Wafer carrier

Abstract

The utility model belongs to the technical field of wafer processing, and particularly relates to a wafer carrier. A central negative pressure area, a first peripheral negative pressure area and a second peripheral negative pressure area are sequentially arranged on the upper surface of a bearing disc of the wafer carrier from the circle center to the periphery, and the central negative pressure area can adsorb the central part of a wafer; the first peripheral negative pressure area and the second peripheral negative pressure area can respectively adsorb the outer edge parts of the wafers of different sizes, and can stably adsorb the wafers of different sizes. In other words, the wafer carrier of the embodiment can stably adsorb wafers of different sizes, and required negative pressure areas can be selectively selected according to the wafers of different sizes.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer carrier. Background Art

[0002] During the wafer manufacturing process, the wafer needs to be processed through multiple processes, among which a vacuum carrier is used to transfer the wafer. Patent CN212230400U discloses a wafer carrier, which increases the adsorption area by adding a central symmetrical graphic design of the vacuum channel, so that the wafer can be completely adsorbed on the wafer carrier during the operation of different equipment, avoiding abnormalities caused by wafer dislocation or warping during the operation, and the carrier has good adaptability to different machines.

[0003] However, in the current integrated circuit manufacturing industry, mainstream wafer sizes are various, such as 4 inches, 6 inches, 8 inches and 12 inches. The above-mentioned wafer carrier is only applicable to wafers of a single size and cannot be applied to multiple sizes. Utility Model Content

[0004] The utility model aims to provide a wafer carrier to solve the technical problem that the existing wafer carrier cannot be applied to wafers of various sizes.

[0005] The present application provides a wafer carrier, comprising: a substrate and a carrier plate arranged on the substrate;

[0006] The upper surface of the carrier plate is provided with a central negative pressure area, a first peripheral negative pressure area and a second peripheral negative pressure area in sequence from the center to the periphery;

[0007] The substrate is provided with a central negative pressure channel assembly, a first peripheral negative pressure channel assembly and a second peripheral negative pressure channel assembly which are respectively connected to the central negative pressure area, the first peripheral negative pressure area and the second peripheral negative pressure area, and are used to generate negative pressure for the corresponding negative pressure areas.

[0008] In one embodiment of the present application, the central negative pressure zone includes a plurality of annular negative pressure grooves spaced outward from the center of the circle and arranged coaxially, each annular negative pressure groove is a complete ring or a part of a ring;

[0009] The central negative pressure zone also includes a plurality of radial negative pressure grooves for connecting adjacent annular negative pressure grooves.

[0010] In one embodiment of the present application, a plurality of first arc-shaped grooves located on a first circular ring are provided in the first peripheral negative pressure zone, and a plurality of second arc-shaped grooves located on a second circular ring are provided in the second peripheral negative pressure zone;

[0011] The diameter of the second circular ring is greater than the diameter of the first circular ring.

[0012] In one embodiment of the present application, the bottom surface of the carrier plate is provided with: a central groove communicating with the annular negative pressure groove, a corresponding first peripheral groove communicating with each first arc groove, and a second peripheral groove communicating with each second arc groove;

[0013] Each groove is respectively connected to the corresponding central negative pressure channel assembly, the first peripheral negative pressure channel assembly and the second peripheral negative pressure channel assembly.

[0014] In one embodiment of the present application, the central negative pressure channel assembly includes:

[0015] a central air inlet hole, communicating with the central groove;

[0016] The central air extraction channel has one end connected to the central air inlet hole and the other end connected to the central negative pressure joint.

[0017] In one embodiment of the present application, the first peripheral negative pressure channel component includes:

[0018] First peripheral air inlet holes connected to the first peripheral grooves in a one-to-one correspondence; and

[0019] A plurality of first peripheral air extraction channels, each of which has one end connected to the corresponding first peripheral air inlet hole and the other end connected to the corresponding first peripheral negative pressure connector.

[0020] In one embodiment of the present application, the second peripheral negative pressure channel component includes:

[0021] Second peripheral air inlet holes communicating with the second peripheral grooves in a one-to-one correspondence; and

[0022] A plurality of second peripheral air extraction channels, one end of each second peripheral air extraction channel is connected to the corresponding second peripheral air inlet hole, and the other end is connected to the corresponding second peripheral negative pressure joint.

