Anti-fracture connecting line

Abstract

The utility model discloses an anti-fracture connecting line comprising a substrate, the top of the substrate is fixedly connected with a film coating layer, and the top of the film coating layer is fixedly connected with a reinforcing layer; the substrate is a flexible circuit board; the film coating layer is a COF chip on film; the reinforcing layer is a resin coating; and the substrate and the film coating layer adopt a chip scale packaging process. The substrate, the film layer and the reinforcing layer are arranged, the reinforcing layer coated with resin is additionally arranged on the easy-to-break line part of the film layer, equivalently, a layer of reinforcing plate is additionally arranged on the film layer, the yield strength of the film layer can be effectively improved, the film layer is prevented from being broken, the material of the film layer does not need to be changed, the time required for improving the material is greatly shortened, and the film can be used immediately after being coated; a bending experiment proves that the capability of resisting line breakage is generally enhanced by 5-10 times before and after the same film coating layer is coated with the resin.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display mold production, in particular to an anti-fracture connecting line. Background Art

[0002] COF, often called chip on film, is a soft film assembly technology that fixes integrated circuits (ICs) on flexible circuit boards. It uses a soft additional circuit board as a packaged chip carrier to combine the chip with the soft substrate circuit, or simply refers to a soft additional circuit board for unpackaged chips, including tape and reel packaging production (TAB substrate, whose process is called TCP), soft board connection chip components, and soft IC carrier board packaging. It is one of the important components in liquid crystal display molds.

[0003] During the production process of existing LCD molds, the COF will be subjected to certain pressure due to actions such as handling and inspection, causing the COF to bend continuously. When the yield strength is reached, the wiring will break, resulting in poor display, affecting the project yield, and there is a risk of the product flowing into the customer end. Utility Model Content

[0004] The purpose of the utility model is to provide a connection line that is resistant to breakage. A reinforcement layer coated with resin is added to the part of the coating layer that is prone to breakage, which is equivalent to adding a reinforcement plate to the coating layer. The yield strength of the coating layer can be effectively increased to prevent the coating layer from breaking. There is no need to change the material of the coating layer, which greatly reduces the time required for material improvement and can be used immediately after coating. Bending experiments have shown that the ability of the same coating layer to resist breakage is generally enhanced by 5 to 10 times before and after resin coating.

[0005] To achieve the above object, a fracture-resistant connecting line is provided, comprising: a substrate, a coating layer fixedly connected to the top of the substrate, and a reinforcement layer fixedly connected to the top of the coating layer.

[0006] According to the anti-fracture connecting line, the substrate is a flexible circuit board.

[0007] According to the anti-fracture connecting wire, the coating layer is a COF film.

[0008] According to the anti-fracture connecting wire, the reinforcement layer is a resin coating.

[0009] According to the anti-fracture connecting wire, the substrate and the covering layer adopt a chip-level packaging process.

[0010] The above scheme has the beneficial effects: by setting a substrate, a coating layer and a reinforcement layer, a resin-coated reinforcement layer is added to the part of the coating layer that is prone to breakage, which is equivalent to adding a reinforcement plate to the coating layer, which can effectively increase the yield strength of the coating layer and prevent the coating layer from breaking. There is no need to change the material of the coating layer, which greatly reduces the time required for material improvement and can be used immediately after coating. Bending experiments have shown that the ability of the same coating layer to resist breakage is generally enhanced by 5 to 10 times before and after resin coating.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0013] Figure 1 This is a front view of an anti-fracture connecting line of the utility model.

[0014] Legend:

[0015] 1. Substrate; 2. Laminating layer; 3. Reinforcement layer. DETAILED DESCRIPTION

[0016] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0017] Reference Figure 1 The utility model embodiment provides an anti-fracture connecting line, which includes: a substrate 1, the substrate 1 is a flexible circuit board, a film layer 2 is fixedly connected to the top of the substrate 1, the film layer 2 is a COF chip-on-film, the substrate 1 and the film layer 2 adopt a chip-level packaging process, a reinforcement layer 3 is fixedly connected to the top of the film layer 2, and the reinforcement layer 3 is a resin coating. Adding a resin-coated reinforcement layer 3 to the part of the film layer 2 that is prone to breakage is equivalent to adding a layer of reinforcement plate to the film layer 2, which can effectively increase the yield strength of the film layer 2 and prevent the film layer 2 from breaking. There is no need to change the material of the film layer 2, which greatly reduces the time required for material improvement and can be applied and used.

[0018] Working principle: Adding a resin-coated reinforcement layer 3 to the part of the coating layer 2 that is prone to breaking is equivalent to adding a reinforcement plate to the coating layer 2, which can effectively increase the yield strength of the coating layer 2 and prevent the coating layer 2 from breaking. There is no need to change the material of the coating layer 2, which greatly reduces the time required for material improvement and can be used immediately after coating. Bending experiments have shown that the ability of the same coating layer 2 to resist breaking is generally enhanced by 5 to 10 times before and after resin coating.

[0019] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A break-proof connecting wire, characterized in that: include: A substrate (1), wherein the substrate (1) is a flexible circuit board, a coating layer (2) is fixedly connected to the top of the substrate (1), the coating layer (2) is a COF chip-on-film, a reinforcing layer (3) is fixedly connected to the top of the coating layer (2), and the reinforcing layer (3) is a resin coating.

2. The anti-fracture connecting wire according to claim 1, characterized in that: The substrate (1) and the coating layer (2) adopt a chip-level packaging process.

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