Heat dissipation structure and electronic equipment

Abstract

The utility model provides a heat dissipation structure and electronic equipment, and relates to the technical field of electronic equipment. The heat dissipation structure comprises a heat dissipation unit, and the heat dissipation unit is provided with a first surface used for heat dissipation; the buffer unit is arranged on the second surface of the heat dissipation unit; the first supporting piece is movably connected with the heat dissipation unit through the buffering unit so that the heat dissipation unit can move relative to the first supporting piece.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation structure and electronic equipment. Background Art

[0002] At present, electronic devices usually use radiators to dissipate heat for products with high power consumption. Screw holes for fixing the radiator are provided around high power consumption components, and the radiator and high power consumption components are fixed with bolts to provide clamping force. However, when the electronic device is impacted or dropped, the radiator has a high risk of crushing the high power consumption components or detaching and damaging other components due to the bolt connection, resulting in damage to the device. Utility Model Content

[0003] The purpose of the embodiment of the present application is to provide a heat dissipation structure, and the embodiment of the present application provides the following technical solutions:

[0004] The first aspect of the present application provides a heat dissipation structure, comprising: a heat dissipation unit, the heat dissipation unit having a first surface for heat dissipation; a buffer unit, the buffer unit being arranged on the second surface of the heat dissipation unit; and a first support member, the first support member being movably connected to the heat dissipation unit through the buffer unit so that the heat dissipation unit can move relative to the first support member.

[0005] In some embodiments of the present application, the buffer unit is in a first state, the heat dissipation unit has a first distance relative to the first support member, and the buffer unit is in a second state, the heat dissipation unit has a second distance relative to the first support member, wherein the second distance is smaller than the first distance.

[0006] In some embodiments of the present application, the buffer unit is an elastic member; the first surface and the second surface of the heat dissipation unit are arranged back to back; the second surface is provided with a first docking portion, and the first support member is provided with a second docking portion on the third surface facing the heat dissipation unit, and the second docking portion is elastically connected to the first docking portion through the elastic member.

[0007] In some embodiments of the present application, the first docking portion is a hole structure or an axis structure, and the second docking portion is an axis structure or a hole structure adapted to the first docking portion.

[0008] In some embodiments of the present application, the elastic member is sleeved on the shaft structure; and / or the elastic member is disposed in the hole structure.

[0009] In some embodiments of the present application, the first support member has a cavity, the heat dissipation unit includes a first part having the first surface and a second part having the second surface, the second part is embedded in the cavity, and the first part is located outside the cavity; the cavity is used to limit the second part from detaching from the first support member when the heat dissipation unit moves relative to the first support member.

[0010] In some embodiments of the present application, the heat dissipation structure also includes: a second support member, the second support member is connected to the fourth surface of the first support member facing away from the heat dissipation unit, the first support member is fixedly connected to the second support member through a locking member, and the first support member is connected to and supports the heat dissipation unit.

[0011] In some embodiments of the present application, the heat dissipation unit has a cooling channel, the inlet of the cooling channel is connected to a liquid inlet pipeline, and the outlet of the cooling channel is connected to a liquid outlet pipeline; the liquid inlet pipeline and the liquid outlet pipeline are hoses.

[0012] In some embodiments of the present application, the heat dissipation structure further includes a heat dissipation material layer, and the heat dissipation material layer is attached to the first surface.

[0013] The second aspect of the present application provides an electronic device, comprising: a functional module; a water cooling system, the water cooling system having a cooling medium for cooling the functional module; a heat dissipation structure, the heat dissipation structure comprising: a heat dissipation unit, the first surface of the heat dissipation unit contacts the functional module for heat dissipation; the heat dissipation unit is connected to the water cooling system and can transmit the cooling medium; a buffer unit, the buffer unit is arranged on the second surface of the heat dissipation unit; a first support member, the first support member is movably connected to the heat dissipation unit through the buffer unit so that the heat dissipation unit can move relative to the first support member. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0015] Figure 1 The schematic diagram of the heat dissipation structure of the present application is schematically shown;

[0016] Figure 2 The front view of the heat dissipation structure of the present application is schematically shown;

[0017] Figure 3 for Figure 2 A top view of

[0018] Figure 4 for Figure 2 Side view of

[0019] Figure 5 The cross-sectional structure diagram of the heat dissipation structure of the present application is schematically shown.

