Mobile phone backlight heat dissipation structure

Abstract

The utility model discloses a mobile phone backlight heat dissipation structure, which comprises a PCB (printed circuit board) and a heat dissipation plate, the PCB and the heat dissipation plate are adhered through a heat conduction layer, a plurality of LED (light-emitting diode) lamps are arranged on the front surface of the PCB, the heat conduction layer covers the whole back surface of the PCB, and the heat conduction layer is provided with an exhaust structure. According to the mobile phone backlight heat dissipation structure provided by the utility model, the PCB and the heat dissipation plate are bonded through the heat conduction layer, so that heat generated by light emission of the LED lamp on the PCB can be conducted to the heat dissipation plate through the heat conduction layer in time, and aging and failure of components caused by over-high temperature of the LED lamp and the PCB due to accumulation on the PCB are avoided. Meanwhile, according to the characteristic that bubbles are easily generated in the extrusion process of the heat conduction layer, the exhaust structure vertically penetrating through the heat conduction layer is arranged, so that the bubbles in the heat conduction layer can be discharged in time during production, the impedance of the heat conduction layer is reduced, and the heat conduction efficiency of the heat conduction layer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight modules, in particular to a mobile phone backlight heat dissipation structure. Background Art

[0002] With the development of economy, the requirements for mobile phones are getting higher and higher. In order to pursue better visual experience, larger display area and more powerful multi-tasking capabilities, there are more and more large-screen mobile phones. As the screen of mobile phones becomes larger and brighter, the requirements for the heat dissipation structure of mobile phone screens are also getting higher and higher. The reason why LEDs in mobile phones heat up is that the added electrical energy is not completely converted into light energy, but part of it is converted into heat energy. The electro-optical conversion efficiency of LEDs is only about 20-30%, which means that about 70% of the electrical energy is converted into heat energy.

[0003] LED is used as the heat source of the mobile phone backlight. In order to accelerate the heat dissipation, a backlight heat dissipation structure is generally provided. For example, Chinese document CN107514574A discloses a mobile phone backlight heat dissipation structure, including a light bar and an inner frame, the light bar and the inner frame are bonded to each other, the light bar includes a plurality of LED lamps, a plurality of accommodating cavities for accommodating the LED lamps are provided on the inner frame, each accommodating cavity is arranged in parallel and spaced, and a heat dissipation device is provided on the inner frame. The mobile phone backlight heat dissipation structure improves the heat dissipation efficiency of LEDs by providing a heat dissipation groove and / or a low Great Wall position lower than the normal Great Wall position in the LED lamp accommodating cavity of the inner frame. However, bubbles are easily generated when the LED light bar and the inner frame are bonded to each other by heat conductive adhesive, thereby increasing the thermal resistance of the heat conductive adhesive, resulting in low heat dissipation efficiency.

[0004] Chinese patent CN 211375258U provides a mobile phone backlight module structure, including a frame, a plurality of circular holes are opened at the front and rear ends of the upper part of the frame, and a plurality of heat dissipation nets are fixedly connected to the front and rear ends of the inner side of the frame, thermal conductive silicone grease is coated on the front and rear ends of the inner side of the frame and on one side of the heat dissipation net, and the front and rear ends of the frame have inner cavities equal to the number of heat dissipation nets, and the front and rear ends of the lower part of the frame have a plurality of docking holes at the lower end of the inner cavity. The mobile phone backlight module has a complex structure, and the thermal conductive silicone grease is coated in a specific structure on the inner side of the frame, and cannot be applied to other common mobile phone modules. Utility Model Content

[0005] Based on this, it is necessary to provide a simple mobile phone backlight heat dissipation structure to address the above technical problems. A thermal conductive layer is set on the PCB board and the heat dissipation plate, and the thermal conductive layer is provided with an exhaust structure, so that the bubbles generated by the thermal conductive layer during the assembly process can be discharged in time when in use.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A mobile phone backlight heat dissipation structure comprises: a PCB board and a heat dissipation plate, wherein the PCB board and the heat dissipation plate are adhered to each other via a heat conduction layer, a plurality of LED lamps are arranged on the front side of the PCB board, the heat conduction layer covers the entire back side of the PCB board, and the heat conduction layer is provided with an exhaust structure.

[0008] Furthermore, the LED lamps are arranged in a grid shape, and the exhaust structure penetrates the heat-conducting layer from top to bottom and is arranged at a corresponding position on the PCB board avoiding the LED lamps.

[0009] Furthermore, the exhaust structure is a plurality of exhaust holes, which are arranged in a grid and spaced apart from the positions of the LED lamps corresponding to the positions on the PCB board.

