Substrate heat dissipation structure

Abstract

The utility model relates to the technical field of heat dissipation substrates, and discloses a substrate heat dissipation structure which comprises two plate shells, the inner wall of the top plate shell is fixedly connected with a mounting plate, the front side and the rear side of the top wall of the mounting plate are both provided with mounting grooves, the inner wall of the bottom plate shell is fixedly connected with a fixing plate, the inner wall of the fixing plate is rotationally connected with a rotating column, and the rotating column is fixedly connected with the mounting plate. The device comprises a rotating column, the bottom wall of the rotating column is fixedly connected with fan equipment, the top wall of the rotating column is fixedly connected with a cleaning shell, the inner bottom wall of the cleaning shell is fixedly connected with a plurality of reset springs at equal intervals, the top ends of the reset springs are fixedly connected with a mounting shell, and bolts are arranged on the left side and the right side of the mounting shell in a threaded and penetrating mode. According to the utility model, by starting the fan equipment, the rotating column drives the cleaning shell and the cleaning brush to rotate together, so that the inner wall gap and the bottom wall of the mounting plate can be dedusted and cleaned, and the situation that the substrate adsorbs more dust to block the interior of the substrate and affect the heat dissipation effect is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation substrates, in particular to a substrate heat dissipation structure. Background Art

[0002] Substrate usually refers to the plate on which the chip is mounted. The materials commonly used for this substrate include aluminum, copper, ceramics, etc. These materials have good thermal conductivity, help dissipate heat, improve the stability and life of the chip, are used to support and connect the chip, and provide electrical connections.

[0003] The heat dissipation substrate is a special substrate for heat dissipation, which is usually used in electronic devices, especially electronic devices that integrate high-power density components. Its main function is to effectively conduct the heat generated by the device to the external environment to keep the operating temperature of the device within a safe range.

[0004] When the existing substrate is dissipating heat, it will absorb a lot of dust, which will reduce the heat dissipation effect and make it difficult for operators to handle the dust and dirt, thereby increasing the accumulation of heat on it and affecting the normal use of the chip. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a substrate heat dissipation structure, which aims to improve the problem that the heat dissipation effect is reduced due to the adsorption of more dust, making it difficult for operators to complete the treatment of dust and dirt, thereby increasing the accumulation of heat thereon and affecting the normal use of the chip.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a substrate heat dissipation structure, comprising two plate shells, the inner wall of the top plate shell is fixedly connected with a mounting plate, the front and rear sides of the top wall of the mounting plate are provided with mounting grooves, the inner wall of the bottom plate shell is fixedly connected with a fixing plate, the inner wall of the fixing plate is rotatably connected with a rotating column, the bottom wall of the rotating column is fixedly connected with a fan device, the top wall of the rotating column is fixedly connected with a cleaning shell, the inner bottom wall of the cleaning shell is equidistantly fixedly connected with a plurality of reset springs, the top ends of the plurality of reset springs are fixedly connected with the mounting shell, the left and right sides of the mounting shell are threaded with bolts, the adjacent sides of the two bolts are threaded with cleaning brushes, and the front and rear sides of the inner wall of the top plate shell are provided with a disassembly mechanism, the disassembly mechanism makes it convenient for operators to inspect and maintain the interior of the substrate, thereby improving the service life of the substrate.

[0007] As a further description of the above technical solution:

[0008] The disassembly mechanism includes two threaded rods, one end of the two threaded rods are respectively rotatably connected to the left and right sides of the inner wall of the top plate shell, the outer walls of the two threaded rods are threadedly connected with locking rods, the right ends of the two locking rods are fixedly connected with knobs, the front and back sides of the inner bottom wall of the top plate shell are provided with sliding grooves, the tops of the two locking rods are respectively slidably connected to the corresponding sliding grooves, the front and back sides of the bottom plate shell are fixedly connected with a locking shell, the right sides of the two locking shells are provided with locking grooves, and the bottom ends of the two locking rods are respectively engaged with the corresponding locking grooves.

[0009] As a further description of the above technical solution:

[0010] The four corners of the top wall of the plate shell at the bottom are fixedly connected with connecting columns, and the four corners of the bottom wall of the plate shell at the top are opened with holes, and the top ends of the multiple connecting columns are respectively engaged with the corresponding holes.

