Heat dissipation assembly and energy storage power supply equipment

Abstract

The embodiment of the utility model provides a heat dissipation assembly and energy storage power supply equipment. The heat dissipation assembly comprises: a heat sink; the radiator comprises a radiating substrate and radiating fins; the heat dissipation fins are arranged on one surface of the heat dissipation substrate at intervals; an accommodating groove is formed in the other surface of the heat dissipation substrate; a heat pipe; the heat pipe is accommodated in the accommodating groove; a heat conducting member; the heat conduction part is arranged on the inner surface of the accommodating groove so as to fill a gap between the heat pipe and the inner surface of the accommodating groove; the heat conduction part can also be used for filling the segment difference formed between the heat pipe and the surface, away from the heat dissipation fins, of the heat dissipation substrate. Through the design of adding the heat pipe, the heat dissipation assembly has better heat dissipation efficiency, has the advantage of simple structure, is easy to manufacture and install, and can effectively reduce the cost. The heat conduction part is arranged in the containing groove of the radiator, the segment difference and the gap between the heat pipe and the radiator can be effectively filled, and therefore the heat pipe and the radiator are in tight contact.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply equipment, in particular to a heat dissipation component and energy storage power supply equipment. Background Art

[0002] With the continuous development of power electronics technology, energy storage power supplies are increasingly used in power systems. As the core component of energy storage power supplies, the working performance of IGBT modules (Insulated Gate Bipolar Transistor modules) directly affects the performance of the entire energy storage power supply. Since IGBT modules generate a lot of heat during operation, heat dissipation components are required to dissipate the heat of the IGBT modules to ensure that the IGBT modules can work normally.

[0003] Traditional heat dissipation components mostly use aluminum profile heat sinks, so traditional heat dissipation components have the defects of low heat dissipation efficiency, large space occupation and high cost. Utility Model Content

[0004] The heat dissipation component and energy storage power supply device provided by the utility model are intended to solve at least one defect of the heat dissipation component for dissipating heat for the IGBT module in the existing energy storage power supply device.

[0005] In a first aspect, the utility model provides a heat dissipation component. The heat dissipation component comprises:

[0006] Radiator; the radiator comprises: a heat dissipation substrate and a plurality of heat dissipation fins;

[0007] A plurality of the heat dissipation fins are arranged at intervals on one surface of the heat dissipation substrate; a plurality of accommodating grooves are provided on the other surface of the heat dissipation substrate;

[0008] A plurality of heat pipes; the heat pipes are accommodated in the containing tank;

[0009] A heat-conducting component; the heat-conducting component is arranged on the inner surface of the containing groove to fill the gap between the heat pipe and the inner surface of the containing groove;

[0010] The heat conducting component may also be used to fill the step formed between the heat pipe and the surface of the heat dissipation substrate away from the heat dissipation fins.

[0011] In some embodiments, the heat dissipation fins are provided with wave patterns to increase the heat dissipation area of ​​the heat sink;

[0012] Wherein, the heat-conducting component is thermally conductive silicone grease.

[0013] In some embodiments, the heat pipe extends along a first direction; both ends of the heat pipe that are away from each other in the first direction are closed ends, so that a closed accommodation cavity is formed inside the heat pipe;

[0014] Wherein, the accommodating cavity is filled with cooling liquid to increase the heat conduction area of ​​the heat pipe.

[0015] In some embodiments, the heat dissipation assembly further includes: a plurality of support components;

[0016] A plurality of first mounting holes are formed on the surface of the heat dissipation substrate away from the heat dissipation fins;

[0017] Wherein, the supporting component is connected to the heat dissipation substrate through the first mounting hole.

[0018] In a second aspect, the utility model provides an energy storage power supply device. The energy storage power supply device comprises:

[0019] A device body and an IGBT module; the IGBT module is arranged on the device body;

[0020] The IGBT module comprises: an IGBT component and the above-mentioned heat dissipation component; the IGBT component is arranged on the heat dissipation component.

