Consumable chip and chip rack

Abstract

The utility model discloses a consumable chip and a chip rack, the consumable chip can be installed on the chip rack along a first direction, the chip rack is provided with an installation groove, the consumable chip comprises a chip substrate, the chip substrate comprises a first surface and a second surface which are oppositely arranged along a second direction, and the second direction and the first direction are arranged in an orthogonal manner. The first surface is provided with a chip contact, the second surface is provided with a chip component, the chip substrate is provided with a first end and a second end along the first direction, the first end of the chip substrate is provided with a mounting part, the mounting part is in clearance fit in the mounting groove, the second end of the chip substrate is provided with a fixing part, and the fixing part is used for fixing the consumable chip and the chip rack. According to the utility model, the first end of the chip substrate is provided with the mounting part, the second end of the chip substrate is provided with the fixing part, and the mounting part is in clearance fit with the mounting groove of the chip rack, so that a thicker chip can still be normally mounted and fixed in the chip rack, and the applicability of the chip during mounting is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of imaging consumables, in particular to a consumable chip and a chip rack. Background Art

[0002] There is a chip rack that is installed with the chip by sliding and snapping through a slide groove and a protrusion. However, for installation stability, the height of the slide groove is set relatively low. For some chips with thicker PCBs, the slide groove cannot accommodate the chip, and the chip cannot be installed normally. For chips that can be installed normally, since the chip contact plane is lower than the surface of the chip rack, when the printer contact pin is short, the chip and the printer may not be able to achieve stable electrical contact. Utility Model Content

[0003] The utility model aims to provide a consumable chip and a chip rack to solve the problem that thicker chips cannot be normally installed in the slide slot of the chip rack.

[0004] In a first aspect, the utility model provides a consumable chip that can be installed on a chip rack along a first direction.

[0005] The chip rack has a mounting groove, the consumable chip includes a chip substrate, the chip substrate includes a first surface and a second surface arranged opposite to each other along a second direction, the second direction is arranged orthogonally to the first direction, chip contacts are arranged on the first surface, and chip components are arranged on the second surface. Along the first direction, the chip substrate has a first end and a second end, the first end of the chip substrate is provided with a mounting portion, the mounting portion is gap-fitted in the mounting groove, and the second end of the chip substrate is provided with a fixing portion, and the fixing portion is used to fix the consumable chip to the chip rack.

[0006] The consumable chip as described above, wherein preferably, in the second direction, the thickness of the mounting portion is smaller than the thickness of the chip substrate.

[0007] A consumable chip as described above, wherein preferably, the chip substrate includes a side surface, the side surface extends along the first direction, the side surface is respectively connected to the first surface and the second surface, the mounting portion includes a first boss, the first boss is protruding from the side surface, and in the second direction, the thickness of the first boss is less than the thickness of the chip substrate.

[0008] In the consumable chip as described above, preferably, the first boss has a first mounting surface and a second mounting surface, wherein:

[0009] In the second direction, the first mounting surface is flush with the second surface, and the second mounting surface is closer to the second surface than the first surface;

[0010] or,

[0011] In the second direction, the second mounting surface is flush with the first surface, and the first mounting surface is closer to the first surface than the second surface.

[0012] A consumable chip as described above, wherein preferably, the side surface includes a first side surface and a second side surface, the first side surface and the second side surface are arranged on opposite sides of the chip substrate along a third direction, and the third direction is perpendicular to both the first direction and the second direction.

[0013] The consumable chip as described above, wherein preferably, in the first direction, the length of the first boss is smaller than the length of the chip substrate.

[0014] In the second aspect, the utility model provides a chip rack for installing the aforementioned consumable chips, the chip rack comprising a accommodating cavity, the accommodating cavity having a first opening formed on the surface of the chip rack, the inner wall surface of the accommodating cavity having a first rib, the inner wall surface of the accommodating cavity at the first opening having a second rib, and the installation groove being formed between the first rib and the second rib.

[0015] A chip rack as described above, wherein preferably, the accommodating cavity further forms a second opening on the surface of the chip rack, and when the mounting portion is loosely fitted in the mounting groove, the chip component is accommodated in the accommodating cavity through the second opening.

[0016] In the chip rack as described above, preferably, an installation notch is provided on the inner wall surface of the accommodating cavity opposite to the second opening, and the installation notch is used to determine whether the installation direction of the consumable chip is correct.