[0010] Furthermore, the exhaust holes and the LED lamps are arranged in alternate rows and columns.

[0011] Furthermore, the exhaust hole is arranged in the same row or column as the LED lamp.

[0012] Furthermore, the exhaust structure is an exhaust slit, and the exhaust slit is arranged horizontally or vertically at a corresponding position of the LED lamp on the PCB board.

[0013] Furthermore, a groove is provided on a side of the heat dissipation plate corresponding to the PCB board, and the shape and size of the groove are adapted to the PCB board.

[0014] Furthermore, the heat-conducting layer is a heat-conducting interface material, and the thickness of the heat-conducting layer is 0.05-0.15 mm.

[0015] Furthermore, the diameter of the exhaust hole is 0.2-0.5 mm.

[0016] Furthermore, the thermally conductive interface material is thermally conductive silicone.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] The mobile phone backlight heat dissipation structure provided by the utility model uses a heat-conducting layer to be pasted between the PCB board and the heat dissipation plate, so that the heat generated by the light-emitting LED lamp on the PCB board can be timely conducted to the heat dissipation plate through the heat-conducting layer, and will not be accumulated on the PCB board, resulting in the excessive temperature of the LED lamp and the PCB board causing the aging and failure of components. At the same time, according to the characteristic that bubbles are easily generated in the heat-conducting layer during the extrusion process, an exhaust structure that runs through the heat-conducting layer from top to bottom is set, so that bubbles in the heat-conducting layer can be discharged in time during production, reducing the impedance of the heat-conducting layer and ensuring the heat conduction efficiency of the heat-conducting layer.

[0019] The exhaust structure can be set as an exhaust hole or an exhaust slit to avoid the LED lamp and be set at a corresponding position on the PCB board. Through a simple and low-cost structure, the purpose of uniform heat conduction and heat dissipation can be achieved efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of the mobile phone backlight heat dissipation structure provided by the utility model Figure 1 ;

[0021] Figure 2 A schematic diagram of the structure of the mobile phone backlight heat dissipation structure provided by the utility model Figure 2 ;

[0022] Figure 3 A schematic diagram of the heat dissipation plate structure of the mobile phone backlight heat dissipation structure provided by the utility model;

[0023] Figure 4 A schematic diagram showing that the exhaust holes and the LED lamps are arranged in rows and at intervals in accordance with the positions of the LED lamps in Example 2;

[0024] Figure 5 A schematic diagram showing that the exhaust holes and the LED lamps are arranged in rows and at intervals corresponding to each other in Example 2;

[0025] Figure 6 A schematic diagram showing that the exhaust holes and the LED lamps are arranged in rows and columns at intervals in Example 2;

[0026] Figure 7 This is a schematic diagram of the arrangement of the exhaust holes and the LED lamps in alternate rows and columns in accordance with the positions of the exhaust holes and the LED lamps in Example 2;

[0027] Figure 8 This is a schematic diagram of the horizontal arrangement of the exhaust slit and the LED lamp interval in Example 3.

[0028] The markings in the figure are as follows:

[0029] LED lamp 1, PCB board 2, heat conducting layer 3, exhaust hole 31, exhaust slot 32, heat sink 4, groove 41. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] As described in the background art, the heat dissipation structure of the mobile phone backlight in the prior art is too complicated or the heat dissipation efficiency is not high, which is not conducive to the heat dissipation requirements of large-screen mobile phones.

[0034] In order to solve this technical problem, the utility model provides a mobile phone backlight heat dissipation structure, which can be applicable to the backlight heat dissipation of most conventional mobile phones.

[0035] Specifically, please refer to Figure 1-3 The mobile phone backlight heat dissipation structure specifically includes:

[0036] A mobile phone backlight heat dissipation structure, characterized in that it comprises: a PCB board 2 and a heat sink 4, the PCB board 2 and the heat sink 4 are pasted together through a heat conductive layer 3, a plurality of LED lamps 1 are arranged on the front side of the PCB board 2, the heat conductive layer 3 covers the entire back side of the PCB board 2, and the heat conductive layer 3 is provided with an exhaust structure.

[0037] The mobile phone backlight heat dissipation structure provided by the utility model is designed with a complete heat dissipation path. A large amount of heat generated by the light emission of the LED lamp 1 on the PCB board 2 is absorbed by the heat conduction layer and timely conducted to the heat dissipation plate 4, and then emitted to the environment by the heat dissipation plate 4. The heat dissipation efficiency is high, and local overheating of the LED lamp 1 and the PCB board 2 is effectively prevented. At the same time, the exhaust structure in the heat conduction layer 3 is simple, and the air introduced by the heat conduction layer 3 during production operation can be effectively discharged, so as to ensure that the heat conduction layer 3 can have a lower thermal resistance and higher thermal conductivity efficiency.

