Silicon wafer cleaning device

Abstract

The utility model relates to the technical field of cleaning, in particular to a silicon wafer cleaning device, which comprises an equipment main body, a silicon wafer cleaning device and a silicon wafer cleaning device, wherein the equipment main body is divided into a main cleaning tank and an auxiliary cleaning tank up and down; a conveying mechanism is arranged in the cleaning main tank in the length direction of the cleaning main tank. And a circulating part is connected between the main cleaning tank and the auxiliary cleaning tank, and the circulating part is communicated with the through-flow space, so that liquid circularly flows in the main cleaning tank and the auxiliary cleaning tank to clean the silicon wafer. The auxiliary tank is arranged below the main tank in the equipment main body, and the connecting circulation part between the main tank and the auxiliary tank is communicated with the through-flow space, so that liquid overflow and circulation are carried out on the conveying mechanism, the cleaning liquid can be ensured to be in more uniform contact with the silicon wafer, the overall cleaning efficiency is improved, and the production cost in the cleaning process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning, in particular to a silicon wafer cleaning device. Background Art

[0002] The pre-washing process in the process of making solar cells can improve the cleaning quality of the silicon wafer surface, help to form a uniform and consistent velvet structure after texturing, thereby improving the photoelectric conversion efficiency of solar cells; in traditional silicon wafer pre-texturing equipment, the main and auxiliary cleaning tanks are designed in a split form, and each tank requires its own independent space, which may result in a larger overall equipment volume. Multiple independent cleaning tanks may lead to a complex equipment layout, and the cleaning liquid flows in one direction, which cannot make the washing liquid evenly delivered to every part of the silicon wafer, resulting in differences in water quality and cleaning effect in different areas of the tank, resulting in poor cleaning effect, and it may be necessary to use more water and cleaning agents to repeat the cleaning process, thereby increasing the consumption of water resources and raw materials.

[0003] Therefore, in order to solve the technical problem that the use of a split cleaning tank results in a single liquid flow path, and the cleaning liquid cannot be evenly transferred to the silicon wafer, resulting in poor cleaning power, it is necessary to design a silicon wafer cleaning device. Utility Model Content

[0004] In order to solve the technical problems mentioned in the background technology, the utility model provides a silicon wafer cleaning device, comprising:

[0005] The equipment body has flow spaces on both sides;

[0006] The main body of the equipment is divided into a main cleaning tank and a secondary cleaning tank;

[0007] A conveying mechanism is provided in the main cleaning tank along its length direction; and

[0008] A circulation portion is connected between the main cleaning tank and the auxiliary cleaning tank, and the circulation portion is communicated with the flow space, so that liquid circulates in the main cleaning tank and the auxiliary cleaning tank to clean the silicon wafer;

[0009] Further, the conveying mechanism includes: an upper guide wheel and a lower transmission wheel;

[0010] The silicon wafer passes through the transmission gap between the upper guide wheel and the lower transmission wheel;

[0011] Furthermore, at least one ultrasonic generator is provided along the conveying mechanism in the main cleaning tank;

[0012] The ultrasonic generator is arranged on the top of the upper guide wheel and / or the bottom of the lower transmission wheel.

[0013] Further, the circulation portion includes: a first circulation port, a second circulation port and a third circulation port;

[0014] The first flow opening is arranged on two width sides of the main cleaning tank, the second flow opening is arranged on one width side of the main cleaning tank, and the third flow opening is arranged on both width sides of the auxiliary cleaning tank;

[0015] The first flow opening, the third flow opening and the third flow opening are respectively connected to the flow space, so that the liquid circulates in the main cleaning tank and the auxiliary cleaning tank.

[0016] Furthermore, the upper guide wheel is made of ceramic material, and the lower transmission wheel is made of metal material.

[0017] Furthermore, a spraying element is provided in the flow space;

[0018] The spraying part comprises: a first spraying part and a second spraying part;

[0019] The first spraying member is located at the terminal end of the conveying mechanism and is arranged above the upper guide wheel; and

[0020] The second spraying member is located at the starting end of the conveying mechanism and is arranged below the lower transmission wheel.