[0017] In the chip rack as described above, preferably, a fixing groove is provided at the edge of the first opening, and when the mounting portion is loosely fitted in the mounting groove, the fixing portion is engaged with the fixing groove.

[0018] Compared with the prior art, the utility model sets a mounting portion at the first end of the chip substrate and a fixing portion at the second end of the chip substrate. Through the clearance cooperation between the mounting portion and the mounting groove of the chip frame, a thicker chip can still be normally installed and fixed in the chip frame, thereby improving the applicability of the chip during installation and ensuring that the chip can be used normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of the consumable chip provided by the embodiment of the utility model;

[0020] Figure 2It is a side view of the consumable chip provided by the embodiment of the utility model;

[0021] Figure 3 This is a state diagram of the consumable chip provided by the embodiment of the utility model being installed on the chip rack;

[0022] Figure 4 It is an axonometric view of a chip rack provided by one embodiment of the utility model;

[0023] Figure 5 It is a top view of a chip rack provided by one embodiment of the utility model;

[0024] Figure 6 This is a front view of a chip rack provided by one embodiment of the utility model;

[0025] Figure 7 is an axonometric view of a chip rack provided by another embodiment of the utility model;

[0026] Figure 8 It is a front view of a chip rack provided by another embodiment of the utility model.

[0027] Description of reference numerals:

[0028] 100-consumable chip, 101-chip substrate, 1011-first surface, 1012-second surface, 1013-mounting portion, 1014-fixing portion, 1015-chip contact, 1016-chip component, 1017-chip protrusion, 1018-first side surface, 1019-second side surface, 102-first boss, 1021-first mounting surface, 1022-second mounting surface;

[0029] 200-chip rack, 201-accommodating cavity, 202-first opening, 203-first rib, 204-second rib, 205-installation groove, 206-second opening, 207-fixing groove, 208-installation notch, 209-connecting portion, 2091-third rib, 2092-fixing protrusion, 2093-columnar protrusion;

[0030] D1-first direction, D2-second direction, D3-third direction. DETAILED DESCRIPTION

[0031] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] First, refer to Figures 1 to 3As shown, the utility model provides a consumable chip 100, which can be installed on a chip frame 200 along a first direction D1. The chip frame 200 has a mounting groove 205. The consumable chip 100 includes a chip substrate 101. The chip substrate 101 includes a first surface 1011 and a second surface 1012 that are relatively arranged along a second direction D2. The second direction D2 is arranged orthogonally to the first direction D1. The first surface 1011 is provided with a chip contact 1015, and the second surface 1012 is provided with a chip component 1016. Along the first direction D1, the chip substrate 101 has a first end and a second end. The first end of the chip substrate 101 is provided with a mounting portion 1013, and the mounting portion 1013 is clearance-fitted in the mounting groove 205. The second end of the chip substrate 101 is provided with a fixing portion 1014, and the fixing portion 1014 is used to fix the consumable chip 100 to the chip frame 200.

[0033] In the embodiment provided in the present application, the first direction D1 is the direction in which the chip slides along the mounting groove 205 to be installed on the chip frame 200, and is also the length direction of the consumable chip 100. The second direction D2 is the gravity direction. The first surface 1011 is located above the second surface 1012 in the gravity direction. When the chip substrate 101 is thicker, the chip substrate 101 cannot be installed in the chip frame 200 through the mounting groove 205. Therefore, a mounting portion 1013 is provided at the first end of the chip substrate 101. Through the clearance fit between the mounting portion 1013 and the mounting groove 205, the thicker consumable chip 100 can still be normally installed in the chip frame 200. When the mounting portion 1013 is clearance fit in the mounting groove 205, the fixing portion 1014 at the second end of the chip substrate 101 fixes the consumable chip 100 to the chip frame 200, so that the consumable chip 100 is stably installed on the chip frame 200.

[0034] The first surface 1011 is the upper surface of the chip substrate 101, and the second surface 1012 is the lower surface of the chip substrate 101. The chip contacts 1015 of the first surface 1011 can be electrically connected to the contact pins of the printing device, so that the printing device can perform printing work. The number of chip contacts 1015 can be set according to printing requirements. The chip components 1016 of the second surface 1012 include devices such as memory, battery, capacitor, resistor, etc. The components such as memory can be soft-packaged or hard-packaged. The second surface 1012 can also include a mounting frame for mounting and fixing the battery. These components can ensure the normal operation of the chip.

