Aging test device
By setting multiple air inlets and air outlets in the aging test device, multiple air ducts are formed, and using the blower components to accelerate the air flow rate, the problem of heat accumulation in the aging test equipment is solved, and better ventilation effect and test accuracy are achieved.
Patent Information
- Application Number
- CN202420645393.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-03-29
AI Technical Summary
When existing aging testing equipment conducts room-temperature aging tests for high-power devices such as system-level chips, there is a risk that heat cannot be dissipated and accumulated, resulting in poor ventilation effect.
An aging test device is designed, by setting a first air inlet and a first air outlet on both sides of the cabinet, forming a first air duct, and setting a second air inlet on the door body to form a second air duct, using a blower assembly such as a fan to speed up the air flow rate and improve ventilation effect.
By forming the first air duct and the second air duct, the ventilation effect of the test space is significantly accelerated, and the heat generated by the semiconductor chip is effectively evacuated, avoiding heat accumulation, and improving test accuracy and efficiency.
Smart Images
Figure CN222689867U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of testing equipment, and in particular to an aging testing device. Background Art
[0002] Electronic products will age after long-term use. Aging tests can be used to understand the aging of products after a number of years of use through short-term tests. Specifically, the overall plan for semiconductor chip aging tests is to supply power signals and test signals to the semiconductor chip under test, and to allow the semiconductor chip under test to work continuously and uninterruptedly for a set time at high or low temperatures or at room temperature, thereby accelerating the failure of the semiconductor chip and screening out good products. Specifically, the aging test is performed in an aging test device, which includes a cabinet, a test board arranged in the cabinet, and a power supply device and a signal generating device respectively connected to the test board. During the semiconductor chip aging test, the semiconductor chip is arranged on the test board and electrically connected to the test board. The power supply device and the signal generating device apply power signals and test signals to the semiconductor chip through the test board.
[0003] During the aging process of semiconductor chips, the power signal and test signal are applied, which causes the semiconductor chips to generate heat. In order to prevent the heat generated by the electrons from affecting the temperature of the test environment, it is usually necessary to circulate gas inside the aging test device. Specifically, there are two types of circulation: internal circulation and external circulation. The external circulation means that the aging test device must meet the need for gas exchange with the outside world during the aging process.
[0004] Although existing aging test equipment is provided with air inlet and outlet channels, due to limited equipment space and in the room temperature aging test of high-power devices such as System on a Chip (SOC), there is still a risk of heat accumulation due to the inability to dissipate heat. Utility Model Content
[0005] The purpose of the present application is to provide an aging test device, which can improve the ventilation effect of the aging test device.
[0006] On the one hand, an embodiment of the present application provides an aging test device, including a cabinet and a door body slidably connected to the cabinet along a first direction, the cabinet having an opening for loading materials, the door body blocking the opening or exposing the opening during the sliding process along the first direction, a test space formed in the cabinet, the test space being used to set a semiconductor chip to be tested, a first air inlet and a first air outlet are respectively provided on both sides of the cabinet along the first direction, so that the first air inlet, the test space and the first air outlet form a first air duct, a second air inlet is opened on the door body to form a second air duct with the test space and the first air outlet, and the first air inlet is arranged at an angle to the second air inlet.
[0007] As an implementable manner, the second air inlets include a plurality of second air inlets arranged in a matrix, and the plurality of second air inlets are distributed throughout the entire door body.
[0008] As an implementable method, the cabinet includes side walls and partitions, the partitions divide the space enclosed by the side walls, the test space is formed by the partitions and the door body, a plurality of test boards are arranged in the test space along the second direction, each test board is provided with a plurality of test stations, and the first direction is perpendicular to the second direction.
[0009] As an implementable manner, the first air inlet and the first air outlet are respectively arranged on the partitions on both sides of the test space along the first direction, and blowing components are respectively arranged at the first air inlet and the first air outlet to speed up the flow rate of the first air duct.
[0010] As an implementable manner, the blowing component is a plurality of fans.
[0011] As an implementable manner, the door body is slidably connected to the cabinet body via a plate guide rail.
[0012] As an implementable method, the aging test device also includes a driving source and a linkage component connected to the driving source, the linkage component is connected to the door body and the cabinet body, and the driving source drives the door body to slide relative to the cabinet body through the linkage component according to the driving signal.
[0013] As an implementable method, the aging test device also includes photoelectric detectors arranged on the cabinet at opposite ends of the opening along the second direction, the photoelectric detectors detect obstacle signals outside the door body, and the driving source controls the state of the door body according to the obstacle signals.
[0014] As an practicable manner, the photoelectric detector includes safety gratings arranged opposite to each other.