[0021] In some embodiments, the IGBT component comprises:

[0022] PCB board; the PCB board (Printed Circuit Board) is assembled to the supporting component of the heat dissipation component through a plurality of first fastening components;

[0023] IGBT transistor module; the IGBT transistor module is assembled to the heat sink of the heat dissipation assembly through a plurality of second fastening components;

[0024] Wherein, at least a portion of the IGBT transistor module forms a communication connection with the PCB board.

[0025] In some embodiments, the IGBT transistor module comprises:

[0026] IGBT transistor; the IGBT transistor comprises: a transistor body and a plurality of connecting pins arranged on the transistor body;

[0027] Wherein, the IGBT transistor can form a communication connection with the PCB board through the connecting pin;

[0028] The pressing block is in contact with the transistor body so that the IGBT transistor is fixed on the heat dissipation substrate of the heat sink.

[0029] In some embodiments, the compact comprises:

[0030] A base and a convex rib; the base is provided with a snap-fitting groove, and a positioning column is arranged in the snap-fitting groove; the convex rib is arranged on the surface of the base and the snap-fitting groove which are away from each other;

[0031] Wherein, a positioning hole is provided on the transistor body; the positioning column is inserted into the positioning hole to guide the pressing block to abut against the transistor body in a preset situation to limit the mutual movement between the pressing block and the transistor body.

[0032] In some embodiments, the ribs include:

[0033] A mounting portion and an anti-foolproof portion; the anti-foolproof portion protrudes from the outer side surface of the mounting portion;

[0034] Wherein, the PCB board is provided with a through hole matching the shape of the convex rib; the through hole is provided with an anti-fool groove matching the anti-fool part;

[0035] When the convex rib passes through the through hole, the fool-proofing portion cooperates with the fool-proofing groove to connect the PCB board to the supporting component in a preset state and to limit the mutual rotation between the pressing block and the PCB board.

[0036] In some embodiments, a second mounting hole penetrating the base is provided on the mounting portion of the convex rib; the second fastening member passes through the second mounting hole so that the pressing block is fixed on the heat dissipation substrate;

[0037] The surface of the transistor body is in contact with the heat dissipation substrate and the heat pipe respectively.

[0038] In some embodiments, the pressing block is made of insulating material; and a metal piece is embedded inside the base.

[0039] At least one beneficial effect of the heat dissipation assembly and energy storage power supply device provided by the embodiment of the utility model is: a new type of heat dissipation assembly is proposed, and by adding a heat pipe design, the heat dissipation assembly provided by the present application has better heat dissipation efficiency than the traditional heat dissipation assembly, and has the advantages of simple structure, easy to manufacture and install, and can effectively reduce costs. By arranging a heat-conducting component in the accommodating groove of the radiator, the step difference and gap between the heat pipe and the radiator can be effectively filled, so that the heat pipe and the radiator are in close contact to achieve heat exchange. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent the same elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0041] Figure 1 A schematic diagram of the structure of an IGBT module provided by an embodiment of the utility model;

[0042] Figure 2 An exploded schematic diagram of an IGBT module provided by an embodiment of the utility model;

[0043] Figure 3 A schematic diagram of the structure of a radiator provided in an embodiment of the utility model;

[0044] Figure 4 The embodiment of the utility model provides Figure 3 A local enlarged view at point A;

[0045] Figure 5 A schematic cross-sectional view of a heat pipe provided in an embodiment of the utility model;

[0046] Figure 6 A schematic cross-sectional view of a pressing block provided in an embodiment of the utility model;

[0047] Figure 7 An exploded schematic diagram of an IGBT transistor module provided by an embodiment of the utility model;

[0048] Figure 8 A schematic diagram of a pressing block provided in an embodiment of the utility model pressing an IGBT transistor onto a heat sink substrate.

