Semiconductor laser packaging structure

Abstract

The utility model provides a semiconductor laser packaging structure, which belongs to the technical field of lasers and comprises a laser assembly and an adjusting assembly, the laser assembly comprises a laser main body, a front shell and a rear shell, and the adjusting assembly comprises a radiating fin and a top block. The front shell and the rear shell are additionally arranged to be matched to install the laser main body, the adjustable cooling fin assembly is installed in the rear shell, the extending range of cooling fins is adjusted through the first jackscrew, the cooling capacity of the laser main body can be adjusted, and the laser can adapt to the use requirements of different states; the casing pipe is rotated through the rotating disc, the laser main body can be driven to move along the middle of the top block under the cooperation of the guide column, the position of the laser main body in the front shell is finely adjusted, the induction range of the laser main body is adaptively adjusted, and the laser main body is conveniently maintained.

Description

Technical Field

[0001] The utility model belongs to the technical field of lasers, and in particular relates to a semiconductor laser packaging structure. Background Art

[0002] Semiconductor laser is a type of laser. Due to its small size, light weight, low voltage and high power, it is widely used. For example, it is widely used in optical fiber communication, optoelectronic integration, optical disk storage, pump light source, atmospheric environment detection, trace toxic gas analysis and molecular spectroscopy, etc. It is closely related to human life and brings a lot of convenience to people's lives.

[0003] The existing semiconductor laser packaging structure is mostly formed by sealing an upper cover plate and a lower base, and is wrapped and sealed with epoxy resin. Although the sealing effect of the packaging structure is guaranteed, it is difficult to disassemble it for a second time, which hinders the inspection, investigation and maintenance of the laser chip. The heat dissipation effect of the sealed packaging structure itself is also greatly reduced, and the heat dissipation effect of the chip cannot be guaranteed at all times during the long-term use of the chip. Utility Model Content

[0004] The utility model aims to provide a semiconductor laser packaging structure, aiming to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A semiconductor laser packaging structure includes a laser assembly and an adjustment assembly, wherein the laser assembly includes a laser body, a front shell and a rear shell, wherein the laser body is plugged into the interior of the front shell, and the rear shell is threadedly connected to the rear of the front shell;

[0007] The adjustment component includes a heat sink and a top block. The heat sink is inserted into the side wall of the rear shell. The end side wall of the laser body is threadedly connected with a sleeve. The side wall of the sleeve is connected to the central groove of the top block through a bearing. The top block is located between the laser body and the heat sink.

[0008] As a preferred solution of the utility model, the inner side wall of the rear shell is connected to a spring via bolts, and the other end of the spring is clamped on the bottom of the heat sink.

[0009] As a preferred solution of the utility model, the side wall of the rear shell is threadedly connected with a first top screw, and an end of the first top screw passes through the side wall of the rear shell and contacts the heat sink.

[0010] As a preferred solution of the utility model, the top fin of the heat sink is provided with a boss edge structure, and the side wall of the top fin of the heat sink and the side wall of the rear shell are matching arc-shaped edge structures.

[0011] As a preferred solution of the utility model, a turntable is connected to one side of the sleeve by bolts, and the turntable is located on the outer side wall of the top block.

[0012] As a preferred solution of the utility model, the side wall of the turntable is threadedly connected with a second top screw, and the end of the second top screw passes through the side wall of the turntable and contacts with the top block.

[0013] As a preferred solution of the utility model, a guide column is threadedly connected to one side of the top block, and the end of the guide column is inserted into the sliding groove on the side wall of the laser body.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: the present application adds a front shell and a rear shell to cooperate with the installation of the laser body, and an adjustable heat sink assembly is installed inside the rear shell. The extension range of the heat sink is adjusted by the first top screw, so that the heat dissipation capacity of the laser body can be adjusted to adapt to the usage requirements of different states. In addition, a spring is added to connect the heat sink, so that the stability of the connection structure between the heat sink and the rear shell can be maintained, and the heat sink can be maintained to move stably on the side wall of the rear shell. An adjustment mechanism is added to connect the front shell with the top block in cooperation with the sleeve. By rotating the sleeve on a turntable, the laser body can be moved along the middle of the top block with the cooperation of the guide column, and the position of the laser body inside the front shell can be fine-tuned to adapt to the adjustment of the sensing range of the laser body, and it is also convenient to maintain the laser body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a side structural schematic diagram of the utility model;

[0018] Figure 3 It is a front structural schematic diagram of the utility model;

[0019] Figure 4 This is a schematic diagram of the internal component structure of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the turntable assembly of the utility model.

[0021] In the figure: 100, laser assembly; 101, laser body; 102, front shell; 103, rear shell; 104, sleeve; 105, turntable; 106, second top screw; 200, adjustment assembly; 201, heat sink; 202, top block; 203, spring; 204, first top screw; 205, guide column. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0025] Example 1

[0026] Reference Figure 1-5 , which is the first embodiment of the utility model, and this embodiment provides the problem raised in the background technology.

[0027] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0028] A semiconductor laser packaging structure includes a laser assembly 100 and an adjustment assembly 200. The laser assembly 100 includes a laser body 101, a front shell 102 and a rear shell 103. The laser body 101 is plugged into the front shell 102, and the rear shell 103 is threadedly connected to the rear of the front shell 102.

[0029] The adjustment component 200 includes a heat sink 201 and a top block 202. The heat sink 201 is inserted into the side wall of the rear shell 103. The end side wall of the laser body 101 is threadedly connected with a sleeve 104. The side wall of the sleeve 104 is connected to the central groove of the top block 202 through a bearing. The top block 202 is located between the laser body 101 and the heat sink 201.

