Fixing device compatible with wafers of multiple sizes

Abstract

The utility model relates to a fixing device compatible with wafers of multiple sizes. The fixing device comprises a fixing main body; the supporting structure is positioned on the inner side of the fixed main body and is configured to bear a wafer; and the clamping mechanism is arranged on the front surface of the fixed main body and is configured to clamp the wafer from the side surface of the wafer. The fixing device can be compatible with non-standard wafers in a certain size range, the flexible clamping head of the clamping mechanism is pushed, the wafers are clamped from the side face through the flexible clamping head, the wafers of different sizes can be fixed, and it is guaranteed that the positions of the non-standard wafers do not move in the detection process.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer fixing, in particular to a fixing device compatible with wafers of multiple sizes. Background Art

[0002] With the rise of third-generation semiconductor technology, the country has vigorously promoted the production and manufacturing of third-generation semiconductors. As the entire industry is in its infancy, compared with silicon-based wafer fabs, many third-generation semiconductor material factories are in the early stages of mass production and are still in the testing stage, resulting in small-batch trial production of wafer materials, and the sizes of wafers are inconsistent between different batches, and even in the same batch.

[0003] At present, most equipment manufacturers have rich experience in the field of silicon-based wafer inspection. However, the non-standard size of third-generation semiconductor wafer materials has caused great trouble to equipment manufacturers. The equipment of equipment manufacturers generally has the following problems:

[0004] The hollow suction cup (chuck) is not compatible with non-standard size wafers; non-standard wafers cannot be fixed in the suction cup, and the wafer will shake during the operation of the detection equipment, affecting the detection quality of the equipment.

[0005] Therefore, there is an urgent need for a compatible fixture for third-generation semiconductor wafers. Utility Model Content

[0006] In order to solve at least part of the above problems in the prior art, the utility model provides a fixing device compatible with wafers of multiple sizes, comprising:

[0007] Fix the subject;

[0008] a support structure located inside the fixed body and configured to carry a wafer; and

[0009] The clamping mechanism is arranged on the front side of the fixing body and is configured to clamp the wafer from the side of the wafer.

[0010] Furthermore, the fixing body is in an arc shape as a whole.

[0011] Further, the support structure protrudes from the fixed body and faces the center of the fixed body, and the support structure includes:

[0012] A connecting portion, the upper surface of which is flush with the front surface of the fixed body, and the side surface of the connecting portion is arc-shaped; and

[0013] The supporting step has an upper surface lower than the front surface of the fixing body and is capable of supporting the wafer.

[0014] Furthermore, the support structure and the fixing body are formed integrally.

[0015] Furthermore, the clamping mechanism comprises:

[0016] A clamping mechanism body, which is fixedly connected to the fixed body;

[0017] A fixing seat, which is located on the first surface of the clamping mechanism body and is fixedly connected to the push rod;

[0018] a flexible clamping head fixedly connected to the fixing seat and configured to clamp the wafer; and

[0019] A push rod is configured to push the fixed seat and the flexible clamping head to move.

[0020] Furthermore, the push rod is installed on the second surface of the clamping mechanism body and passes through the clamping mechanism body to be connected with the fixing seat, wherein the second surface of the clamping mechanism body is opposite to the first surface.

[0021] Furthermore, the flexible clamping head has an opening capable of clamping a wafer.

[0022] Furthermore, the clamping mechanism also includes a guiding mechanism, which is configured to guide the flexible clamping head and the fixing seat to move in a straight line.

[0023] Furthermore, the guiding mechanism comprises:

[0024] A guide sleeve, which is arranged on the second surface of the clamping mechanism body, two guide sleeves are located on both sides of the push rod, and a through hole is provided at the connection between the guide sleeve and the clamping mechanism body, and the through hole is communicated with the guide sleeve;

[0025] A guide rod is inserted into the guide sleeve and one end of the guide rod is connected to the fixed seat. The guide rod can move linearly in the guide sleeve to guide the fixed seat and the flexible clamping head to move linearly.

[0026] Furthermore, it also includes a positioning pin, which is arranged on the back side of the fixing body.

[0027] The utility model has at least the following beneficial effects: (1) the fixing device is compatible with non-standard wafers within a certain size range. When in use, the flexible clamping head of the clamping mechanism is pushed, and the wafer is clamped from the side using the flexible clamping head, so that wafers of different sizes can be fixed to ensure that the position of the non-standard wafer does not move during the detection process; (2) the flexible clamping head of the fixing device is made of soft material and does not damage the wafer. The fixing method will not damage the wafer surface; (3) the fixing device has a simple structure, a small number of parts, low cost, and is easy to disassemble and assemble, and can be quickly replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to further illustrate the above and other advantages and features of various embodiments of the present invention, a more specific description of various embodiments of the present invention will be presented with reference to the accompanying drawings. It will be understood that these drawings only depict typical embodiments of the present invention and are therefore not to be considered as limiting the scope thereof. In the accompanying drawings, for clarity, identical or corresponding parts will be represented by identical or similar reference numerals.

