Heterogeneous integrated chip packaging structure

Abstract

The utility model relates to the technical field of chip packaging, and discloses a heterogeneous integrated chip packaging structure, which solves the problem that heat cannot be uniformly and quickly dissipated due to over-high temperature when a heterogeneous integrated chip is packaged, and comprises a base bottom plate, an upper packaging cover is arranged above the base bottom plate, and a lower packaging cover is arranged above the upper packaging cover. An upper cooling assembly for cooling the chip is arranged on the bottom surface of the upper packaging cover, the upper cooling assembly comprises a mounting plate fixedly connected to the bottom surface of the upper packaging cover, a top groove is formed in the upper surface of the mounting plate, liquid storage plates are fixedly connected to the bottom surface of the mounting plate, the liquid storage plates are filled with cooling liquid, and the number of the liquid storage plates is six; the six sets of liquid storage plates are symmetrically arranged, a gap is formed between every two sets of liquid storage plates, a fan is fixedly connected to the upper surface of the base bottom plate, an air blowing groove is formed in one side of the fan, and through cooperation of all the components, the purpose of uniform and rapid heat dissipation of the heterogeneous integrated chip is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a heterogeneous integrated chip packaging structure. Background Art

[0002] A heterogeneous integrated chip is an integrated circuit that integrates different types of functional units on the same chip. Compared with traditional homogeneous integrated circuits, heterogeneous integrated chips can integrate multiple devices with different functions on one chip to achieve collaborative work of multiple functions. This integration method can improve system performance, reduce power consumption, and simplify system design and packaging processes to a certain extent. Heterogeneous integrated chips usually need to solve problems such as communication, collaborative work and management between different functional units. Therefore, advanced packaging technology and design methods are needed to achieve effective integration and collaborative work between different functional units. However, existing heterogeneous integrated chips do not have a good heat dissipation structure when packaged, and fans are often used to dissipate heat on the outside of the chips. However, this method cannot dissipate heat evenly and quickly on the chips in a timely manner, affecting the service life of the chips.

[0003] In view of the above problems, a heterogeneous integrated chip packaging structure is proposed to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a heterogeneous integrated chip packaging structure, and adopts the device to work, thereby solving the problem that the temperature is too high and the heat cannot be uniformly and quickly dissipated when packaging heterogeneous integrated chips.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heterogeneous integrated chip packaging structure, comprising a base bottom plate, an upper packaging cover is arranged above the base bottom plate, a mounting assembly for assembling the chip is arranged inside the base bottom plate, and an upper cooling assembly for cooling the chip is arranged on the bottom surface of the upper packaging cover;

[0006] The upper cooling assembly includes a mounting plate fixedly connected to the bottom surface of the upper packaging cover, a top groove is provided on the upper surface of the mounting plate, a liquid storage plate is fixedly connected to the bottom surface of the mounting plate, the liquid storage plate is filled with coolant, there are six groups of liquid storage plates in total, the six groups of liquid storage plates are symmetrically arranged and a gap is provided between every two groups of liquid storage plates, a fan is fixedly connected to the upper surface of the base bottom plate, an air blowing groove is provided on one side of the fan, there are two groups of fans in total, and the two groups of fans are symmetrically arranged.

[0007] Preferably, a liquid storage chamber is provided inside the bottom plate of the base, and the liquid storage chamber is filled with cooling liquid.

[0008] Preferably, the installation component includes a silicon interposer, a chip board is arranged above the silicon interposer, a metal ball B is fixedly connected to the bottom surface of the chip board, a wire is fixedly connected to the bottom surface of the metal ball B, a through hole is fixedly connected to the upper surface of the silicon interposer, the through hole is arranged corresponding to the wire, a metal ball A is fixedly connected to the bottom surface of the silicon interposer, and a ventilation groove is opened on one side of the silicon interposer.

[0009] Preferably, an exhaust fan is fixedly connected to the upper surface of the upper packaging cover, a filter is fixedly connected to the inner wall of the exhaust fan, and the exhaust fan is communicated with the interior of the upper packaging cover.

[0010] Preferably, a mounting groove is provided on the inner wall of the base bottom plate, and a pin is fixedly connected to the inner wall of the base bottom plate.

[0011] Preferably, a sealing groove is provided on the upper surface of the base bottom plate, a clamping block is fixedly connected to the bottom surface of the upper sealing cover, a sealing sleeve is fixedly connected to the outer side of the clamping block, a thread groove A is provided on one side of the base bottom plate, a thread groove B is provided on one side of the clamping block, the clamping block and the sealing groove are arranged correspondingly, and the thread groove A and the thread groove B are arranged correspondingly.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0013] The utility model proposes a heterogeneous integrated chip packaging structure. During packaging, a liquid storage plate is arranged around the chip to cool the chip. At the same time, the fan is turned on to blow air through the air blowing groove, driving the air flow inside the bottom plate of the base, promoting the contact between the hot air and the liquid storage plate for cooling, thereby achieving a cooling effect on the chip. At the same time, through the arrangement of the liquid storage chamber, the chip is cooled from the bottom, which promotes the cooling effect. The exhaust fan is used to discharge the heat inside the bottom plate of the base from the top groove, which assists the heat dissipation effect, and finally achieves the purpose of uniform and rapid heat dissipation of the heterogeneous integrated chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the liquid storage chamber structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the chip assembly structure of the utility model;

[0017] Figure 4 This is a schematic diagram of the mounting plate structure of the utility model.

