproof layer is made of a waterproof coating material.

[0014] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0015] The surface-mount radio frequency chip is equipped with a heat dissipation limiting component, which can dissipate the heat of the chip body during the operation of the radio frequency chip, reduce the long-term accumulation of heat, cause damage to the chip body, and increase the service life of the chip body. It can limit and fix chip bodies of different sizes, so that the chip body is installed more firmly. By installing a protective component, the shell has waterproof and wear-resistant properties, which can protect the components in the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a cross-sectional view of the structure of the utility model;

[0017] Figure 2 It is a three-dimensional diagram of the structure of the utility model;

[0018] Figure 3This is a cross-sectional view of the shell structure of the utility model.

[0019] In the figure: 1. substrate; 2. shell; 3. mounting block; 4. telescopic spring; 5. limit plate; 6. T-shaped pull rod; 7. heat sink; 8. heat sink; 9. induction coil; 10. wear-resistant layer; 11. waterproof layer; 12. chip body; 13. protective layer. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3 A surface-mount radio frequency chip in this embodiment includes a substrate 1 and a shell 2, a heat dissipation limiting component is installed on the substrate 1, and a protective component is installed on the shell 2.

[0022] The heat dissipation limit assembly includes two mounting blocks 3 fixedly mounted on the top of the substrate 1, two vertical plates are mounted on the bottom of the substrate 1, and two heat dissipation holes are opened at the bottom of the shell 2 to facilitate ventilation and heat dissipation, reduce long-term heat accumulation, and cause damage to the chip body 12, thereby improving the quality of use of the device.

[0023] Telescopic springs 4 are fixedly installed on the opposite sides of the two mounting blocks 3. Mounting grooves are opened on the opposite sides of the two mounting blocks 3. The telescopic springs 4 are fixedly connected to the mounting blocks 3 through the mounting grooves. Limiting plates 5 are fixedly installed on the opposite sides of the two telescopic springs 4.

[0024] A T-shaped pull rod 6 is fixedly installed on the opposite side of the two limit plates 5. Extension holes are opened inside the two mounting blocks 3. The T-shaped pull rod 6 extends to the outside of the mounting block 3 through the extension hole, which is convenient for the user to pull the T-shaped pull rod 6, thereby driving the telescopic spring 4 to compress, and then the limit plate 5 is moved and adjusted, which is convenient for fixing and limiting the chip body 12, making the chip body 12 installed more firmly, thereby improving the practicality of the device.

[0025] A heat sink 7 is fixedly installed on the top of the substrate 1. A placement groove is opened on the top of the substrate 1. The heat sink 7 is fixedly connected to the substrate 1 through the placement groove. A heat sink 8 is fixedly installed on the bottom of the heat sink 7. A through hole is opened at the bottom of the substrate 1. The heat sink 8 extends to the outside of the substrate 1 through the through hole, which is convenient for heat dissipation of the chip body 12, reduces long-term heat accumulation, causes damage to the chip body 12, and improves the service life of the chip body 12.

[0026] An induction coil 9 is fixedly installed on the top of the substrate 1, and the gap formed outside the induction coil 9 is filled with a high-temperature resistant potting colloid, which effectively improves the protection performance of the shell 2, so that when the device is in use, it can protect the chip body 12 more closely and improve the service life of the chip body 12.

[0027] It should be noted that the surface-mount RF chip, by installing a heat dissipation limiting component, can dissipate the heat of the chip body 12 during the operation of the RF chip, reduce long-term heat accumulation, cause damage to the chip body 12, etc., improve the service life of the chip body 12, and can limit and fix chip bodies 12 of different sizes, so that the chip body 12 can be installed more firmly.

[0028] Specifically, when the surface-mount RF chip is in use, the two T-shaped pull rods 6 are pulled in opposite directions to drive the two telescopic springs 4, and then the chip body 12 is pasted and set on the substrate 1. Then, the two T-shaped pull rods 6 are loosened, and the telescopic springs 4 are reset, driving the limit plate 5 to move, and the chip body 12 is limited and fixed. The heat sink 7 contacts the bottom surface of the chip body 12, and the heat sink 7 and the heat sink 8 are used to dissipate the heat of the chip body 12 during the operation of the RF chip, thereby improving the service life of the chip body 12.

