Lead frame decapsulation jig

Abstract

The utility model provides a lead frame decapsulation jig, and relates to the technical field of semiconductor decapsulation. The jig comprises a test plate and a central grounding part, the test plate is provided with a hollow hole in a penetrating manner, and one side, facing the hollow hole, of the test plate is provided with a plurality of first pins; the first pin is used for being arranged corresponding to a second pin of a to-be-unsealed product; the hollow holes are used for glue injection so as to be fixedly connected with the plurality of first pins. The central grounding part is located in the hollow hole. According to the jig, the pins can be fixed after the lead frame is decapsulated, and decapsulation analysis of a decapsulated product is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor depackaging, in particular to a lead frame depackaging jig. Background Art

[0002] QFN (Quad Flat No-leads Package) is a square flat no-lead package, which is square or rectangular. There is a base island at the bottom center of the packaged product. The base island uses a large exposed pad for heat conduction. There are multiple conductive pins for electrical connection on the periphery and intervals of the base island. Since the conductive pins are fixed with a resin plastic package, when the existing conventional manual chemical decapping technology is used for product decapsulation analysis, it is very easy to cause the conductive pins to move or be missing, resulting in the detachment and breakage of the internal leads of the product, thereby affecting the decapsulation analysis results. Utility Model Content

[0003] The purpose of the utility model includes, for example, providing a lead frame depackaging jig, which can realize pin fixation in the lead frame depackaging process, and facilitates the depackaging analysis of the packaged product.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the utility model provides a lead frame depackaging jig, comprising:

[0006] A test board, wherein the test board is provided with a hollow hole, and a plurality of first pins are provided on a side of the test board facing the hollow hole; the first pins are used to be arranged corresponding to the second pins of the product to be unsealed; the hollow hole is used for injecting glue to fix the plurality of first pins;

[0007] A central grounding portion is located in the hollow hole.

[0008] In an optional embodiment, a connecting rib is provided in the hollow hole, one end of the connecting rib is connected to the central grounding portion, and the other end of the connecting rib is connected to the test board, and the connecting rib is spaced apart from the first pin.

[0009] In an optional implementation, a plating layer is provided on the first pin.

[0010] In an optional embodiment, it also includes a mounting bracket, which is mounted on the test board. The mounting bracket is provided with a mounting hole, and the mounting hole is used to mount the product to be unsealed so that the second pin of the product to be unsealed is connected to the first pin.

[0011] In an optional embodiment, the first pin is at least partially exposed from the mounting hole.

[0012] In an optional embodiment, a groove is provided on the test plate, and the mounting bracket is arranged in the groove.

[0013] In an optional embodiment, the mounting bracket is snap-connected to the test board.

[0014] In an optional embodiment, a hand-held portion is provided on the test board.

[0015] In an optional embodiment, one of the mounting bracket and the test board is provided with a card block, and the other is provided with a card slot that is plugged into and cooperates with the card block.

[0016] In an optional embodiment, the test board and the central grounding portion are made of metal.

[0017] The beneficial effects of the embodiments of the present utility model include, for example:

[0018] The lead frame decapsulation jig provided by the embodiment of the utility model has a hollow hole on the test board, and the central grounding part can support and conduct heat for the product to be decapsulated. After the product to be decapsulated is placed on the test board, the second pin of the product to be decapsulated is connected to the first pin on the test board, and glue is injected into the hollow hole from the side of the test board away from the product to be decapsulated, so that multiple first pins can be fixed. In this way, after the plastic package of the product to be decapsulated is removed, a single pin can be fixed on the first pin of the test board, so as to keep the pin of the product after decapsulation from shifting or falling, which is conducive to decapsulation analysis and testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of a lead frame depackaging jig provided in an embodiment of the utility model;

[0021] Figure 2 A schematic diagram of the disassembly structure of the test board and the mounting bracket in the lead frame depackaging fixture provided by an embodiment of the utility model;

[0022] Figure 3 A schematic diagram of the disassembly structure of the lead frame decapsulation jig and the product to be decapsulated provided in an embodiment of the utility model;

[0023] Figures 4 to 8A schematic diagram of the structure of the lead frame depackaging jig provided by an embodiment of the utility model in various states during use.