[0035] In the embodiment provided in the present application, mounting portions 1013 are provided on opposite sides of the first end of the chip substrate 101, and fixing portions 1014 are provided on opposite sides of the second end of the chip substrate 101. With the joint action of the two mounting portions 1013 and the two fixing portions 1014, the chip substrate 101 can be more stably installed on the chip frame 200.

[0036] In the second direction D2, the thickness of the mounting portion 1013 is less than the thickness of the chip substrate 101. In the embodiment provided in the present application, the second direction D2 is the gravity direction. In the gravity direction, when the thickness of the mounting portion 1013 is less than the thickness of the chip substrate 101, the mounting portion 1013 is arranged at the first end of the chip substrate 101 in a stepped manner, and the thickness of the mounting portion 1013 is adapted to the width of the mounting groove 205, so that even if the thickness of the chip substrate 101 is relatively thick, it can still be installed on the chip frame 200 through the mounting portion 1013. In a feasible implementation, a stepped mounting portion 1013 is formed on the edge of the chip substrate 101 by a milling platform process, so that any consumable chip 100 of any thickness can be normally installed on the chip frame 200.

[0037] In other embodiments, when the width of the chip substrate 101 is small, for a thicker chip substrate 101, even if the stepped mounting portion 1013 is processed on the edge of the chip substrate 101 by a milling platform, the chip substrate 101 still cannot be mounted on the chip frame 200, so the mounting portion 1013 can be fixed to the edge of the chip substrate 101 by welding or other methods to increase the width of the chip substrate 101 so that the chip substrate 101 can be mounted on the chip frame 200. The fixing portion 1014 can also be provided at the second end of the chip substrate 101 in the same manner. Preferably, only the mounting portion 1013 is provided to save costs.

[0038] Further, the chip substrate 101 includes a side surface, the side surface extends along the first direction D1, and the side surface is respectively connected to the first surface 1011 and the second surface 1012. The mounting portion 1013 includes a first boss 102, and the first boss 102 is protruding from the side surface. In the second direction D2, the thickness of the first boss 102 is less than the thickness of the chip substrate 101. The first boss 102 is formed in a stepped shape on the side surface of the chip substrate 101. When the chip substrate 101 is installed, the first boss 102 slides along the mounting groove 205 to achieve the installation of the chip substrate 101 in the chip frame 200.

[0039] Reference Figure 2 As shown, the first boss 102 has a first mounting surface 1021 and a second mounting surface 1022, wherein: in the second direction D2, the first mounting surface 1021 is flush with the second surface 1012, and the second mounting surface 1022 is closer to the second surface 1012 than the first surface 1011; or, in the second direction D2, the second mounting surface 1022 is flush with the first surface 1011, and the first mounting surface 1021 is closer to the first surface 1011 than the second surface 1012.

[0040] In a feasible implementation, when the first mounting surface 1021 is flush with the second surface 1012, there is a certain distance between the second mounting surface 1022 and the first surface 1011, and the first boss 102 is arranged at the lower part of the side of the chip substrate 101 to form a stepped mounting portion 1013. When the consumable chip 100 is installed on the chip rack 200 through the first boss 102, the first surface 1011 is flush with the plane where the top of the chip rack 200 is located or the distance is small. When the contact pin of the printing device is short, or the contact pin metal fatigue and insufficient elasticity caused by long-term use, the chip contact 1015 of the first surface 1011 can still be electrically connected to the contact pin of the printing device, which is beneficial to ensure that the printing device can perform printing work normally.

[0041] In another feasible implementation, when the second mounting surface 1022 is flush with the first surface 1011, there is a certain distance between the first mounting surface 1021 and the second surface 1012, and the first boss 102 is provided on the upper side of the chip substrate 101 to form a stepped mounting portion 1013, and the consumable chip 100 can be mounted on the chip frame 200 by the clearance between the first boss 102 and the mounting groove 205. Since the chip components 1016 are all provided on the second surface 1012, when there are more chip components 1016, the first boss 102 whose first mounting surface 1021 is flush with the second surface 1012 is preferably selected.