[0015] The beneficial effects of the embodiments of the present application include:
[0016] The aging test device provided by the present application includes a cabinet and a door body connected to the cabinet body in a sliding manner along a first direction. The cabinet body has an opening for loading materials. The door body blocks the opening or exposes the opening during the sliding process along the first direction. A test space is formed in the cabinet body. The test space is used to set the semiconductor chip to be tested. The cabinet body is provided with a first air inlet and a first air outlet on both sides along the first direction, so that the first air inlet, the test space and the first air outlet form a first air duct. During the test, the heat generated by the semiconductor chip to be tested is evacuated along the first air duct to achieve a ventilation effect. A second air inlet is provided on the door body to form a second air duct with the test space and the first air outlet. The heat generated by the semiconductor chip to be tested can also be evacuated along the second air duct to achieve a ventilation effect, wherein the first air inlet and the second air inlet are arranged at an angle. The aging test device of the embodiment of the present application can accelerate the ventilation effect of the test space by forming the first air duct and the second air duct. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 One of the structural schematic diagrams of an aging test device provided in an embodiment of the present application;
[0019] Figure 2 This is a second structural schematic diagram of an aging test device provided in an embodiment of the present application.
[0020] Icons: 100-aging test device; 110-cabinet; 111-partition; 112-side wall; 120-door; 130-test space; 141-first air inlet; 142-first air outlet; 143-first air duct; 144-second air inlet; 145-second air duct; 151-blowing assembly; 161-photoelectric detector; 171-plate guide rail. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0023] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0024] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0025] The aging test device is used to perform aging tests on semiconductor chips, that is, the semiconductor chip works at a preset temperature for a preset time. When the semiconductor chip needs to work at room temperature for a preset time, the semiconductor chip is placed in the aging test device, and a preset power signal is supplied to the semiconductor chip to make it work. The heat generated by the semiconductor chip during operation will affect the temperature inside the cabinet.
[0026] The present application embodiment provides an aging test device 100, such as Figure 1 and Figure 2 As shown, it includes a cabinet 110 and a door body 120 slidably connected to the cabinet 110 along a first direction, the cabinet 110 has an opening for loading materials, and the door body 120 blocks the opening or exposes the opening during sliding along the first direction. A test space 130 is formed in the cabinet 110, and the test space 130 is used to set the semiconductor chips to be tested. The cabinet 110 is respectively provided with a first air inlet 141 and a first air outlet 142 on both sides along the first direction, so that the first air inlet 141, the test space 130 and the first air outlet 142 form a first air duct 143, and a second air inlet 144 is opened on the door body 120 to form a second air duct 145 with the test space 130 and the first air outlet 142.
[0027] The aging test device 100 provided in the embodiment of the present application is used to test the aging condition of the chip to be tested. The aging test device 100 includes a cabinet 110 and a door 120, and the cabinet 110 and the door 120 are slidably connected, wherein the cabinet 110 has an opening, and the door 120 blocks or exposes the opening during the sliding process relative to the cabinet 110. Specifically, when the aging test device 100 is used, the door 120 is first moved to expose the opening; then the semiconductor chip to be tested is placed in the test space 130 of the cabinet 110 through the opening, and connected to the test board in the test space 130; finally, the door 120 is moved to block the opening to start the test until the test is completed. Among them, the first direction is Figure 2 left and right direction.
[0028] The cabinet 110 is provided with a first air inlet 141 and a first air outlet 142 on both sides along the second direction, and the first air inlet 141, the test space 130 and the first air outlet 142 form a first air duct 143 (such as Figure 2During the test, the heat generated by the semiconductor chip to be tested is evacuated along the first air duct 143 to achieve ventilation. The door body 120 is provided with a second air inlet 144, and the second air inlet 144, the test space 130 and the first air outlet 142 form a second air duct 145 (such as Figure 2 In the test process, the heat generated by the semiconductor chip to be tested can also be evacuated along the second air duct 145 to achieve ventilation effect. The aging test device 100 of the embodiment of the present application can accelerate the ventilation effect of the test space 130 by forming the first air duct 143 and the second air duct 145. The first air inlet 141 and the second air inlet 144 are arranged at an angle, so that the air enters the test space from different directions, thereby improving the ventilation effect.
[0029] The aging test device 100 provided in the present application has a first air inlet 141 and a first air outlet 142 respectively arranged on both sides of the cabinet 110 along the first direction during the test process, so that the first air inlet 141, the test space 130 and the first air outlet 142 form a first air duct 143, and the heat generated by the semiconductor chip to be tested is evacuated along the first air duct 143 to achieve a ventilation effect. A second air inlet 144 is provided on the door body 120 to form a second air duct 145 with the test space 130 and the first air outlet 142, and the heat generated by the semiconductor chip to be tested can also be evacuated along the second air duct 145 to achieve a ventilation effect. The aging test device 100 of the embodiment of the present application can accelerate the ventilation effect of the test space 130 by forming the first air duct 143 and the second air duct 145.