[0024] Icons: 100-lead frame depackaging jig; 110-test board; 111-hollow hole; 113-first pin; 114-plating; 115-groove; 116-handle part; 120-center grounding part; 130-connecting rib; 140-mounting bracket; 141-mounting hole; 150-insulating glue; 200-product to be depackaged. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0028] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.

[0029] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0030] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0031] Please refer to Figure 1, this embodiment provides a lead frame decapsulation jig 100, which can keep the lead frame pins fixed after decapsulation, which is convenient for analysis, observation and electrical performance testing. The lead frame decapsulation jig 100 includes a test board 110 and a central grounding portion 120. The test board 110 is penetrated by a hollow hole 111. A plurality of first pins 113 are provided on the side of the test board 110 facing the hollow hole 111, that is, the first pins 113 are arranged on the hole wall of the hollow hole 111. The first pin 113 is used to be arranged corresponding to the second pin of the product 200 to be decapsulated; the hollow hole 111 is used for injecting glue to fix the plurality of first pins 113. The central grounding portion 120 is located in the hollow hole 111. The central grounding portion 120 can support and conduct heat for the product 200 to be unsealed. After the product 200 to be unsealed is placed on the test board 110, the second pin of the product 200 to be unsealed is connected to the first pin 113 on the test board 110. Glue is injected into the hollow hole 111 from the side of the test board 110 away from the product 200 to be unsealed, so that multiple first pins 113 can be fixed. In this way, after the plastic package of the product 200 to be unsealed is removed, a single second pin can be fixed on the first pin 113 of the test board 110, so as to keep the pin of the unsealed product from shifting or falling, which is conducive to decapsulation analysis and testing.

[0032] Optionally, a connecting rib 130 is provided in the hollow hole 111, one end of the connecting rib 130 is connected to the central grounding portion 120, and the other end is connected to the test board 110, and the connecting rib 130 is spaced apart from the first pin 113. In this embodiment, the test board 110 is made of a metal plate, such as copper, aluminum, iron, etc. The central grounding portion 120 is rectangular, the cross section of the hollow hole 111 is rectangular, the number of the connecting ribs 130 is four, one end of the four connecting ribs 130 is respectively connected to the four corners of the central grounding portion 120, and the other end is respectively connected to the four corners of the hollow hole 111.

[0033] Of course, it is not limited to this, and the cross-sectional shape of the central grounding portion 120 can also be a circle, an ellipse, a diamond, a triangle or other polygons, which are not specifically limited here. The connecting ribs 130 are used to connect the central grounding portion 120 and the test board 110 as a whole, and the number and position of the connecting ribs 130 can be arranged according to actual needs.

[0034] The hollow hole 111 , the first pin 113 , the central grounding portion 120 , the connecting rib 130 and the like can be formed on the test board 110 by stamping or etching.

[0035] Optionally, a coating 114 is provided on the first pin 113. The coating 114 may be solder paste or other materials. The coating 114 facilitates the electrical connection between the first pin 113 on the test board 110 and the second pin of the product to be unsealed 200, improves the connection reliability, and makes the structure more stable. The coating 114 may be formed by electroplating, coating, or pasting, which is not specifically limited here. It is understandable that the coating 114 may also be applied to the second pin of the product to be unsealed 200, so that similar technical effects can be achieved without providing the coating 114 on the first pin 113 of the test board 110. Alternatively, the coating 114 may be provided on the first pin 113 and the second pin, respectively, which is not specifically limited here.

[0036] Combination Figure 2 , Figure 3 Optionally, the lead frame decapsulation jig 100 further includes a mounting bracket 140, which is mounted on the test board 110. The mounting bracket 140 is provided with a mounting hole 141, which is used to mount the product 200 to be decapsulated, so that the second pin of the product 200 to be decapsulated is connected to the first pin 113. The mounting bracket 140 plays a guiding role, and the mounting hole 141 serves as a guide hole. When the product 200 to be decapsulated is placed on the test board 110, it is placed on the test board 110 through the mounting hole 141, which can facilitate the alignment of the second pin of the product 200 to be decapsulated and the first pin 113 on the test board 110. In other words, the shape and size of the mounting hole 141 are adapted to the shape and size of the product 200 to be decapsulated. The mounting bracket 140 has a positioning and guiding function, which facilitates the rapid installation of the product 200 to be decapsulated.