[0049] Reference numerals:

[0050] 100, heat dissipation assembly; 1, radiator; 11, heat dissipation substrate; 12, heat dissipation fins; 101, receiving groove; 111, first mounting hole; 121, wave pattern; 2, heat pipe; 201, first direction; 202, receiving cavity; 203, closed end; 3, supporting component;

[0051] 200, IGBT module; 2001, IGBT assembly; 4, PCB board; 401, through hole; 4011, foolproof groove; 5, first fastening component; 6, IGBT transistor module; 61, IGBT transistor; 62, pressing block; 611, transistor body; 612, connecting pin; 621, substrate; 622, convex rib; 6111, positioning hole; 6201, metal part; 6211, snap-fit ​​groove; 6212, positioning column; 6220, second mounting hole; 6221, mounting portion; 6222, foolproof portion; 7, second fastening component. DETAILED DESCRIPTION

[0052] The present invention is described in detail below in conjunction with specific embodiments. It should be emphasized that the following description is merely illustrative and is not intended to limit the scope and application of the present invention.

[0053] It should be noted that, unless otherwise clearly specified and limited, the terms "first direction", "guide", "insert", "depart from each other", "outside", "inside", etc. used in this specification to indicate the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. The terms such as "installation", "fitting", "connection" and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; "fixation" can be bolt fixation, snap fixation or glue fixation; the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, the features specified as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" or "several" means two or more; in addition, "and / or" includes any and all combinations of one or more related listed items; for ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances.

[0054] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0055] In this embodiment, the specific shape, structure and size of the "heat dissipation component and energy storage power supply device" are not limited, and those skilled in the art can selectively use a suitable heat dissipation component according to actual needs.

[0056] Figure 1 This is a schematic diagram of the structure of an IGBT module provided in an embodiment of the utility model. Figure 2 This is a schematic diagram of an exploded view of an IGBT module provided in an embodiment of the utility model.

[0057] See also Figure 1-Figure 2 The heat dissipation assembly 100 includes: a heat sink 1, a plurality of heat pipes 2 and a heat conducting component.

[0058] The heat sink 1 includes a heat sink substrate 11 and a plurality of heat sink fins 12 . The heat sink fins 12 are arranged at intervals on one surface of the heat sink substrate 11 . A plurality of receiving grooves 101 are provided on the other surface of the heat sink substrate 11 .

[0059] In addition, the heat pipe 2 is accommodated in the receiving groove 101 ; and a heat conducting component is disposed on the inner surface of the receiving groove 101 to fill the gap between the heat pipe 2 and the inner surface of the receiving groove 101 .

[0060] It should be noted that the heat-conducting component can also be used to fill the step formed between the heat pipe 2 and the surface of the heat dissipation substrate 11 away from the heat dissipation fins 12 .

[0061] Specifically, the IGBT component 2001 in the energy storage power supply device (not shown in the figure) is in contact with the heat dissipation component 100, which can discharge the heat generated by the IGBT component 2001 to ensure the normal operation of the IGBT module 200 and the energy storage power supply device.

[0062] It is understandable that the heat sink 1 is in close contact with three surfaces of the heat pipe 2 through the thermal conductive silicone grease coated on the inner surface of the receiving groove 101, thereby effectively expanding the heat conduction area of ​​the heat pipe 2.

[0063] Figure 3 A schematic structural diagram of a radiator provided in an embodiment of the utility model. Figure 4 The embodiment of the utility model provides Figure 3 A partial enlarged view at point A.

[0064] In some embodiments, Figure 3-Figure 4 As shown, the heat dissipation fins 12 are provided with wave patterns 121 to increase the heat dissipation area of ​​the heat sink 1; and the heat-conducting component is thermally conductive silicone grease.

[0065] Specifically, the wavy patterns 121 provided on the heat dissipation fins 12 can further expand the heat dissipation area, thereby increasing the heat exchange efficiency of the radiator 1 .

[0066] Figure 5 A schematic cross-sectional view of a heat pipe provided in an embodiment of the utility model.

[0067] In some embodiments, Figure 2 and Figure 5 It can be seen that the heat pipe 2 extends along the first direction 201; the two ends of the heat pipe 2 that are opposite to each other in the first direction 201 are both closed ends 203, so that a closed accommodating cavity 202 is formed inside the heat pipe 2; the accommodating cavity 202 is filled with coolant (or a mixture of coolant and air), which further increases the heat conduction area of ​​the heat pipe 2.

[0068] Specifically, the cross-sectional shape of the accommodating cavity 202 and the accommodating groove 101 may be a rectangle or other shapes.

