Circuit chip surface film pressing equipment capable of improving film pressing density

Abstract

The utility model relates to circuit chip surface film pressing equipment, in particular to circuit chip surface film pressing equipment capable of improving pressed film density, which comprises a top seat, a hydraulic rod fixedly mounted on the lower surface of the top seat, an electric heating plate fixedly mounted at the other end of the hydraulic rod, and a workbench, linear rails fixedly mounted at two ends of the upper surface of the workbench, two sliding blocks are fixedly installed on the linear rail, a grabbing mechanism is fixedly installed at the upper ends of the sliding blocks, a fixing plate is fixedly installed on the lower surface of one end of the workbench, a fan is fixedly installed on the upper surface of the fixing plate, and a cooling table is fixedly installed on the upper surface of one end of the workbench. The circuit chip subjected to film pressing is grabbed to the upper surface of the cooling table through the grabbing mechanism, and the fan runs, so that the flowability of air around the circuit chip is accelerated, the circuit chip subjected to film pressing is rapidly cooled, a film material is cooled and cured, a firm compact coating is formed on the surface of the circuit chip, and the film pressing density of the circuit chip is improved.

Description

Technical Field

[0001] The utility model relates to circuit chip surface lamination equipment, in particular to circuit chip surface lamination equipment which can improve the density of lamination. Background Art

[0002] A circuit chip is a basic component used to support and connect electronic components. It is usually a flat plate with a series of conductive tracks and connection points printed on it for connecting and transmitting current, signals and data. Circuit chips play a key role in modern electronic devices. They provide mechanical support, electrical connections and thermal management for electronic components. Circuit chip surface lamination equipment is a key equipment used in the circuit chip manufacturing process. This equipment is usually used to coat a protective film on the surface of the circuit chip to enhance its performance and durability. If the film material cannot be fully cured or dried after lamination, it will directly affect the density of the film material on the surface of the circuit chip. Therefore, the purpose of the utility model is to provide a circuit chip surface lamination equipment that can improve the density of lamination. Utility Model Content

[0003] The purpose of the utility model is to solve the defect in the above background technology that if the film material cannot be fully cured or dried after lamination, the density of the film material on the surface of the circuit chip will be directly affected by proposing a circuit chip surface lamination device that can improve the density of the film.

[0004] The technical solution adopted by the utility model is as follows:

[0005] Provided is a circuit chip surface lamination device capable of improving lamination density, comprising a top seat, a hydraulic rod fixedly mounted on the lower surface of the top seat, an electric heating plate fixedly mounted on the other end of the hydraulic rod, a plurality of support rods fixedly mounted on the lower surface of the top seat, and further comprising:

[0006] A workbench, wherein linear rails are fixedly installed at both ends of the upper surface of the workbench, two sliders are fixedly installed on the linear rails, a grabbing mechanism is fixedly installed on the upper ends of the sliders, a fixed plate is fixedly installed on the lower surface of one end of the workbench, a fan is fixedly installed on the upper surface of the fixed plate, a cooling platform is fixedly installed on the upper surface of one end of the workbench, and a plurality of air vents are opened on the upper surface of the cooling platform for accelerating air flow and improving the cooling efficiency of circuit chips placed on the cooling platform.

[0007] As a preferred technical solution of the utility model: a plurality of the support rods are fixedly connected to the workbench, and the electric heating plate is aligned with the film pressing table in the upper and lower directions.

[0008] As a preferred technical solution of the utility model: support rods are fixedly installed at both ends of the side wall at the other end of the workbench, and guide shafts are rotatably installed on the side walls of the support rods.

[0009] As a preferred technical solution of the utility model: a groove is provided in the cooling platform, and the fan is arranged at the lower end of the cooling platform.

[0010] As a preferred technical solution of the utility model: the grabbing mechanism includes a moving plate, a cylinder is fixedly installed at the center of the upper surface of the moving plate, and the piston end of the cylinder passes through the moving plate.