[0030] Specifically, the inner wall of the rear housing 103 is connected with a spring 203 via bolts, and the other end of the spring 203 is clamped on the bottom of the heat sink 201 .

[0031] Furthermore, a first top screw 204 is threadedly connected to the side wall of the rear shell 103 , and an end of the first top screw 204 passes through the side wall of the rear shell 103 and contacts the heat sink 201 .

[0032] Furthermore, the top fin of the heat sink 201 is provided with a boss edge structure, and the side wall of the top fin of the heat sink 201 and the side wall of the rear shell 103 are matched with each other in an arc-shaped edge structure.

[0033] Furthermore, a rotating disk 105 is connected to one side of the sleeve 104 by bolts, and the rotating disk 105 is located on the outer side wall of the top block 202 .

[0034] Furthermore, a second top screw 106 is threadedly connected to the side wall of the rotating disk 105 , and an end of the second top screw 106 passes through the side wall of the rotating disk 105 and contacts the top block 202 .

[0035] Furthermore, a guide post 205 is threadedly connected to one side of the top block 202 , and an end of the guide post 205 is inserted into a sliding groove on the side wall of the laser body 101 .

[0036] When in use, when it is necessary to fine-tune the laser body 101 between the front shell 102 and the rear shell 103, loosen the second top screw 106, and then rotate the turntable 105, and drive the sleeve 104 to rotate on the side wall of the top block 202 through the turntable 105. Since the side wall of the top block 202 is equipped with a guide column 205, the guide column 205 can limit the laser body 101 with the cooperation of the top block 202 to prevent the laser body 101 from rotating. Driven by the sleeve 104, it will move along the middle area of ​​the top block 202 to adjust the position of the laser body 101 inside the front shell 102. After the adjustment is completed, tighten the second top screw 106, cooperate with the top block 202 to fix the sleeve 104 with the turntable 105. When it is necessary to adjust the heat dissipation capacity of the laser body 101 component, loosen the first top screw 204. Based on the elastic force provided by the spring 203 and the rear shell 103, the heat sink 201 can be pushed out from the side wall of the rear shell 103, thereby increasing the heat dissipation capacity near the rear shell 103. Tighten the first top screw 204 inward. The first top screw 204 can drive the heat sink 201 to move inward based on the connection with the rear shell 103, thereby reducing the exposed area of ​​the heat sink 201 and reducing the heat dissipation capacity.

[0037] In summary, the present application adds a front shell 102 and a rear shell 103 to cooperate with the installation of the laser body 101, and installs an adjustable heat sink 201 assembly inside the rear shell 103. The extension range of the heat sink 201 is adjusted by the first top screw 204, so that the heat dissipation capacity of the laser body 101 can be adjusted to adapt to the use requirements of different states. In addition, a spring 203 is added to be connected to the heat sink 201, so that the stability of the connection structure between the heat sink 201 and the rear shell 103 can be maintained, and the heat sink 201 can be maintained to move stably on the side wall of the rear shell 103. An adjustment mechanism is added by connecting the sleeve 104 with the top block 202 and the front shell 102. The sleeve 104 is rotated by the turntable 105. With the cooperation of the guide column 205, the laser body 101 can be moved along the middle of the top block 202, and the position of the laser body 101 inside the front shell 102 can be fine-tuned to adapt to the adjustment of the sensing range of the laser body 101, and it is also convenient to maintain the laser body 101.

[0038] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and ratio of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present utility model. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0039] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0040] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A semiconductor laser packaging structure, characterized in that: The invention comprises a laser assembly (100) and an adjustment assembly (200), wherein the laser assembly (100) comprises a laser body (101), a front shell (102) and a rear shell (103), wherein the laser body (101) is inserted into the interior of the front shell (102), and the rear shell (103) is threadedly connected to the rear of the front shell (102); The adjustment component (200) comprises a heat sink (201) and a top block (202); the heat sink (201) is plugged into the side wall of the rear shell (103); a sleeve (104) is threadedly connected to the side wall of the end of the laser body (101); the side wall of the sleeve (104) is connected to the central groove of the top block (202) via a bearing; and the top block (202) is located between the laser body (101) and the heat sink (201).

2. A semiconductor laser packaging structure according to claim 1, characterized in that: The inner wall of the rear shell (103) is connected to a spring (203) via bolts, and the other end of the spring (203) is clamped on the bottom of the heat sink (201).

3. A semiconductor laser packaging structure according to claim 2, characterized in that: The side wall of the rear shell (103) is threadedly connected with a first top screw (204), and an end of the first top screw (204) passes through the side wall of the rear shell (103) and contacts the heat sink (201).

4. A semiconductor laser packaging structure according to claim 3, characterized in that: The top fin of the heat sink (201) is provided with a boss edge structure, and the side wall of the top fin of the heat sink (201) and the side wall of the rear shell (103) are matching arc-shaped edge structures.

5. The semiconductor laser packaging structure according to claim 1, characterized in that: A rotating disk (105) is connected to one side of the sleeve (104) via bolts, and the rotating disk (105) is located on the outer side wall of the top block (202).

6. The semiconductor laser packaging structure according to claim 5, characterized in that: The side wall of the rotating disk (105) is threadedly connected with a second top screw (106), and the end of the second top screw (106) passes through the side wall of the rotating disk (105) and contacts the top block (202).

7. A semiconductor laser packaging structure according to claim 6, characterized in that: A guide column (205) is threadedly connected to one side of the top block (202), and the end of the guide column (205) is inserted into a sliding groove on the side wall of the laser body (101).

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