Heat dissipation device and heat pump host

Abstract

The utility model discloses a heat dissipation device and a heat pump host. The heat dissipation device comprises a machine shell, and ventilation holes are formed in the surface of the machine shell; the partition plate is arranged in the machine shell and divides a fan cavity and a mechanical cavity, and first heat dissipation holes are formed in the partition plate; the fan is arranged in the fan cavity; the electric control box is arranged in the mechanical cavity and comprises a box body and a circuit board fixed on the box body; the box body comprises second heat dissipation holes; the circuit board comprises a first electronic component and a second electronic component; the first electronic element on the circuit board and the external air of the shell are subjected to natural convection heat dissipation through the second heat dissipation holes and the ventilation holes; the second electronic component carries out forced convection heat dissipation through the first heat dissipation holes. Therefore, according to the size of the operation power of the first electronic component and the second electronic component, the heat dissipation mode of the second electronic component and the heat dissipation mode of the first electronic component are set separately, and the heat dissipation efficiency of the circuit board can be improved by combining the negative pressure state formed during the operation of the fan and the natural convection heat dissipation mode in the box body of the electric control box.

Description

Technical Field

[0001] The utility model relates to the technical field of heat pumps, in particular to a heat dissipation device and a heat pump host. Background Art

[0002] Existing air-source heat pumps usually need to use circuit boards to control operation, and the circuit boards are usually placed in the electrical control box of the heat pump host. As the specifications of the heat pump increase, the number of electrical components required to be arranged on the circuit board increases, and when the heat pump is running, the total heat generated by the electrical components also increases. However, the space in the electrical control box is limited, the heat dissipation of the electrical components is restricted, and the heat dissipation efficiency of the circuit board is poor. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an improved heat dissipation device and a heat pump host to improve the heat dissipation efficiency of a circuit board.

[0004] The technical solution adopted by the utility model to solve the technical problem is: to provide a heat dissipation device, which includes:

[0005] A casing, wherein a ventilation hole is provided on a surface of the casing;

[0006] A partition plate is arranged inside the housing and separates a fan cavity and a mechanical cavity, wherein the fan cavity is located on one side of the mechanical cavity, and a first heat dissipation hole is formed on the partition plate;

[0007] A fan is disposed in the fan cavity;

[0008] An electric control box, arranged in the mechanical cavity, comprising a box body and a circuit board fixed to the box body;

[0009] The box body comprises a second heat dissipation hole;

[0010] The circuit board includes a first electronic component and a second electronic component;

[0011] The first electronic component is arranged toward the inner side of the housing, and dissipates heat through natural convection with the external air of the housing through the second heat dissipation holes and the ventilation holes;

[0012] The second electronic component is arranged toward the first heat dissipation hole. When the fan is running, the fan cavity is in a negative pressure state, and the second electronic component is cooled by forced convection through the first heat dissipation hole.

[0013] Preferably, the circuit board further includes a substrate, the substrate is arranged inside the box, and the first electronic component and the second electronic component are respectively arranged on the substrate.

[0014] Preferably, the circuit board further comprises a heat dissipation fin arranged on the substrate, and the heat dissipation fin is arranged on one side of the second electronic component for dissipating heat from the second electronic component.

[0015] Preferably, the electric control box further comprises a first cover shell arranged on the periphery of the heat dissipation fins.

[0016] Preferably, the first cover shell extends to be connected to the partition.

[0017] Preferably, the box body is provided with a first opening and a second opening, the first opening and the second opening are arranged opposite to each other, the circuit board is arranged between the first opening and the second opening, the first electronic component faces the first opening, and the second electronic component faces the second opening.

[0018] Preferably, the electric control box further comprises a cover body arranged on the box body; the box body is further provided with a third heat dissipation hole, and the cover body is connected to the third heat dissipation hole and the first heat dissipation hole.

[0019] Preferably, the cover body includes a first cover shell and a second cover shell; the first cover shell is arranged on one side of the first heat dissipation hole, the first cover shell is provided with a fourth heat dissipation hole on one side of the second cover shell, and the first cover shell is connected to the second cover shell through the fourth heat dissipation hole; the second cover shell is arranged on one side of the third heat dissipation hole, and the third heat dissipation hole, the fourth heat dissipation hole and the first heat dissipation hole are connected in sequence to form a forced convection air duct.