[0038] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0039] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0040] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0041] Example 1

[0042] Please refer to Figure 1-8 This embodiment proposes a mobile phone backlight heat dissipation structure, which includes a PCB board 2 and a heat sink 4, and a heat conductive layer 3 arranged between the PCB board 2 and the heat sink 4. Specifically, the heat conductive layer 3 has adhesiveness on both sides, and the back of the PCB board 2 is adhered to the heat sink 4 through the heat conductive layer 3. A plurality of LED lamps 1 are arranged on the PCB board 2. When in use, the heat generated by the LED lamp 1 when working is transferred from the PCB board 2 to the heat conductive layer 3, and the heat conductive layer 3 further transfers the absorbed heat to the heat sink 4 by using its good heat dissipation performance, and finally the heat is radiated to the environment by the heat sink 4, thereby ensuring that the heat generated by the LED lamp 1 is timely discharged, ensuring the reliability of the LED lamp 1, and preventing the internal temperature of the mobile phone module from being too high.

[0043] Furthermore, the pins of the LED lamps 1 are soldered to pads of the PCB board 2 , and the LED lamps 1 are distributed in a grid pattern on the PCB board 2 , thereby ensuring that a uniform backlight source is provided.

[0044] The heat sink 4 is a plate-like structure, and a groove 41 is provided on one side of the heat sink 4 corresponding to the PCB board 2, and the shape and size of the groove 41 are adapted to the PCB board 2. When in use, the PCB board 2 is adhered to the heat conductive layer 3 and then adhered to the rectangular groove 41. The heat sink 4 is made of metal material. When in use, the heat sink 4 uses a large surface area and good thermal conductivity to quickly radiate the absorbed heat to the outside of the mobile phone.

[0045] Furthermore, the heat sink 4 may be a copper plate, an aluminum alloy plate or a steel plate.

[0046] Furthermore, the thermal conductive layer 3 is pasted to cover the entire back side of the PCB board 2 to ensure the maximum contact area between the PCB board 2 and the thermal conductive layer 3, so that the heat generated by all LED lamps 1 on the PCB board 2 can be dissipated as quickly as possible through the thermal conductive layer 3.

[0047] Furthermore, the heat-conducting layer 3 is a heat-conducting interface material, such as heat-conducting silica gel, heat-conducting silicone grease and heat-conducting tape, etc. The heat-conducting layer 3 is arranged in the gap between the PCB board 2 and the heat sink 4 to reduce the heat transfer impedance of the joint between the PCB board 2 and the heat sink 4 and form an effective heat-conducting path.

[0048] Furthermore, an exhaust structure is provided on the thermal conductive layer 3, and the exhaust structure penetrates the thermal conductive layer 3 from top to bottom. When the PCB board 2 is pasted on the heat dissipation plate 4, bubbles generated by the extrusion operation are discharged from the thermal conductive layer 3 through the exhaust structure, thereby preventing the air in the bubbles from increasing the thermal resistance of the thermal conductive layer 3 and reducing the effective contact heat conductive area of ​​the thermal conductive layer 3.

[0049] The heat-conducting layer 3 is preferably made of heat-conducting silicone material, and the thickness of the heat-conducting layer 3 is 0.05-0.15 mm.

[0050] Example 2

[0051] Please refer to Figure 1-8 This embodiment proposes a mobile phone backlight heat dissipation structure. As a further improvement on the embodiment 1, the exhaust structure is a plurality of exhaust holes 31 arranged in a grid shape, and the exhaust holes 31 are arranged away from the position of the LED lamp 1. When in use, the heat-conducting layer 3 is first adhered to the back of the PCB board 2, and then a punching machine is set to punch the heat-conducting layer 3, and then the heat-conducting layer 3 is adhered to the heat dissipation plate 4. When the PCB board 2 and the heat dissipation plate 4 are pressed together, the bubbles generated by squeezing the heat-conducting layer 3 can be discharged through the exhaust holes 31, and will not be retained in the heat-conducting layer 3 to increase the contact thermal resistance and reduce the heat conduction efficiency of the heat-conducting layer 3.

