BT board fantasy color lamp bead packaging structure

Abstract

The utility model relates to the technical field of BT board fantasy colored lamp beads, and particularly discloses a BT board fantasy colored lamp bead packaging structure, which comprises a BT circuit board, a conductive wire and a back surface, the BT circuit board is made of ceramic matrix composite materials, the upper end part of the BT circuit board is provided with a light-emitting surface, four corners of the BT circuit board are respectively provided with a positive conductive hole and a negative conductive hole in a penetrating manner, and the back surface of the BT circuit board is provided with a positive conductive hole and a negative conductive hole. The BT circuit board is made of a ceramic-based composite material, and when the connection positions of the photoelectric LED chip and the internal control colorful IC with the signal control end, the circuit negative board, the control signal end and the circuit positive line are provided with epoxy glue layers using a molding process to package the conductive wire, the connection positions are not inaccurate due to high temperature; according to the utility model, the conductive wires are prevented from being disordered or broken, stable and reliable connection is ensured, accurate positioning is further completed, and meanwhile, the BT circuit board is made of a high-temperature-resistant material, so that damage to the BT circuit board caused by high temperature during mold pressing process manufacturing can be avoided, the yield is improved, and the practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of BT board colorful lamp beads, in particular to a BT board colorful lamp bead packaging structure. Background Art

[0002] Colorful lamp beads usually refer to LED lamp beads with colorful light effects, which can produce rich color changes and special effects. Such lamp beads are often used in decoration and lighting fields, and have good visual effects and atmosphere creation functions. Colorful lamp beads usually adopt LED light-emitting technology to achieve different light effects by controlling the brightness and color of LED lamp beads, such as breathing light effects, gradient color effects, flashing effects, etc. These lamp beads can be used alone or remotely controlled through a controller or smart home system to achieve personalized light adjustment and timed switching.

[0003] When the existing fantasy lamp beads are packaged on a BT circuit board, their signal lines and power lines are often welded to the welding positions of the BT circuit board. Since the existing BT circuit board does not have a special soldering pad, it is easy to produce tin connection during welding, which in turn causes a short circuit and affects the use. In addition, the wires connected to the existing BT circuit board, the optoelectronic LED chip and the internal control fantasy IC are generally positioned by a molding process and an epoxy glue layer in combination with the epoxy glue layer. However, the existing BT circuit board is generally made of BT resin. Since the molding process generates high temperature, the resin material is difficult to withstand, and the epoxy glue layer cannot accurately position the wires, resulting in insufficient product yield and practicality that needs to be improved. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the utility model provides a BT board colorful lamp bead packaging structure, which solves the technical problem of insufficient practicality of the prior device.

[0006] (II) Technical solution

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A BT board colorful lamp bead packaging structure, comprising a BT circuit board, a conductive wire and a back surface, wherein the material of the BT circuit board is a ceramic-based composite material, the upper end of the BT circuit board is provided with a light-emitting surface, the lower end of the BT circuit board is provided with a back surface, and the four corners of the BT circuit board are penetrated with positive and negative conductive holes;

[0009] Positioning structures are respectively provided on the surfaces of the front and back conductive holes;

[0010] The positioning structure includes a signal control terminal, a circuit negative board, a control signal terminal and a circuit positive line. The signal control terminal and the control signal terminal are located between the circuit negative board and the circuit positive line. A photoelectric LED chip is provided on the surface of the circuit negative board, and an internal control magic color IC is provided on the surface of the signal control terminal.

[0011] Preferably: a power pad group, a signal pad group and a BT board insulation layer are provided on the back side, the heights of the two BT board insulation layers are lower than the heights of the power pad group and the signal pad group, and the power pad group consists of a power output pad and a power input pad.

[0012] Preferably: the signal pad group consists of a signal input pad and a signal output pad, a well-shaped insulating layer is provided between the power pad group, the signal pad group and the BT board insulating layer, the well-shaped insulating layer is a planar structure, and the lateral width of the well-shaped insulating layer is smaller than the middle width of the back side.

[0013] Preferably: the conductive wire is connected between the internal control magic color IC and the circuit negative board, the internal control magic color IC is connected to the control signal end, the conductive wire is connected between the photoelectric LED chip and the internal control magic color IC, the conductive wire is connected between the internal control magic color IC and the circuit negative board, and the conductive wire is packaged on the BT circuit board using an epoxy glue layer molding process.

[0014] Preferably: the ground wire of the colorful lamp beads on the BT circuit board is welded to the power output pad in the power pad group, the power wire of the colorful lamp beads on the BT circuit board is welded to the power input pad, the signal wire of the colorful lamp beads on the BT circuit board is welded to the signal pad group, and the signal wire of the colorful lamp beads on the BT circuit board is connected in a cut-open manner in the middle of the signal input pad and the signal output pad.