[0023] In one embodiment of the present application, the peripheries of the central air inlet hole, each first peripheral air inlet hole, and each second peripheral air inlet hole are all provided with sealing grooves for accommodating sealing rings.

[0024] In one embodiment of the present application, a collecting block is provided on one side of the substrate for connecting the central negative pressure joint, the first peripheral negative pressure joint, and the second peripheral negative pressure joint.

[0025] In one embodiment of the present application, a cover plate is further provided on the substrate, and the upper surface of the carrier plate is exposed from the cover plate.

[0026] Different from the prior art, the upper surface of the carrying plate of the wafer carrier provided in the present application is provided with a central negative pressure zone, a first peripheral negative pressure zone and a second peripheral negative pressure zone in sequence from the center to the periphery. The central negative pressure zone can adsorb the central part of the wafer. When the diameter of the carried wafer is large, the first peripheral negative pressure zone and the second peripheral negative pressure zone can respectively adsorb the outer edge parts of wafers of different sizes, and can stably adsorb wafers of different sizes.

[0027] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 is a three-dimensional diagram of a wafer carrier according to a preferred embodiment of the present invention;

[0031] Figure 2 This is a three-dimensional diagram of a wafer carrier of a preferred embodiment of the utility model with the cover plate hidden;

[0032] Figure 3 is a top view of a carrier plate of a preferred embodiment of the utility model;

[0033] Figure 4 It is a bottom view of a carrier plate of a preferred embodiment of the utility model;

[0034] Figure 5 This is a partial schematic diagram of a substrate of a preferred embodiment of the utility model

[0035] Figure 6 It is a top view of a substrate of a preferred embodiment of the utility model.

[0036] In the figure:

[0037] Substrate 1, central negative pressure channel assembly 11, central air inlet hole 111, central air extraction channel 112, central negative pressure connector 113, first peripheral negative pressure channel assembly 12, first peripheral air inlet hole 121, first peripheral air extraction channel 122, first peripheral negative pressure connector 123, second peripheral negative pressure channel assembly 13, second peripheral air inlet hole 131, second peripheral air extraction channel 132, second peripheral negative pressure connector 133, sealing groove 14, manifold 15;

[0038] The carrier plate 2, the central negative pressure area 21, the annular negative pressure groove 211, the radial negative pressure groove 212, the central groove 213, the first peripheral negative pressure area 22, the first arc groove 221, the first peripheral groove 222, the second peripheral negative pressure area 23, the second arc groove 231, the second peripheral groove 232;

[0039] Cover plate 3. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] The present application provides a wafer carrier, which is described in detail below. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments of the present application. In the following embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0042] See also Figure 1 , Figure 2 , Figure 3 , Figure 5 As shown, one embodiment of the present application provides a wafer carrier, comprising: a substrate 1 and a carrying plate 2 arranged on the substrate 1; the upper surface of the carrying plate 2 is provided with a central negative pressure area 21, a first peripheral negative pressure area 22 and a second peripheral negative pressure area 23 in sequence from the center to the periphery; the substrate 1 is provided with a central negative pressure channel assembly 11, a first peripheral negative pressure channel assembly 12 and a second peripheral negative pressure channel assembly 13 which are respectively connected to the central negative pressure area 21, the first peripheral negative pressure area 22 and the second peripheral negative pressure area 23, for generating negative pressure to the corresponding negative pressure areas.

[0043] See also Figure 3In a specific embodiment, the central negative pressure zone 21 can be the area within the dotted circle A, the first peripheral negative pressure zone 22 can be the area between the dotted circles A and B, and the second peripheral negative pressure zone 23 can be the area between the dotted circles B and C.

[0044] In some application scenarios, when carrying small-sized wafers, the wafers can be adsorbed by the central negative pressure zone 21; when carrying slightly larger-sized wafers, the central part of the wafer can be adsorbed by the central negative pressure zone 21, and the edge of the wafer can be adsorbed by the first peripheral negative pressure zone 22; when carrying larger-sized wafers, the central part of the wafer can be adsorbed by the central negative pressure zone 21, and the edge of the wafer can be adsorbed by the first peripheral negative pressure zone 22 and the second peripheral negative pressure zone 23. In other words, the wafer carrier of this embodiment can stably adsorb wafers of different sizes, and the required negative pressure zone can be selectively selected according to the wafers of different sizes.

