Flatness improving structure of circuit board

Abstract

The utility model discloses a flatness improving structure of a circuit board. The flatness improving structure comprises a flatness improving device body and a device upper plate arranged at the upper end of the flatness improving device body. Connecting inserting strips are arranged at the side face positions of the extrusion head and the pressing safety tool, an air exhausting and blowing connecting block is arranged in the middle position of the connecting inserting strip at the bottom, a communicating structure is arranged in the middle position of the inner side face of the air exhausting and blowing connecting block, and a telescopic connecting strip is arranged on the upper side of the air exhausting and blowing connecting block. When the telescopic connecting strip is stretched by the extrusion head, air can be extracted from the communicating opening of the air extracting and blowing connecting block, air can be blown to the communicating opening of the air extracting and blowing connecting block in a compression mode, and the extrusion head drives the telescopic connecting strip to extract and blow air to the position of the pressing and placing tool, so that air flow at the position of the pressing and placing tool can be accelerated; and the cooling speed of the circuit board is accelerated to a certain extent, so that the flatness of the circuit board is improved, and the use practicability of the structure is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field related to circuit board processing, and specifically relates to a circuit board flatness improvement structure. Background Art

[0002] In response to the need to improve the flatness of circuit boards, the board curvature leveling structure used for 5G high-frequency circuit boards can effectively improve the flatness of circuit boards, reduce the impact on circuit boards during leveling, and improve work efficiency. The flattening process of circuit boards is crucial to ensuring product quality, improving production efficiency, and meeting the high performance requirements of modern electronic equipment.

[0003] During the flattening process, the circuit board needs to be heated so that it can be softened for easy extrusion, but it takes a certain amount of time to cool down after pressing. Waiting for cooling to complete will waste a lot of time, and using air cooling or water cooling is not conducive to resource conservation.

[0004] The utility model improves the above-mentioned problem and specifically relates to a circuit board flatness improvement structure which facilitates accelerated cooling. Utility Model Content

[0005] The purpose of the utility model is to provide a circuit board flatness improvement structure to solve the problem proposed in the above background technology that the circuit board needs to be heated during the flattening process so that it can be softened for easy extrusion, but it takes a certain amount of time to cool down after pressing, and waiting for the cooling to complete will waste a lot of time, and the use of air cooling or water cooling is not conducive to resource conservation.

[0006] To achieve the above purpose, the utility model provides the following technical solution: a circuit board flatness improvement structure, comprising:

[0007] A flatness improving device body and a device upper plate arranged at the upper end of the flatness improving device body;

[0008] An extrusion head is provided at the middle bottom position of the upper plate of the device;

[0009] A pressing and placing tool is provided at the bottom of the extrusion head;

[0010] Connecting strips are arranged at the side positions of the extrusion head and the pressing and placing tooling, a vacuum and blowing connecting block is arranged at the middle position of the bottom connecting strip, the middle position of the inner side surface of the vacuum and blowing connecting block is a connecting structure, a telescopic connecting strip is arranged at the upper side position of the vacuum and blowing connecting block, and the telescopic connecting strip can exhaust the connecting port of the vacuum and blowing connecting block when stretched by the extrusion head, and the compression type will blow air at the connecting port of the vacuum and blowing connecting block.

[0011] Preferably, the upper end of the extrusion head is connected to the cylinder in the upper plate of the device, and bumps are provided at both ends of the lower side surface of the extrusion head.

[0012] Preferably, connecting support columns are provided at positions between the flatness improving device body and the upper plate of the device, and the connecting support columns are connected to the four corners between the flatness improving device body and the upper plate of the device by screws.

[0013] Preferably, the pressing and placing tooling is a groove-shaped structure, and a heating tube is arranged inside the wall surface of the pressing and placing tooling.

[0014] Preferably, a circuit board placement box is provided at the right side of the pressing and placing tooling, and through grooves having a height equal to the thickness of the circuit board are provided at the bottom of the left and right sides of the circuit board placement box.

[0015] Preferably, a driving extrusion cylinder is provided at the right side of the circuit board placement box, and the driving extrusion cylinder is installed and connected to the flatness improvement device body through a support plate with screws.

[0016] Preferably, a heat dissipation mesh frame is provided on the front side surface of the flatness improvement device body near the left end, and the heat dissipation mesh frame is installed and connected to the flatness improvement device body by plug-in and card connection.

[0017] Preferably, a data display screen is provided on the front side surface of the flatness improvement device body near the right end, and an adjustment control button is provided at the bottom of the data display screen.