[0069] It should be noted that the heat pipe 2, as a heat transfer device with a relatively high thermal conductivity, has the following advantages: excellent heat transfer performance. The heat pipe 2 can achieve rapid heat transfer and has high thermal conductivity, and can achieve high heat transfer rate under a small temperature difference; excellent isothermal property. The evaporation and condensation process of the heat pipe 2 can maintain a relatively constant temperature, so that the temperature difference between each part is very small; good airtightness. The interior of the heat pipe 2 is a closed accommodating cavity 202, so there will be no leakage and other problems; low cost. With the continuous maturity of production technology and large-scale production and application, the price of the heat pipe 2 is getting cheaper and cheaper.

[0070] In summary, the heat pipe 2 has the advantages of high thermal conductivity, flexible heat transfer area, stable heat transfer effect, excellent isothermal property, good airtightness and low cost.

[0071] In some embodiments, see Figure 1-Figure 4 The heat dissipation assembly 100 also includes: a plurality of supporting components 3.

[0072] In the embodiment of the present application, a plurality of first mounting holes 111 are formed on the surface of the heat dissipation substrate 11 away from the heat dissipation fins 12 ; the support component 3 is connected to the heat dissipation substrate 11 through the first mounting holes 111 .

[0073] Please continue reading Figure 1-Figure 2 The energy storage power supply device includes: a device body (not shown in the figure) and an IGBT module 200.

[0074] The IGBT module 200 is arranged on the device body.

[0075] In addition, the IGBT module 200 includes: an IGBT component 2001 and the above-mentioned heat dissipation component 100 ; the IGBT component 2001 is disposed on the heat dissipation component 100 .

[0076] Figure 6 A schematic cross-sectional view of a pressing block provided in an embodiment of the utility model. Figure 7 This is a schematic diagram of an exploded view of an IGBT transistor module provided by an embodiment of the utility model. Figure 8 A schematic diagram of a pressing block provided in an embodiment of the utility model pressing an IGBT transistor onto a heat sink substrate.

[0077] In some embodiments, in combination Figure 1 , Figure 2 ,and Figure 7 It can be seen that the IGBT component 2001 includes: a PCB board 4 and an IGBT transistor module 6 .

[0078] In the embodiment of the present application, the PCB board 4 is assembled to the supporting component 3 of the heat dissipation assembly 100 through a plurality of first fastening components 5 .

[0079] It should be noted that the IGBT transistor module 6 is assembled to the heat sink 1 of the heat dissipation assembly 100 via a plurality of second fastening components 7 .

[0080] It can be understood that at least a portion of the IGBT transistor module 6 forms a communication connection with the PCB board 4 .

[0081] In some embodiments, according to Figure 1 , Figure 2 , Figure 7 and Figure 8 It can be known that the IGBT transistor module 6 includes an IGBT transistor 61 and a pressing block 62 .

[0082] The IGBT transistor 61 includes a transistor body 611 and a plurality of connecting pins 612 arranged on the transistor body 611 .

[0083] In addition, the IGBT transistor 61 can form a communication connection with the PCB board 4 through the connecting pin 612 .

[0084] Specifically, the pressing block 62 abuts against the transistor body 611 , so that the IGBT transistor 61 is fixed on the heat dissipation substrate 11 of the heat sink 1 .

[0085] In the embodiment of the present application, the pressing block 62 is disposed above the IGBT transistor 61 , and the downward pressure of the pressing block 62 is used to force the IGBT transistor 61 to be in close contact with the heat sink 1 and the heat pipe 2 , respectively.

[0086] In some embodiments, see Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 8 The pressing block 62 includes a base 621 and a convex rib 622 .

[0087] It is understandable that a locking groove 6211 is formed on the base 621 , and a positioning column 6212 is disposed in the locking groove 6211 ; the rib 622 is disposed on surfaces of the base 621 and the locking groove 6211 that are away from each other.

[0088] It should be noted that a positioning hole 6111 is provided on the transistor body 611 ; the positioning column 6212 is inserted into the positioning hole 6111 to guide the pressing block 62 to abut against the transistor body 611 in a preset state to limit the mutual movement between the pressing block 62 and the transistor body 611 .