[0045] See also Figure 3 Optionally, the central negative pressure zone 21 includes a plurality of annular negative pressure grooves 211 spaced apart from the center of the circle and arranged coaxially, and each annular negative pressure groove 211 is a complete ring or a part of a ring; the central negative pressure zone 21 also includes a plurality of radial negative pressure grooves 212 for connecting adjacent annular negative pressure grooves 211.

[0046] In this example, the central area of ​​the wafer can be stably adsorbed by a plurality of annular negative pressure grooves 211 and a plurality of radial negative pressure grooves 212 to ensure that the wafer will not move during processing and transportation.

[0047] See also Figure 3 Optionally, a plurality of first arc grooves 221 located on the first circular ring are arranged in the first peripheral negative pressure zone 22, and a plurality of second arc grooves 231 located on the second circular ring are arranged in the second peripheral negative pressure zone 23; the diameter of the second circular ring is greater than the diameter of the first circular ring.

[0048] In this example, the second arc groove 231 can be used to absorb the edge of a larger wafer. For example, the first arc groove 221 absorbs the edge of a 6-inch wafer, and the second arc groove 231 can be used to absorb the edge of an 8-inch wafer.

[0049] See also Figure 4 Optionally, the bottom surface of the carrier plate 2 is provided with: a central groove 213 connected to the annular negative pressure groove 211, a corresponding first peripheral groove 222 connected to each first arc groove 221, and a second peripheral groove 232 connected to each second arc groove 231; each groove is respectively connected to the corresponding central negative pressure channel assembly 11, the first peripheral negative pressure channel assembly 12 and the second peripheral negative pressure channel assembly 13.

[0050] Specifically, the central groove 213 , the first peripheral groove 222 , and the second peripheral groove 232 can be connected to the corresponding annular negative pressure groove 211 , the first arc groove 221 , and the second arc groove 231 through the through holes penetrating the carrier plate 2 .

[0051] Optionally, the central groove 213 can be a circular area covering all the annular negative pressure grooves 211. Since it is located in the middle of the bottom surface of the supporting plate 2, it is convenient for processing; the first peripheral groove 222 and the second peripheral groove 232 can be arc grooves that match the shape of the first arc groove 221 and the second arc groove 231.

[0052] See also Figure 5 and Figure 6 The central negative pressure channel assembly 11 includes: a central air inlet hole 111, which is connected to the central groove 213; a central air extraction channel 112, one end of which is connected to the central air inlet hole 111, and the other end is connected to the central negative pressure connector 113.

[0053] Optionally, the first peripheral negative pressure channel assembly 12 includes: a first peripheral air inlet hole 121 connected to each first peripheral groove 222 in a one-to-one correspondence; and a plurality of first peripheral air exhaust ducts 122, one end of each first peripheral air exhaust duct 122 connected to the corresponding first peripheral air inlet hole 121, and the other end connected to the corresponding first peripheral negative pressure connector 123.

[0054] Optionally, the second peripheral negative pressure channel assembly 13 includes: second peripheral air inlet holes 131 connected one-to-one with each second peripheral groove 232; and a plurality of second peripheral air exhaust ducts 132, one end of each second peripheral air exhaust duct 132 connected with the corresponding second peripheral air inlet hole 131, and the other end connected with the corresponding second peripheral negative pressure connector 133.

[0055] Preferably, the peripheries of the central air inlet hole 111 , each of the first peripheral air inlet holes 121 , and each of the second peripheral air inlet holes 131 are all provided with sealing grooves 14 for accommodating sealing rings.

[0056] In a specific implementation, the sealing ring on the periphery of the central air inlet hole 111 can cover the central groove 213, and the sealing rings on the periphery of each first peripheral air inlet hole 121 and each second peripheral air inlet hole 131 can cover the corresponding first peripheral groove 222 and second peripheral groove 232, thereby forming a negative pressure space in the central groove 213, the first peripheral groove 222, and the second peripheral groove 232.

[0057] See also Figure 1 A collecting block 15 is provided on one side of the substrate 1 for connecting the central negative pressure joint 113, the first peripheral negative pressure joint 123, and the second peripheral negative pressure joint 133; it is convenient for connecting and leading out the air pipe.

