Printed circuit board assembly

Abstract

The utility model provides a printed circuit board assembly, which belongs to the technical field of printed circuit boards and comprises a printed circuit board, a ventilation structure and a component which are sequentially overlapped. A through hole is formed in the printed circuit board; the component is provided with a pin, and the pin passes through the through hole; the ventilation structure is provided with an exhaust channel, the exhaust channel is communicated with the through hole, the exhaust channel penetrates through the peripheral surface of the ventilation structure in the radial direction, and the exhaust channel is used for exhausting gas generated when the pins and the printed circuit board are welded. According to the printed circuit board assembly provided by the utility model, the ventilation structure is provided with the exhaust channel, the exhaust channel is communicated with the through hole, and the exhaust channel penetrates through the peripheral surface of the ventilation structure, so that the exhaust channel is communicated with the outside, gas generated when the pins are welded with the printed circuit board is exhausted, and the pins have good air permeability when being welded; and insufficient tin climbing height during welding is avoided, so that good contact between the pins and the printed circuit board is ensured, and potential safety hazards are eliminated.

Description

Technical Field

[0001] The utility model belongs to the technical field of printed circuit boards, and more specifically, relates to a printed circuit board assembly. Background Art

[0002] Wave soldering is a soldering technology for electronic components. Some electronic components are mainly soldered on printed circuit boards using wave soldering. In the prior art, components are tightly attached to printed circuit boards, and the soldering parts of component pins and printed circuit boards are isolated from the outside world, resulting in insufficient soldering height during wave soldering, poor pin soldering, and pin burnout, and even the risk of printed circuit board fire, which poses a safety hazard. Utility Model Content

[0003] The utility model aims to provide a printed circuit board assembly, aiming to solve the technical problem of poor welding between the component pins and the welding parts of the printed circuit board existing in the prior art.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a printed circuit board assembly, including a printed circuit board, a ventilating structure and components which are stacked in sequence;

[0005] The printed circuit board is provided with a through hole;

[0006] The component has a pin, and the pin passes through the through hole;

[0007] The air permeable structure is provided with an exhaust channel, the exhaust channel is communicated with the through hole, and the exhaust channel radially penetrates the outer peripheral surface of the air permeable structure, and the exhaust channel is used to exhaust the gas generated when the pin is welded to the printed circuit board.

[0008] In a possible implementation, the air-permeable structure has a first surface and a second surface that are arranged opposite to each other, the first surface faces the printed circuit board, and the second surface faces the component; a support portion is provided on the first surface and / or the second surface;

[0009] The front portion of the printed circuit board abuts against the support portion on the first surface, so that the exhaust channel is formed between the front portion of the printed circuit board and the first surface; and / or

[0010] The end surface of the component abuts against the support portion, so that the exhaust channel is formed between the end surface of the component and the second surface.

[0011] In some embodiments, the support portion includes a plurality of support platforms that are spaced apart and distributed in a circular array.

[0012] In some embodiments, the support portion includes a plurality of support bars distributed at intervals.

[0013] In a possible implementation, the end surface of the component has an inwardly recessed cavity; the cavity is connected to the through hole;

[0014] The exhaust channel includes a plurality of air-permeable grooves distributed in a ring array, each of the air-permeable grooves is communicated with the concave cavity, and each of the air-permeable grooves radially penetrates the outer peripheral surface of the air-permeable structure.

[0015] In a possible implementation, the air-permeable structure is an insulating gasket, the insulating gasket is provided with a via hole corresponding to the axial direction of the through hole, and the pin also passes through the via hole.

[0016] In some embodiments, the outer peripheral shape of the insulating gasket is matched with the end face shape of the component.

[0017] In a possible implementation, the air-permeable structure is a conductive copper layer laid on the front side of the printed circuit board.

[0018] In some embodiments, the conductive copper layer includes a first base layer and a second base layer that are spaced apart from each other, and a space between the first base layer and the second base layer forms the exhaust channel.

[0019] In some embodiments, the conductive copper layer comprises:

[0020] A main substrate layer, laid on the front side of the printed circuit board;

[0021] A first cushioning layer, laid on the main base layer; and

[0022] A second cushioning layer is laid on the main base layer and is spaced apart from the second cushioning layer;

[0023] Wherein, the space between the second raising layer and the first raising layer forms the exhaust channel.