[0011] As a preferred technical solution of the utility model: a fixing block is fixedly installed on the piston end of the cylinder, an extension rod is fixedly installed on the side walls around the fixing block, and a suction cup is fixedly installed on the other end of the extension rod.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] In the circuit chip surface lamination device capable of improving the density of lamination, the circuit chip after lamination is grabbed to the upper surface of the cooling platform by a grabbing mechanism, and the fan arranged at the lower end of the cooling platform is operated to accelerate the air flow around the circuit chip, so as to quickly cool the circuit chip after lamination, cool and solidify the film material, and form a solid and dense coating on the surface of the circuit chip, so as to improve the density of lamination of the circuit chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a circuit chip surface lamination device that can improve the density of lamination in a preferred embodiment of the utility model;

[0015] Figure 2 It is a schematic structural diagram of a circuit chip surface lamination device capable of improving lamination density in a preferred embodiment of the utility model;

[0016] Figure 3 It is a structural schematic diagram of the grabbing mechanism in the preferred embodiment of the utility model.

[0017] The meaning of each mark in the figure is:

[0018] 1. Top seat; 101. Hydraulic rod; 102. Electric heating plate; 103. Support rod;

[0019] 2. Workbench; 201. Laminating table; 202. Sensor; 203. Support rod; 204. Guide shaft; 205. Linear rail; 206. Slider;

[0020] 3. Fixed plate; 301. Cooling platform; 302. Air outlet; 303. Fan;

[0021] 4. Grasping mechanism; 401. Cylinder; 402. Fixed block; 403. Extension rod; 404. Suction cup; 405. Moving plate. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this embodiment can be combined with each other. The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 3 As shown, the purpose of this embodiment is to provide a circuit chip surface lamination device that can improve the density of lamination, including a top seat 1, a hydraulic rod 101 is fixedly installed on the lower surface of the top seat 1, and a heating plate 102 is fixedly installed on the other end of the hydraulic rod 101. A heating wire is laid in the heating plate 102. The heating wire is a component used for heating, usually made of a slender metal wire or alloy wire. These wires have a high resistivity. When current passes through the heating wire, the resistance heating effect generated by the resistance will cause the wire to heat up and release heat energy. The heating wire is widely used in various heating applications. A plurality of support rods 103 are fixedly installed on the lower surface of the top seat 1, and also includes:

[0024] A workbench 2 is provided with linear rails 205 fixedly installed at both ends of the upper surface of the workbench 2, two sliders 206 are fixedly installed on the linear rails 205, and a grabbing mechanism 4 is fixedly installed on the upper ends of the sliders 206. A fixing plate 3 is fixedly installed on the lower surface of one end of the workbench 2, and a fan 303 is fixedly installed on the upper surface of the fixing plate 3. The fan 303 is a mechanical device for generating airflow or wind, which usually includes rotating blades or propellers to generate air flow through movement. A cooling platform 301 is fixedly installed on the upper surface of one end of the workbench 2, and a plurality of air outlets 302 are provided on the upper surface of the cooling platform 301 for accelerating the air flow rate and improving the cooling efficiency of the circuit chips placed on the cooling platform 301.

[0025] A number of support rods 103 are fixedly connected to the workbench 2, and the electric heating plate 102 is aligned with the laminating table 201. When the electric heating plate 102 is pushed down by the hydraulic rod 101, the electric heating plate 102 can cover the circuit chip placed on the laminating table 201, laminating the circuit chip and improving the laminating quality.

[0026] Support rods 203 are fixedly installed at both ends of the side wall at the other end of the workbench 2, and guide shafts 204 are rotatably installed on the side walls of the support rods 203. The guide shafts 204 are used to guide the film material to the same level as the circuit chip placed on the laminating table 201, further improving the uniform coverage of the film material on the surface of the circuit chip, and further improving the density of the circuit chip laminating.

[0027] A groove is provided in the cooling platform 301, and a fan 303 is arranged at the lower end of the cooling platform 301, which is used to increase the air flow speed around the circuit chip placed on the upper surface of the cooling platform 301, thereby increasing the cooling rate of the circuit chip after lamination, further improving the working efficiency of the lamination equipment, and further improving the density of the lamination on the surface of the circuit chip.