[0029] The protective component includes a wear-resistant layer 10 and a waterproof layer 11 arranged inside the shell 2. The wear-resistant layer 10 is a polyurethane layer, and the waterproof layer 11 is made of a waterproof coating material, which improves the performance of the shell 2, protects the components inside the shell 2, and improves the practicality of the device.

[0030] A chip body 12 is arranged on the top of the substrate 1. A connecting wire connected to the induction coil 9 is installed at the left end of the chip body 12 to facilitate connecting the chip body 12 and the induction coil 9. A protective layer 13 is installed on the outer side of the chip body 12. The protective layer 13 is a polysilicon coating to provide direct protection for the chip body 12.

[0031] It should be noted that the surface-mount radio frequency chip is provided with a protective component, so that the housing 2 has waterproof and wear-resistant properties, and can protect the components in the housing 2.

[0032] Specifically, the surface-mount radio frequency chip protects the chip body 12 through the protective layer 13 to improve the performance of the chip body 12, and the shell 2 has wear-resistant and waterproof properties through the wear-resistant layer 10 and the waterproof layer 11, which can protect the electronic components in the shell 2 and improve the practicality of the device.

[0033] The working principle of the above embodiment is:

[0034] (1) When the surface mount RF chip is used, the two T-shaped pull rods 6 are pulled in opposite directions to drive the two telescopic springs 4, and then the chip body 12 is pasted and set on the substrate 1. Then, the two T-shaped pull rods 6 are loosened, and the telescopic springs 4 are reset to drive the limit plate 5 to move, and the chip body 12 is limited and fixed. The heat sink 7 contacts the bottom surface of the chip body 12, and the heat sink 7 and the heat sink 8 are used to dissipate the heat of the chip body 12 during the operation of the RF chip, thereby improving the service life of the chip body 12.

[0035] (2) The surface-mount radio frequency chip protects the chip body 12 through the protective layer 13, thereby improving the performance of the chip body 12. The wear-resistant layer 10 and the waterproof layer 11 make the shell 2 wear-resistant and waterproof, which can protect the electronic components in the shell 2 and improve the practicality of the device.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A surface mount radio frequency chip, comprising a substrate (1) and a housing (2), characterized in that: A heat dissipation limiting component is installed on the substrate (1), and a protection component is installed on the shell (2); The heat dissipation limiting assembly comprises two mounting blocks (3) fixedly mounted on the top of the base plate (1), telescopic springs (4) being fixedly mounted on opposite sides of the two mounting blocks (3), and limiting plates (5) being fixedly mounted on opposite sides of the two telescopic springs (4); A T-shaped pull rod (6) is fixedly mounted on the opposite sides of the two limit plates (5), a heat sink (7) is fixedly mounted on the top of the base plate (1), a heat sink (8) is fixedly mounted on the bottom of the heat sink (7), and an induction coil (9) is fixedly mounted on the top of the base plate (1).

2. A surface mount radio frequency chip according to claim 1, characterized in that: The protective component comprises a wear-resistant layer (10) and a waterproof layer (11) arranged inside the shell (2); a chip body (12) is arranged on the top of the substrate (1); and a protective layer (13) is installed on the outside of the chip body (12).

3. The surface-mount radio frequency chip according to claim 1, characterized in that: An installation groove is provided on one side opposite to the two installation blocks (3), and the telescopic spring (4) is fixedly connected to the installation block (3) via the installation groove.

4. The surface mount radio frequency chip according to claim 1, characterized in that: An extension hole is provided inside each of the two mounting blocks (3), and the T-shaped pull rod (6) extends to the outside of the mounting block (3) through the extension hole.

5. The surface-mount radio frequency chip according to claim 1, characterized in that: A placement groove is provided on the top of the base plate (1), and the heat sink (7) is fixedly connected to the base plate (1) via the placement groove.

6. The surface mount radio frequency chip according to claim 1, characterized in that: A through hole is provided at the bottom of the substrate (1), and the heat sink (8) extends to the outside of the substrate (1) through the through hole.

7. The surface-mount radio frequency chip according to claim 2, characterized in that: The protective layer (13) is a polysilicon coating, the wear-resistant layer (10) is a polyurethane layer, and the waterproof layer (11) is made of a waterproof coating material.

Images