[0020] Preferably, the fourth heat dissipation hole is arranged close to the first heat dissipation hole and away from one side of the second electronic component.

[0021] The utility model also provides a heat pump host, which comprises any one of the heat dissipation devices described above.

[0022] The utility model has at least the following beneficial effects: the first electronic component on the circuit board is cooled by natural convection with the external air of the housing through the second heat dissipation hole and the ventilation hole; the second electronic component is cooled by forced convection through the first heat dissipation hole. Thus, according to the operating power of the first electronic component and the second electronic component, the heat dissipation methods of the second electronic component and the first electronic component are set separately, and the negative pressure state formed when the fan is running and the natural convection heat dissipation method inside the electric control box can be combined to improve the heat dissipation efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the utility model, the utility model will be further described below in conjunction with the accompanying drawings and embodiments, in which:

[0024] Figure 1It is a schematic diagram of the three-dimensional structure of the heat pump host with part of the casing hidden in some embodiments of the utility model;

[0025] Figure 2 yes Figure 1 The enlarged structural diagram of part A in the middle;

[0026] Figure 3 yes Figure 1 The three-dimensional structural diagram of the heat pump main unit shown in another viewing angle;

[0027] Figure 4 yes Figure 3 The enlarged structural diagram of part B in the middle;

[0028] Figure 5 yes Figure 1 A schematic diagram of the three-dimensional structure of the circuit board of the heat pump host shown;

[0029] Figure 6 yes Figure 5 A schematic diagram of the three-dimensional structure of the circuit board shown in another perspective;

[0030] Figure 7 yes Figure 1 The three-dimensional structural diagram of the electric control box of the heat pump main unit is shown;

[0031] Figure 8 yes Figure 7 A schematic diagram of the three-dimensional structure of the electric control box from another perspective;

[0032] Fig. 9 yes Figure 8 The exploded structural diagram of the electric control box shown;

[0033] Fig.10 It is a schematic diagram of the three-dimensional structure of the heat pump host with part of the casing hidden in some embodiments of the utility model. DETAILED DESCRIPTION

[0034] In order to have a clearer understanding of the technical features, purposes and effects of the present utility model, the specific implementation methods of the present utility model are now described in detail with reference to the accompanying drawings.

[0035] like Figures 1 to 4As shown, the heat pump main unit of one embodiment of the utility model includes a heat dissipation device. The heat dissipation device includes a casing 1, a partition 2, a fan 3 and an electrical control box. The casing 1 in this embodiment is roughly rectangular, and accommodates the partition 2, the fan 3 and the electrical control box therein. The partition 2 is connected to the inside of the casing 1, and the partition 2 separates a fan cavity 30 and a mechanical cavity 31 inside the casing 1. The fan cavity 30 is connected to the outside of the casing 1, and the fan 3 is arranged in the fan cavity 30. When the fan 3 is running, the fan cavity 30 is in a negative pressure state. The mechanical cavity 31 is used to place other system components and pipelines of the heat pump main unit, such as a liquid storage tank 52 and an indoor heat exchanger 51. Specifically, as Figures 1 to 4 In the illustrated embodiment, the partition 2 is disposed transversely inside the housing 1, dividing the interior of the housing 1 into a relatively upper fan chamber 30 and a relatively lower mechanical chamber 31, that is, the fan chamber 30 is located on one side of the mechanical chamber 31. It should be noted that the transverse direction can refer to the horizontal direction when the heat pump host is in the working state, and the horizontal direction is parallel to the placement surface of the heat pump host in the natural placement state. In other embodiments, the fan chamber 30 can also be located on the left or right side of the mechanical chamber 31, or the fan chamber 30 can also be located on the upper side or lower side of the mechanical chamber 31.