[0037] Optionally, in order to align the first pin 113 with the second pin and achieve electrical connection, the first pin 113 is at least partially exposed from the mounting hole 141. It should be noted that the number of the first pins 113 is multiple, the number of the second pins is multiple, and the number of the first pins 113 is equal to the number of the second pins. Alternatively, the number of the first pins 113 is more than the number of the second pins, as long as each second pin can be fixed on a corresponding first pin 113.

[0038] Optionally, the length of the first pin 113 extending into the hollow hole 111 can be extended as much as possible, and the size of the central grounding portion 120 can be appropriately designed to be smaller. In this way, more lead frame packaged products of the same type with different package sizes can be matched and applied. For example, lead frame packaged products with the same outer ring pin spacing but different appearance sizes can all be used on the test board 110 for decapsulation analysis, thereby improving the utilization rate of the fixture.

[0039] Optionally, the test board 110 is provided with a groove 115, and the mounting bracket 140 is disposed in the groove 115. Optionally, the mounting bracket 140 is snap-fitted with the test board 110. For example, one of the mounting bracket 140 and the test board 110 is provided with a card block, and the other is provided with a card slot, and the card block is inserted into the card slot for plug-in matching to achieve a fixed connection between the mounting bracket 140 and the test board 110. In some other embodiments, the mounting bracket 140 and the test board 110 may also be bonded, bolted, welded, riveted, or magnetically fixed, which is not specifically limited here.

[0040] Optionally, the height of the mounting bracket 140 is not less than the depth of the groove 115. After the mounting bracket 140 is mounted to the groove 115 of the test board 110, the mounting bracket 140 is flush with or higher than the surface of the test board 110. This can better guide the installation of the product 200 to be unsealed.

[0041] The mounting bracket 140 may be made of, but not limited to, polyetherketone or polyimide. The mounting bracket 140 should have high temperature resistance, for example, it should not melt at a high temperature of 250° C. for at least 3 to 5 minutes.

[0042] Optionally, a handheld portion 116 is provided on the test board 110 to facilitate moving the test board 110 for observation, analysis, etc. The handheld portion 116 and the test board 110 can be integrally formed or separately fixedly connected, which is not specifically limited here. When the handheld portion 116 and the test board 110 are separately connected, the material of the handheld portion 116 can be metal or other materials.

[0043] The lead frame depackaging jig provided in the embodiment of the utility model is used for depackaging the lead frame, and its use principle is roughly as follows:

[0044] Combination Figure 4 , providing the above-mentioned test board 110. The test board 110 has a hollow hole 111, a first pin 113 provided on the hole wall of the hollow hole 111, and a central grounding portion 120 located in the hollow hole 111. The first pin 113 and the central grounding portion 120 are both made of conductive materials. The distribution of the first pin 113 corresponds to the second pin of the product 200 to be unsealed.

[0045] Combination Figure 5 Optionally, the first pin 113 is tin-plated.

[0046] Combination Figure 6, a mounting bracket 140 is placed on the test board 110; the mounting bracket 140 is installed in the groove 115 of the test board 110. The mounting bracket 140 has a mounting hole 141 adapted to the product 200 to be unsealed. The product 200 to be unsealed is placed in the mounting hole 141 of the mounting bracket 140, so that the second pin of the product 200 to be unsealed is correspondingly connected to the first pin 113 on the test board 110. The solder paste on the first pin 113 or the second pin is softened by heating to achieve electrical connection and fixation between the first pin 113 and the second pin. Optionally, a manually placed hot air gun can be used to blow hot air to the first pin 113 and the second pin to achieve the connection between the first pin 113 and the second pin.

[0047] Combination Figure 7 , on the side of the test board 110 away from the product 200 to be unsealed, inject insulating glue 150 from the hollow hole 111, and after the glue is cured, fix the multiple first pins 113. In addition, the insulating glue 150 can also strengthen the connection between the first pin 113 and the second pin, as well as strengthen the connection between the test board 110 and the mounting bracket 140. Optionally, the insulating glue 150 is acid-resistant and does not fall off or dissolve after being corroded by sulfuric acid and nitric acid. In this embodiment, the insulating glue 150 adopts a composition of epoxy resin and benzyl alcohol, wherein the mass proportion of epoxy resin is approximately 60% to 90%, and the mass proportion of benzyl alcohol is approximately 10% to 40%.