[0015] (III) Beneficial effects

[0016] 1. By setting the material of the BT circuit board to a ceramic-based composite material, an epoxy glue layer using a molding process is set at each connection position of the photoelectric LED chip and the internal control magic color IC with the signal control terminal, the circuit negative board, the control signal terminal and the circuit positive line to encapsulate the conductive wire, so that the connection position will not be inaccurate due to high temperature, and the conductive wire can be firmly fixed at a specific position to avoid confusion or breakage of the conductive wire, ensure a stable and reliable connection, and then complete precise positioning. At the same time, since the BT circuit board is a high-temperature resistant material, it can avoid damage to the BT circuit board caused by the high temperature during the molding process, thereby improving the yield rate and increasing practicality;

[0017] 2. By setting the power pad group and the signal pad group on the back of the BT circuit board, it is convenient for the staff to weld the ground wire, power wire and signal wire of the fantasy lamp beads on the BT circuit board to the power pad group and the signal pad group respectively, which is convenient for the individual wiring and positioning of the metal wires. At the same time, it can avoid the short circuit caused by welding tin, and further improve the welding efficiency and product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.

[0019] Figure 1 This is a planar structural diagram of the light-emitting surface of the utility model;

[0020] Figure 2 It is a back plane structural diagram of the utility model.

[0021] Legend: 11, BT circuit board; 12, light-emitting surface; 13, positive and negative conductive holes; 14, signal control terminal; 15, circuit negative board; 16, control signal terminal; 17, circuit positive line; 18, photoelectric LED chip; 19, internal control colorful IC; 21, conductive line; 22, back side; 23, power pad group; 24, signal pad group; 25, BT board insulation layer; 26, well-shaped insulation layer. DETAILED DESCRIPTION

[0022] The embodiment of the present application provides a BT board fantasy lamp bead packaging structure, which effectively solves the technical problem of insufficient practicality of the existing device. By setting a signal control terminal, a circuit negative board, a control signal terminal and a circuit positive line, and setting an epoxy glue layer using a molding process at each connection position of the photoelectric LED chip and the internal control fantasy IC with the signal control terminal, the circuit negative board, the control signal terminal and the circuit positive line to encapsulate the conductive wire, the conductive wire can be firmly fixed in a specific position to avoid disorder or breakage of the conductive wire, ensure a stable and reliable connection, and then complete precise positioning. At the same time, since the BT circuit board is a high-temperature resistant material, the high temperature during the molding process can be avoided from damaging the BT circuit board, thereby improving the yield rate and increasing practicality. In addition, by setting a power pad group and a signal pad group on the back of the BT circuit board, it is convenient for the staff to weld the ground wire, power line and signal line of the fantasy lamp bead on the BT circuit board to the power pad group and the signal pad group respectively, so as to facilitate the individual wiring and positioning of the metal wires. At the same time, it can avoid short circuits caused by tinning during welding, further improving welding efficiency and product yield rate.

[0023] Example

[0024] like Figure 1-Figure 2As shown, the technical solution in the embodiment of the present application effectively solves the technical problem of insufficient practicality of the existing device, and the overall idea is as follows:

[0025] In view of the problems existing in the prior art, the utility model provides a BT board colorful lamp bead packaging structure, including a BT circuit board 11, a conductive wire 21 and a back surface 22. The material of the BT circuit board 11 is a ceramic-based composite material (a ceramic-based composite material is a special composite material composed of a ceramic matrix and other reinforcing materials, and has excellent high temperature performance and corrosion resistance). The upper end of the BT circuit board 11 is provided with a light-emitting surface 12, the lower end of the BT circuit board 11 is provided with a back surface 22, and the four corners of the BT circuit board 11 are penetrated with positive and negative conductive holes 13;

[0026] Positioning structures are respectively provided on the surfaces of the front and back conductive holes 13;

[0027] The positioning structure includes a signal control terminal 14, a circuit negative board 15, a control signal terminal 16 and a circuit positive line 17. The signal control terminal 14 and the control signal terminal 16 are located between the circuit negative board 15 and the circuit positive line 17. The circuit negative board 15 is provided with a photoelectric LED chip 18 on its surface. The signal control terminal 14 is provided with an internal control magic color I C19, a power pad group 23, a signal pad group 24 and a BT board insulating layer 25 are provided on the back side 22, the heights of the two BT board insulating layers 25 are lower than the heights of the power pad group 23 and the signal pad group 24, the power pad group 23 is composed of a power output pad and a power input pad, the signal pad group 24 is composed of a signal input pad and a signal output pad, a well-shaped insulating layer 26 is provided between the power pad group 23, the signal pad group 24 and the BT board insulating layer 25, the well-shaped insulating layer 26 is a planar structure, and the lateral width of the well-shaped insulating layer 26 is smaller than the middle width of the back side 22, by setting the material of the BT circuit board 11 to a ceramic-based composite material, between the optoelectronic LED chip 18 and the internal control magic color I When the connection positions of C19 and the signal control terminal 14, the circuit negative board 15, the control signal terminal 16 and the circuit positive line 17 are set with the epoxy glue layer of the molding process to encapsulate the conductive wire 21, the connection position will not be inaccurate due to high temperature. The conductive wire 21 can be firmly fixed at a specific position to avoid disorder or breakage of the conductive wire 21, thereby ensuring a stable and reliable connection and completing precise positioning. At the same time, since the BT circuit board 11 is made of a material that can withstand a high temperature of 300 degrees, the high temperature during the molding process can be avoided to damage the BT circuit board 11, thereby improving the yield rate and increasing practicality.