[0021] Furthermore, a liquid inlet is provided at the bottom of the main cleaning tank, and the liquid inlet is connected to a liquid inlet pipe leading out from the bottom of the main body.

[0022] Furthermore, at least four liquid inlets are provided.

[0023] Furthermore, a waste outlet for cleaning the main tank is provided at the bottom of the equipment body.

[0024] Furthermore, a filter screen is provided at the connection between the waste outlet and the main cleaning tank.

[0025] The beneficial effect of the utility model is that a sub-trough is arranged below the main tank in the equipment body, and the main cleaning tank and the sub-cleaning tank are provided with a circulation part, which connects the flow space on both sides of the inside of the equipment body to overflow and circulate the liquid in the conveying mechanism, so that a plurality of liquid flow channels are formed in the tank, and the liquid can circulate through the equipment, which can ensure that the cleaning liquid contacts the silicon wafer more evenly, improve the overall cleaning efficiency, reduce the production cost in the cleaning process, save space and improve the compactness of the layout.

[0026] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic structural diagram of a silicon wafer cleaning device according to some embodiments is shown;

[0030] Figure 2 A partial enlarged view of a silicon wafer cleaning device according to some embodiments is shown;

[0031] Figure 3 A liquid flow direction diagram of a silicon wafer cleaning device according to some embodiments is shown;

[0032] Figure 4 A schematic diagram of the bottom structure of a silicon wafer cleaning device according to some embodiments is shown;

[0033] Figure 5 A schematic top view of a silicon wafer cleaning device according to some embodiments is shown;

[0034] In the figure:

[0035] 100 equipment body, 101 main cleaning tank, 102 auxiliary cleaning tank, 103 waste outlet, 104 liquid inlet, 105 filter, 106 motor, 111 ultrasonic generator, 211 lower ultrasonic generator, 111a ultrasonic wiring tube, 211a lower ultrasonic wiring tube, 107 temperature detector;

[0036] 120 circulation part, 121 first circulation port, 122 second circulation port, 123 third circulation port;

[0037] 200 conveying mechanism, 201 upper guide wheel, 202 lower transmission wheel, 203 feeding port;

[0038] 300 spray part, 301 first spray part, 302 second spray part. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] like Figure 1 and Figure 2 As shown, at least one embodiment provides a silicon wafer cleaning device, including an equipment body 100, with flow spaces 110 on both sides thereof; wherein the equipment body 100 is divided into a main cleaning tank 101 and a sub-cleaning tank 102 in the upper and lower parts; a conveying mechanism 200 is arranged in the main cleaning tank 101 along its length direction; and a circulation part 120 is connected between the main cleaning tank 101 and the sub-cleaning tank 102, and the circulation part 120 is communicated with the flow space 110, so that liquid circulates in the main cleaning tank 101 and the sub-cleaning tank 102 to clean the silicon wafers.

[0041] In some embodiments, the circulation portion 120 includes: a first circulation port 121, a second circulation port 122 and a third circulation port 123; the first circulation port 121 is arranged on the two width sides of the main cleaning tank 101, the second circulation port 122 is arranged on the width side of the main cleaning tank 101, and the third circulation port 123 is opened on both width sides of the cleaning sub-tank 102; the first circulation port 121, the third circulation port 123 and the third circulation port 123 are respectively connected to the flow space 110 to allow the liquid to circulate in the main cleaning tank 101 and the cleaning sub-tank 102.

[0042] like Figure 3 As shown, the silicon wafer enters the silicon wafer cleaning device through the feed port 203, and is placed on the conveying mechanism 200 and moved along the length direction of the main cleaning tank 101. The silicon wafer moves and soaks in the main cleaning tank 101. During this period, cleaning liquid is injected into the main cleaning tank 101 and the sub-cleaning tank 102, and multiple channels are formed through the circulation part 120 and the flow space 110. The liquid in the main body of the equipment circulates in the direction F, which can ensure that the cleaning liquid contacts the silicon wafer more evenly, and the circulation part 120 ensures that the liquid level in the cleaning tank is stable to prevent overflow.

