Heat dissipation structure of circuit board

Abstract

The utility model discloses a circuit board heat dissipation structure, which comprises a circuit board and a chip, the chip is arranged at the top of the circuit board, the top of the chip is provided with a heat dissipation sheet, the left side and the right side of the heat dissipation sheet are respectively provided with a movable plate, one side of each movable plate close to the heat dissipation sheet is fixedly connected with two fixed rods, and the two fixed rods are fixedly connected with the circuit board. According to the circuit board heat dissipation structure, the movable plate drives the fixed rod to be inserted into the side wall of the heat dissipation sheet, the screw penetrates through the through hole to be screwed in the inner cavity of the screw hole, then the cylinder is rotated by means of mutual cooperation of the internal hexagonal wrench and the groove, and the cylinder drives the threaded pipe to rotate on the outer side of the screw through the connecting ring. The threaded pipe moves downwards relative to the screw under the action of the threads, the threaded pipe extrudes the movable plate downwards, the movable plate drives the fixing rod to move downwards, the fixing rod presses the cooling fins downwards, and therefore the cooling fins are fixed, the cooling fins do not need to be fixed through glue, the installation time is greatly shortened, the working efficiency is improved, and stability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board heat dissipation, in particular to a circuit board heat dissipation structure. Background Art

[0002] Chips are the core components of electronic devices. Usually, chips are installed on circuit boards and control electronic devices to work through circuit boards. Whether the chip can operate normally is related to whether the entire electronic device can operate normally. Therefore, chip protection devices are usually provided on electronic devices. When the chip is running, heat will be generated. When the heat is accumulated due to failure to be transferred in time, the temperature of the chip and its surrounding circuit board fragments will continue to rise. If the temperature exceeds the temperature limit that the chip and circuit board materials can withstand, it will easily cause the chip and circuit board to be damaged or burned. In order to transfer the heat generated by the operation of the chip and the heat on the circuit board in time, heat sinks are generally installed on existing circuit boards. At present, most heat sinks on circuit boards are glued to the chip. Since the area of ​​the heat sink bonding surface is much larger than the chip bonding surface, it is easy to cause the heat sink to be not firmly bonded to the chip, and there is a risk of the heat sink falling off the chip. In addition, it takes a while to wait for the glue to solidify when the heat sink is glued to the chip. This will cause inconvenience to the assembly of other components during production and affect work efficiency. Utility Model Content

[0003] The technical problem solved by the utility model is to overcome the defects of the prior art and provide a circuit board heat dissipation structure.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A circuit board heat dissipation structure comprises a circuit board and a chip, wherein the chip is located at the top of the circuit board, a heat sink is provided on the top of the chip, movable plates are provided on the left and right sides of the heat sink, two fixing rods are fixedly connected to the side of the movable plate close to the heat sink, a through hole is provided on the movable plate, a threaded tube is provided on the top of the movable plate, a connecting ring is fixedly sleeved on the outer edge of the threaded tube close to the top, a cylinder is fixedly connected to the top of the connecting ring, a groove is provided on the inner ring of the cylinder close to the top, a screw is provided on the top of the cylinder, two screw holes are provided on the circuit board, and the bottom end of the screw movably passes through the cylinder, the connecting ring, the threaded tube and the through hole, and is plugged into the inner cavity of the adjacent screw hole.

[0006] Preferably, the fixing rod and the heat sink match each other, and the fixing rod is movably plugged into the side wall of the heat sink.

[0007] Preferably, the screw is a plum screw, and the screw is threadedly connected to the threaded tube and the screw hole respectively.

[0008] Preferably, the bottom end of the threaded tube fits with the top of the movable plate.

[0009] Preferably, the groove is a hexagonal groove, and the outer diameter of the screw is smaller than the inner diameter of the cylinder.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The utility model discloses a heat dissipation structure for a circuit board. A movable plate drives a fixing rod to be inserted on a side wall of a heat sink. A screw is passed through a through hole and is tightened in an inner cavity of the screw hole. Then, a hexagonal wrench and a groove cooperate with each other to rotate a cylinder. The cylinder drives a threaded tube to rotate on the outer side of the screw through a connecting ring. The threaded tube moves downward relative to the screw under the action of the thread. The threaded tube presses the movable plate downward. The movable plate drives the fixing rod to move downward. The fixing rod presses the heat sink downward, thereby fixing the heat sink. There is no need to use glue to fix the heat sink, thereby greatly shortening the installation time, improving the work efficiency, and having high stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a frontal stereogram of the utility model;

[0013] Figure 2 For this utility model Figure 1 Exploded diagram of

[0014] Figure 3 It is a front perspective view of the movable plate of the utility model component;

[0015] Figure 4 For this utility model Figure 3 Exploded diagram of

[0016] Figure 5 It is a front perspective view of the connecting ring of the utility model component;

[0017] Figure 6 It is a bottom perspective view of the connecting ring of the utility model.