[0089] In some embodiments, the rib 622 includes: a mounting portion 6221 and an anti-foolproof portion 6222 .

[0090] In the embodiment of the present application, the foolproof portion 6222 protrudes from the outer side of the mounting portion 6221;

[0091] The PCB board 4 is provided with a through hole 401 which matches the shape of the convex rib 622 ; the through hole 401 is provided with an anti-mistake groove 4011 which matches the anti-mistake portion 6222 .

[0092] In addition, when the rib 622 passes through the through hole 401, the fool-proofing portion 6222 cooperates with the fool-proofing groove 4011 to connect the PCB board 4 to the supporting component 3 in a preset state and to limit the rotation between the pressing block 62 and the PCB board 4.

[0093] Specifically, the anti-mistake portion 6222 and the anti-mistake groove 4011 cooperate with each other to limit the relative rotation between the pressing block 62 and the PCB board 4, thereby ensuring that there is a relative displacement between the IGBT transistor 61 and the PCB board 4, and effectively avoiding the connection pin 612 of the IGBT transistor 61 from being torn or other undesirable phenomena.

[0094] It should be noted that, through the cooperation between the anti-mistake portion 6222 and the anti-mistake groove 4011, the installation positioning between the pressing block 62 and the PCB board 4 can be achieved and the pressing block 62 can be prevented from rotating relative to the PCB board 4, thereby ensuring the accuracy of the installation of the IGBT transistor 61 and the stability of the heat exchange of the IGBT transistor 61.

[0095] In some embodiments, a second mounting hole 6220 penetrating through the base 621 is formed on the mounting portion 6221 of the rib 622 ; the second fastening component 7 passes through the second mounting hole 6220 , so that the pressing block 62 is fixed on the heat dissipation substrate 11 .

[0096] Specifically, the surfaces of the transistor body 611 are in contact with the heat dissipation substrate 11 and the heat pipe 2 respectively.

[0097] In some embodiments, the pressing block 62 is made of insulating material; a metal piece 6201 is embedded inside the base 621 to improve the strength of the pressing block 62 .

[0098] Specifically, the pressing block 62 is made of insulating materials such as plastic in order to strengthen the insulation requirements to achieve electrical performance; however, in order to compensate for the insufficient strength of the plastic material, a high-strength metal part 6201 can be further embedded in the base 621 of the pressing block 62 made of plastic material, thereby meeting the mechanical structure strength requirements and further meeting the stability of the attached pressure.

[0099] Combination Figure 1-Figure 8, the heat dissipation process of the IGBT transistor module 6 is described in detail: first, the heat pipe 2 is installed in the receiving groove 101 of the radiator 1, and is in close contact with the radiator through the thermal conductive silicone grease coated on the inner surface of the receiving groove 101; then, the downward pressure of the pressing block 62 is used to force the IGBT transistor 61 to be in close contact with the heat pipe 2, and the heat generated by the IGBT transistor module 6 is absorbed through the heat conduction of the heat pipe 2; thereafter, the heat pipe 2 conducts the absorbed heat to the radiator 1; finally, the air flowing on the surface of the radiator 1 takes the heat out, and the IGBT transistor module 6 can achieve efficient heat dissipation.

[0100] In the embodiment of the present application, in order to further enhance the heat dissipation effect of the IGBT transistor module 6, a fan can be added to the end surface of the heat sink 1 or the heat dissipation fins 12 can be exposed to the external environment to allow air to flow smoothly, so that the heat sink 1 can more effectively remove heat.