[0020] Description of Figure Numbers:

[0021] 1. heat dissipation unit; 101. first surface; 102. second surface; 103. first docking portion; 104. first part; 105. second part; 106. cooling channel; 2. buffer unit; 3. first support member; 301. second docking portion; 302. cavity; 303. third surface; 4. second support member; 5. locking member; 6. hose; 7. connecting pipe; 8. heat dissipation material layer. DETAILED DESCRIPTION

[0022] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0023] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0024] Example 1

[0025] The embodiment of the present application provides a heat dissipation structure, such as Figures 1 to 5 As shown, it includes: a heat dissipation unit 1, the heat dissipation unit 1 has a first surface 101 for heat dissipation; a buffer unit 2, the buffer unit 2 is arranged on the second surface 102 of the heat dissipation unit 1; and a first support member 3, the first support member 3 is movably connected with the heat dissipation unit 1 through the buffer unit 2 so that the heat dissipation unit 1 can move relative to the first support member 3.

[0026] The heat dissipation structure provided in the embodiment of the present application can be applied to high-power functional modules in electronic devices, such as high-power processors and graphics processing units in computers, to dissipate heat.

[0027] The heat dissipation unit 1 can be made of a high thermal conductivity material, such as a metal material, a ceramic material, a thermally conductive plastic, etc. The first surface 101 of the heat dissipation unit 1 can contact a high-consumption functional module in an electronic device, quickly conduct heat through the first surface 101, and then release the accumulated heat energy to the surrounding environment, effectively controlling the temperature of the functional module. The buffer unit 2 is connected to the second surface 102 of the heat dissipation unit 1, which can absorb the vibration generated when the electronic device is running, and can also ensure good contact between the heat dissipation unit 1 and the functional module, so that when the functional module of the electronic device expands due to heat or changes in mechanical stress, a stable heat conduction path can be maintained. The first support member 3 can be a metal bracket or a plastic frame, which can be firmly connected to the main frame of the electronic device, providing a reliable suspension platform for the heat dissipation unit 1 and the buffer unit 2. The first support member 3 is connected to the heat dissipation unit 1 through the buffer unit 2, thereby allowing the heat dissipation unit 1 to move freely within a certain range to cope with sudden impact or falling situations.

[0028] The embodiment of the present application provides a heat dissipation structure which is movably connected to the first support member 3 through the heat dissipation unit 1 using the buffer unit 2. When the electronic device is impacted or falls, the heat dissipation structure can be safely separated from the functional module, thereby avoiding squeezing damage to the functional module by the heat dissipation unit 1. At the same time, it also prevents the heat dissipation unit 1 from falling off and causing secondary damage to other components, thereby enhancing the impact resistance and long-term reliability of the entire electronic device.

[0029] In some embodiments, the buffer unit 2 is in a first state, the heat dissipation unit 1 has a first distance relative to the first support member 3, and the buffer unit 2 is in a second state, the heat dissipation unit 1 has a second distance relative to the first support member 3, wherein the second distance is smaller than the first distance.

[0030] When the functional module is at normal operating temperature or in standby mode, or the electronic device remains stationary, the buffer unit 2 is in the first state. In this state, the buffer unit 2 is maintained in a relatively thick or uncompressed state, and there is a relatively large gap between the heat dissipation unit 1 and the first support member 3, namely, the first gap. This allows the heat dissipation unit 1 to be closely fitted with the functional module, effectively improving the heat conduction efficiency, while ensuring that no physical pressure is applied to the functional module, thereby ensuring long-term stability and reliable operation of the device.