[0018] Preferably, a bottom connecting universal wheel is provided at a position near a corner at the bottom of the flatness improving device body, and the bottom connecting universal wheel is connected to the position near a corner at the bottom of the flatness improving device body by screws.

[0019] Compared with the prior art, the utility model provides a circuit board flatness improvement structure, which has the following beneficial effects:

[0020] 1. In the flatness improvement structure of the circuit board, connecting strips are arranged at the side positions of the extrusion head and the pressing and placing tooling, and an exhaust and blowing connecting block is arranged at the middle position of the connecting strip at the bottom. The middle position of the inner side of the exhaust and blowing connecting block is a connecting structure, and a telescopic connecting strip is arranged at the upper side of the exhaust and blowing connecting block. When the telescopic connecting strip is stretched by the extrusion head, the connecting port of the exhaust and blowing connecting block can be exhausted, and the compression type will blow air at the connecting port of the exhaust and blowing connecting block. The extrusion head drives the telescopic connecting strip to exhaust and blow air at the position of the pressing and placing tooling, which can accelerate the air flow at the position of the pressing and placing tooling, accelerate the cooling speed of the circuit board to a certain extent, and thus improve the practicality of the flatness improvement structure of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The utility model is a schematic diagram of the overall structure of the circuit board for improving the flatness.

[0022] Figure 2 The utility model is a schematic diagram of the overall cross-sectional structure of the circuit board for improving the flatness.

[0023] Figure 3 This is a schematic diagram of the structure of the circuit board flatness improvement structure of the utility model at the position of the vacuum and air blowing connection block when viewed from above.

[0024] Figure 4 This is an enlarged structural diagram of the structure number A for improving the flatness of the circuit board of the utility model.

[0025] In the figure: 1. Flatness improvement device body; 2. Pressing and placing tooling; 3. Extrusion head; 4. Driving extrusion cylinder; 5. Circuit board placement box; 6. Device upper plate; 7. Connecting support column; 8. Discharging conveyor belt; 9. Heat dissipation mesh frame; 10. Data display screen; 11. Adjustment control button; 12. Bottom connecting universal wheel; 13. Heating tube; 14. Exhaust and blowing connection block; 15. Connecting plug strip; 16. Telescopic connection strip. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] The utility model provides Figure 1-4As shown, a circuit board flatness improvement structure comprises a flatness improvement device body 1 and a device upper plate 6 arranged at the upper end of the flatness improvement device body 1; an extrusion head 3 is arranged at the middle bottom position of the device upper plate 6; a pressing and placing tool 2 is arranged at the bottom position of the extrusion head 3; a connecting strip 15 is arranged at the side positions of the extrusion head 3 and the pressing and placing tool 2, an exhaust and blowing connecting block 14 is arranged at the middle position of the bottom connecting strip 15, and a connecting structure is arranged at the middle position of the inner side of the exhaust and blowing connecting block 14 A telescopic connecting strip 16 is provided at the upper side of the vacuum and blowing connecting block 14. When the telescopic connecting strip 16 is stretched by the extrusion head 3, it can evacuate the connecting port of the vacuum and blowing connecting block 14. The compression type will blow air to the connecting port of the vacuum and blowing connecting block 14. The extrusion head 3 drives the telescopic connecting strip 16 to extract and blow air at the position of the pressing and placing tooling 2, which can accelerate the air flow at the position of the pressing and placing tooling 2, accelerate the cooling speed of the circuit board to a certain extent, thereby improving the flatness of the circuit board and improving the practicality of the structure.

[0028] like Figure 1 As shown, the upper end of the extrusion head 3 is connected to the cylinder in the upper plate 6 of the device, and bumps are provided at both ends of the lower side of the extrusion head 3. The extrusion head 3 is driven up and down by the cylinder in the upper plate 6 of the device. The bumps on both sides of the extrusion head 3 can protect the two ends of the circuit board and keep it flat.

[0029] like Figure 1 As shown, connecting support columns 7 are provided between the flatness improving device body 1 and the upper plate 6 of the device. The connecting support columns 7 are connected to the four corners between the flatness improving device body 1 and the upper plate 6 of the device by screws, and the connecting support columns 7 play a role of connecting support.

[0030] like Figure 1 As shown, the pressing and placing tool 2 is a groove-shaped structure, and a heating tube 13 is arranged inside the wall of the pressing and placing tool 2. The heating tube 13 in the pressing and placing tool 2 will generate heat in the middle space to soften the circuit board.