[0036] like Figures 1 to 4 In the illustrated embodiment, a first heat dissipation hole 21 is provided on the partition 2. The electric control box is arranged in the mechanical cavity 31, and is located on one side of the indoor heat exchanger 51. The electric control box includes a box body 40 and a circuit board 41 fixed inside the box body 40. The circuit board 41 can be detachably fixed to the box body 40, or can be non-detachably fixed to the box body 40. The first heat dissipation hole 21 is connected to the inside of the box body 40. Figure 3 As shown, a ventilation hole 24 is provided on the surface of the casing 1 , and the ventilation hole 24 connects the mechanical cavity 31 inside the casing 1 with the outside of the casing 1 .

[0037] like Figure 7 and Figure 8 As shown, the box body 40 is provided with a second heat dissipation hole 22, and the second heat dissipation hole 22 is connected to the ventilation hole 24 of the housing 1. The ventilation hole 24 is respectively connected to the outside of the housing 1 and the second heat dissipation hole 22 on the box body 40 of the electric control box, thereby connecting the second heat dissipation hole 22 on the box body 40 of the electric control box to the outside of the housing 1. Among them, the first heat dissipation hole 21 can be connected to the second heat dissipation hole 22, or it can be not connected. The first heat dissipation hole 21 connects the fan cavity 30 with the inside of the box body 40 to form a forced heat dissipation air duct. The second heat dissipation hole 22 and the ventilation hole 24 together connect the outside of the housing 1 with the inside of the box body 40 to form a natural convection heat dissipation air duct.

[0038] like Figure 6 and Figure 7As shown, the circuit board 41 includes a first electronic component 411 and a second electronic component 412, and the operating power of the first electronic component 411 can be less than the operating power of the second electronic component 412. That is, relatively speaking, the first electronic component 411 can be a small electronic component, and the second electronic component 412 can be a large electronic component. For example, the second electronic component 412 can include an IPM module (Intelligent Power Module), which is a highly integrated, high-performance power semiconductor device module. The IPM module is mainly used to control the speed of the compressor motor and realize the frequency regulation of the compressor. The first electronic component 411 may include components such as an inductor and a capacitor. When the heat pump main unit is running, the first electronic component 411 and the second electronic component 412 will generate heat, so it is necessary to ventilate and dissipate heat for the first electronic component 411 and the second electronic component 412, wherein the second electronic component 412 with relatively large operating power generates more heat.

[0039] The first electronic component 411 is arranged toward the inner side of the housing 40, and performs natural convection heat dissipation with the external air of the casing 1 through the second heat dissipation holes 22 and the ventilation holes 24. That is, the air outside the casing 1 and the air inside the housing 40 can perform natural convection through the ventilation holes 24 and the second heat dissipation holes 22 to complete heat exchange, thereby ventilating and cooling the first electronic component 411 that is closer to the second heat dissipation holes 22. The second electronic component 412 is arranged toward the first heat dissipation holes 21. When the fan 3 is running, the fan cavity 30 is in a negative pressure state, and the second electronic component 412 performs forced convection heat dissipation through the first heat dissipation holes 21. In this way, the space of the fan cavity 30 and the space of the housing 40 can be used together to achieve heat dissipation of the second electronic component 412.

[0040] The second electronic component 412 is closer to the first heat dissipation hole 21 than the first electronic component 411. Therefore, the second electronic component 412 with relatively large operating power is mainly forced to dissipate heat through the forced heat dissipation duct defined by the inside of the box body 40, the first heat dissipation hole 21 and the fan cavity 30. The first electronic component 411 is closer to the second heat dissipation hole 22 than the second electronic component 412. Therefore, the first electronic component 411 is mainly cooled by natural convection with the external air of the housing 1 through the second heat dissipation hole 22 and the ventilation hole 24. Therefore, according to the different operating powers, the heat dissipation methods of the second electronic component 412 and the first electronic component 411 are set separately, which can effectively improve the heat dissipation efficiency of the circuit board 41.