[0018] Numbers in the figure: 1, circuit board; 2, chip; 3, heat sink; 4, movable plate; 5, fixing rod; 6, through hole; 7, threaded tube; 8, connecting ring; 9, cylinder; 10, groove; 11, screw; 12, screw hole. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-6 , the utility model provides a technical solution:

[0021] A circuit board heat dissipation structure comprises a circuit board 1 and a chip 2, wherein the chip 2 is located at the top of the circuit board 1, a heat sink 3 is arranged on the top of the chip 2, a movable plate 4 is arranged on the left and right sides of the heat sink 3, two fixing rods 5 are fixedly connected to one side of the movable plate 4 close to the heat sink 3, the fixing rods 5 match the heat sink 3, the fixing rods 5 are movably plugged into the side wall of the heat sink 3, a through hole 6 is opened on the movable plate 4, a threaded tube 7 is arranged on the top of the movable plate 4, the bottom end of the threaded tube 7 is in contact with the top of the movable plate 4, and the outer edge of the threaded tube 7 is close to the top A connecting ring 8 is fixedly sleeved at the end, and a cylinder 9 is fixedly connected to the top of the connecting ring 8. A groove 10 is provided on the inner ring of the cylinder 9 near the top. A screw 11 is provided on the top of the cylinder 9. Two screw holes 12 are provided on the circuit board 1. The bottom end of the screw 11 movably passes through the cylinder 9, the connecting ring 8, the threaded tube 7 and the through hole 6, and is inserted into the inner cavity of the adjacent screw hole 12. The screw 11 is a plum screw, and the screw 11 is threadedly connected to the threaded tube 7 and the screw hole 12 respectively. The groove 10 is a hexagonal groove, and the outer diameter of the screw 11 is smaller than the inner diameter of the cylinder 9.

[0022] Working principle: The utility model is a circuit board heat dissipation structure. During use, first, move the heat sink 3 and place the heat sink 3 on the chip 2, then move the movable plate 4, the movable plate 4 drives the fixing rod 5 to be plugged into the side wall of the heat sink 3, and then move the screw 11, the threaded tube 7, the connecting ring 8 and the cylinder 9 as a whole, pass the screw 11 through the through hole 6, and tighten it in the inner cavity of the screw hole 12 through a plum screwdriver, and then use the hexagonal wrench and the groove 10 to cooperate with each other to rotate the cylinder 9, the cylinder 9 drives the threaded tube 7 to rotate on the outside of the screw 11 through the connecting ring 8, the threaded tube 7 moves downward relative to the screw 11 under the action of the thread, the threaded tube 7 squeezes the movable plate 4 downward, the movable plate 4 drives the fixing rod 5 to move downward, the fixing rod 5 presses the heat sink 3 downward, thereby fixing the heat sink 3, and no glue is needed to fix the heat sink 3, which greatly shortens the installation time, improves the work efficiency, and has high stability.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0028] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A circuit board heat dissipation structure, comprising a circuit board (1) and a chip (2), wherein the chip (2) is located on top of the circuit board (1), and is characterized in that: A heat sink (3) is provided on the top of the chip (2), and movable plates (4) are provided on the left and right sides of the heat sink (3). Two fixing rods (5) are fixedly connected to the side of the movable plate (4) close to the heat sink (3), and a through hole (6) is provided on the movable plate (4). A threaded tube (7) is provided on the top of the movable plate (4), and a connecting ring (8) is fixedly sleeved on the outer edge of the threaded tube (7) near the top. A cylinder (9) is fixedly connected to the top of the connecting ring (8), and a groove (10) is provided on the inner ring of the cylinder (9) near the top. A screw (11) is provided on the top of the cylinder (9), and two screw holes (12) are provided on the circuit board (1). The bottom end of the screw (11) movably passes through the cylinder (9), the connecting ring (8), the threaded tube (7) and the through hole (6), and is inserted into the inner cavity of the adjacent screw hole (12).

2. A circuit board heat dissipation structure according to claim 1, characterized in that: The fixing rod (5) and the heat sink (3) match each other, and the fixing rod (5) is movably plugged into the side wall of the heat sink (3).

3. A circuit board heat dissipation structure according to claim 1, characterized in that: The screw (11) is a plum screw, and the screw (11) is threadedly connected to the threaded tube (7) and the screw hole (12) respectively.

4. The circuit board heat dissipation structure according to claim 1, characterized in that: The bottom end of the threaded tube (7) is in contact with the top of the movable plate (4).

5. The circuit board heat dissipation structure according to claim 1, characterized in that: The groove (10) is a hexagonal groove, and the outer diameter of the screw (11) is smaller than the inner diameter of the cylinder (9).

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