Electroplating and cleaning integrated equipment for manufacturing circuit board

Abstract

The utility model discloses electroplating and cleaning integrated equipment for manufacturing a circuit board, and relates to the technical field of circuit board production. A movable assembly, the movable assembly comprises fixed shafts connected to the two ends of the inner side of the supporting plate, torsional springs connected to the outer surfaces of the fixed shafts, clamping plates connected to the outer surfaces of the torsional springs, a fixed plate connected to the lower portion of the supporting frame, an electric telescopic rod connected to the inner portion of the center of the fixed plate, and a suction cup connected to the top end of the electric telescopic rod. The driving motor is connected to one side of the upper end of the fixing plate; according to the utility model, the movable assembly is utilized, so that the problems that the production efficiency of the circuit board is influenced during production, the labor cost and the space cost are caused and the production efficiency is influenced because the electroplated circuit board generally needs to be manually collected and transferred to the position of a cleaning machine after the existing circuit board is electroplated and the electroplating and the cleaning cannot be simultaneously carried out are solved. And the use is inconvenient.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to electroplating and cleaning integrated equipment used for circuit board production. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. When circuit boards are produced, their outer surfaces need to be electroplated to ensure the conductivity of the circuit boards, and they need to be cleaned after the electroplating is completed.

[0003] After electroplating, existing circuit boards usually need to be manually collected and transferred to a cleaning machine. Since electroplating and cleaning cannot be performed at the same time, the production efficiency of the circuit boards will be affected during production, and labor and space costs will be incurred, making it inconvenient to use. Utility Model Content

[0004] The purpose of the utility model is to provide an integrated electroplating and cleaning device for circuit board production, so as to solve the problem proposed in the above background technology that after electroplating, the existing circuit boards usually need to be manually collected and transferred to a cleaning machine. Since electroplating and cleaning cannot be carried out at the same time, the production efficiency of the circuit boards will be affected during production, and labor costs and space costs will be caused, which is inconvenient to use.

[0005] In order to solve the above technical problems, the utility model provides an integrated electroplating and cleaning device for circuit board production, comprising:

[0006] An electroplating assembly, the electroplating assembly comprising a support frame and a support plate;

[0007] A movable component, the movable component includes a fixed shaft connected to the two ends of the inner side of the support plate, a torsion spring connected to the outer surface of the fixed shaft, a clamping plate connected to the outer surface of the torsion spring, a fixed plate connected to the lower position of the support frame, an electric telescopic rod connected to the central inner position of the fixed plate, a suction cup connected to the top position of the electric telescopic rod, a driving motor connected to one side of the upper end of the fixed plate and a transmission belt placed on the inner side of the lower end of the support frame.

[0008] Furthermore, the electroplating assembly also includes a top plate connected to the top end of the support frame and an electroplating nozzle connected to the bottom end of the top plate, and the support plate is connected to the upper end of the support frame.

[0009] Furthermore, the suction cup is located at the lower center of the conveyor belt, and the conveyor belt driving shaft is connected to the output shaft of the driving motor.

[0010] Furthermore, the conveyor belt is located below the clamping plate, and the clamping plate is an L-shaped structure.

[0011] Furthermore, it also includes a cleaning component, which includes a cleaning box placed at an external position on one side of the conveyor belt, a rotating shaft connected to the upper end position inside the cleaning box, a brush connected to the outer surface position of the rotating shaft, a cleaning liquid tank connected to the upper end position of the cleaning box, a cleaning nozzle connected to the upper end position of the cleaning box, a water pump connected to the upper end position of the cleaning liquid tank, and a water pipe connected to the outer end position of the water pump.

[0012] Furthermore, the brush is located above the conveyor belt, the cleaning nozzle is connected to the bottom end of the cleaning liquid tank, and the other end of the water pipe is connected to one side of the bottom end of the cleaning tank.

[0013] Compared with the prior art, the utility model has the following beneficial effects: by setting a movable component, the circuit board is placed at the upper end of the clamping plate, and after the circuit board is electroplated by the electroplating nozzle, the electric telescopic rod is controlled to drive the suction cup to move upward, and the suction cup adsorbs the bottom end of the circuit board, and then the electric telescopic rod is controlled to move downward, and the electric telescopic rod drives the suction cup and the circuit board to move downward, and the circuit board drives the clamping plate to rotate and move up and down from the clamping plate, and when the bottom end of the circuit board contacts the side of the conveyor belt, the suction cup releases the circuit board, so that the electroplated circuit board is transported and transferred through the conveyor belt, and no manual transportation is required;

[0014] At the same time, by setting up a cleaning component, when the circuit board moves to the inside of the cleaning box driven by the conveyor belt, the brush brushes the upper end of the circuit board driven by the rotating shaft, and the cleaning liquid tank sprays the cleaning liquid from the cleaning nozzle to the upper end of the circuit board, thereby achieving a better cleaning effect for the circuit board. At the same time, the water pump generates suction on the water pipe, and the cleaning liquid at the bottom of the cleaning box is recovered into the cleaning liquid tank, so that the cleaning liquid will not be wasted. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the front view of the utility model;

[0016] Figure 2 This is a structural diagram of the electroplating assembly of the utility model;

[0017] Figure 3 This is a structural diagram of the active components of the utility model;

[0018] Figure 4 This is a structural diagram of the cleaning component of the utility model.