[0031] When the functional module expands due to the increase in temperature caused by the increase in the load of the electronic device, or when the electronic device encounters an external force impact (such as falling or collision), the buffer unit 2 is in the second state. In this state, the buffer unit 2 can shrink or compress so that the distance between the heat dissipation unit 1 and the first support member 3 is reduced to the second distance. At this time, a protective gap is formed between the heat dissipation unit 1 and the functional module to prevent the heat dissipation unit 1 from directly pressing the high-consumption functional module, reduce the risk of physical damage, and protect the integrity of the electronic device.

[0032] The buffer unit 2 is designed to have a variable spacing adjustment function, so that the distance between the heat dissipation unit 1 and the first support member 3 can be dynamically adjusted under different working conditions to adapt to different thermal management requirements and mechanical stress changes. At the same time, the variable spacing adjustment function of the buffer unit 2 can also integrate the heat dissipation structure into electronic devices with different internal designs or layouts, thereby improving the versatility and adaptability of the heat dissipation structure.

[0033] The buffer unit 2 may be a gasket or frame structure made of elastic material (such as silicone, thermoplastic elastomer TPE or rubber, etc.), or a material with shape memory properties (such as shape memory alloy or a specific type of elastomer), or a composite structure designed to include compressible and stretchable parts. When subjected to external forces (such as thermal expansion of functional modules caused by temperature changes, falling or collision of electronic equipment), the buffer unit 2 can change from the first state to the second state, and adjust the distance between the heat dissipation unit 1 and the first support member 3 by changing its thickness or compression state.

[0034] In some embodiments, the buffer unit 2 is an elastic member; the first surface 101 and the second surface 102 of the heat dissipation unit 1 are arranged back to back; the second surface 102 is provided with a first docking portion 103, and the first support member 3 is provided with a second docking portion 301 facing the third surface 303 of the heat dissipation unit 1, and the second docking portion 301 is elastically connected to the first docking portion 103 through an elastic member.

[0035] The first surface 101 and the second surface 102 of the heat dissipation unit 1 are arranged opposite to each other, so that the buffer unit 2 can drive the heat dissipation unit 1 to approach or move away from the functional module. The buffer unit 2 is an elastic member, which can be a spring, and can provide the necessary elastic force to form a buffer area between the heat dissipation unit 1 and the first support member 3 that can adapt to thermal expansion and absorb impact force.

[0036] One or more first docking parts 103 may be provided on the second surface 102 of the heat dissipation unit 1 in accordance with the number of elastic members to ensure stable connection. The first docking part 103 may be a protrusion, a groove or a connecting pin, and is used to accurately match the second docking part 301 on the first support member 3. The third surface 303 of the first support member 3, i.e., the side facing the second surface 102 of the heat dissipation unit 1, is correspondingly provided with a second docking part 301, and the shape of the second docking part 301 is complementary to the first docking part 103, ensuring that the two can be tightly combined.

[0037] The second docking portion 301 is connected to the first docking portion 103 through an elastic member, which can be directly placed between the docking portions, or the elastic member can be implemented as a part of the connection structure, such as a telescopic rod, etc. This allows the heat dissipation unit 1 to move up and down or left and right along the elastic range of the elastic member when subjected to thermal expansion pressure or external impact, so that it can absorb additional force while maintaining good contact with the functional module, so that when the electronic device encounters a physical impact, it can effectively absorb and disperse the impact force, reduce the force directly transmitted to the functional module, and protect the functional module from damage.

[0038] In some embodiments, Figure 5 As shown, the first docking portion 103 is a hole structure or an axis structure, and the second docking portion 301 is an axis structure or a hole structure adapted to the first docking portion 103 .