[0024] The beneficial effect of the printed circuit board assembly provided by the utility model is that: compared with the prior art, the printed circuit board assembly of the utility model is provided with an exhaust channel on the air-permeable structure, so that the exhaust channel is connected with the through hole, and the exhaust channel runs through the outer peripheral surface of the air-permeable structure, so that the exhaust channel is connected with the outside, thereby exhausting the gas generated when the pin is welded to the printed circuit board, so that the pin has good air permeability when welding, avoids insufficient tin climbing height during welding, and then ensures good contact between the pin and the printed circuit board, eliminating safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic cross-sectional view of a printed circuit board assembly provided in a first embodiment of the utility model;

[0027] Figure 2 A schematic cross-sectional view of a printed circuit board assembly provided in a second embodiment of the utility model;

[0028] Figure 3 A schematic cross-sectional view of a printed circuit board assembly provided in a third embodiment of the utility model;

[0029] Figure 4 A schematic diagram of the structure of an insulating gasket provided in the first embodiment of the utility model;

[0030] Figure 5 A schematic structural diagram of an insulating gasket provided in a second embodiment of the utility model;

[0031] Figure 6 A schematic structural diagram of an insulating gasket provided in a third embodiment of the utility model;

[0032] Figure 7 A schematic top view of the structure of a printed circuit board assembly provided in a fourth embodiment of the utility model (components are not shown in the figure);

[0033] Figure 8 A schematic diagram of the structure of the current-carrying copper layer provided in the first embodiment of the utility model;

[0034] Fig. 9 A schematic structural diagram of a current-carrying copper layer provided for the second embodiment of the utility model.

[0035] In the figure: 1, printed circuit board; 11, through hole; 2, breathable structure; 21, exhaust channel; 22, support part; 221, support platform; 222, support bar; 23, breathable groove; 24, insulating gasket; 241, via; 25, conductive copper layer; 251, first base layer; 252, second base layer; 253, main base layer; 254, first padding layer; 255, second padding layer; 3, components; 31, pins; 32, cavity. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0037] Please also read Figures 1 to 3 Now, the printed circuit board assembly provided by the utility model is described. The printed circuit board assembly comprises a printed circuit board 1, a breathable structure 2 and a component 3 which are stacked in sequence; the printed circuit board 1 is provided with a through hole 11; the component 3 has a pin 31, and the pin 31 passes through the through hole 11; the breathable structure 2 is provided with an exhaust channel 21, the exhaust channel 21 is connected with the through hole 11, and the exhaust channel 21 radially penetrates the outer peripheral surface of the breathable structure 2, and the exhaust channel 21 is used to exhaust the gas generated when the pin 31 is welded with the printed circuit board 1.

[0038] The component 3 is soldered to the printed circuit board 1. Specifically, the pin 31 of the component 3 passes through the through hole 11 of the printed circuit board 1 and is soldered to the printed circuit board 1 by wave soldering. The component 3 is a common electronic component in the prior art.

[0039] The breathable structure 2 can be an independent component. When installing the components 3, the breathable structure 2 is first placed at the position of the printed circuit board 1 where the components 3 are fixed, and then the components 3 are placed on the breathable structure 2, or the breathable structure 2 is first installed on the end surface of the components 3, and then the combination of the two is installed on the printed circuit board 1, and finally soldered. It should be noted that due to the development demand of miniaturization of printed circuit board components, if the breathable structure 2 is an independent component, its thickness must be much smaller than the thickness of the printed circuit board 1.

[0040] The air permeable structure 2 may also be a layer structure on the front side of the printed circuit board 1, and an exhaust channel 21 is formed between the air permeable structure 2 and the printed circuit board 1, or the air permeable structure 2 itself forms the exhaust channel 21. The components 3 are in contact with the air permeable structure 2, and the air permeable structure 2 can not only realize the functional requirements of the printed circuit board 1, but also support the components 3 and exhaust the gas generated during welding.