[0031] like Figure 1 and Figure 2 As shown, there is a circuit board placement box 5 at the right side of the pressing and placing tool 2, and the left and right bottoms of the circuit board placement box 5 are provided with through grooves with a height equal to the thickness of the circuit board. A driving extrusion cylinder 4 is provided at the right side of the circuit board placement box 5, and the driving extrusion cylinder 4 is installed and connected with the flatness improvement device body 1 through a supporting plate with screws. The circuit boards inside the circuit board placement box 5 are stacked, and the extrusion of the driving extrusion cylinder 4 will drive them one by one to enter the pressing and placing tool 2 for extrusion and flattening.

[0032] like Figure 1 and Figure 2As shown, a heat dissipation mesh frame 9 is provided on the front side surface of the flatness improvement device body 1 near the left end. The heat dissipation mesh frame 9 is installed and connected to the flatness improvement device body 1 by plug-in card connection. The setting of the heat dissipation mesh frame 9 can accelerate the better circulation of air inside and outside the flatness improvement device body 1, thereby accelerating the dissipation of internal heat, thereby increasing the service life of internal components.

[0033] like Figure 1 and Figure 2 As shown, a data display screen 10 is provided on the front side of the flatness improvement device body 1 near the right end, and an adjustment control button 11 is provided at the bottom of the data display screen 10. The data display screen 10 can display data more intuitively.

[0034] like Figure 1 and Figure 2 As shown, a bottom connecting universal wheel 12 is provided at a bottom near the corner of the flatness improving device body 1. The bottom connecting universal wheel 12 is connected to the bottom near the corner of the flatness improving device body 1 by screws. The bottom connecting universal wheel 12 can reduce the friction between the flatness improving device body 1 and the ground, thereby facilitating the user to push and move it to a designated position for placement.

[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board flatness improvement structure, comprising: A flatness improving device body (1) and a device upper plate (6) arranged at the upper end of the flatness improving device body (1); An extrusion head (3) is provided at the middle bottom position of the upper plate (6) of the device; A pressing and placing tool (2) is provided at the bottom of the extrusion head (3); Features: A connecting strip (15) is provided at the side positions of the extrusion head (3) and the pressing and placing tooling (2); an exhaust and blowing connecting block (14) is provided at the middle position of the bottom connecting strip (15); the middle position of the inner side surface of the exhaust and blowing connecting block (14) is a connecting structure; a telescopic connecting strip (16) is provided at the upper side position of the exhaust and blowing connecting block (14); the telescopic connecting strip (16) can exhaust air at the connecting opening of the exhaust and blowing connecting block (14) when stretched by the extrusion head (3); and the compression type can blow air at the connecting opening of the exhaust and blowing connecting block (14).

2. The circuit board flatness improvement structure according to claim 1, characterized in that: The upper end of the extrusion head (3) is connected to the cylinder in the upper plate (6) of the device, and bumps are arranged at both ends of the lower side surface of the extrusion head (3).

3. The circuit board flatness improvement structure according to claim 1, characterized in that: A connecting support column (7) is provided at a position between the flatness improving device body (1) and the device upper plate (6), and the connecting support column (7) is connected to the flatness improving device body (1) and the device upper plate (6) at four corners by screws.

4. The circuit board flatness improvement structure according to claim 1, characterized in that: The pressing and placing tool (2) is a groove-shaped structure, and a heating pipe (13) is arranged inside the wall surface of the pressing and placing tool (2).

5. The circuit board flatness improvement structure according to claim 4, characterized in that: A circuit board placement box (5) is provided at the right side of the pressing and placing tool (2), and through grooves having a height equal to the thickness of the circuit board are provided at the left and right bottoms of the circuit board placement box (5).

6. The circuit board flatness improvement structure according to claim 5, characterized in that: A driving extrusion cylinder (4) is arranged at the right side of the circuit board placement box (5), and the driving extrusion cylinder (4) is installed and connected to the flatness improvement device body (1) via a support plate with screws.

7. The circuit board flatness improvement structure according to claim 1, characterized in that: A heat dissipation mesh frame (9) is provided on the front side surface of the flatness improvement device body (1) near the left end, and the heat dissipation mesh frame (9) is installed and connected to the flatness improvement device body (1) by means of plug-in card connection.

8. The circuit board flatness improvement structure according to claim 1, characterized in that: A data display screen (10) is arranged on the front side surface of the flatness improving device body (1) near the right end, and an adjustment control button (11) is arranged at the bottom of the data display screen (10).

9. The circuit board flatness improvement structure according to claim 1, characterized in that: A bottom connecting universal wheel (12) is provided at a position near the corner at the bottom of the flatness improving device body (1), and the bottom connecting universal wheel (12) is connected to the position near the corner at the bottom of the flatness improving device body (1) by screw installation.

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