[0039] The second surface 102 of the heat dissipation unit 1 is provided with at least one hole structure as the first docking portion 103, and the hole structure can be circular, square or other shapes. Correspondingly, the third surface 303 of the first support member 3 is configured with an axis structure adapted to the hole structure as the second docking portion 301, and the size and shape of the axis are adapted to the hole. The axis structure can extend into the hole structure and can move relative to the hole structure. By adjusting the length of the axis structure deep into the hole, the conversion of the buffer unit 2 between the first state and the second state can be realized, thereby dynamically adapting to the displacement caused by thermal expansion or equipment vibration, and ensuring the thermal contact between the heat dissipation unit 1 and the functional module. Vice versa, that is, the first docking portion 103 is an axis structure and the second docking portion 301 is a hole structure, and a suitable matching form can be selected according to actual design requirements. Among them, the depth of the hole structure must not be less than the length of the axis structure to avoid the end of the axis structure abutting against the bottom of the hole structure when it is fully inserted, resulting in unnecessary mechanical pressure, which may cause damage to the bottom of the hole structure, the axis structure itself, and even the connected heat dissipation unit 1.

[0040] In the cooperation between the hole and the shaft, the elastic member (such as a spring, an elastic sleeve or an elastic retaining ring) can be embedded or wrapped in the shaft structure, or embedded in the hole structure or even arranged on the edge. In this way, when the shaft structure is inserted into the hole structure, the elastic member can be compressed or stretched to form an elastic connection point. Through the cooperation between the hole and the shaft, the movement of the elastic member along the axial direction can be guided and constrained, rather than allowing it to move freely in the radial direction, thereby avoiding unnecessary interference between the heat dissipation unit 1 and surrounding components due to unnecessary radial deviation.

[0041] In some embodiments, the elastic member is sleeved on the shaft structure; and / or, the elastic member is disposed in the hole structure.

[0042] When the elastic member is sleeved on the shaft structure, the elastic member (such as a spring sleeve, a rubber ring or an elastic tube, etc.) can be directly sleeved on the outer surface of the shaft structure. The diameter of the elastic member is larger than the diameter of the hole structure, that is, one end of the elastic member contacts the second surface 102 of the heat dissipation unit 1, and the other end contacts the third surface 303 of the first support member 3. When the shaft structure is inserted into the hole structure, the second surface 102 of the heat dissipation unit 1 and the third surface 303 of the first support member 3 are close, and the elastic member is compressed, thereby forming an elastic connection between the shaft and the hole.

[0043] When the elastic member is arranged in the hole structure, the elastic member (such as an elastic gasket, an O-ring or a customized elastic filler, etc.) is placed in the hole structure. When the shaft structure is inserted into the hole, the end of the shaft structure will squeeze the elastic member, and an elastic connection is also achieved.

[0044] An elastic member may be arranged on the outer surface of the shaft structure and another elastic member may be arranged inside the hole structure, thereby realizing a double-insurance elastic connection design and further enhancing the flexibility and stability of the connection between the heat dissipation unit 1 and the first support member 3 .

[0045] Whether the elastic member is sleeved on the shaft or arranged in the hole, it can allow a certain relative displacement while maintaining close contact between the heat dissipation unit 1 and the functional module. The elastic member can absorb and disperse the vibration energy and external impact force generated during the operation of the electronic device, protect the heat dissipation unit 1 and the functional module from damage, and improve the mechanical stability and reliability of the entire electronic device.

[0046] In some embodiments, Figure 4 As shown, the first support member 3 has a cavity 302, the heat dissipation unit 1 includes a first part 104 with a first surface 101 and a second part 105 with a second surface 102, the second part 105 is embedded in the cavity 302, and the first part 104 is located outside the cavity 302; the cavity 302 is used to limit the second part 105 from detaching from the first support member 3 when the heat dissipation unit 1 moves relative to the first support member 3.

[0047] The first support member 3 may be composed of a pair of U-shaped clamping walls arranged opposite to each other, and the pair of U-shaped clamping walls enclose a cavity 302 with a rectangular cross section. One end of the U-shaped clamping walls is connected, and the other end is reserved for opening, forming a cavity for accommodating the second part 105 of the heat dissipation unit 1.