[0052] Further, such as Figure 4 and 5 As shown, the exhaust holes 31 are arranged between the LED lamps 1 and are arranged in rows or columns at intervals corresponding to the LED lamps 1. Figure 6 As shown, the exhaust holes 31 are arranged between the LED lamps 1 and are arranged in rows and columns corresponding to the LED lamps 1. Preferably, in order to achieve uniform exhaust and ensure the maximum contact area between the heat conducting layer 3 and the PCB board 2, as shown in FIG. Figure 7 As shown, in this embodiment, the exhaust holes 31 are arranged between the LED lamps 1 and are arranged in alternate rows and columns with the LED lamps 1. At this time, the exhaust holes 31 are evenly arranged between the LED lamps 1 to evenly remove the bubbles in the thermal conductive layer 3, and the effective contact area between the thermal conductive layer 3 and the heat sink 4 will not be reduced due to the excessive arrangement of the exhaust holes 31, thereby affecting the adhesive performance and thermal conductivity of the thermal conductive layer 3.

[0053] Furthermore, the shape of the exhaust hole 31 is not limited, and can be circular, rectangular, polygonal, etc., preferably circular, as the arc-shaped structure has less resistance and is conducive to the discharge of bubbles. Furthermore, the diameter of the exhaust hole 31 is 0.2-0.5 mm.

[0054] Example 3

[0055] Please refer to Figure 1-8 This embodiment proposes a mobile phone backlight heat dissipation structure, as a further improvement of embodiment 1, the exhaust structure is an exhaust slit 32, such as Figure 8 As shown, the exhaust slit 32 is arranged horizontally with an interval from the LED lamp 1, and the exhaust slit 32 and the LED lamp 1 can also be arranged vertically with an interval (not shown in the figure). When in use, the heat-conducting layer 3 is first adhered to the back of the PCB board 2, and then a seam punching machine is set to perform seam punching on the heat-conducting layer 3, so that the heat-conducting layer 3 forms an exhaust slit 32 spaced from the LED lamp 1, and then the heat-conducting layer 3 is adhered to the heat dissipation plate 4. When the PCB board 2 and the heat dissipation plate 4 are pressed together, the bubbles generated by squeezing the heat-conducting layer 3 can be discharged through the exhaust slit 32 and will not be retained inside the heat-conducting layer 3.

[0056] The use process of a mobile phone backlight heat dissipation structure provided by the utility model is as follows: a heat-conducting layer 3 is adhered to the back of a PCB board 2, and then a punching or slitting operation is performed on the heat-conducting layer 3, wherein the punching or slitting needs to avoid the position on the PCB board 2 corresponding to the soldering pad of the LED lamp 1, and then the heat-conducting layer 3 is adhered to the heat dissipation plate 4, and the bubbles in the heat-conducting layer 3 are expelled through the exhaust holes 31 or the exhaust slits 32, thereby forming a complete heat dissipation path.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A mobile phone backlight heat dissipation structure, characterized in that: It includes: PCB board The PCB (2) and the heat dissipation plate (4) are adhered to each other via a heat conduction layer (3); a plurality of LED lamps (1) are arranged on the front of the PCB (2); the heat conduction layer (3) covers the entire back of the PCB (2); and the heat conduction layer (3) is provided with an exhaust structure; the LED lamps (1) are arranged in a grid shape, and the exhaust structure penetrates the heat conduction layer (3) from top to bottom and is arranged at a corresponding position on the PCB (2) avoiding the LED lamps (1).

2. A mobile phone backlight heat dissipation structure according to claim 1, characterized in that: The exhaust structure is a plurality of exhaust holes (31), the exhaust holes (31) being arranged in a grid shape and spaced apart from each other at positions corresponding to the LED lamps (1) on the PCB board (2).

3. A mobile phone backlight heat dissipation structure according to claim 2, characterized in that: The exhaust holes (31) and the LED lamps (1) are arranged in alternate rows and columns.

4. A mobile phone backlight heat dissipation structure according to claim 2, characterized in that: The exhaust hole (31) is arranged in the same row or column as the LED lamp (1).

5. The mobile phone backlight heat dissipation structure according to claim 1, characterized in that: The exhaust structure is an exhaust slit (32), and the exhaust slit (32) is arranged horizontally or vertically at a corresponding position of the LED lamp (1) on the PCB board (2).

6. The mobile phone backlight heat dissipation structure according to claim 1, characterized in that: A groove (41) is provided on one side of the heat dissipation plate (4) corresponding to the PCB board (2); the shape and size of the groove (41) are adapted to the PCB board (2).

7. The mobile phone backlight heat dissipation structure according to claim 1, characterized in that: The heat-conducting layer (3) is a heat-conducting interface material, and the thickness of the heat-conducting layer (3) is 0.05-0.15 mm.

8. The mobile phone backlight heat dissipation structure according to claim 2, characterized in that: The diameter of the exhaust hole (31) is 0.2-0.5 mm.

9. The mobile phone backlight heat dissipation structure according to claim 7, characterized in that: The thermal conductive interface material is thermal conductive silica gel.

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