[0058] See also Figure 1 The substrate 1 is also covered with a cover plate 3, and the upper surface of the carrier plate 2 is exposed from the cover plate 3; the substrate 1 can be dustproof and protected.

[0059] In summary, the wafer carrier of the utility model sets corresponding negative pressure zones in areas with different diameters. When carrying small-sized wafers, the wafer can be adsorbed through the central negative pressure zone 21; when carrying slightly larger-sized wafers, the central part of the wafer can be adsorbed through the central negative pressure zone 21, and the edge of the wafer can be adsorbed through the first peripheral negative pressure zone 22; when carrying larger-sized wafers, the central part of the wafer can be adsorbed through the central negative pressure zone 21, and the first peripheral negative pressure zone 22 and the second peripheral negative pressure zone 23 can cooperate to adsorb the edge of the wafer. In other words, the wafer carrier of this embodiment can stably adsorb wafers of different sizes, and the required negative pressure zone can be selectively selected according to the wafers of different sizes.

[0060] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods.

[0061] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection.

[0062] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0063] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without departing from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer carrier, characterized in that: include: A substrate and a carrier plate disposed on the substrate; The upper surface of the carrier plate is provided with a central negative pressure area, a first peripheral negative pressure area and a second peripheral negative pressure area in sequence from the center to the periphery; The substrate is provided with a central negative pressure channel assembly, a first peripheral negative pressure channel assembly and a second peripheral negative pressure channel assembly which are respectively connected to the central negative pressure area, the first peripheral negative pressure area and the second peripheral negative pressure area, and are used to generate negative pressure for the corresponding negative pressure areas.

2. The wafer carrier according to claim 1, characterized in that: The central negative pressure zone includes a plurality of annular negative pressure grooves spaced outward from the center of the circle and arranged coaxially, each annular negative pressure groove is a complete ring or a part of a ring; The central negative pressure zone also includes a plurality of radial negative pressure grooves for connecting adjacent annular negative pressure grooves.

3. The wafer carrier according to claim 1, characterized in that: A plurality of first arc-shaped grooves located on a first circular ring are provided in the first peripheral negative pressure zone, and a plurality of second arc-shaped grooves located on a second circular ring are provided in the second peripheral negative pressure zone; The diameter of the second circular ring is greater than the diameter of the first circular ring.

4. The wafer carrier according to claim 1, characterized in that: The bottom surface of the carrier plate is provided with: a central groove communicating with the annular negative pressure groove, corresponding first peripheral grooves communicating with each first arc groove, and second peripheral grooves communicating with each second arc groove; Each groove is respectively connected to the corresponding central negative pressure channel assembly, the first peripheral negative pressure channel assembly and the second peripheral negative pressure channel assembly.

5. The wafer carrier according to claim 4, characterized in that: The central negative pressure channel component comprises: a central air inlet hole, communicating with the central groove; The central air extraction channel has one end connected to the central air inlet hole and the other end connected to the central negative pressure joint.

6. The wafer carrier according to claim 5, characterized in that: The first peripheral negative pressure channel component comprises: First peripheral air inlet holes connected to the first peripheral grooves in a one-to-one correspondence; and A plurality of first peripheral air extraction channels, one end of each first peripheral air extraction channel is connected to the corresponding first peripheral air inlet hole, and the other end is connected to the corresponding first peripheral negative pressure joint.

7. The wafer carrier according to claim 6, characterized in that: The second peripheral negative pressure channel component comprises: Second peripheral air inlet holes communicating with the second peripheral grooves in a one-to-one correspondence; and A plurality of second peripheral air extraction channels, one end of each second peripheral air extraction channel is connected to the corresponding second peripheral air inlet hole, and the other end is connected to the corresponding second peripheral negative pressure joint.

8. The wafer carrier according to claim 7, characterized in that: The peripheries of the central air inlet hole, each first peripheral air inlet hole, and each second peripheral air inlet hole are all provided with sealing grooves for accommodating sealing rings.

9. The wafer carrier according to claim 8, characterized in that: A collecting block is arranged on one side of the substrate, which is used for connecting the central negative pressure joint, the first peripheral negative pressure joint, and the second peripheral negative pressure joint.

10. The wafer carrier according to claim 1, characterized in that: The base plate is also covered with a cover plate, and the upper surface of the carrying plate is exposed from the cover plate.

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