[0028] The grasping mechanism 4 includes a moving plate 405, at the center of the upper surface of the moving plate 405, a cylinder 401 is fixedly installed, the piston end of the cylinder 401 passes through the moving plate 405, a fixed block 402 is fixedly installed on the piston end of the cylinder 401, an extension rod 403 is fixedly installed on the side walls around the fixed block 402, and a suction cup 404 is fixedly installed on the other end of the extension rod 403. When the piston of the cylinder 401 extends, the suction cup 404 will gradually approach the circuit chip, and when the suction nozzle at the lower end of the suction cup 404 contacts the surface of the circuit chip, the circuit chip will be adsorbed by the suction cup 404. At this time, the cylinder 401 retracts, the circuit chip is picked up, and the grasping mechanism 4 moves linearly along the linear rail 205 to the upper end of the cooling platform 301, and the cylinder 401 extends. At this time, the suction cup 404 no longer adsorbs the circuit chip, and the circuit chip will be placed on the upper surface of the cooling platform 301 for grasping and placing the circuit chip.

[0029] When the utility model is used, the circuit chip is placed on the upper surface of the film pressing table 201, and the film material is pulled out through the guide shaft 204 to cover the surface of the circuit chip. The hydraulic rod 101 will push the electric heating plate 102 down to contact the circuit chip. The electric heating plate 102 will heat the circuit chip while applying pressure to the circuit chip. Then the hydraulic rod 101 drives the electric heating plate 102 to rise, and the grasping mechanism 4 moves linearly along the linear rail 205 to the upper end of the film pressing table 201, and the piston of the cylinder 401 extends, and the suction cup 40 4 will gradually approach the circuit chip. When the suction nozzle at the lower end of the suction cup 404 contacts the surface of the circuit chip, the circuit chip will be sucked by the suction cup 404. At this time, the cylinder 401 retracts, the circuit chip is picked up, and the grasping mechanism 4 moves linearly along the linear track 205 to the upper end of the cooling platform 301. The cylinder 401 extends. At this time, the suction cup 404 no longer absorbs the circuit chip, and the circuit chip will be placed on the upper surface of the cooling platform 301. The fan starts to run to accelerate the curing of the film material of the circuit chip placed on the upper surface of the cooling platform.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. Circuit chip surface lamination equipment capable of improving lamination density, characterized in that: The invention comprises a top seat (1), a hydraulic rod (101) is fixedly mounted on the lower surface of the top seat (1), an electric heating plate (102) is fixedly mounted on the other end of the hydraulic rod (101), a plurality of support rods (103) are fixedly mounted on the lower surface of the top seat (1), and further comprises: A workbench (2), wherein linear rails (205) are fixedly mounted at both ends of the upper surface of the workbench (2), two sliders (206) are fixedly mounted on the linear rails (205), a gripping mechanism (4) is fixedly mounted on the upper ends of the sliders (206), a fixing plate (3) is fixedly mounted on the lower surface of one end of the workbench (2), a fan (303) is fixedly mounted on the upper surface of the fixing plate (3), a cooling platform (301) is fixedly mounted on the upper surface of one end of the workbench (2), and a plurality of air vents (302) are provided on the upper surface of the cooling platform (301) for accelerating air flow and improving the cooling efficiency of circuit chips placed on the cooling platform (301).

2. The circuit chip surface lamination device capable of improving lamination density according to claim 1, characterized in that: The plurality of support rods (103) are fixedly connected to the workbench (2), and the electric heating plate (102) is aligned vertically with the film pressing table (201).

3. The circuit chip surface lamination device capable of improving lamination density according to claim 1, characterized in that: Support rods (203) are fixedly mounted on both ends of the side wall at the other end of the workbench (2), and a guide shaft (204) is rotatably mounted on the side wall of the support rod (203).

4. The circuit chip surface lamination device capable of improving lamination density according to claim 1, characterized in that: A groove is provided in the cooling platform (301), and the fan (303) is arranged at the lower end of the cooling platform (301).

5. The circuit chip surface lamination device capable of improving lamination density according to claim 1, characterized in that: The grabbing mechanism (4) comprises a movable plate (405), a cylinder (401) being fixedly mounted at the center of the upper surface of the movable plate (405), and a piston end of the cylinder (401) passing through the movable plate (405).

6. The circuit chip surface lamination device capable of improving lamination density according to claim 5, characterized in that: A fixing block (402) is fixedly mounted on the piston end of the cylinder (401), an extension rod (403) is fixedly mounted on the side walls around the fixing block (402), and a suction cup (404) is fixedly mounted on the other end of the extension rod (403).

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