Chip mounter capable of automatically identifying bulk materials

By designing an automatic bulk material identification patch machine, using vibrating Fidd and high-definition camera sets for automatic identification and mounting, the existing patch machine has solved the problem of waste and low flexibility in small batch production, and achieved efficient bulk material mounting.

CN222674618UActive Publication Date: 2025-03-25JIAXING BOVI ELECTRONIC TECH CO LTD
0 Cites 1 Cited by

Patent Information

Application Number
CN202421331626.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-12
Publication Date
2025-03-25
Estimated Expiration
2034-06-12

AI Technical Summary

Technical Problem

The existing patch machines are not suitable for trial production in small batches or proofing stages, because of the reasons including wasteful material supply, cumbersome installation, low flexibility, and the inability to automatically identify and install bulk materials.

Method used

An automatic bulk material patch machine is designed, using a vibrating Federa feeding mechanism and a flexible vibration disk, combined with a high-definition camera set for automatic identification and mounting, so as to realize the linear and rail movement mechanism to drive the patch head to move along the X-axis and Y-axis directions.

Benefits of technology

It realizes automatic feeding, identification and mounting of bulk materials, improves mounting efficiency, avoids equipment waste, and is suitable for mounting work in small batches and trial production stages.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model discloses a chip mounter capable of automatically identifying bulk materials, which comprises a workbench, a circuit board feeding mechanism, a chip mounter head, a linear guide rail movement mechanism, a feeder board seat, a flexible vibration disc, a vibration feeder feeding mechanism and a high-definition camera group, and is characterized in that the circuit board feeding mechanism is input from a side input end of the workbench and is arranged along an X-axis direction; outputting from a side output end of the workbench; the vibration feeder feeding mechanism and the flexible vibration disc are arranged at the front part of the working table; a mounted material piece is fed from the front part of the working table through the vibration feeder feeding mechanism and is input into the flexible vibration disc; the linear rail movement mechanism is erected above the circuit board feeding mechanism and the flexible vibration disc and comprises an X-axis movement mechanism and a Y-axis movement mechanism, the chip mounter head is arranged in the linear rail movement mechanism, and the linear rail movement mechanism drives the chip mounter head to move in the X-axis direction and the Y-axis direction; the chip mounter head internally comprises a circuit board camera assembly, a flying camera assembly, a driving device and a plurality of groups of independent mounting head mechanisms, and the driving device drives the flying camera assembly to move back and forth along the arrangement direction of the mounting head mechanisms; and the high-definition camera group is erected at the upper end of the automatic identification bulk material chip mounter, and a camera lens of the high-definition camera group is downwards opposite to the flexible vibration disc. According to the utility model, automatic feeding, identification and mounting work of bulk materials can be realized, automation of mounting is realized, mounting efficiency is improved, and unnecessary equipment waste is avoided at the same time.
Need to check novelty before this filing date? Find Prior Art