[0043] Specifically, when the cleaning liquid flows from the first flow port 121 and the second flow port 122 of the main cleaning tank 101 to the flow space 110, and then flows to the sub-cleaning tank 102 through the third flow port 123, the cleaning liquid forms a circulation flow between the main cleaning tank 101 and the sub-cleaning tank 102, ensuring uniform distribution and effective utilization of the cleaning liquid.

[0044] In some embodiments, the conveying mechanism 200 includes: an upper guide wheel 201 and a lower transmission wheel 202; the silicon wafer passes through the transmission gap between the upper guide wheel 201 and the lower transmission wheel 202. The upper guide wheel 201 is made of ceramic material, and the lower transmission wheel 202 is made of metal material. The upper guide wheel 201 and the lower transmission wheel 202 are rotatably arranged above and below the main cleaning tank 101, respectively. The silicon wafer to be cleaned is placed in the conveying mechanism 200 through the feed port, the upper surface of the silicon wafer is pressed by the upper guide wheel 201, and the lower surface thereof passes through the lower transmission wheel 202 and moves in the main cleaning tank 101 for cleaning.

[0045] In some embodiments, the upper guide wheel 201 is made of ceramic material. The lower transmission wheel 202 is made of metal material. The upper guide wheel 201 is made of ceramic material that is relatively hard and has a smooth surface, which is suitable for pressing the silicon wafer to move, reducing the risk of silicon wafer loss, and helping to maintain the cleanliness of the silicon wafer surface. The metal lower transmission wheel 202 has good wear resistance, is suitable for bearing the weight of the silicon wafer and the friction generated during the transmission process for a long time, and is not easily contaminated with particles and pollutants.

[0046] In some embodiments, an ultrasonic generator 111 is arranged along the conveying mechanism in the main cleaning tank 101; the ultrasonic generator 111 is arranged at the top of the upper guide wheel 201 and / or the bottom of the lower transmission wheel 202. The ultrasonic generator 111 (including the lower ultrasonic generator 211 in some embodiments) is distributed along the length direction of the conveying mechanism 200, and can clean the upper surface and the lower surface of the silicon wafer at the same time. The ultrasonic generator 111 (lower ultrasonic generator 211) is connected to the tank body through the 111a ultrasonic wiring tube (211a lower ultrasonic wiring tube) to ensure that the silicon wafer can receive uniform ultrasonic cleaning in the entire cleaning tank 101. The ultrasonic generator 111 and the conveying mechanism 200 operate synchronously to ensure that the silicon wafer is continuously cleaned by ultrasonic waves during the conveying process.

[0047] In some embodiments, a spray member 300 is provided in the flow space 110; the spray member 300 includes: a first spray member 301 and a second spray member 302; the first spray member 301 is located at the terminal end of the conveying mechanism 200 and is arranged above the upper guide wheel 201; and the second spray member 302 is located at the starting end of the conveying mechanism 200 and is arranged below the lower transmission wheel 202.

[0048] like Figure 4 and Figure 5 As shown, a liquid inlet 104 is provided at the bottom of the main cleaning tank 101, and the liquid inlet 104 is connected to a liquid inlet pipe and leads out from the bottom of the main body 100. At least four liquid inlets 104 are provided.

[0049] In some embodiments, a waste outlet 103 of the main cleaning tank 101 is provided at the bottom of the device body 100. The waste outlet 103 is used to discharge the waste liquid generated during the cleaning process from the main cleaning tank 101 for collection and treatment, to prevent solid particles in the waste liquid from accumulating in the tank, and to reduce the risk of blockage inside the cleaning tank.

[0050] In some embodiments, a filter screen 105 is provided at the connection between the waste outlet 103 and the main cleaning tank 101. When the waste outlet 103 is used to discharge the waste liquid generated during the cleaning process, the waste liquid is filtered through the filter screen 105 to prevent the discharge of solid particles, avoid clogging the drainage system or polluting the environment.