[0048] The heat dissipation unit 1 is divided into two parts, which can form a block structure with a T-shaped profile to adapt to the rectangular cavity 302 of the first support member 3. The first part 104 is located outside, facing the functional module, and has a first surface 101 with efficient heat dissipation, which is in direct contact with the functional module to achieve heat conduction. The second part 105 is larger in volume and embedded in the cavity 302, with its second surface 102 facing the cavity 302, and the first part 104 can extend to the outside of the cavity 302 through the opening. The inner wall surface of the cavity 302 facing the second part 105 is the third surface 303 of the first support member 3, and there is a certain distance between the second surface 102 of the second part 105 and the third surface 303 of the cavity 302. The buffer unit 2 is arranged in this distance to achieve an elastic connection between the heat dissipation unit 1 and the first support member 3.

[0049] The fifth surface of the second part 105 facing the first part 104 can contact the sixth surface in the cavity 302 opposite to the third surface 303, and the size of the opening of the cavity 302 can limit the second part 105 from detaching from the first support member 3 during movement without hindering the free movement of the first part 104.

[0050] In normal working or static state, the fifth surface of the second part 105 abuts against the sixth surface of the cavity 302, and the first surface 101 and the third surface 303 maintain a first distance to ensure that the heat dissipation unit 1 is in close contact with the functional module without excessive pressure.

[0051] When encountering an impact or falling, the heat dissipation unit 1 uses inertia and is compressed by the buffer unit 2, and the second part 105 moves in the cavity 302, and the distance between the second surface 102 and the third surface 303 is reduced to the second spacing, which buffers the external impact. When the system returns to normal, the buffer unit 2 rebounds and the heat dissipation unit 1 returns to its original position. Due to the limitation of the cavity 302, the distance between the second surface 102 and the third surface 303 is maintained within the first spacing, ensuring that the first surface 101 and the functional module are in continuous good contact without pressure.

[0052] The cavity 302 can provide a fixed installation position and movement range for the second part 105 of the heat dissipation unit 1, ensuring that the heat dissipation unit 1 can remain in the best working position even when the temperature of the electronic device changes or is slightly impacted, without affecting the heat dissipation efficiency and device performance. By limiting the movement range of the second part 105, the heat dissipation unit 1 is effectively prevented from accidentally falling out in extreme cases, protecting the functional module from direct impact or pressure, and improving the stability of the overall structure and the long-term reliability of the electronic device.

[0053] In some embodiments, Figures 1 to 5As shown, the heat dissipation structure also includes: a second support member 4, the second support member 4 is connected to the fourth surface of the first support member 3 facing away from the heat dissipation unit 1, the first support member 3 is fixedly connected to the second support member 4 through a locking member 5, and the first support member 3 is connected to and supports the heat dissipation unit 1.

[0054] The second support member 4 can be a reinforcing structure that spans the main frame of the electronic device, and its two ends can be detachably connected to the main frame of the device, avoiding the dense screw holes around the functional module, reducing interference with the functional module area. The second support member 4 is connected to the fourth surface of the first support member 3 (i.e., the side away from the heat dissipation unit 1), and can be fixed by fastening screws, buckles or special connectors. The second support member 4 is customized according to the internal space of the device, and the shape can be a flat plate, frame or other structure to ensure that a stable support system is formed with the first support member 3. The first support member 3 and the second support member 4 can be fixedly connected by locking members 5 (such as screws, quick-disassembly fasteners, bolts and nuts). The layout of these locking members 5 needs to ensure uniform force to maintain the balance and stability of the installation of the heat dissipation unit 1.

[0055] In some embodiments, Figure 5 As shown, the heat dissipation unit 1 has a cooling channel 106 , the inlet of the cooling channel 106 is connected to a liquid inlet pipeline, and the outlet of the cooling channel 106 is connected to a liquid outlet pipeline; the liquid inlet pipeline and the liquid outlet pipeline are hoses 6 .