[0041] like Figure 4-Figure 5In the illustrated embodiment, the circuit board 41 further includes a substrate 410, which is disposed inside the box 40. The substrate 410 includes a first surface 421 and a second surface 422. The second surface 422 is closer to the first heat dissipation hole 21 than the first surface 421, and the first surface 421 is closer to the second heat dissipation hole 22 than the second surface 422. The first electronic component 411 is disposed on the first surface 421, and the second electronic component 412 is disposed on the second surface 422. Thus, by adjusting the placement position of the substrate 410 inside the box 40, the second electronic component 412 disposed on the substrate 410 can be disposed corresponding to the first heat dissipation hole 21, and the first electronic component 411 disposed on the substrate 410 can be disposed corresponding to the second heat dissipation hole 22. Specifically, the second electronic component 412 can be fixedly connected to the substrate 410 by pins.

[0042] like Figure 3 and Figure 4 As shown, in some embodiments, the placement position of the substrate 410 inside the box 40 can be set as follows: the substrate 410 is perpendicular to the partition 2. The partition 2 is arranged in the horizontal direction (horizontal direction) inside the housing 1, so the substrate 410 is arranged vertically in the box 40. In this way, the second electronic component 412 and the first electronic component 411 on the substrate 410 are distributed on opposite sides of the substrate 410 in the horizontal direction.

[0043] like Figure 2 , Figure 5 and Figure 6 As shown, in some embodiments, the circuit board 41 further includes a heat sink 413 disposed on the second surface 422. The heat sink 413 is disposed on one side of the second electronic component 412 and is used to dissipate heat from the second electronic component 412. The second electronic component 412 on the second surface 422 can be connected to the heat sink 413 through a thermally conductive silicone (not shown) to effectively conduct heat generated at the second electronic component 412, thereby enhancing the heat dissipation efficiency of the second electronic component 412. Figure 2 As shown, the fins of the heat dissipation fins 413 are arranged at intervals in the vertical direction.

[0044] like Figures 7 to 10 As shown, in some embodiments, the electric control box further includes a cover body disposed on the box body 40. The cover body includes a first cover shell 43 disposed on the periphery of the heat dissipation fins 413. The first cover shell 43 communicates with the interior of the box body 40 and the first heat dissipation holes 21. The first cover shell 43 can concentrate the air near the heat dissipation fins 413, allowing the air near the heat dissipation fins 413 to flow in the first cover shell 43, thereby increasing the heat exchange efficiency between the air and the heat dissipation fins 413.

[0045] like Figures 7 to 9As shown, in some embodiments, the box body 40 is provided with a first opening 401 and a second opening 402, the first opening 401 and the second opening 402 are arranged opposite to each other, the substrate 410 of the circuit board 41 is arranged between the first opening 401 and the second opening 402, the second surface 422 of the substrate 410 faces the second opening 402, so that the second electronic component 412 on the second surface 422 faces the second opening 402; the first surface 421 of the substrate 410 faces the first opening 401, so that the first electronic component 411 on the first surface 421 faces the first opening 401. The first heat dissipation hole 21 is connected to the interior of the box body 40 through the second opening 402. The first opening 401 can be used as an inspection port for maintenance personnel to inspect the circuit board 41. The second opening 402 mainly serves to connect the first heat dissipation hole 21 and the box body 40, and the second electronic component 412 is forced to convectively dissipate heat through the first heat dissipation hole 21. Therefore, the opening area of ​​the first opening 401 can be larger than the opening area of ​​the second opening 402.

[0046] like Figures 7 to 9 As shown, in some embodiments, the first cover 43 is connected to the box body 40, is arranged at the second opening 402, and is respectively connected to the second opening 402 and the first heat dissipation hole 21. That is, the interior of the box body 40, the second opening 402, the first cover 43, the first heat dissipation hole 21 and the fan cavity 30 are sequentially connected to form a forced convection heat dissipation air duct. Further, the upper end of the first cover 43 can be extended to connect with the partition 2 and be fixed to the partition 2, thereby playing a role in concentrating airflow and enhancing heat dissipation efficiency.