[0019] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0020] 11. Support frame; 12. Top plate; 13. Electroplating nozzle; 14. Support plate; 21. Fixed shaft; 22. Torsion spring; 23. Clamping plate; 24. Fixed plate; 25. Electric telescopic rod; 26. Suction cup; 27. Drive motor; 28. Conveyor belt; 31. Cleaning box; 32. Rotating shaft; 33. Brush; 34. Cleaning liquid tank; 35. Cleaning nozzle; 36. Water pump; 37. Water pipe. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-3 As shown, this embodiment is an integrated electroplating and cleaning device for circuit board production, comprising:

[0023] The electroplating assembly includes a support frame 11 and a support plate 14;

[0024] The movable assembly includes a fixed shaft 21 connected to both ends of the inner side of the support plate 14, a torsion spring 22 connected to the outer surface of the fixed shaft 21, a clamping plate 23 connected to the outer surface of the torsion spring 22, a fixed plate 24 connected to the lower part of the support frame 11, an electric telescopic rod 25 connected to the central inner part of the fixed plate 24, a suction cup 26 connected to the top of the electric telescopic rod 25, a driving motor 27 connected to one side of the upper end of the fixed plate 24, and a conveyor belt 28 placed on the inner side of the lower end of the support frame 11;

[0025] The fixed shaft 21 is used to support the torsion spring 22, the torsion spring 22 is used to support the clamping plate 23, the clamping plate 23 is used to clamp the circuit board, the fixed plate 24 is used to support the electric telescopic rod 25, the electric telescopic rod 25 is used to drive the suction cup 26 to move, the suction cup 26 is used to adsorb the bottom end of the circuit board, the driving motor 27 is used to drive the conveyor belt 28 to rotate, and the conveyor belt 28 is used to transport the circuit board;

[0026] The electroplating assembly also includes a top plate 12 connected to the top end of the support frame 11 and an electroplating nozzle 13 connected to the bottom end of the top plate 12, and a support plate 14 is connected to the upper end of the support frame 11;

[0027] The support frame 11 is used to support the top plate 12, the support plate 14 and the fixed plate 24. The top plate 12 is used to support the electroplating nozzle 13, and the support plate 14 is used to support the fixed shaft 21.

[0028] The suction cup 26 is located at the central lower end of the conveyor belt 28, and the driving shaft of the conveyor belt 28 is connected to the output shaft of the driving motor 27;

[0029] The suction cup 26 can move up and down driven by the electric telescopic rod 25, and the suction cup 26 can drive the circuit board to move;

[0030] The conveyor belt 28 is located below the clamping plate 23, and the clamping plate 23 is an L-shaped structure;

[0031] The clamping plate 23 can rotate along the direction of the fixed axis 21, and when the clamping plate 23 rotates, the torsion spring 22 will be deformed;

[0032] Working principle: Place the circuit board on the inner side of the upper end of the clamping plate 23. When the electroplating nozzle 13 completes the electroplating of the upper end of the circuit board, the electric telescopic rod 25 is controlled to extend upward. The electric telescopic rod 25 extends upward to drive the suction cup 26 to move upward. When the suction cup 26 adsorbs the bottom end of the circuit board, the electric telescopic rod 25 is controlled to shorten downward. The electric telescopic rod 25 shortens downward to drive the suction cup 26 to move downward and drive the circuit board to move downward. The downward movement of the circuit board drives the clamping plate 23 to flip downward without blocking the circuit board. The flipping of the clamping plate 23 causes the torsion spring 22 to release. The deformation generates elastic force. When the clamping plate 23 is separated from the circuit board, the clamping plate 23 is reset under the drive of the torsion spring 22. At this time, the next electroplating board can be placed, and the previous circuit board is driven by the suction cup 26 to move downward to the positions on both sides of the conveyor belt 28. The suction cup 26 is controlled not to adsorb the bottom end of the circuit board, and the electric telescopic rod 25 is controlled to continue to move downward and drive the suction cup 26 to move downward, so that the suction cup 26 and the circuit board are separated, and then the drive motor 27 is started. The drive motor 27 drives the conveyor belt 28 to rotate, so that the conveyor belt 28 transfers the circuit board.