[0030] Optional, such as Figure 1 As shown, the second air inlets 144 include a plurality of second air inlets 144 arranged in a matrix, and the plurality of second air inlets 144 are distributed throughout the door body 120 .
[0031] In order to ensure the strength of the door body 120, the second air inlet 144 is configured as a plurality of vents with smaller areas, such as Figure 1 As shown, a plurality of second air inlets 144 are provided on the door body 120, and the plurality of second air inlets 144 are arranged in a matrix, so that while ensuring the strength of the door body 120, the air inlet area of the second air inlets 144 is made as large as possible to improve the ventilation effect.
[0032] Specifically, the second air inlets 144 may be arranged in a plurality of matrix groups, such as Figure 1 As shown, an unperforated area of a preset width is reserved on the periphery of the door body 120 to increase the strength of the door body 120 .
[0033] In one possible implementation of the embodiment of the present application, Figure 1 and Figure 2As shown, the cabinet 110 includes a side wall 112 and a partition 111, the partition 111 divides the space enclosed by the side wall 112, the test space 130 is formed by the partition 111 and the door body 120, and the test space 130 is provided with a plurality of test boards along the second direction, each test board is provided with a plurality of test stations, and the first direction is perpendicular to the second direction, wherein the first direction is a horizontal direction and the second direction is a vertical direction.
[0034] Those skilled in the art will know that when an aging test is performed on a semiconductor chip to be tested, a preset power signal needs to be applied to the semiconductor chip. The embodiment of the present application uses a partition 111 to divide the space inside the cabinet 110 into a plurality of subspaces, wherein the subspace enclosed by the door 120 and the partition 111 is the test space 130, and the other subspaces are used to set an external voltage-stabilized power supply or other components. In this way, the test space 130 and other parts are distributed in different spaces to avoid touching other components when the semiconductor chip to be tested is set in the test space 130.
[0035] In addition, the door body 120 and the partition 111 enclose a test space 130, so that the test space 130 is the internal space corresponding to the opening of the cabinet 110, so that when the semiconductor chip to be tested is set on the test board, it can be operated conveniently. Specifically, a multi-layer test board is arranged in the vertical direction in the test space 130, and a plurality of test stations are arranged on the multi-layer test board. When performing the aging test, each test station on the multi-layer test board is respectively connected to set the semiconductor chip to be tested. In this way, the aging test of multiple semiconductor chips to be tested can be realized in one aging test, thereby improving the test efficiency.
[0036] It should be noted that the door body 120 is slidably disposed on the cabinet body 110 , and the door body 120 and the partition 111 enclose the test space 130 when the door body 120 is in a blocked opening state, that is, the test space 130 is connected to the opening of the cabinet body 110 .
[0037] Optional, such as Figure 2 As shown, the first air inlet 141 and the first air outlet 142 are respectively arranged on the partitions 111 on both sides of the test space 130 along the first direction, and the blowing components 151 are respectively arranged at the first air inlet 141 and the first air outlet 142 to speed up the flow rate of the first air duct 143.
[0038] The first air inlet 141 and the first air outlet 142 are respectively arranged on the partition 111 on both sides of the test space 130, so that the first air inlet 141 and the first air outlet 142 are close to the test space 130, and a blowing assembly 151 is arranged at the first air inlet 141 and the first air outlet 142. The blowing assembly 151 can accelerate the flow rate of air in the first air duct 143, and the first air inlet 141 and the first air outlet 142 are close to the test space 130, thereby further improving the ventilation effect in the test space 130.
[0039] It can be understood that the first air inlet 141 and the first air outlet 142 are arranged on the partition 111, because the test space 130 needs to exchange gas with the external environment, and therefore, there should be a gas flow channel between the partition 111 and the side wall 112, that is, the partition 111 and the side wall 112 are not sealed, such as Figure 1 shown.
[0040] In addition, when there are multiple first air inlets 141, the blowing components 151 can be set at all of the multiple first air inlets 141, or the blowing components 151 can be set at some of them; similarly, the blowing components 151 can be set at all of the multiple first air outlets 142, or the blowing components 151 can be set at some of them.
[0041] When there are multiple first air inlets 141, multiple air inlets 141 may be arranged along the third direction, multiple air inlets may be arranged along the second direction, or multiple air inlets may be arranged in a matrix. When multiple air inlets are arranged along the second direction, they may be arranged corresponding to each layer of the test board to better remove the heat generated by the semiconductor chip to be tested.