[0041] Compared with the prior art, the printed circuit board assembly provided by the utility model has an additional air permeable structure 2 between the printed circuit board 1 and the component 3, and an exhaust channel 21 is arranged on the air permeable structure 2. The exhaust channel 21 runs through the outer peripheral surface of the air permeable structure 2, so that the exhaust channel 21 is connected with the outside, and the exhaust channel 21 is also connected with the through hole 11. The gas generated when the pin 31 is welded to the printed circuit board 1 can be discharged through the exhaust channel 21, so that the pin 31 has good air permeability when welded, avoids insufficient tin climbing height during welding, and then ensures that the pin 31 is in good contact with the printed circuit board 1, and eliminates safety hazards.

[0042] In some embodiments, the above-mentioned breathable structure 2 can be used as follows Figure 1 , Figure 2 , Figure 4 and Figure 5 The structure shown, see Figure 1 , Figure 2 , Figure 4 and Figure 5 The air-permeable structure 2 has a first surface and a second surface that are arranged opposite to each other, the first surface faces the printed circuit board 1, and the second surface faces the component 3; a supporting portion 22 is provided on the first surface and / or the second surface.

[0043] The front portion of the printed circuit board 1 abuts against the support portion 22 on the first surface, so that an exhaust channel 21 is formed between the front portion of the printed circuit board 1 and the first surface; and / or, the end surface portion of the component 3 abuts against the support portion 22, so that an exhaust channel 21 is formed between the end surface of the component 3 and the second surface.

[0044] The support portion 22 serves to elevate the breathable structure 2 and the component 3. Since the support portion 22 abuts against the front portion of the printed circuit board 1 and / or the end face of the component 3, in one embodiment, there is a distance between the portion of the front face of the printed circuit board 1 that is not abutted and the first face, and in another embodiment, there is a distance between the portion of the end face of the component 3 that is not abutted and the second face. In the radial direction, the above two distances can form an exhaust channel 21.

[0045] The support portion 22 is used to elevate the breathable structure 2 and the components 3 to form the exhaust channel 21, which can simplify the structure of the breathable structure 2 and make the breathable structure 2 itself easier to manufacture. If the breathable structure 2 is an independent component, it is sufficient to add the support portion 22 to the breathable structure 2. If the breathable structure 2 is a layer structure on the front of the printed circuit board 1, it is sufficient to increase the thickness of a certain part of the layer structure. It should be noted that no matter which of the above structures is used, the support portion 22 supports the components 3 while also balancing the overall force of the components 3.

[0046] The support portion 22 may be disposed only on the first surface. For a specific embodiment, please refer to Figure 1 The support portion 22 is disposed on the first surface, the support portion 22 abuts against the front surface of the printed circuit board 1, and the end surface of the component 3 is completely in contact with the second surface.

[0047] The support portion 22 may be disposed only on the second surface. For another specific embodiment, please refer to Figure 2 The support portion 22 is disposed on the second surface, the support portion 22 abuts against the end surface of the component 3, and the front surface of the printed circuit board 1 is completely in contact with the first surface.

[0048] The support portion 22 can be arranged on the first surface or the second surface. Specifically, in the third embodiment, the support portion 22 on the first surface abuts against the front surface of the printed circuit board 1 , and the support portion 22 on the second surface abuts against the end surface of the component 3 .

[0049] It should be noted that, in order to simplify the specific structure of the breathable structure 2 , reduce the thickness, and increase the stability of the breathable structure 2 , preferably, the support portion 22 is only provided on the first surface, or only on the second surface.

[0050] In one embodiment, the support portion 22 may be formed as follows: Figure 4 The structure shown, see Figure 4 The support portion 22 includes a plurality of support platforms 221 that are spaced apart and distributed in a circular array.

[0051] Preferably, the support platforms 221 are close to the outer peripheral surface of the air-permeable structure 2 and are evenly spaced in the circumferential direction to ensure balanced forces when the support portion 22 abuts against the printed circuit board 1 and when the support portion 22 abuts against the component 3 .

[0052] In another embodiment, the support portion 22 may be formed as follows: Figure 5 The structure shown, see Figure 5 The support portion 22 includes a plurality of support bars 222 that are spaced apart from each other.

[0053] Preferably, the support strips 222 are long and corrugated. Both ends of each support strip 222 do not extend to the periphery of the air-permeable structure 2, that is, there is a gap between the ends of the support strips 222 and the periphery of the air-permeable structure 2 to increase the diffusion area of ​​the periphery of the exhaust channel 21.

