Semiconductor chilling plate detection device

Abstract

The utility model relates to the technical field of semiconductor chilling plates, in particular to a semiconductor chilling plate detection device which comprises a detection cavity with a closed space inside, and a detection position for placing a semiconductor chilling plate and a clamping tool located on one side of the detection position are arranged in the detection cavity. The detection position is provided with a first heat conduction block with a first temperature sensor, the clamping tool is provided with a second heat conduction block with a second temperature sensor, and the second heat conduction block is used for clamping the semiconductor chilling plate together with the first heat conduction block and detecting the hot surface temperature and the cold surface temperature of the semiconductor chilling plate. The detection device has the beneficial effects that the semiconductor chilling plate is arranged in the closed space for detection, so that the semiconductor chilling plate cannot be condensed, and the accuracy of the detection process can be ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration sheets, in particular to a semiconductor refrigeration sheet detection device. Background Art

[0002] At present, the semiconductor cooling chip detection devices on the market mainly detect the performance of semiconductor cooling chips under atmospheric conditions. During the detection process, due to exposure to the atmospheric environment, the cold surface temperature of the semiconductor cooling chip needs to be controlled during the detection, otherwise there will be a risk of condensation, resulting in inaccurate test results. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a semiconductor refrigeration piece detection device, which can effectively avoid the occurrence of semiconductor refrigeration piece condensation phenomenon and ensure the accuracy of the detection process.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0005] A semiconductor refrigeration chip detection device comprises a detection cavity with a closed space inside, wherein a detection position for placing the semiconductor refrigeration chip and a clamping tool located on one side of the detection position are provided in the detection cavity, a first heat-conducting block with a first temperature sensor is provided on the detection position, a second heat-conducting block with a second temperature sensor is provided on the clamping tool, and the second heat-conducting block is used to clamp the semiconductor refrigeration chip together with the first heat-conducting block and detect the hot surface temperature and the cold surface temperature of the semiconductor refrigeration chip.

[0006] Furthermore, a water cooling device is provided in the detection cavity, and the water cooling device is arranged through the detection position.

[0007] Furthermore, a water pipe joint is provided on the side wall of the detection cavity, and the water cooling device includes a U-shaped water channel, which is arranged at the bottom of the detection cavity and corresponds to the detection position. The water channel is connected to the water pipe joint, and the water pipe joint is connected to the external circulating water for cooling.

[0008] Furthermore, the contact surface between the first heat-conducting block and the semiconductor cooling sheet is coated with silicone grease for heat conduction.

[0009] Furthermore, the hot surface and the cold surface of the semiconductor refrigeration plate are respectively provided with thermally conductive silicone pads.

[0010] Furthermore, an air pipe joint is provided on the side wall of the detection cavity, and the air pipe joint is connected to an external vacuum unit.

[0011] Furthermore, the detection cavity includes an upper shell and a lower shell, and a sealing ring is provided between the upper shell and the lower shell to form a closed space together.

[0012] Furthermore, a positioning member with adjustable position is provided on the first heat conducting block and is used to limit the position of the semiconductor cooling plate.

[0013] Furthermore, a signal output interface is provided on the side wall of the detection cavity, which is used to be electrically connected to the signal output end of the built-in temperature sensor.

[0014] Furthermore, the number of the detection positions is more than two, and each detection position is configured with a clamping tool.