[0011] As a further description of the above technical solution:

[0012] The left sides of the bottom ends of the two locking rods are fixedly connected with rubber sleeves, and the external dimensions of the two rubber sleeves match the internal dimensions of the corresponding locking grooves.

[0013] As a further description of the above technical solution:

[0014] The left and right sides of the plate shell at the bottom and the left and right sides of the bottom wall of the plate shell at the top are both provided with heat dissipation grooves.

[0015] As a further description of the above technical solution:

[0016] The top wall of the plate shell is fixedly connected with a protective ring, and the inner wall of the protective ring adopts a smooth design.

[0017] As a further description of the above technical solution:

[0018] The outer walls of the two knobs are fixedly connected with a plurality of protrusions, and the outer walls of the plurality of protrusions are all square in design.

[0019] As a further description of the above technical solution:

[0020] The middle parts of the two bolts are fixedly connected with rubber pads.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, by starting the fan device, the rotating column drives the cleaning shell and the cleaning brush fixedly installed by the threaded knob to rotate together, so that the inner wall gaps and the bottom wall of the mounting plate can be dust-removed and cleaned, thereby avoiding the substrate from absorbing a lot of dust when dissipating heat, thereby clogging and affecting the heat dissipation effect, reducing the accumulation of heat inside the substrate, and improving the heat dissipation effect of the substrate.

[0023] 2. In the utility model, by turning two knobs, the threaded rod drives the locking rod to move rightward within the rotation limit of the seaweed, so that the left end of the locking rod is unlocked from the locking shell, and by pulling the top plate shell, the two plate shells can be disassembled and separated, thereby facilitating maintenance of the interior of the plate shell and greatly improving the service life of the base plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A three-dimensional diagram of a substrate heat dissipation structure proposed by the utility model;

[0025] Figure 2 A schematic structural diagram of a cleaning brush for a substrate heat dissipation structure proposed by the utility model;

[0026] Figure 3 The utility model is a schematic diagram of a disassembly mechanism of a substrate heat dissipation structure.

[0027] Legend:

[0028] 1. Plate shell; 2. Disassembly mechanism; 201. Threaded rod; 202. Locking rod; 203. Knob; 204. Slide groove; 205. Locking shell; 206. Locking groove; 207. Bump; 208. Rubber sleeve; 3. Mounting plate; 4. Mounting groove; 5. Fixing plate; 6. Fan device; 7. Rotating column; 8. Cleaning shell; 9. Reset spring; 10. Mounting shell; 11. Bolt; 12. Cleaning brush; 13. Rubber pad; 14. Connecting column; 15. Hole; 16. Protective ring; 17. Heat sink. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Reference Figure 1 and Figure 2, the utility model provides an embodiment: a substrate heat dissipation structure, including two plate shells 1, the inner wall of the top plate shell 1 is fixedly connected with a mounting plate 3, the front and rear sides of the top wall of the mounting plate 3 are provided with mounting grooves 4, the inner wall of the bottom plate shell 1 is fixedly connected with a fixing plate 5, the inner wall of the fixing plate 5 is rotatably connected with a rotating column 7, the bottom wall of the rotating column 7 is fixedly connected with a fan device 6, the top wall of the rotating column 7 is fixedly connected with a cleaning shell 8, the inner bottom wall of the cleaning shell 8 is equidistantly fixedly connected with a plurality of reset springs 9, the top ends of the plurality of reset springs 9 are fixedly connected with a mounting shell 10, the left and right sides of the mounting shell 10 are threaded with bolts 11, the adjacent sides of the two bolts 11 are threadedly connected with a cleaning brush 12, the front and rear sides of the inner wall of the top plate shell 1 are provided with a disassembly mechanism 2, the disassembly mechanism 2 makes it convenient for operators to inspect and maintain the interior of the substrate, thereby improving the service life of the substrate;