[0033] See also Figure 4 As shown, this embodiment is based on the above embodiment and also includes:

[0034] A cleaning assembly, the cleaning assembly includes a cleaning box 31 placed at an outer position on one side of the conveyor belt 28, a rotating shaft 32 connected to the upper end of the cleaning box 31, a brush 33 connected to the outer surface of the rotating shaft 32, a cleaning liquid tank 34 connected to the upper end of the cleaning box 31, a cleaning nozzle 35 connected to the upper end of the cleaning box 31, a water pump 36 connected to the upper end of the cleaning liquid tank 34, and a water pipe 37 connected to the outer end of the water pump 36;

[0035] The cleaning box 31 is used to support the rotating shaft 32 and the cleaning liquid tank 34. The rotating shaft 32 is used to drive the brush 33 to rotate. The brush 33 is used to brush the upper end of the circuit board. The cleaning liquid tank 34 is used to place the circuit board cleaning liquid. The cleaning nozzle 35 is used to spray the cleaning liquid downward. The water pump 36 is used to generate suction. The water pipe 37 is used to guide the water.

[0036] The brush 33 is located above the conveyor belt 28, the cleaning nozzle 35 is connected to the bottom of the cleaning liquid tank 34, and the other end of the water pipe 37 is connected to one side of the bottom of the cleaning tank 31;

[0037] When the brush 33 brushes the upper end of the circuit board, the cleaning nozzle 35 sprays the cleaning liquid downward to the upper end of the circuit board;

[0038] Working principle: When the conveyor belt 28 transfers the circuit board to the inside of the cleaning box 31, the rotating shaft 32 rotates, driving the brush 33 to rotate. The brush 33 rotates to brush the upper end of the circuit board, and the cleaning nozzle 35 sprays the cleaning liquid in the cleaning liquid tank 34 downward to the upper end of the circuit board, so that the circuit board can be cleaned more thoroughly. At the same time, the water pump 36 is started. The water pump 36 generates suction to the cleaning liquid at the lower end of the cleaning box 31 through the water pipe 37 and sucks it into the cleaning liquid tank 34 to recover the cleaning liquid and avoid waste of the cleaning liquid.

[0039] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An integrated electroplating and cleaning device for circuit board production, characterized in that: include: An electroplating assembly, the electroplating assembly comprising a support frame (11) and a support plate (14); A movable assembly, the movable assembly comprising a fixed shaft (21) connected to both ends of the inner side of a support plate (14), a torsion spring (22) connected to the outer surface of the fixed shaft (21), a clamping plate (23) connected to the outer surface of the torsion spring (22), a fixed plate (24) connected to the lower part of the support frame (11), an electric telescopic rod (25) connected to the central inner part of the fixed plate (24), a suction cup (26) connected to the top end of the electric telescopic rod (25), a driving motor (27) connected to one side of the upper end of the fixed plate (24), and a conveyor belt (28) placed on the inner side of the lower end of the support frame (11).

2. The electroplating and cleaning integrated equipment for circuit board production according to claim 1, characterized in that: The electroplating assembly further comprises a top plate (12) connected to the top end of the support frame (11) and an electroplating nozzle (13) connected to the bottom end of the top plate (12), and the support plate (14) is connected to the upper end of the support frame (11).

3. The electroplating and cleaning integrated equipment for circuit board production according to claim 1, characterized in that: The suction cup (26) is located at the central lower end of the conveyor belt (28), and the driving shaft of the conveyor belt (28) is connected to the output shaft of the driving motor (27).

4. The electroplating and cleaning integrated equipment for circuit board production according to claim 1, characterized in that: The conveyor belt (28) is located below the clamping plate (23), and the clamping plate (23) is an L-shaped structure.

5. The electroplating and cleaning integrated equipment for circuit board production according to claim 1, characterized in that: The cleaning device also includes a cleaning assembly, which includes a cleaning box (31) placed at an external position on one side of the conveyor belt (28), a rotating shaft (32) connected to the upper end position inside the cleaning box (31), a brush (33) connected to the outer surface position of the rotating shaft (32), a cleaning liquid tank (34) connected to the upper end position of the cleaning box (31), a cleaning nozzle (35) connected to the upper end position of the cleaning box (31), a water pump (36) connected to the upper end position of the cleaning liquid tank (34), and a water pipe (37) connected to the outer end position of the water pump (36).

6. The electroplating and cleaning integrated equipment for circuit board production according to claim 5, characterized in that: The brush (33) is located above the conveyor belt (28), the cleaning nozzle (35) is connected to the bottom end of the cleaning liquid tank (34), and the other end of the water pipe (37) is connected to a side position of the bottom end of the cleaning tank (31).

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