[0015] The beneficial effects of the utility model are:

[0016] The utility model provides a semiconductor refrigeration chip detection device, which places the semiconductor refrigeration chip in a closed space for detection, which is equivalent to the entire detection process being in a rough vacuum environment with an air pressure less than 50pa. The semiconductor refrigeration chip will not condense, thereby ensuring the accuracy of the detection process. At the same time, the heat conduction blocks in contact with the hot and cold surfaces of the semiconductor refrigeration chip are equipped with temperature sensors for monitoring the temperature, which can detect the real-time temperature of the semiconductor refrigeration chip. The real-time temperature data can be used to form a refrigeration curve and calculate the maximum refrigeration temperature difference to obtain the detection result of the semiconductor refrigeration chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor refrigeration chip detection device of the utility model;

[0018] Description of labels:

[0019] 1. Upper shell; 2. Second heat-conducting block; 3. Clamping tool; 4. First temperature sensor; 5. Semiconductor cooling sheet; 6. First heat-conducting block; 7. Aviation socket; 8. Quick clamp; 9. Two-input and four-output terminal block; 10. Water pipe joint; 11. Air pipe joint; 12. Sealing ring; 13. Lower shell; 14. Positioning piece; 15. Aviation socket; 16. Sealing ring; 17. Bottom plate. DETAILED DESCRIPTION

[0020] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0021] Please refer to Figure 1 The utility model provides a semiconductor refrigeration chip detection device, including a detection cavity with a closed space inside, wherein a detection position for placing the semiconductor refrigeration chip and a clamping tool located on one side of the detection position are provided in the detection cavity, a first heat-conducting block with a first temperature sensor is provided on the detection position, a second heat-conducting block with a second temperature sensor is provided on the clamping tool, and the second heat-conducting block is used to clamp the semiconductor refrigeration chip together with the first heat-conducting block and detect the hot surface temperature and the cold surface temperature of the semiconductor refrigeration chip.

[0022] From the above description, it can be seen that the beneficial effects of the utility model are: the utility model provides a semiconductor refrigeration plate detection device, which places the semiconductor refrigeration plate in a closed space for detection, which is equivalent to the entire detection process being in a rough vacuum environment with an air pressure of less than 50pa. The semiconductor refrigeration plate will not condense, thereby ensuring the accuracy of the detection process; at the same time, there are temperature sensors for monitoring the temperature in the heat conductive blocks in contact with the hot and cold surfaces of the semiconductor refrigeration plate, which can detect the real-time temperature of the semiconductor refrigeration plate. The real-time temperature data can be used to form a refrigeration curve and calculate the maximum refrigeration temperature difference to obtain the detection result of the semiconductor refrigeration plate.

[0023] Furthermore, a water cooling device is provided in the detection cavity, and the water cooling device is arranged through the detection position.

[0024] From the above description, it can be seen that by using a water cooling device as a heat dissipation method, the water flow rate can be adjusted in real time to ensure that the hot surface of the semiconductor refrigeration plate is in good heat dissipation condition. It can be adapted to the detection of different types of semiconductor refrigeration plates and the entire detection device has no rotating parts and no noise.

[0025] Furthermore, a water pipe joint is provided on the side wall of the detection cavity, and the water cooling device includes a U-shaped water channel, which is arranged at the bottom of the detection cavity and corresponds to the detection position. The water channel is connected to the water pipe joint, and the water pipe joint is connected to the external circulating water for cooling.

[0026] From the above description, it can be seen that the water cooling structure design is realized through the above method.

[0027] Furthermore, the contact surface between the first heat-conducting block and the semiconductor cooling sheet is coated with silicone grease for heat conduction.

[0028] It can be seen from the above description that the above method can ensure the temperature uniformity of the first heat conducting block and the accuracy of the temperature sensing of the temperature sensor.

[0029] Furthermore, the hot surface and the cold surface of the semiconductor refrigeration plate are respectively provided with thermally conductive silicone pads.

[0030] It can be seen from the above description that the contact thermal resistance can be effectively reduced through the above method.

[0031] Furthermore, an air pipe joint is provided on the side wall of the detection cavity, and the air pipe joint is connected to an external vacuum unit.

[0032] It can be seen from the above description that the vacuum operation of the detection cavity is achieved through the above method, so that a rough vacuum environment is formed inside the detection cavity, and the air pressure is less than 50 Pa.

[0033] Furthermore, the detection cavity includes an upper shell and a lower shell, and a sealing ring is provided between the upper shell and the lower shell to form a closed space together.