[0042] Reference Figure 1 As shown, the side surface includes a first side surface 1018 and a second side surface 1019, and the first side surface 1018 and the second side surface 1019 are arranged on opposite sides of the chip substrate 101 along a third direction D3, and the third direction D3 is perpendicular to the first direction D1 and the second direction D2. In the embodiment provided by the present application, the third direction D3 is the width direction of the chip substrate 101, and the first side surface 1018 and the second side surface 1019 are symmetrically arranged on both sides of the chip substrate 101. The first boss 102 is arranged on at least one side of the first side surface 1018 and the second side surface 1019, and preferably, the first boss 102 is arranged on both the first side surface 1018 and the second side surface 1019 to ensure the stability of the consumable chip 100 installed on the chip frame 200.

[0043] In a feasible implementation, in the first direction D1, the length of the first boss 102 is less than the length of the chip substrate 101. In order to save costs, the length of the first boss 102 only needs to be sufficient to mount the chip substrate 101 on the chip frame 200, so the length of the first boss 102 is set to be less than the chip substrate 101. Preferably, the length of the first boss 102 is adapted to the length of the mounting groove 205.

[0044] Second, refer to Figures 4 to 8As shown, the utility model provides a chip rack 200 for installing the aforementioned consumable chip 100, the chip rack 200 includes a housing chamber 201, the housing chamber 201 is formed with a first opening 202 on the surface of the chip rack 200, the inner wall surface of the housing chamber 201 is provided with a first rib 203, the inner wall surface of the housing chamber 201 at the first opening 202 is provided with a second rib 204, and a mounting groove 205 is formed between the first rib 203 and the second rib 204. In the embodiment provided by the present application, the first opening 202 is formed at the top of the chip rack 200, the first rib 203 and the second rib 204 are each provided with two, and then two mounting grooves 205 are provided in the housing chamber 201, and the two mounting grooves 205 are provided on two opposite inner wall surfaces of the housing chamber 201. The two mounting portions 1013 provided at the first end of the chip substrate 101 are respectively matched with the two mounting grooves 205 in a clearance, and together realize the mounting of the consumable chip 100 on the chip rack 200.

[0045] Furthermore, the accommodating cavity 201 is also formed with a second opening 206 on the surface of the chip frame 200. When the mounting portion 1013 is loosely fitted in the mounting groove 205, the chip component 1016 is accommodated in the accommodating cavity 201 through the second opening 206. The second opening 206 is arranged on the side of the chip frame 200, perpendicular to the plane where the first opening 202 is located. During the process of the chip substrate 101 sliding along the mounting groove 205 and being fixed to the chip frame 200, the chip component 1016 approaches the accommodating cavity 201 along with the chip substrate 101, and is accommodated in the accommodating cavity 201 after passing through the second opening 206. The size of the accommodating cavity 201 can be set according to the space occupied by the chip component 1016, so that the chip component 1016 can be tightly accommodated in the accommodating cavity 201, thereby ensuring that the consumable chip 100 can be stably connected and have a good electrical connection effect after being installed on the chip frame 200.

[0046] In the embodiment provided in the present application, an installation notch 208 is provided on the inner wall surface of the accommodating cavity 201 opposite to the second opening 206, and the installation notch 208 is used to determine whether the installation direction of the consumable chip 100 is correct. A chip protrusion 1017 is provided on the second surface 1012 of the consumable chip 100. After the consumable chip 100 is installed on the chip frame 200, the chip protrusion 1017 can cooperate with the installation notch 208 to identify the direction of the consumable chip 100 and prevent the consumable chip 100 from being installed upside down.

[0047] Reference Figure 4 , Figure 5 as well as Figure 7As shown, a fixing groove 207 is provided at the edge of the first opening 202. The fixing groove 207 can be a through groove or a groove with an opening. When the mounting portion 1013 is loosely matched with the mounting groove 205, the fixing portion 1014 is engaged with the fixing groove 207. In the embodiment provided by the present application, the fixing portion 1014 is a fixing protrusion provided at the second end of the chip substrate 101. When the mounting portion 1013 is loosely matched with the mounting groove 205 and the chip substrate 101 covers the first opening 202, the fixing protrusion is engaged with the fixing groove 207 to fix the consumable chip 100 to the chip frame 200. Preferably, two fixing grooves 207 and two fixing protrusions are provided respectively, and the two fixing grooves 207 are respectively provided at the opposite two sides of the first opening 202, and the two fixing protrusions are respectively provided at the opposite two sides of the second end of the chip substrate 101. The cooperation between the two fixing grooves 207 and the two fixing protrusions makes the consumable chip 100 and the chip frame 200 more firmly fixed.