[0029] Figure 1 A front schematic diagram of a fixing device compatible with wafers of multiple sizes according to an embodiment of the utility model is shown.

[0030] Figure 2 A back schematic diagram of a fixing device compatible with wafers of multiple sizes according to an embodiment of the utility model is shown.

[0031] Figure 3 A structural schematic diagram of a clamping mechanism according to an embodiment of the utility model is shown.

[0032] Figure 4 A schematic structural diagram of a wafer clamping device compatible with wafers of multiple sizes according to an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0033] It should be noted that various components in the various drawings may be shown exaggeratedly for illustrative purposes and are not necessarily correct to scale.

[0034] In the present invention, each embodiment is only intended to illustrate the solution of the present invention and should not be understood as limiting.

[0035] In the present invention, unless otherwise specified, the quantifiers "a", "an" and "an" do not exclude the presence of multiple elements.

[0036] It should also be pointed out that in the embodiments of the present invention, for the sake of clarity and simplicity, only a portion of the parts or components may be shown, but a person of ordinary skill in the art will understand that, under the guidance of the present invention, required parts or components may be added according to the needs of specific scenarios.

[0037] It should also be pointed out that within the scope of the present invention, the terms "same", "equal", "equal to" and the like do not mean that the two values ​​are absolutely equal, but allow a certain reasonable error, that is, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0038] It should also be pointed out that in the description of the present invention, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as explicitly or implicitly indicating relative importance.

[0039] In addition, the embodiments of the present invention describe the process steps in a specific order, but this is only for the convenience of distinguishing the steps, and does not limit the order of the steps. In different embodiments of the present invention, the order of the steps can be adjusted according to the adjustment of the process.

[0040] In the present invention, the term "extending outward" refers to extending in a direction away from the controller cover (or the combination of the controller cover and the controller housing), and the extension direction may be, for example, perpendicular or parallel to the peripheral interface of the controller cover or at a certain angle thereto.

[0041] Figure 1 A front schematic diagram of a fixing device compatible with wafers of multiple sizes according to an embodiment of the utility model is shown. Figure 2 A back schematic diagram of a fixing device compatible with wafers of multiple sizes according to an embodiment of the utility model is shown. Figure 3 A structural schematic diagram of a clamping mechanism according to an embodiment of the utility model is shown. Figure 4 A schematic structural diagram of a wafer clamping device compatible with wafers of multiple sizes according to an embodiment of the utility model is shown.

[0042] like Figure 1 and Figure 2 As shown, a fixing device compatible with wafers of multiple sizes includes a fixing body 10 , a supporting structure 11 , a positioning pin 12 and a clamping mechanism 20 .

[0043] The fixed body 10 is in an arc shape as a whole, and a plurality of support structures 11 are located inside the fixed body 10 and can carry wafers toward the center of the fixed body 10. The fixed body 10 is integrated with the support structure 11, and the support structure protrudes from the fixed body 10. The support structure 11 includes a connecting part and a supporting step, wherein the upper surface of the connecting part is flush with the front of the fixed body 10, and the side of the connecting part is arc-shaped and can fit with the side of the wafer. The upper surface of the supporting step is lower than the front of the fixed body 10 and can carry wafers.

[0044] The clamping mechanism 20 is disposed on the front side of the fixing body 10 and is used to clamp the wafer from the side of the wafer.

[0045] The positioning pin 12 is arranged on the back of the fixing body 10 for installing the fixing device. The positioning pin is inserted into the positioning hole of the installation position to install the fixing device. This installation method can be disassembled and the entire fixing device can be quickly replaced.

[0046] like Figure 3 As shown, the clamping mechanism 20 includes a clamping mechanism body 21, a fixing seat 22, a flexible clamping head 23, a push rod 24, and a guide mechanism.

[0047] The clamping mechanism body 21 is fixedly connected to the fixing body 10 , for example, by bolts.

[0048] The fixing seat 22 is located on the first surface of the clamping mechanism body 21 and is fixedly connected to the push rod 24 . The push rod can push the fixing seat 22 to move toward the inside of the fixing body 10 .