[0034] It can be seen from the above description that the sealing ring forms a seal between the upper shell and the lower shell, forming a closed space as a whole.

[0035] Furthermore, a positioning member with adjustable position is provided on the first heat conducting block and is used to limit the position of the semiconductor cooling plate.

[0036] It can be seen from the above description that the positioning member plays a positioning role when installing the semiconductor cooling plate, and the installation position of the positioning member on the first heat conductive block can be adjusted to adapt to the installation of semiconductor cooling plates of different sizes.

[0037] Furthermore, a signal output interface is provided on the side wall of the detection cavity, which is used to be electrically connected to the signal output end of the built-in temperature sensor.

[0038] It can be seen from the above description that the temperature data collected by the temperature sensor can be output through the above method.

[0039] Furthermore, the number of the detection positions is more than two, and each detection position is configured with a clamping tool.

[0040] From the above description, it can be seen that more than two semiconductor refrigeration chips can be detected at the same time, thereby improving the detection efficiency.

[0041] Please refer to Figure 1 , Embodiment 1 of the present utility model is:

[0042] The utility model provides a semiconductor cooling film detection device, including a detection cavity with a closed space inside, the detection cavity includes an upper shell 1 and a lower shell 13, a sealing ring 12 is arranged between the upper shell 1 and the lower shell 13, and two quick clamps 8 provide a pre-tightening force to press the sealing ring 12 to form a closed space. Four detection positions for placing semiconductor cooling films 5 are distributed in the closed space, and four semiconductor cooling films can be detected at the same time; each detection position is equipped with a clamping tool 3, and the clamping tool 3 is installed on one side of the detection position; the four detection positions are distributed according to a 2×2 matrix.

[0043] A first heat-conducting block 6 with a first temperature sensor 4 is provided at the detection position. The contact surface between the first heat-conducting block 6 and the semiconductor refrigeration plate 5 is coated with silicone grease for good heat conduction, which can ensure the temperature uniformity of the first heat-conducting block and the accuracy of the temperature sensing of the temperature sensor. Specifically, the first heat-conducting block 6 is screwed into the lower shell 13. Among them, the first temperature sensor 4 adopts a temperature sensor of model PT100 to monitor the temperature of the hot surface of the semiconductor refrigeration plate. The first heat-conducting block 6 is also provided with a position-adjustable positioning member 14 and is used to limit the semiconductor refrigeration plate. Among them, the positioning member can be a positioning pin. The positioning member plays a role in positioning the semiconductor refrigeration plate during installation, and the installation position of the positioning member on the first heat-conducting block can be adjusted to adapt to the installation of semiconductor refrigeration plates of different sizes.

[0044] The clamping fixture 3 is provided with a second heat-conducting block 2 with a second temperature sensor. The clamping fixture 3 provides a clamping force so that the second heat-conducting block 2 maintains good contact with the semiconductor refrigeration sheet 5, and clamps the semiconductor refrigeration sheet 5 together with the first heat-conducting block 6 to detect the hot surface temperature and the cold surface temperature of the semiconductor refrigeration sheet 5. The second temperature sensor also uses a PT100 temperature sensor to monitor the temperature of the cold surface of the semiconductor refrigeration sheet. In order to reduce the contact thermal resistance, thermal conductive silicone pads are added to the hot surface and the cold surface of the refrigeration sheet 5 to be detected during the detection.