[0056] One end of the cooling channel 106 is connected to the liquid inlet pipeline as the inlet of the cooling medium; the other end is connected to the liquid outlet pipeline as the outlet of the heated cooling medium. The cooling channel 106 can circulate the cooling medium of the cooling system. The two pipelines can be respectively connected to the water cooling system composed of a circulation pump and a heat exchanger (such as a heat sink or a condenser), so that heat energy release and cooling medium recycling preparation can be performed. The cooling medium can be a substance for heat exchange in the cooling system. The heat emitted by the functional module can be transferred to the cooling channel 106 through the first surface 101 of the heat dissipation unit 1. The cooling medium in the cooling channel 106 absorbs heat and flows out of the cooling channel 106 and then transfers the heat to other parts, thereby reducing the operating temperature of the system or electronic equipment. The selection of the cooling medium can be based on the specific requirements of the application, such as the required cooling temperature range, cost-effectiveness, safety, and environmental factors. The cooling medium can be substances such as water, cooling gas or phase change material.

[0057] The liquid inlet and outlet pipelines are designed with a hose 6. The hose 6 can be made of high-temperature resistant and corrosion-resistant synthetic rubber or silicone material. It has good flexibility and can flexibly adapt to the complex and changeable layout inside the electronic equipment. At the same time, it also ensures that when the heat dissipation unit 1 moves relative to the functional module, the hose 6 can adapt synchronously and move accordingly without causing constraints or restrictions, thereby avoiding stress concentration, wear or leakage problems that may be caused by rigid connections.

[0058] In some embodiments, the heat dissipation structure further includes a pair of connecting pipes 7, which are respectively arranged at both ends of the cooling channel 106, and the cooling channel 106 is connected to the liquid inlet pipeline and the liquid outlet pipeline through the connecting pipes 7. The connecting pipes 7 are made of hard materials, such as copper, stainless steel, etc., so that the cooling channel 106 is conveniently connected to the flexible liquid inlet pipeline and the liquid outlet pipeline. A limiting protrusion structure is provided on the outer surface of the connecting pipe 7 to ensure that the connecting pipe 7 is more firmly connected to the liquid inlet pipeline and the liquid outlet pipeline to prevent displacement caused by vibration or pressure changes.

[0059] In some embodiments, the heat dissipation structure further includes a heat dissipation material layer 8 , and the heat dissipation material layer 8 is attached to the first surface 101 .

[0060] The heat dissipation material layer 8 can be made of materials with high thermal conductivity, such as graphene, thermal grease, phase change material (PCM) or metal foil (such as copper foil, aluminum foil). These materials have excellent thermal conductivity and can quickly transfer heat from the heat source to the cooling medium or other parts in the cooling channel 106 of the heat dissipation unit 1. The heat dissipation material layer 8 can be firmly bonded with an adhesive (such as thermally conductive glue or double-sided thermally conductive tape) to ensure that there is no gap between the two to maximize the heat conduction efficiency. The heat dissipation material layer 8 can significantly improve the thermal contact quality between the heat dissipation unit 1 and the heat source, reduce thermal resistance, make heat transfer faster, and thus improve the overall heat dissipation efficiency.

[0061] Example 2

[0062] An embodiment of the present application provides an electronic device, comprising: a functional module; a water cooling system, the water cooling system having a cooling medium for cooling the functional module; a heat dissipation structure, the heat dissipation structure comprising: a heat dissipation unit 1, the first surface 101 of the heat dissipation unit 1 contacts the functional module for heat dissipation; the heat dissipation unit 1 is connected to the water cooling system and can transmit the cooling medium; a buffer unit 2, the buffer unit 2 is arranged on the second surface 102 of the heat dissipation unit 1; a first support member 3, the first support member 3 is movably connected to the heat dissipation unit 1 through the buffer unit 2 so that the heat dissipation unit 1 can move relative to the first support member 3.

[0063] The core functional modules of the electronic device, such as a high-performance CPU, GPU, etc., have a contact surface for closely fitting with the first surface 101 of the heat dissipation unit 1 to ensure efficient transfer of heat energy.

[0064] The water cooling system may include a water pump, a heat sink, a cooling medium (such as water, cooling gas or phase change material, etc.), a pipeline and a control unit. The cooling medium circulates under the impetus of the water pump, first absorbs heat through the cooling channel 106 of the heat dissipation unit 1, then flows through the heat sink and other heat dissipation facilities to release heat to the external environment, and then circulates back to the vicinity of the functional module to form a closed loop.