[0048] The plastic package of the unsealed product 200 is dissolved by chemical agents. Optionally, the chemical agent is a mixed solution of 98% concentrated sulfuric acid and 90% to 97.5% fuming nitric acid. The mixing ratio of 98% concentrated sulfuric acid and 90% to 97.5% fuming nitric acid is 1:4 to 2:3.

[0049] After dissolving the plastic package, the unsealed lead frame can be inspected and observed to find abnormal points.

[0050] Combination Figure 8 If further electrical performance test and analysis is required, the test board 110 can be trimmed to separate the first pin 113 and the test board 110. After trimming, the multiple first pins 113 are separated from each other and have no electrical connection. Due to the presence of the insulating glue 150, the multiple first pins 113 are still bonded together and will not fall off or shift. The first pin 113 or the second pin can be tested for electrical performance by a multimeter or other testing and analysis equipment, so that the electrical performance test and analysis of the decapsulated product can be performed.

[0051] In summary, the lead frame decapsulation jig 100 provided in the embodiment of the present invention has the following beneficial effects, including:

[0052] The lead frame decapsulation jig 100 provided by the embodiment of the utility model has a hollow hole 111 on the test board 110, and the central grounding part 120 can support and conduct heat for the product 200 to be decapsulated. After the product 200 to be decapsulated is placed on the test board 110, the second pin of the product 200 to be decapsulated is correspondingly connected to the first pin 113 on the test board 110, and glue is injected into the hollow hole 111 from the side of the test board 110 away from the product 200 to be decapsulated, so that multiple first pins 113 can be fixed. In this way, after the plastic package of the product 200 to be decapsulated is removed, a single pin can be fixed on the first pin 113 of the test board 110, so as to keep the pin of the decapsulated product from shifting or falling, which is conducive to decapsulation analysis and testing. Insulating glue 150 is injected into the hollow hole 111, multiple first pins 113 are bonded and fixedly connected, and the first pins 113 are made to have no electrical connection through the trimming process, so that the electrical performance test of the lead frame after depackaging can be realized, various abnormal points can be checked, the depackaging efficiency is high, and the electrical performance test and analysis after depackaging can be realized.

[0053] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A lead frame decapsulation jig, characterized in that: include: A test board, wherein the test board is provided with a hollow hole, and a plurality of first pins are provided on a side of the test board facing the hollow hole; the first pins are used to be arranged corresponding to the second pins of the product to be unsealed; the hollow hole is used for injecting glue to fix the plurality of first pins; A central grounding portion is located in the hollow hole.

2. The lead frame decapsulation jig according to claim 1, characterized in that: A connecting rib is provided in the hollow hole, one end of the connecting rib is connected to the central grounding portion, and the other end is connected to the test board, and the connecting rib is spaced apart from the first pin.

3. The lead frame decapsulation jig according to claim 1, characterized in that: A plating layer is provided on the first pin.

4. The lead frame decapsulation jig according to claim 1, characterized in that: It also includes a mounting bracket, which is mounted on the test board. The mounting bracket is provided with a mounting hole, and the mounting hole is used to mount the product to be unsealed so that the second pin of the product to be unsealed is connected to the first pin.

5. The lead frame decapsulation jig according to claim 4, characterized in that: The first pin is at least partially exposed from the mounting hole.

6. The lead frame decapsulation jig according to claim 4, characterized in that: The test plate is provided with a groove, and the mounting bracket is arranged in the groove.

7. The lead frame decapsulation jig according to claim 4, characterized in that: The mounting bracket is clamped with the test board.

8. The lead frame decapsulation jig according to claim 7, characterized in that: One of the mounting bracket and the testing board is provided with a card block, and the other is provided with a card slot which is plugged and matched with the card block.

9. The lead frame decapsulation jig according to claim 1, characterized in that: The test board and the central grounding portion are made of metal.

10. The lead frame decapsulation jig according to any one of claims 1 to 9, characterized in that: The test board is provided with a hand-held part.

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