[0045] A water cooling device is provided in the lower shell 13, and the water cooling device is arranged through the detection position. Specifically, a water pipe joint 10 is provided on the side wall of the lower shell 13, and the water cooling device includes a U-shaped water channel, which is arranged at the bottom of the detection cavity and corresponds to the detection position, so as to take away the heat generated during the detection; the water channel is connected to the water pipe joint 10, and the water pipe joint 10 is connected to the external circulating water for cooling. Among them, a bottom plate 17 is provided on the bottom surface of the lower shell 13, and the water channel is arranged on the bottom plate 17, and the bottom plate 17 and the sealing ring 16 are pressed by screws to form a seal. By using a water cooling device as a heat dissipation method, the water flow rate can be adjusted in real time to ensure that the heat dissipation condition of the hot surface of the semiconductor refrigeration plate is good, and it can be adapted to the detection of different types of semiconductor refrigeration plates, and the entire detection device has no rotating parts and no noise.

[0046] The side wall of the lower shell 13 is provided with an air pipe joint 11, which is connected to an external vacuum unit. The detection cavity is evacuated to form a rough vacuum environment inside the detection cavity, with an air pressure of less than 50 Pa.

[0047] The lower shell 13 is also provided with an aviation socket 7 and an aviation socket 15, which are used for 12VDC power input and temperature sensor signal output respectively. Specifically, the power line of the semiconductor cooling plate 5 is connected through two two-input and four-output wiring terminals 9, and the cable of the two-input and four-output wiring terminals is led out from the lower shell 13 through the aviation socket 7; the cable of the temperature sensor is led out from the lower shell 13 through the aviation socket 15.

[0048] To sum up, the utility model provides a semiconductor refrigeration plate detection device, which places the semiconductor refrigeration plate in a closed space for detection, which is equivalent to the entire detection process being in a rough vacuum environment with an air pressure less than 50pa. The semiconductor refrigeration plate will not condense, thereby ensuring the accuracy of the detection process. At the same time, there are temperature sensors for monitoring the temperature in the heat conductive blocks in contact with the hot and cold surfaces of the semiconductor refrigeration plate, which can detect the real-time temperature of the semiconductor refrigeration plate. The real-time temperature data can be used to form a refrigeration curve and calculate the maximum refrigeration temperature difference to obtain the detection result of the semiconductor refrigeration plate.

[0049] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor refrigeration chip detection device, characterized in that: The invention comprises a detection cavity with a closed space inside, wherein a detection position for placing a semiconductor cooling sheet and a clamping fixture located on one side of the detection position are provided in the detection cavity, a first heat-conducting block with a first temperature sensor is provided on the detection position, a second heat-conducting block with a second temperature sensor is provided on the clamping fixture, and the second heat-conducting block is used to clamp the semiconductor cooling sheet together with the first heat-conducting block and detect the hot surface temperature and the cold surface temperature of the semiconductor cooling sheet.

2. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: A water cooling device is provided in the detection cavity, and the water cooling device is arranged through the detection position.

3. A semiconductor refrigeration chip detection device according to claim 2, characterized in that: A water pipe joint is provided on the side wall of the detection cavity, and the water cooling device includes a U-shaped water channel, which is arranged at the bottom of the detection cavity and corresponds to the detection position. The water channel is connected to the water pipe joint, and the water pipe joint is connected to the external circulating water for cooling.

4. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: Silicone grease for heat conduction is coated on the contact surface between the first heat-conducting block and the semiconductor cooling sheet.

5. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: The hot surface and the cold surface of the semiconductor refrigeration plate are respectively provided with heat-conducting silicone pads.

6. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: An air pipe joint is provided on the side wall of the detection cavity, and the air pipe joint is connected to an external vacuum unit.

7. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: The detection cavity comprises an upper shell and a lower shell, and a sealing ring is arranged between the upper shell and the lower shell to form a closed space together.

8. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: The first heat-conducting block is provided with a positioning piece with adjustable position and is used to limit the position of the semiconductor cooling plate.

9. A semiconductor refrigeration chip detection device according to claim 1, characterized in that: A signal output interface is provided on the side wall of the detection cavity, which is used to be electrically connected to the signal output end of the built-in temperature sensor.

10. The semiconductor refrigeration chip detection device according to claim 1, characterized in that: The number of the detection positions is more than two, and each detection position is equipped with a clamping tool.

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