[0065] The heat dissipation unit 1 can be made of a high thermal conductivity material, and its first surface 101 can be covered with a coating or microstructure that enhances heat transfer performance, directly contacting the functional module to quickly absorb heat. A cooling channel 106 is provided inside the heat dissipation unit 1, which is connected to the water inlet and outlet pipes of the water cooling system to ensure smooth circulation of the cooling medium.

[0066] The second surface 102 of the heat dissipation unit 1 is installed with an elastic buffer unit 2, which can absorb the vibration of the electronic device during operation and adapt to the deformation caused by the thermal expansion of the functional module. The first support member 3 is movably connected with the heat dissipation unit 1 by cooperating with the buffer unit 2, allowing the heat dissipation unit 1 to move to a limited extent when the functional module undergoes thermal expansion or the electronic device undergoes mechanical shock, thereby protecting the functional module and the electronic device structure from damage.

[0067] By integrating the water cooling system and heat dissipation structure, electronic equipment not only significantly improves the heat dissipation efficiency, but also ensures the stable operation of electronic equipment under various working conditions.

[0068] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation structure, characterized in that: include: a heat dissipation unit having a first surface for dissipating heat; A buffer unit, wherein the buffer unit is disposed on the second surface of the heat dissipation unit; A first support member is movably connected to the heat dissipation unit through the buffer unit so that the heat dissipation unit can move relative to the first support member.

2. The heat dissipation structure according to claim 1, characterized in that: The buffer unit is in a first state, the heat dissipation unit has a first distance relative to the first support member, and the buffer unit is in a second state, the heat dissipation unit has a second distance relative to the first support member, wherein the second distance is smaller than the first distance.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: The buffer unit is an elastic member; The first surface and the second surface of the heat dissipation unit are arranged opposite to each other; the second surface is provided with a first docking portion, and the first support member is provided with a second docking portion on a third surface facing the heat dissipation unit, and the second docking portion is elastically connected to the first docking portion through the elastic member.

4. The heat dissipation structure according to claim 3, characterized in that: The first docking portion is a hole structure or an axis structure, and the second docking portion is an axis structure or a hole structure matched with the first docking portion.

5. The heat dissipation structure according to claim 4, characterized in that: The elastic member is sleeved on the shaft structure; and / or the elastic member is arranged in the hole structure.

6. The heat dissipation structure according to claim 3, characterized in that: The first support member has a cavity, the heat dissipation unit includes a first part having the first surface and a second part having the second surface, the second part is embedded in the cavity, and the first part is located outside the cavity; The cavity is used to limit the second part from separating from the first support member when the heat dissipation unit moves relative to the first support member.

7. The heat dissipation structure according to claim 1 or 2, characterized in that: Also includes: The second support member is connected to a fourth surface of the first support member facing away from the heat dissipation unit. The first support member is fixedly connected to the second support member via a locking member. The first support member is connected to and supports the heat dissipation unit.

8. The heat dissipation structure according to claim 1 or 2, characterized in that: The heat dissipation unit has a cooling channel, the inlet of the cooling channel is connected to a liquid inlet pipeline, and the outlet of the cooling channel is connected to a liquid outlet pipeline; The liquid inlet pipeline and the liquid outlet pipeline are hoses.

9. The heat dissipation structure according to claim 1 or 2, characterized in that: It also includes a heat dissipation material layer, and the heat dissipation material layer is attached to the first surface.

10. An electronic device, characterized in that: include: Functional modules; A water cooling system, wherein the water cooling system has a cooling medium for cooling the functional modules; A heat dissipation structure, the heat dissipation structure comprising: a heat dissipation unit, a first surface of the heat dissipation unit contacts the functional module for heat dissipation; The heat dissipation unit is in communication with the water cooling system and is capable of transmitting the cooling medium; A buffer unit, wherein the buffer unit is disposed on the second surface of the heat dissipation unit; A first support member is movably connected to the heat dissipation unit through the buffer unit so that the heat dissipation unit can move relative to the first support member.

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