[0018] In the figure: 1. base bottom plate; 11. sealing groove; 111. threaded groove A; 12. mounting groove; 121. pin; 13. liquid storage chamber; 2. upper packaging cover; 21. exhaust fan; 22. filter; 23. block; 24. sealing sleeve; 25. threaded groove B; 26. upper cooling assembly; 261. mounting plate; 262. liquid storage plate; 263. top groove; 3. mounting assembly; 31. silicon interposer; 32. through hole; 33. air permeable groove; 34. metal ball A; 35. chip board; 36. metal ball B; 37. wire; 4. fan; 41. air blowing groove. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings.

[0021] Combination Figure 1 A heterogeneous integrated chip packaging structure includes a base bottom plate 1, an upper packaging cover 2 is arranged above the base bottom plate 1, a mounting component 3 for assembling the chip is arranged inside the base bottom plate 1, and an upper cooling component 26 for cooling the chip is arranged on the bottom surface of the upper packaging cover 2.

[0022] The utility model is further described below in conjunction with embodiments.

[0023] Combination Figure 2-Figure 4The upper cooling assembly 26 includes a mounting plate 261 fixedly connected to the bottom surface of the upper packaging cover 2, a top groove 263 is provided on the upper surface of the mounting plate 261, a liquid storage plate 262 is fixedly connected to the bottom surface of the mounting plate 261, and the liquid storage plate 262 is filled with cooling liquid. There are six groups of liquid storage plates 262, and the six groups of liquid storage plates 262 are symmetrically arranged and a gap is provided between each two groups of liquid storage plates 262. The upper surface of the base bottom plate 1 is fixedly connected to a fan 4, and a gas blowing groove 41 is provided on one side of the fan 4. There are two groups of fans 4, two groups The fan 4 is symmetrically arranged. Through the arrangement of the mounting plate 261, the liquid storage plate 262, the top groove 263, the fan 4 and the air blowing groove 41, when packaging the chip, the top groove 263 is used to align with the chip and leave space. After the upper packaging cover 2 is installed on the base bottom plate 1, the liquid storage plate 262 is used to cool the chip, and the fan 4 is turned on at the same time. The fan 4 blows air into the inside of the base bottom plate 1 through the air blowing groove 41, and the gas flows through the gap between the sealing sleeves 24, which promotes the cooling effect on the chip and achieves the purpose of uniform and stable cooling.

[0024] A liquid storage chamber 13 is provided inside the base bottom plate 1. The liquid storage chamber 13 is filled with cooling liquid. Through the provision of the liquid storage chamber 13, the chip is cooled from the bottom to promote the cooling effect.

[0025] The mounting assembly 3 includes a silicon interposer 31, a chip board 35 is arranged above the silicon interposer 31, a metal ball B36 is fixedly connected to the bottom surface of the chip board 35, a wire 37 is fixedly connected to the bottom surface of the metal ball B36, a through hole 32 is fixedly connected to the upper surface of the silicon interposer 31, the through hole 32 is arranged corresponding to the wire 37, a metal ball A34 is fixedly connected to the bottom surface of the silicon interposer 31, and a ventilation groove 33 is opened on one side of the silicon interposer 31. Through the arrangement of the silicon interposer 31, the through hole 32, the ventilation groove 33, the metal ball A34, the chip board 35, the metal ball B36 and the wire 37, the chip board 35 to be packaged is aligned with the through hole 32 through the metal ball B36 and the wire 37 for connection and installation, and the connection and communication between devices in the multi-chip system are realized by connecting to the silicon interposer 31. The metal ball A34 is used to transmit electrical signals, and the ventilation groove 33 can discharge the heat generated during the working process and drive the air flow through the fan 4.

[0026] An exhaust fan 21 is fixedly connected to the upper surface of the upper packaging cover 2, and a filter screen 22 is fixedly connected to the inner wall of the exhaust fan 21. The exhaust fan 21 is connected to the interior of the upper packaging cover 2. Through the arrangement of the exhaust fan 21 and the filter screen 22, the heat inside the base bottom plate 1 can be discharged from the top groove 263 to assist the heat dissipation effect. The filter screen 22 is used to prevent impurities from entering the interior of the base bottom plate 1.