[0048] In a feasible implementation, a connection portion 209 is provided on the side of the chip rack 200 away from the accommodating cavity 201, and the connection portion 209 can fix the chip rack 200 on the consumable box, which can be an ink box or ink bottle filled with ink, or a toner box or a toner cartridge box filled with toner. Figure 4 As shown, the connecting portion 209 is a plurality of third ribs 2091 with fixing protrusions 2092, and is connected to the consumable box by means of the fixing protrusions 2092. Figure 7 as well as Figure 8 As shown, the connecting portion 209 is a plurality of columnar protrusions 2093, and the plurality of columnar protrusions 2093 cooperate with the holes on the consumable box to install the chip rack 200 on the consumable box. In other embodiments, the connecting portion 209 can be other structures capable of installing the chip rack 200 on the consumable box, which is not limited here.

[0049] The above describes in detail the structure, features and effects of the utility model based on the embodiments shown in the drawings. The above is only a preferred embodiment of the utility model, but the utility model is not limited to the scope of implementation shown in the drawings. Any changes made in accordance with the concept of the utility model, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and the drawings, should be within the protection scope of the utility model.

Claims

1. A consumable chip, which can be mounted on a chip rack along a first direction, wherein the chip rack has a mounting groove, and is characterized in that: The consumable chip includes a chip substrate, which includes a first surface and a second surface arranged opposite to each other along a second direction, the second direction being arranged orthogonal to the first direction, chip contacts being arranged on the first surface, and chip components being arranged on the second surface, and along the first direction, the chip substrate has a first end and a second end, the first end of the chip substrate is provided with a mounting portion, the mounting portion is loosely fitted in the mounting groove, and the second end of the chip substrate is provided with a fixing portion, and the fixing portion is used to fix the consumable chip to the chip frame.

2. The consumable chip according to claim 1, characterized in that: In the second direction, the thickness of the mounting portion is smaller than the thickness of the chip substrate.

3. The consumable chip according to claim 1, characterized in that: The chip substrate includes a side surface, which extends along the first direction and is respectively connected to the first surface and the second surface. The mounting portion includes a first boss, which is protruding from the side surface. In the second direction, the thickness of the first boss is less than the thickness of the chip substrate.

4. The consumable chip according to claim 3, characterized in that: The first boss has a first mounting surface and a second mounting surface, wherein: In the second direction, the first mounting surface is flush with the second surface, and the second mounting surface is closer to the second surface than the first surface; or, In the second direction, the second mounting surface is flush with the first surface, and the first mounting surface is closer to the first surface than the second surface.

5. The consumable chip according to claim 3, characterized in that: The side surface includes a first side surface and a second side surface, wherein the first side surface and the second side surface are arranged on opposite sides of the chip substrate along a third direction, and the third direction is perpendicular to both the first direction and the second direction.

6. The consumable chip according to claim 3, characterized in that: In the first direction, the length of the first protrusion is smaller than the length of the chip substrate.

7. A chip rack for mounting the consumable chip according to any one of claims 1 to 6, characterized in that: The chip rack includes a accommodating cavity, which has a first opening formed on the surface of the chip rack, a first rib provided on the inner wall of the accommodating cavity, a second rib provided on the inner wall of the accommodating cavity at the first opening, and the mounting groove is formed between the first rib and the second rib.

8. The chip rack according to claim 7, characterized in that: The accommodating cavity is further formed with a second opening on the surface of the chip frame. When the mounting portion is loosely fitted in the mounting groove, the chip component is accommodated in the accommodating cavity through the second opening.

9. The chip rack according to claim 8, characterized in that: An installation notch is provided on the inner wall surface of the accommodating cavity opposite to the second opening, and the installation notch is used to determine whether the installation direction of the consumable chip is correct.

10. The chip rack according to claim 7, characterized in that: A fixing groove is provided at the edge of the first opening, and when the mounting portion is loosely fitted in the mounting groove, the fixing portion is clamped with the fixing groove.

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