[0047] For details, please refer to Figures 7 to 9 In the illustrated embodiment, the box body 40 includes a length direction and a width direction, and the first opening 401 and the second opening 402 on the box body 40 are arranged opposite to each other along the width direction of the box body 40. The second heat dissipation hole 22 on the box body 40 is arranged on a side wall in the length direction of the box body 40. The box body 40 includes a long side wall 403 and two short side walls 404, a top plate 405 and a bottom plate 406. The long side wall 403 is arranged along the length direction of the box body 40, that is, the long side wall 403 is parallel to the length direction of the box body 40; the short side wall 404 is arranged along the width direction of the box body 40, that is, the short side wall 404 is parallel to the width direction of the box body 40. The long side wall 403 and the short side wall 404 are respectively connected between the top plate 405 and the bottom plate 406. The two short side walls 404 are connected to the long side walls 403 respectively, and the top plate 405, the bottom plate 406, the long side walls 403 and the two short side walls 404 together surround a first opening 401. The second opening 402 is provided on the long side wall 403 and passes through the long side wall 403 along the width direction. The second heat dissipation hole 22 is provided on one of the short side walls 404.

[0048] like Figures 7 to 9 As shown, in some embodiments, the cover body further includes a second cover shell 44. The box body 40 is further provided with a third heat dissipation hole 23, and the third heat dissipation hole 23 is arranged opposite to the second heat dissipation hole 22. The cover body is connected to the third heat dissipation hole 23 and the first heat dissipation hole 21. The first cover shell 43 is provided on one side of the first heat dissipation hole 21, and the first cover shell 43 is provided with a fourth heat dissipation hole 434 on one side of the second cover shell 44, and the first cover shell 43 is connected to the second cover shell 44 through the fourth heat dissipation hole 434. The second cover shell 44 is provided on one side of the third heat dissipation hole 23, and the third heat dissipation hole 23, the fourth heat dissipation hole 434 and the first heat dissipation hole 21 are connected in sequence to form a forced convection air duct. That is, the airflow can flow between the third heat dissipation hole 23, the second cover shell 44, the fourth heat dissipation hole 434, the first cover shell 43 and the first heat dissipation hole 21 to form a first airflow path 61. The first airflow path 61 can be used to indirectly connect the space near the first electronic component 411 disposed inside the box 40 to the first heat dissipation hole 21 through the third heat dissipation hole 23, the second cover 44, the fourth heat dissipation hole 434, and the heat dissipation fins 413, and the first electronic component 411 can be forced to dissipate heat through the first airflow path 61. Thus, the first electronic component 411 and the second electronic component 412 respectively realize forced convection heat dissipation through different airflow paths at the same time, further enhancing the heat dissipation efficiency of the circuit board 41.

[0049] Specifically, the third heat dissipation hole 23 and the second heat dissipation hole 22 are respectively arranged on the two short side walls 404 of the box body 40, so that the third heat dissipation hole 23 and the second heat dissipation hole 22 are arranged opposite to each other along the length direction of the box body 40. The second cover shell 44 can be connected to the short side wall 404 of the box body 40 where the third heat dissipation hole 23 is located. The second cover shell 44 covers the third heat dissipation hole 23 and the fourth heat dissipation hole 434 together, so that the airflow between the fourth heat dissipation hole 434 and the third heat dissipation hole 23 can be concentrated to enhance the heat dissipation efficiency. The second cover shell 44 can be connected to the heat dissipation fins 413 at the second opening 402, so that the second cover shell 44 is indirectly connected to the first heat dissipation hole 21 on the partition 2 through the heat dissipation fins 413. The opening of the second cover shell 44 is connected to the heat dissipation fins 413 and the third heat dissipation hole 23 at the same time, so that the airflow at the third heat dissipation hole 23 is guided to the heat dissipation fins 413, and the airflow path is as shown in FIG. Fig. 9 Indicated by the dotted arrow.

[0050] Furthermore, if Figures 7 to 9As shown, in some embodiments, the fourth heat dissipation hole 434 is arranged close to the first heat dissipation hole 21, and the fourth heat dissipation hole 434 is arranged away from the second electronic component 412. As a result, the heat dissipated by the first electronic component 411 is directly sent to the first heat dissipation hole 21 through the first airflow path 61, and finally enters the fan cavity 30. The heat dissipated by the first electronic component 411 will not pass through the second electronic component 412 or the heat dissipation fins 413, so as to avoid the heat dissipated by the first electronic component 411 from affecting the heat dissipation effect of the second electronic component 412. That is, the first electronic component 411 and the second electronic component 412 can respectively achieve forced convection heat dissipation through different airflow paths.