[0027] The inner wall of the base bottom plate 1 is provided with a mounting groove 12, and the inner wall of the base bottom plate 1 is also fixedly connected with a pin 121. The mounting groove 12 and the pin 121 are arranged to leave space for chip installation, and the pin 121 is used for electrical connection of the chip.

[0028] A sealing groove 11 is provided on the upper surface of the base bottom plate 1, a clamping block 23 is fixedly connected to the bottom surface of the upper packaging cover 2, a sealing sleeve 24 is fixedly connected to the outer side of the clamping block 23, a thread groove A111 is provided on one side of the base bottom plate 1, a thread groove B25 is provided on one side of the clamping block 23, the clamping block 23 is arranged correspondingly to the sealing groove 11, and the thread groove A111 is arranged correspondingly to the thread groove B25. Through the arrangement of the clamping block 23, the sealing sleeve 24, the thread groove B25, the sealing groove 11 and the thread groove A111, when the chip is finally packaged, the clamping block 23 is aligned with the sealing groove 11 for installation, the sealing sleeve 24 has a sealing effect, and then other fixing parts are used to align the thread groove A111 and the thread groove B25 for fixation to complete the packaging operation.

[0029] Specifically, during packaging, a liquid storage plate 262 is set around the chip to cool the chip. At the same time, the fan 4 is turned on to blow air through the air blowing groove 41, driving the air flow inside the base bottom plate 1, promoting the hot air to contact with the liquid storage plate 262 for cooling, thereby achieving a cooling effect on the chip. At the same time, through the setting of the liquid storage chamber 13, the chip is cooled from the bottom, which promotes the cooling effect. The exhaust fan 21 is used to discharge the heat inside the base bottom plate 1 from the top groove 263, which assists the heat dissipation effect, and finally achieves the purpose of uniform and rapid heat dissipation of the heterogeneous integrated chip.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heterogeneous integrated chip packaging structure, comprising a base bottom plate (1), an upper packaging cover (2) being arranged above the base bottom plate (1), characterized in that: The base bottom plate (1) is provided with a mounting assembly (3) for assembling the chip inside, and the bottom surface of the upper packaging cover (2) is provided with an upper cooling assembly (26) for cooling the chip; The upper cooling assembly (26) comprises a mounting plate (261) fixedly connected to the bottom surface of the upper packaging cover (2), a top groove (263) being provided on the upper surface of the mounting plate (261), a liquid storage plate (262) being fixedly connected to the bottom surface of the mounting plate (261), the liquid storage plate (262) being filled with cooling liquid, a total of six groups of liquid storage plates (262) being provided, the six groups of liquid storage plates (262) being symmetrically arranged and a gap being provided between every two groups of liquid storage plates (262), a fan (4) being fixedly connected to the upper surface of the base bottom plate (1), a gas blowing groove (41) being provided on one side of the fan (4), a total of two groups of fans (4) being provided, the two groups of fans (4) being symmetrically arranged.

2. The heterogeneous integrated chip packaging structure according to claim 1, characterized in that: A liquid storage chamber (13) is provided inside the base bottom plate (1), and the liquid storage chamber (13) is filled with cooling liquid.

3. The heterogeneous integrated chip packaging structure according to claim 1, characterized in that: The mounting assembly (3) comprises a silicon interposer (31), a chip board (35) is arranged above the silicon interposer (31), a metal ball B (36) is fixedly connected to the bottom surface of the chip board (35), a wire (37) is fixedly connected to the bottom surface of the metal ball B (36), a through hole (32) is fixedly connected to the top surface of the silicon interposer (31), the through hole (32) and the wire (37) are arranged correspondingly, a metal ball A (34) is fixedly connected to the bottom surface of the silicon interposer (31), and a venting groove (33) is provided on one side of the silicon interposer (31).

4. The heterogeneous integrated chip packaging structure according to claim 1, characterized in that: An exhaust fan (21) is fixedly connected to the upper surface of the upper packaging cover (2), a filter screen (22) is fixedly connected to the inner wall of the exhaust fan (21), and the exhaust fan (21) is communicated with the interior of the upper packaging cover (2).

5. The heterogeneous integrated chip packaging structure according to claim 1, characterized in that: The inner wall of the base bottom plate (1) is provided with a mounting groove (12), and the inner wall of the base bottom plate (1) is also fixedly connected with a pin (121).

6. The heterogeneous integrated chip packaging structure according to claim 1, characterized in that: The upper surface of the base bottom plate (1) is provided with a sealing groove (11); the bottom surface of the upper sealing cover (2) is fixedly connected with a clamping block (23); the outer side of the clamping block (23) is fixedly connected with a sealing sleeve (24); one side of the base bottom plate (1) is provided with a thread groove A (111); one side of the clamping block (23) is provided with a thread groove B (25); the clamping block (23) and the sealing groove (11) are arranged correspondingly; and the thread groove A (111) and the thread groove B (25) are arranged correspondingly.

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