PIN pin and IGBT module using same

Abstract

The utility model discloses a PIN pin and an IGBT module using the same, the PIN pin is arranged in an IGBT plastic body in an insert molding mode, the PIN pin is provided with a welding surface and a connecting terminal which are exposed out of the IGBT plastic body, one side or two sides perpendicular to the welding surface extend outwards to form a protruding structure, and the other side or two sides perpendicular to the welding surface extend outwards to form the connecting terminal. And the convex structure is embedded in the IGBT plastic body. According to the PIN pin provided by the utility model, the protruding structure is additionally arranged, so that the PIN pin and the IGBT plastic body are fixed up and down, the shaking phenomenon in the ultrasonic welding process is reduced, and the welding quality and the product reliability are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor power devices, and more specifically to a PIN plug and an IGBT module using the same. Background Art

[0002] In the IGBT module manufacturing process, the combination of the PIN pin and the plastic body is crucial to the quality and performance of the overall product. However, in traditional designs, after the insert molding is completed, there is a lack of effective adhesion between the PIN pin and the plastic body, which brings a series of challenges in the ultrasonic welding process.

[0003] Specifically, after the insert molding is completed, the PIN pin and the IGBT plastic body are connected as one. Subsequently, during the welding process, the IGBT circuit board lead needs to be connected to the welding surface of the PIN pin. However, due to the lack of adhesive support, the PIN pin shakes up and down on the welding surface, which leads to frequent welding defects. Summary of the invention

[0004] The utility model aims to solve one of the technical problems in the related art to a certain extent. To this end, the utility model proposes a PIN plug, which, by adding a protruding structure, allows the PIN plug and the IGBT plastic body to have an upper and lower fixing effect, thereby reducing the shaking phenomenon during ultrasonic welding and improving the welding quality and product reliability.

[0005] The utility model also provides an IGBT module with the PIN pin.

[0006] The technical solution adopted by the utility model is: to provide a PIN pin, which is arranged to be insert-molded in an IGBT plastic body, and the PIN pin has a welding surface and a connecting terminal exposed from the IGBT plastic body, and extends outward perpendicularly to one or both sides of the welding surface to form a protruding structure, and the protruding structure is buried in the IGBT plastic body.

[0007] After adopting the above structure, by adding the raised structure, the PIN pin and the IGBT plastic body have an upper and lower fixing effect, which reduces the shaking phenomenon during ultrasonic welding and improves the welding quality and product reliability. This technical solution helps to improve the overall quality and performance of the product.

[0008] According to an embodiment of the present invention, the protruding structure includes a wing-shaped structure; the wing-shaped structure is a flat and continuous plate-shaped structure.

[0009] According to an embodiment of the present invention, the protrusion structure includes a plurality of protrusions that are spaced apart and arranged in parallel; that is, the plurality of protrusions are flat and discontinuous comb-tooth-shaped structures.

[0010] According to one embodiment of the utility model, the vertical thickness of the welding surface is greater than the vertical thickness of the protruding structure; this helps to embed the PIN pin at the welding surface into the IGBT plastic body and form a horizontal bonding surface, which is used to limit the vertical movement of the PIN pin relative to the IGBT plastic body, that is, to limit the up and down shaking of the PIN pin on the welding surface.

[0011] According to an embodiment of the utility model, the PIN pin has a through hole, and the through hole is buried in the IGBT plastic body; that is, during the molding process of the IGBT plastic body, molten plastic is injected and fills the through hole, so that the PIN pin is more tightly connected to the IGBT plastic body.

[0012] An IGBT module comprises an IGBT plastic body and any one of the above-mentioned PIN pins.

[0013] According to an embodiment of the present invention, the IGBT module further includes a circuit board and a lead, and the lead is configured to connect the PIN pin and the circuit board.

[0014] According to an embodiment of the present invention, the lead wire is connected to the welding surface of the PIN pin by welding.

[0015] According to an embodiment of the present invention, the lead wire is connected to the welding surface of the PIN pin by ultrasonic welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A three-dimensional diagram of an IGBT module in an embodiment of the utility model;

[0018] Figure 2 This is a three-dimensional diagram of the IGBT module in the embodiment of the utility model after the circuit board is removed;

[0019] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0020] Figure 4 This is a top view of the IGBT module in the embodiment of the utility model after the circuit board is removed;

[0021] Figure 5 for Figure 4 A partial enlarged cross-sectional view of the AA line;

[0022] Figure 6 A three-dimensional diagram of a PIN pin in an embodiment of the utility model;

[0023] Figure 7 This is a schematic diagram of the structure of the PIN pin in the embodiment of the utility model;

[0024] Figure 8 It is a side view of the PIN pin in the embodiment of the utility model.