[0042] In one possible implementation of the embodiment of the present application, Figure 2 As shown, the blowing assembly 151 is a plurality of fans.
[0043] In other embodiments, in order to increase the air volume of the second air duct 145 , a fan structure may also be installed on the door body 120 .
[0044] Optional, such as Figure 1 As shown, the door body 120 is slidably connected to the cabinet body 110 via a plate guide rail 171 .
[0045] The door body 120 is characterized by its heavy weight, while the plate guide rail 171 has the advantages of high precision, high rigidity, high load capacity and low wear, which can ensure the stability and accuracy of the equipment in long-term, frequent and high-speed movement, thereby improving the durability of the door body 120 and the cabinet body 110.
[0046] In one achievable manner of an embodiment of the present application, the aging test device 100 also includes a driving source and a linkage component connected to the driving source, the linkage component is connected to the door body 120 and the cabinet body 110, and the driving source drives the door body 120 to slide relative to the cabinet body 110 through the linkage component according to a driving signal.
[0047] The setting of the driving source realizes the automation of the sliding of the door body 120. It can be understood that the aging test device 100 also includes a controller. The controller sends a driving signal according to the instruction. The driving source drives the door body 120 to slide relative to the cabinet body 110 through the linkage component according to the driving signal, thereby realizing the automatic sliding of the door body 120 and blocking the opening or exposing the opening.
[0048] Optional, such as Figure 1 As shown, the aging test device 100 also includes a photoelectric detector 161 disposed on the cabinet 110 at opposite ends of the opening along the second direction. The photoelectric detector 161 detects an obstacle signal outside the door 120, and the driving source controls the state of the door 120 according to the obstacle signal.
[0049] The photoelectric detector 161 detects an obstacle signal outside the door body 120 and sends the obstacle signal to the controller. The controller controls the driving source with the obstacle signal, and the driving source drives the door body 120 to pause closing or open and close. Specifically, when the door body 120 is closing, if an obstacle signal outside the door body 120 is detected at this time, the obstacle signal is transmitted to the controller, and the controller controls the driving source to stop closing according to the obstacle signal; if an obstacle signal outside the door body 120 is detected at this time, the obstacle signal is transmitted to the controller, and the controller alarms according to the obstacle signal. The setting of the photoelectric detector 161 can improve the safety of the aging test device 100 during operation.
[0050] The specific structure of the photodetector 161 is not specifically limited in this application, and is exemplified as follows: Figure 1 As shown, the photodetector 161 includes oppositely disposed safety light barriers.
[0051] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An aging test device, characterized in that: It includes a cabinet body and a door body slidably connected to the cabinet body along a first direction, the cabinet body has an opening for loading materials, the door body blocks the opening or exposes the opening during the sliding process along the first direction, a test space is formed in the cabinet body, the test space is used to set the semiconductor chip to be tested, the cabinet body is respectively provided with a first air inlet and a first air outlet on both sides along the first direction, so that the first air inlet, the test space and the first air outlet form a first air duct, the door body is provided with a second air inlet to form a second air duct with the test space and the first air outlet, and the first air inlet is arranged at an angle to the second air inlet.
2. The aging test device according to claim 1, characterized in that: The second air inlets include a plurality of second air inlets arranged in a matrix, and the plurality of second air inlets are distributed throughout the door body.
3. The aging test device according to claim 1, characterized in that: The cabinet includes side walls and partitions, the partitions divide the space enclosed by the side walls, the test space is formed by the partitions and the door, a plurality of test boards are arranged in the test space along the second direction, a plurality of test stations are arranged on each test board, and the first direction is perpendicular to the second direction.
4. The aging test device according to claim 3, characterized in that: The first air inlet and the first air outlet are respectively arranged on the partitions on both sides of the test space along the first direction, and the first air inlet and the first air outlet are respectively provided with blowing components to speed up the flow rate of the first air duct.
5. The aging test device according to claim 4, characterized in that: The blowing components are a plurality of fans.
6. The aging test device according to claim 1, characterized in that: The door body is slidably connected to the cabinet body via a plate-type guide rail.
7. The aging test device according to claim 6, characterized in that: It also includes a driving source and a linkage component connected to the driving source, wherein the linkage component is connected to the door body and the cabinet body, and the driving source drives the door body to slide relative to the cabinet body through the linkage component according to a driving signal.
8. The aging test device according to claim 7, characterized in that: It also includes photoelectric detectors on the cabinet body arranged at opposite ends of the opening along the second direction, the photoelectric detectors detect obstacle signals outside the door body, and the driving source controls the state of the door body according to the obstacle signals.
9. The aging test device according to claim 8, characterized in that: The photoelectric detector includes a safety grating arranged opposite to each other.