[0054] In some embodiments, the above-mentioned air permeable structure 2 and the component 3 can be connected by 3 and Figure 6 The structure shown, see Figure 3 and Figure 6 The end face of the component 3 has an inwardly recessed cavity 32; the cavity 32 is connected to the through hole 11; the exhaust channel 21 includes a plurality of air-permeable grooves 23 distributed in a ring array, each of the air-permeable grooves 23 is respectively connected to the cavity 32, and each of the air-permeable grooves 23 radially penetrates the outer peripheral surface of the air-permeable structure 2.

[0055] Due to the functional requirements of some components 3, a cavity 32 is formed on the end face, but the cavity 32 does not penetrate the outer peripheral surface of the component 3. After the component 3 abuts against the printed circuit board 1, the cavity 32 forms a closed space, and the gas generated during welding will gather in the cavity 32 and cannot be discharged.

[0056] In order to adapt to the cavity 32 structure of the above-mentioned component 3, a plurality of ventilation grooves 23 are provided on the ventilation structure 2. Each ventilation groove 23 penetrates along the thickness direction of the ventilation structure 2, and one end of the ventilation groove 23 penetrates along the radial direction. Figure 6 shown.

[0057] Each vent groove 23 is connected to the concave cavity 32, and the concave cavity 32 is connected to the through hole 11, so that each vent groove 23 is evenly connected to the through hole 11. The gas during welding enters the concave cavity 32 through the through hole 11, and then is discharged to the outside through each vent groove 23, so as to ensure that the tin climbing height during wave soldering is sufficient.

[0058] Compared with the structure in which the support portion 22 is provided on the breathable structure 2 , a plurality of breathable grooves 23 are provided on the breathable structure 2 , so that the thickness of the breathable structure 2 can be reduced and the breathable structure 2 can be more suitable for the component 3 with the cavity 32 .

[0059] Whether the support portion 22 is provided on the ventilating structure 2 or the ventilating groove 23 is provided, the ventilating structure 2 is preferably an insulating gasket 24. The insulating gasket 24 is an independent component and does not need to be carried by the printed circuit board 1. Moreover, the insulating gasket 24 can use a gasket structure commonly used in the prior art. It only needs to stamp the support portion 22 or the ventilating groove 23 on the insulating gasket 24. The structure is simple and the cost is low.

[0060] Specifically, the insulating gasket 24 is provided with a through hole 241 corresponding to the axial direction of the through hole 11, and the pin 31 also passes through the through hole 241. The outer peripheral shape of the insulating gasket 24 is also adapted to the end face shape of the component 3, and the insulating gasket 24 does not protrude from the component 3 in the radial direction, and the insulating gasket 24 does not occupy additional space.

[0061] In addition to being an insulating gasket 24, in another embodiment, the air permeable structure 2 can also be a conductive copper layer 25 laid on the front side of the printed circuit board 1, and the conductive copper layer 25 itself forms an exhaust channel 21, such as Figure 7 shown.

[0062] The current-carrying copper layer 25 is a part of the printed circuit board 1 and plays a conductive role. Generally, the current-carrying copper layer 25 is laid at the part of the printed circuit board 1 where the current needs to be carried. In this embodiment, the components 3 are placed on the current-carrying copper layer 25. Since the current-carrying copper layer 25 is the original structure of the printed circuit board 1, the current-carrying copper layer 25 is used to elevate the components 3 to avoid direct contact between the components 3 and the printed circuit board 1. No additional components are required, which can reduce the overall thickness of the printed circuit board assembly and reduce costs.

[0063] In one embodiment, the above-mentioned copper layer 25 can be made of Figure 8 The structure shown, see Figure 8 The conductive copper layer 25 includes a first base layer 251 and a second base layer 252 which are spaced apart from each other, and a space between the first base layer 251 and the second base layer 252 forms an exhaust channel 21. The exhaust channel 21 has a portion corresponding to the axial direction of the through hole 11.

[0064] It should be noted that the front side of the printed circuit board 1 does not need to be paved with the electric copper layer 25 on the entire surface, and the electric copper layer 25 only needs to be paved at the position of the overcurrent. If the periphery corresponding to the through hole 11 does not need overcurrent, the electric copper layer 25 is not paved at the periphery of the through hole 11, and the first base layer 251 and the second base layer 252 are paved at the location where the components 3 are installed, and the first base layer 251 and the second base layer 252 are spaced apart to form an exhaust channel 21 connected to the through hole 11.