[0031] Specifically, when the fan device 6 is started, it will drive the rotating column 7 to rotate together. The rotational movement of the rotating column 7 enables the cleaning shell 8 to be effectively driven. With the movement of the cleaning shell 8, the mounting shell 10 and the cleaning brush 12 fixedly mounted by two bolts 11 also start to work. These cleaning brushes 12 are carefully designed to fit tightly against the bottom wall and internal gaps of the mounting plate 3, thereby effectively removing dust and impurities therein. This cleaning method has significant advantages. First, it greatly reduces the adsorption and accumulation of dust on the bottom wall and inside of the mounting plate 3. In addition, this cleaning device also adopts the design of multiple reset springs 9. These reset springs 9 have good elasticity and resilience, which can ensure that the cleaning brush 12 is always tightly against the bottom wall of the mounting plate 3. This close-fitting design not only improves the cleaning effect, but also effectively prevents the cleaning brush 12 from loosening or falling off during the cleaning process, thereby reducing the accumulation of heat inside the substrate, avoiding the blockage of dust from affecting the heat dissipation of the substrate, and thus improving the heat dissipation effect of the substrate.

[0032] Reference Figure 1 and Figure 3 The disassembly mechanism 2 includes two threaded rods 201, one end of the two threaded rods 201 is rotatably connected to the left and right sides of the inner wall of the top plate shell 1, the outer walls of the two threaded rods 201 are threadedly connected with locking rods 202, the right ends of the two locking rods 202 are fixedly connected with knobs 203, the front and rear sides of the inner bottom wall of the top plate shell 1 are provided with sliding grooves 204, the tops of the two locking rods 202 are respectively slidably connected with the corresponding sliding grooves 204, the front and rear sides of the bottom plate shell 1 are fixedly connected with locking shells 205, the right sides of the two locking shells 205 are provided with locking grooves 206, and the bottom ends of the two locking rods 202 are respectively engaged with the corresponding locking grooves 206;

[0033] Specifically, when the knob 203 is turned, the threaded rod 201 starts to rotate. Under the rotation of the threaded rod 201, the locking rod 202 has a tendency to rotate and move. Under the restriction of the slide groove 204, the locking rod 202 completes a linear displacement in the left and right directions. As the locking rod 202 moves, it gradually separates from the locking groove 206 inside the locking shell 205 and then releases the lock, thereby pulling the top plate shell 1, so that the base plate can be disassembled, thereby facilitating the maintenance of the inside of the plate shell 1, and greatly improving the service life of the base plate.

[0034] Reference Figure 1 , Figure 2 and Figure 3 The four corners of the top wall of the bottom plate shell 1 are fixedly connected with connecting columns 14, and the four corners of the bottom wall of the top plate shell 1 are provided with holes 15, and the top ends of the multiple connecting columns 14 are respectively engaged with the corresponding holes 15; the left sides of the bottom ends of the two locking rods 202 are fixedly connected with rubber sleeves 208, and the external dimensions of the two rubber sleeves 208 match the internal dimensions of the corresponding locking grooves 206;

[0035] Specifically, the top ends of the plurality of connection columns 14 are respectively engaged with the corresponding holes 15 , thereby improving the connection effect of the two plate shells 1 , and the locking rod 202 and the corresponding locking groove 206 are more stably locked by the rubber sleeve 208 .

[0036] Reference Figure 1 and Figure 3 The left and right sides of the bottom plate shell 1 and the left and right sides of the bottom wall of the top plate shell 1 are provided with heat dissipation grooves 17; the top wall of the top plate shell 1 is fixedly connected with a protective ring 16, and the inner wall of the protective ring 16 is designed to be smooth; the outer walls of the two knobs 203 are fixedly connected with a plurality of protrusions 207, and the outer walls of the plurality of protrusions 207 are designed to be square; the middle parts of the two bolts 11 are fixedly connected with rubber pads 13;

[0037] Specifically, the heat dissipation effect of the substrate is improved through multiple heat dissipation grooves 17, the installed chip can be protected through the protective ring 16, the static friction of the knob 203 is increased through multiple bumps 207, thereby improving the anti-slip effect of the knob 203, and the two rubber pads 13 reduce the rotational damage of the bolt 11 to both sides of the mounting shell 10.