[0025] Description of the numbers in the figure:

[0026] 1. IGBT plastic body; 2. PIN pin; 3. Circuit board; 4. Lead wire;

[0027] 21. Welding surface; 22. Wing-shaped structure; 23. Through hole; 24. Connecting terminal. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention. Embodiment 1

[0029] like Figure 4-8 As shown, in this embodiment, a PIN pin 2 is disclosed, which is configured to be insert-molded in the IGBT plastic body 1. The PIN pin 2 has a welding surface 21 and a connecting terminal 24 exposed from the IGBT plastic body 1, and extends outward perpendicularly to one or both sides of the welding surface 21 to form a protruding structure, and the protruding structure is buried in the IGBT plastic body 1.

[0030] Furthermore, in this embodiment, the PIN pin 2 is roughly L-shaped, with the vertical direction being perpendicular to the direction of the welding surface 21. The PIN pin 2 has a vertical portion and a horizontal portion, with the side of the vertical portion close to the horizontal portion being the front-to-back direction, and the two sides of the horizontal portion being the left-to-right direction. The vertical length of the vertical portion is greater than the front-to-back length of the horizontal portion, and the lower portion of the horizontal portion is buried in the IGBT plastic body 1, and its upper surface is the welding surface 21 and is exposed to the IGBT plastic body 1. The left and right sides of the horizontal portion both extend outward to form a wing-shaped structure 22, and the vertical thickness of the special-shaped structure is less than the vertical thickness of the horizontal portion. The special-shaped structure is continuous in the front-to-back direction, and its lower edge is flush with the lower edge of the horizontal portion.

[0031] In some other embodiments, the raised structure includes a plurality of spaced-apart and parallel-arranged protrusions, and the plurality of protrusions are flat and discontinuous comb-tooth-like structures, that is, the protrusions are formed by extending outward from both sides of the horizontal part of the PIN pin 2, and are spaced-apart and parallel-arranged in the front-to-back direction, and the lengths of adjacent protrusions are equal or unequal, and the plurality of protrusions are combined to form a comb-tooth-like structure.

[0032] Specifically, combined Figure 6 As shown, the PIN pin 2 has a through hole 23, and the through hole 23 is buried in the IGBT plastic body 1; that is, during the molding process of the IGBT plastic body 1, the molten plastic is injected and fills the through hole 23, so that the PIN pin 2 and the IGBT plastic body 1 are more tightly connected.

[0033] In other embodiments, an IGBT module is disclosed, comprising an IGBT plastic body 1 and the PIN pin 2 described in this embodiment. The IGBT module further comprises a circuit board 3 and a lead 4, wherein the lead 4 is configured to connect the PIN pin 2 and the circuit board 3. The lead 4 is connected to the welding surface 21 of the PIN pin 2 by welding. Preferably, the lead 4 is connected to the welding surface 21 of the PIN pin 2 by ultrasonic welding.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A PIN plug, which is configured to be insert-molded in an IGBT plastic body, the PIN plug having a welding surface and a connection terminal exposed from the IGBT plastic body, characterized in that: One side or both sides perpendicular to the welding surface extend outward to form a protruding structure, and the protruding structure is buried in the IGBT plastic body.

2. A PIN according to claim 1, characterized in that: The raised structure includes a wing-shaped structure.

3. A PIN according to claim 1, characterized in that: The protrusion structure includes a plurality of protrusions which are spaced apart and arranged in parallel.

4. A PIN according to claim 1, characterized in that: The vertical thickness of the welding surface is greater than the vertical thickness of the protruding structure.

5. A PIN according to claim 1, characterized in that: The PIN pin has a through hole, and the through hole is buried in the IGBT plastic body.

6. An IGBT module, characterized in that: It comprises an IGBT plastic body and a PIN plug as described in any one of claims 1-5.

7. An IGBT module according to claim 6, characterized in that: It also includes a circuit board and a lead wire, wherein the lead wire is configured to connect the PIN pin and the circuit board.

8. An IGBT module according to claim 7, characterized in that: The lead wire is connected to the welding surface of the PIN pin by welding.

9. An IGBT module according to claim 8, characterized in that: The lead wire is connected to the welding surface of the PIN pin by ultrasonic welding.

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