[0065] In another embodiment, the above-mentioned copper layer 25 can also be made of Fig. 9 The structure shown, see Fig. 9 The conductive copper layer 25 includes a main base layer 253, a first padding layer 254 and a second padding layer 255. The main base layer 253 is laid on the front of the printed circuit board 1; the first padding layer 254 is laid on the main base layer 253; the second padding layer 255 is laid on the main base layer 253 and is spaced apart from the second padding layer 255; wherein the space between the second padding layer 255 and the first padding layer 254 forms an exhaust channel 21.

[0066] If overcurrent is required at the periphery of the printed circuit board 1 corresponding to the through hole 11, a main base layer 253 is laid at the periphery of the through hole 11, and the overcurrent is achieved by using the main base layer 253. In addition, a first cushioning layer 254 and a second cushioning layer 255 are laid on the basis of the main base layer 253 corresponding to the location where the components 3 are installed. The first cushioning layer 254 and the second cushioning layer 255 are spaced apart from each other to form an exhaust channel 21 connected to the through hole 11.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A printed circuit board assembly, characterized in that: It comprises a printed circuit board (1), a ventilating structure (2) and components (3) which are stacked in sequence; The printed circuit board (1) is provided with a through hole (11); The component (3) has a pin (31), and the pin (31) passes through the through hole (11); The air permeable structure (2) is provided with an exhaust channel (21), the exhaust channel (21) is in communication with the through hole (11), and the exhaust channel (21) radially penetrates the outer peripheral surface of the air permeable structure (2), and the exhaust channel (21) is used to exhaust gas generated when the pin (31) and the printed circuit board (1) are welded.

2. The printed circuit board assembly according to claim 1, wherein: The air-permeable structure (2) has a first surface and a second surface arranged opposite to each other, the first surface faces the printed circuit board (1), and the second surface faces the component (3); a support portion (22) is provided on the first surface and / or the second surface; The front portion of the printed circuit board (1) abuts against the support portion (22) on the first surface, so that the exhaust channel (21) is formed between the front portion of the printed circuit board (1) and the first surface; and / or The end surface portion of the component (3) abuts against the support portion (22), so that the exhaust channel (21) is formed between the end surface of the component (3) and the second surface.

3. The printed circuit board assembly according to claim 2, characterized in that The support portion (22) comprises a plurality of support platforms (221) that are spaced apart and distributed in a circular array.

4. The printed circuit board assembly according to claim 2, characterized in that: The support portion (22) comprises a plurality of support bars (222) distributed at intervals.

5. The printed circuit board assembly according to claim 1, wherein: The end surface of the component (3) has an inwardly recessed cavity (32); the cavity (32) is connected to the through hole (11); The exhaust channel (21) comprises a plurality of air permeable grooves (23) distributed in a ring array, each of the air permeable grooves (23) is respectively connected to the concave cavity (32), and each of the air permeable grooves (23) radially penetrates the outer peripheral surface of the air permeable structure (2).

6. The printed circuit board assembly according to any one of claims 2 to 5, characterized in that: The air-permeable structure (2) is an insulating gasket (24), and a through hole (241) corresponding to the axial direction of the through hole (11) is provided on the insulating gasket (24), and the pin (31) also passes through the through hole (241).

7. The printed circuit board assembly according to claim 6, characterized in that: The outer peripheral shape of the insulating gasket (24) is matched to the end face shape of the component (3).

8. The printed circuit board assembly according to claim 1, wherein: The air-permeable structure (2) is a conductive copper layer (25) laid on the front side of the printed circuit board (1).

9. The printed circuit board assembly according to claim 8, characterized in that The conductive copper layer (25) comprises a first base layer (251) and a second base layer (252) which are arranged at intervals, and the space between the first base layer (251) and the second base layer (252) forms the exhaust channel (21).

10. The printed circuit board assembly according to claim 8, wherein: The conductive copper layer (25) comprises: A main substrate layer (253) is laid on the front side of the printed circuit board (1); A first cushioning layer (254) is laid on the main base layer (253); and A second cushioning layer (255) is laid on the main base layer (253) and is spaced apart from the second cushioning layer (255); The space between the second raising layer (255) and the first raising layer (254) forms the exhaust channel (21).

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