[0028] The conductive wire 21 is connected between the internal control magic color IC 19 and the circuit negative plate 15, the internal control magic color IC 19 is connected to the control signal terminal 16, and the conductive wire 21 is connected between the photoelectric LED chip 18 and the internal control magic color IC 19. C19 is connected, the conductive wire 21 is located in the internal control fantasy IC19 and is connected to the circuit negative plate 15, the conductive wire 21 is encapsulated on the BT circuit board 11 by an epoxy glue layer molding process, the ground wire of the fantasy lamp bead on the BT circuit board 11 is welded to the power output pad in the power pad group 23, the power wire of the fantasy lamp bead on the BT circuit board 11 is welded to the power input pad, the signal wire of the fantasy lamp bead on the BT circuit board 11 is welded to the signal pad group 24, the signal wire of the fantasy lamp bead on the BT circuit board 11 is connected to the signal input pad and the signal output pad in the middle of the cut-open connection mode, by arranging the power pad group 23 and the signal pad group 24 on the back side 22 of the BT circuit board 11, it is convenient for the staff to weld the ground wire, power wire and signal wire of the fantasy lamp bead on the BT circuit board 11 to the power pad group 23 and the signal pad group 24 respectively, which is convenient for the individual wiring and positioning of the metal wires. At the same time, it can avoid the short circuit caused by welding tinning, thereby improving the welding efficiency and product yield.

[0029] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A BT board colorful lamp bead packaging structure, comprising a BT circuit board (11), a conductive wire (21) and a back surface (22), characterized in that: The material of the BT circuit board (11) is a ceramic-based composite material; the upper end of the BT circuit board (11) is provided with a light-emitting surface (12); the lower end of the BT circuit board (11) is provided with a back surface (22); and the four corners of the BT circuit board (11) are penetrated by positive and negative conductive holes (13); Positioning structures are respectively provided on the surfaces of the front and back conductive holes (13); The positioning structure comprises a signal control terminal (14), a circuit negative plate (15), a control signal terminal (16) and a circuit positive line (17); the signal control terminal (14) and the control signal terminal (16) are located between the circuit negative plate (15) and the circuit positive line (17); a photoelectric LED chip (18) is provided on the surface of the circuit negative plate (15); and an internal control magic color IC (19) is provided on the surface of the signal control terminal (14).

2. A BT board colorful lamp bead packaging structure as claimed in claim 1, characterized in that: The back surface (22) is provided with a power pad group (23), a signal pad group (24) and a BT board insulation layer (25), and the heights of the two BT board insulation layers (25) are both lower than the heights of the power pad group (23) and the signal pad group (24); Wherein, the power pad group (23) consists of a power output pad and a power input pad.

3. A BT board colorful lamp bead packaging structure as claimed in claim 2, characterized in that: The signal pad group (24) is composed of a signal input pad and a signal output pad, and a well-shaped insulating layer (26) is provided between the power pad group (23), the signal pad group (24) and the BT board insulating layer (25); The lateral width of the well-shaped insulating layer (26) is smaller than the middle width of the back surface (22).

4. A BT board colorful lamp bead packaging structure as claimed in claim 3, characterized in that: The conductive wire (21) is connected between the internal control magic color IC (19) and the circuit negative plate (15), and the internal control magic color IC (19) is connected to the control signal terminal (16); Wherein, the conductive wire (21) is connected between the photoelectric LED chip (18) and the internal control magic color IC (19).

5. A BT board colorful lamp bead packaging structure as claimed in claim 4, characterized in that: The conductive wire (21) is located inside the control magic color IC (19) and is connected to the circuit negative plate (15); Wherein, the conductive wire (21) is packaged on the BT circuit board (11) by using an epoxy glue layer molding process.

6. A BT board colorful lamp bead packaging structure as claimed in claim 5, characterized in that: The ground wire of the colorful lamp bead on the BT circuit board (11) is welded to the power output pad in the power pad group (23), the power wire of the colorful lamp bead on the BT circuit board (11) is welded to the power input pad, and the signal wire of the colorful lamp bead on the BT circuit board (11) is welded to the signal pad group (24).

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