[0051] In some embodiments, the device body 100 is connected to a motor 106 to drive the conveying mechanism. The operator or the automatic control system starts the motor 106, and the motor starts to drive the conveying mechanism 200. The device body 100 is also connected to a temperature detector 107 to detect the temperature of the water level. The silicon wafer moves at a predetermined speed and direction through the lower transmission wheel 202, and the silicon wafer is gradually guided through the main cleaning tank 101 for cleaning.

[0052] To summarize, a sub-tank is provided below the main tank in the equipment body, and the main cleaning tank and the sub-tank are provided with flow ports, which connect the flow spaces on both sides of the equipment body to allow the liquid to overflow and circulate in the conveying mechanism, thereby forming multiple liquid flow channels in the tank. The liquid in the equipment can circulate, ensuring that the cleaning liquid contacts the silicon wafer more evenly, thereby improving the overall cleaning efficiency, reducing the production cost during the cleaning process, saving space, and improving the compactness of the layout.

[0053] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0055] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. With the above-mentioned ideal embodiments of the utility model as inspiration, through the above-mentioned description, relevant staff can make various changes and modifications without departing from the scope of the technical idea of ​​the utility model. The technical scope of the utility model is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon wafer cleaning device, characterized in that: include: The device body (100) has flow-through spaces (110) on both sides; wherein The equipment body (100) is divided into a main cleaning tank (101) and a secondary cleaning tank (102) in upper and lower parts; A conveying mechanism (200) is arranged in the main cleaning tank (101) along its length direction; and A circulation portion is connected between the main cleaning tank (101) and the auxiliary cleaning tank (102), and the circulation portion is in communication with the flow space (110), so that liquid circulates in the main cleaning tank (101) and the auxiliary cleaning tank (102) to clean the silicon wafer; The conveying mechanism (200) comprises: an upper guide wheel (201) and a lower transmission wheel (202); The silicon wafer passes through the transmission gap between the upper guide wheel (201) and the lower transmission wheel (202); An ultrasonic generator (111) is arranged along the conveying mechanism in the main cleaning tank (101); The ultrasonic generator (111) is arranged on the top of the upper guide wheel (201) and / or on the bottom of the lower transmission wheel (202).

2. The silicon wafer cleaning device according to claim 1, characterized in that: The circulation portion comprises: a first circulation port (121), a second circulation port (122) and a third circulation port (123); The first flow opening (121) is arranged on two width sides of the main cleaning tank (101), the second flow opening (122) is arranged on one width side of the main cleaning tank (101), and the third flow opening (123) is opened on both width sides of the auxiliary cleaning tank (102); The first circulation port (121), the third circulation port (123) and the third circulation port (123) are respectively connected to the flow space (110) so that the liquid circulates in the main cleaning tank (101) and the auxiliary cleaning tank (102).

3. The silicon wafer cleaning device according to claim 1, characterized in that: The upper guide wheel (201) is made of ceramic material, and the lower transmission wheel (202) is made of metal material.

4. The silicon wafer cleaning device according to claim 1, characterized in that: A spraying element (300) is provided in the flow space (110); The spraying element (300) comprises: a first spraying element (301) and a second spraying element (302); The first spraying member (301) is located at the terminal end of the conveying mechanism (200) and is arranged above the upper guide wheel (201); and The second spraying member (302) is located at the starting end of the conveying mechanism (200) and is arranged below the lower transmission wheel (202).

5. The silicon wafer cleaning device according to claim 1, characterized in that: The bottom of the main cleaning tank (101) is provided with a liquid inlet (104), and the liquid inlet (104) is connected to a liquid inlet pipe leading out from the bottom of the main body (100).

6. The silicon wafer cleaning device according to claim 5, characterized in that: At least four liquid inlets (104) are provided.

7. The silicon wafer cleaning device according to claim 1, characterized in that: The bottom of the equipment body (100) is provided with a waste outlet (103) for cleaning the main tank (101).

8. The silicon wafer cleaning device according to claim 7, characterized in that: A filter screen (105) is provided at the connection between the waste outlet (103) and the main cleaning tank (101).

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