[0038] Working principle: When starting to use, the chip is installed through the two mounting grooves 4 on the top wall of the mounting plate 3. When using heat dissipation, the fan device 6 is started to rotate the rotating column 7, so that the cleaning shell 8 is driven, and then the mounting shell 10 and the cleaning brush 12 fixedly installed by two bolts 11 start to clean the bottom wall and internal gaps of the mounting plate 3, thereby reducing the adsorption and accumulation of dust on the bottom wall and inside of the mounting plate 3. Through the elastic force of multiple return springs 9, the cleaning brush 12 can be closely attached to the bottom wall of the mounting plate 3, thereby improving the cleaning effect. By rotating the two bolts 11, the cleaning brush 12 can be replaced and disassembled;

[0039] And by turning the knob 203, the threaded rod 201 is rotated, so that the locking rod 202 has a tendency to rotate and move. When the sliding groove 204 restricts the rotation of the locking rod 202, the locking rod 202 completes a linear displacement in the left and right directions, and then can contact and lock with the locking groove 206 inside the locking shell 205. By pulling the top plate shell 1, the two plate shells 1 are completely disassembled.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A substrate heat dissipation structure, comprising two plate shells (1), characterized in that: The inner wall of the plate shell (1) at the top is fixedly connected with a mounting plate (3), and mounting grooves (4) are provided on the front and rear sides of the top wall of the mounting plate (3); the inner wall of the plate shell (1) at the bottom is fixedly connected with a fixing plate (5), and the inner wall of the fixing plate (5) is rotatably connected with a rotating column (7), and the bottom wall of the rotating column (7) is fixedly connected with a fan device (6); the top wall of the rotating column (7) is fixedly connected with a cleaning shell (8), and the inner bottom wall of the cleaning shell (8) is fixedly connected with a plurality of return springs (9) at equal intervals, and the top ends of the plurality of return springs (9) are fixedly connected with a mounting shell (10), and bolts (11) are threadedly penetrated on the left and right sides of the mounting shell (10), and cleaning brushes (12) are threadedly connected on the adjacent sides of the two bolts (11); and a disassembly mechanism (2) is provided on the front and rear sides of the inner wall of the plate shell (1) at the top, and the disassembly mechanism (2) makes it convenient for operators to inspect and maintain the interior of the base plate, thereby improving the service life of the base plate.

2. A substrate heat dissipation structure according to claim 1, characterized in that: The disassembly mechanism (2) comprises two threaded rods (201), one end of the two threaded rods (201) is rotatably connected to the left and right sides of the inner wall of the top plate shell (1), the outer walls of the two threaded rods (201) are threadedly connected with locking rods (202), the right ends of the two locking rods (202) are fixedly connected with knobs (203), the front and rear sides of the inner bottom wall of the top plate shell (1) are provided with sliding grooves (204), the tops of the two locking rods (202) are slidably connected with the corresponding sliding grooves (204), the front and rear sides of the bottom plate shell (1) are fixedly connected with locking shells (205), the right sides of the two locking shells (205) are provided with locking grooves (206), and the bottom ends of the two locking rods (202) are respectively engaged with the corresponding locking grooves (206).

3. The substrate heat dissipation structure according to claim 1, characterized in that: The top wall of the plate shell (1) at the bottom is fixedly connected with connecting columns (14) at the four corners, and the bottom wall of the plate shell (1) at the top is provided with holes (15) at the four corners, and the top ends of the plurality of connecting columns (14) are respectively engaged with the corresponding holes (15).

4. A substrate heat dissipation structure according to claim 2, characterized in that: The left sides of the bottom ends of the two locking rods (202) are fixedly connected with rubber sleeves (208), and the external dimensions of the two rubber sleeves (208) match the internal dimensions of the corresponding locking grooves (206).

5. The substrate heat dissipation structure according to claim 1, characterized in that: The left and right sides of the bottom plate shell (1) and the left and right sides of the bottom wall of the top plate shell (1) are both provided with heat dissipation grooves (17).

6. The substrate heat dissipation structure according to claim 1, characterized in that: A protective ring (16) is fixedly connected to the top wall of the plate shell (1) at the top, and the inner wall of the protective ring (16) is of smooth design.

7. The substrate heat dissipation structure according to claim 2, characterized in that: The outer walls of the two knobs (203) are both fixedly connected with a plurality of protrusions (207), and the outer walls of the plurality of protrusions (207) are all square in design.

8. The substrate heat dissipation structure according to claim 1, characterized in that: The middle parts of the two bolts (11) are fixedly connected with rubber pads (13).

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