[0051] In some embodiments, a fan (not shown) may be provided between the ventilation hole 24 and the second heat dissipation hole 22 to promote heat exchange between the ventilation hole 24 and the second heat dissipation hole 22 by accelerating airflow, thereby enhancing the heat dissipation efficiency of the first electronic component 411 .

[0052] It can be understood that the above embodiments only express the preferred implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the utility model. It should be pointed out that, for ordinary technicians in this field, without departing from the concept of the utility model, the above-mentioned technical features can be freely combined, and several deformations and improvements can be made, which all belong to the protection scope of the utility model. Therefore, all equivalent changes and modifications made to the scope of the claims of the utility model should fall within the scope of the claims of the utility model.

Claims

1. A heat dissipation device, characterized in that: include; A casing (1), wherein a ventilation hole (24) is provided on a surface of the casing (1); a partition (2) disposed inside the housing (1) and separating a fan cavity (30) and a mechanical cavity (31), wherein the fan cavity (30) is located on one side of the mechanical cavity (31), and a first heat dissipation hole (21) is provided on the partition (2); A fan (3) is arranged in the fan cavity (30); An electric control box, disposed in the mechanical cavity (31), comprising a box body (40) and a circuit board (41) fixed to the box body (40); The box body (40) comprises a second heat dissipation hole (22); The circuit board (41) comprises a first electronic component (411) and a second electronic component (412); The first electronic component (411) is arranged toward the inside of the box body (40) and dissipates heat through natural convection with the external air of the housing (1) through the second heat dissipation holes (22) and the ventilation holes (24); The second electronic component (412) is arranged toward the first heat dissipation hole (21); when the fan (3) is in operation, the fan cavity (30) is in a negative pressure state, and the second electronic component (412) is cooled by forced convection through the first heat dissipation hole (21).

2. The heat dissipation device according to claim 1, characterized in that: The circuit board (41) further comprises a substrate (410), wherein the substrate (410) is arranged inside the box (40), and the first electronic component (411) and the second electronic component (412) are respectively arranged on the substrate (410).

3. The heat dissipation device according to claim 2, characterized in that: The circuit board (41) further comprises a heat dissipation fin (413) arranged on the substrate (410); the heat dissipation fin (413) is arranged on one side of the second electronic component (412) and is used for dissipating heat from the second electronic component (412).

4. The heat dissipation device according to claim 3, characterized in that: The electric control box further comprises a first cover shell (43) arranged on the periphery of the heat dissipation fins (413).

5. The heat dissipation device according to claim 4, characterized in that: The first cover shell (43) extends to be connected to the partition plate (2).

6. The heat dissipation device according to claim 1, characterized in that: The box body (40) is provided with a first opening (401) and a second opening (402), the first opening (401) and the second opening (402) are arranged opposite to each other, and the circuit board (41) is arranged between the first opening (401) and the second opening (402); The first electronic component (411) faces the first opening (401); The second electronic component (412) faces the second opening (402).

7. The heat dissipation device according to claim 1, characterized in that: The electric control box also includes a cover body arranged on the box body (40); The box body (40) is also provided with a third heat dissipation hole (23), and the cover body is connected to the third heat dissipation hole (23) and the first heat dissipation hole (21).

8. The heat dissipation device according to claim 7, characterized in that: The cover body comprises a first cover shell (43) and a second cover shell (44); The first cover shell (43) is disposed on one side of the first heat dissipation hole (21); the first cover shell (43) is provided with a fourth heat dissipation hole (434) on one side of the second cover shell (44); the first cover shell (43) is connected to the second cover shell (44) through the fourth heat dissipation hole (434); The second cover shell (44) is arranged to cover one side of the third heat dissipation hole (23); the third heat dissipation hole (23), the fourth heat dissipation hole (434) and the first heat dissipation hole (21) are connected in sequence to form a forced convection air duct.

9. The heat dissipation device according to claim 8, characterized in that: The fourth heat dissipation hole (434) is arranged close to the first heat dissipation hole (21) and away from the second electronic component (412).

10. A heat pump host, characterized in that: A heat dissipation device comprising any one of claims 1 to 9.

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