[0049] The flexible clamping head 23 is fixedly connected to the fixing seat 22. The flexible clamping head 23 is made of soft material, has certain elasticity and adaptability, and can ensure that the wafer is clamped without damaging the surface of the wafer. The flexible clamping head 23 has an opening that can clamp the wafer, and can clamp the side of the wafer when in use.

[0050] The push rod 24 is mounted on the second surface of the clamping mechanism body 21, and passes through the clamping mechanism body 21 to be connected with the fixing seat 22. The second surface of the clamping mechanism body 21 is opposite to the first surface.

[0051] The guide mechanism includes a guide sleeve 25 and a guide rod, which are used to guide the flexible clamping head 23 to move in a straight line. The guide sleeve 25 is arranged on the second surface of the clamping mechanism body 21, and two guide sleeves 25 are located on both sides of the push rod 24. A through hole is provided at the connection between the clamping mechanism body 21 and the guide sleeve 25, and the through hole is connected to the guide sleeve 25. The guide rod (not shown) is inserted into the guide sleeve 25, and one end is connected to the fixed seat 22, so that the fixed seat 22 can be pushed and pulled. The guide rod moves in the guide sleeve 25, which can ensure that it moves forward and backward along a straight line without tilting.

[0052] like Figure 4As shown, a non-standard wafer 30 (within a certain size range) is placed on the support step 11 of the fixed body 10, and the push rod 24 of the clamping mechanism 20 is pushed, and the guide rod is pushed at the same time. The flexible clamping head 23 in the clamping mechanism moves in a straight line under the guidance of the guide mechanism, and clamps the non-standard wafer 30 from the side. The flexible clamping head 23 clamps one side of the wafer, and the other side of the wafer will press against the side of the connecting part of the support structure 11. The push rod 24 of the clamping mechanism can realize the position holding function, ensuring that the push rod is fixed after being pushed into position, and the wafer can be firmly fixed. The fixing device can be compatible with non-standard wafers within a certain size range, ensuring that the position of the non-standard wafer does not move during the detection process.

[0053] Although some embodiments of the present invention have been described in this application document, it will be understood by those skilled in the art that these embodiments are only shown as examples. Under the guidance of the present invention, those skilled in the art can think of numerous variations, alternatives and improvements without exceeding the scope of the present invention. The attached claims are intended to define the scope of the present invention and thereby cover methods and structures within the scope of these claims themselves and their equivalents.

Claims

1. A fixture compatible with wafers of multiple sizes, characterized in that: include: Fix the subject; a support structure, which is located inside the fixed body and is configured to carry a wafer; as well as The clamping mechanism is arranged on the front side of the fixing body and is configured to clamp the wafer from the side of the wafer.

2. The device according to claim 1, characterized in that: The fixing body is in an arc shape as a whole.

3. The device according to claim 1, characterized in that: The support structure protrudes from the fixing body and faces the center of the fixing body, and the support structure includes: A connecting portion, the upper surface of which is flush with the front surface of the fixed body, and the side surface of the connecting portion is arc-shaped; and The supporting step has an upper surface lower than the front surface of the fixing body and is capable of supporting the wafer.

4. The device according to claim 1, characterized in that: The supporting structure and the fixing body are formed integrally.

5. The device according to any one of claims 1 to 4, characterized in that: The clamping mechanism comprises: A clamping mechanism body, which is fixedly connected to the fixed body; A fixing seat, which is located on the first surface of the clamping mechanism body and is fixedly connected to the push rod; a flexible clamping head fixedly connected to the fixing seat and configured to clamp the wafer; and A push rod is configured to push the fixed seat and the flexible clamping head to move.

6. The device according to claim 5, characterized in that: The push rod is installed on the second surface of the clamping mechanism body and passes through the clamping mechanism body to be connected with the fixing seat, wherein the second surface of the clamping mechanism body is opposite to the first surface.

7. The device according to claim 5, characterized in that: The flexible clamping head has an opening capable of clamping a wafer.

8. The device according to claim 5, characterized in that: The clamping mechanism further includes a guiding mechanism configured to guide the flexible clamping head and the fixing seat to move along a straight line.

9. The device according to claim 8, characterized in that: The guiding mechanism comprises: A guide sleeve, which is arranged on the second surface of the clamping mechanism body, two guide sleeves are located on both sides of the push rod, and a through hole is provided at the connection between the guide sleeve and the clamping mechanism body, and the through hole is communicated with the guide sleeve; A guide rod is inserted into the guide sleeve and one end of the guide rod is connected to the fixed seat. The guide rod can move linearly in the guide sleeve to guide the fixed seat and the flexible clamping head to move linearly.

10. The device according to claim 1, characterized in that: Also included is a positioning pin, which is arranged on the back side of the fixing body.

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