[0101] Combined 1- Figure 8 , the assembly process of the IGBT component 2001 and the heat dissipation component 100 is described in detail: first, the heat pipe 2 is installed in the receiving groove 101 of the radiator 1; at this time, there will be some step differences and gaps in the assembly of the heat pipe 2 and the radiator 1, and the above-mentioned step differences and gaps will directly affect the heat conduction between the heat pipe 2 and the radiator 1; therefore, in order to enhance the heat conduction between the heat pipe 2 and the radiator 1, before the heat pipe 2 is installed, it is necessary to apply thermal conductive silicone grease on the inner surface of the receiving groove 101 of the radiator 1 to fill the step differences and gaps generated between the heat pipe 2 and the radiator 1, so that the heat pipe 2 and the radiator 1 can conduct heat more fully; then, the four support components 3 are installed in the first mounting holes 111 of the radiator 1; its In the embodiment, the supporting component 3 is used to fix and support the PCB board 4 to prevent the PCB board 4 from deformation and displacement; then, the IGBT transistor module 6 is installed on the heat dissipation substrate 11 of the radiator 1 through the second fastening component 7; at the same time, when the second fastening component 7 is tightened, the pressing block 62 is forced to be squeezed downward, so that the IGBT transistor 61 can be pressed tightly, so that the IGBT transistor 61 is in close contact with the heat pipe 2, and the heat generated by the IGBT transistor module 6 is absorbed through the heat conduction of the heat pipe 2; finally, the PCB board 4 is installed on the supporting component 3 using the first fastening component 5 to prevent the PCB board 4 from being displaced and affecting the heat dissipation of the IGBT transistor module 6 and the normal operation of the energy storage power supply equipment.

[0102] Specifically, traditional heat dissipation components use ceramic substrates for thermal conductivity and heat dissipation, while the heat dissipation component 100 provided by the present application uses a cheaper heat pipe 2 for thermal conductivity and heat dissipation; therefore, the heat dissipation component 100 provided by the present application has a lower cost than traditional heat dissipation components while ensuring sufficient heat dissipation performance and heat dissipation efficiency.

[0103] In summary, the heat dissipation assembly and energy storage power supply device provided by the embodiment of the utility model, by adding the design of the heat pipe, makes the heat dissipation assembly provided by the present application have better heat dissipation efficiency than the traditional heat dissipation assembly, and has the advantages of simple structure, easy to manufacture and install, and can effectively reduce costs. By arranging a heat-conducting component in the receiving groove of the radiator, the step difference and gap between the heat pipe and the radiator can be effectively filled, so that the heat pipe and the radiator are in close contact to achieve heat exchange. Therefore, the heat dissipation assembly provided by the embodiment of the utility model has a certain novelty compared with the traditional heat dissipation assembly.

[0104] The above contents are further detailed descriptions of the present invention in combination with specific / preferred implementations, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A heat dissipation component, characterized in that: include: Radiator; the radiator comprises: a heat dissipation substrate and a plurality of heat dissipation fins; A plurality of the heat dissipation fins are arranged at intervals on one surface of the heat dissipation substrate; a plurality of accommodating grooves are provided on the other surface of the heat dissipation substrate; A plurality of heat pipes; the heat pipes are accommodated in the containing tank; A heat-conducting component; the heat-conducting component is arranged on the inner surface of the containing groove to fill the gap between the heat pipe and the inner surface of the containing groove; The heat conducting component may also be used to fill the step formed between the heat pipe and the surface of the heat dissipation substrate away from the heat dissipation fins.

2. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation fins are provided with wave patterns to increase the heat dissipation area of ​​the heat sink; Wherein, the heat-conducting component is thermally conductive silicone grease.

3. The heat dissipation assembly according to claim 1, characterized in that: The heat pipe extends along a first direction; both ends of the heat pipe that are away from each other in the first direction are closed ends, so that a closed accommodating cavity is formed inside the heat pipe; Wherein, the accommodating cavity is filled with cooling liquid to increase the heat conduction area of ​​the heat pipe.

4. The heat dissipation assembly according to claim 1, characterized in that: Also includes: A number of supporting components; A plurality of first mounting holes are formed on the surface of the heat dissipation substrate away from the heat dissipation fins; Wherein, the supporting component is connected to the heat dissipation substrate through the first mounting hole.

5. An energy storage power supply device, characterized in that: include: Equipment body and IGBT module; The IGBT module is arranged on the device body; The IGBT module comprises: an IGBT component and a heat dissipation component according to any one of claims 1 to 4; The IGBT component is arranged on the heat dissipation component.

6. The energy storage power supply device according to claim 5, characterized in that: The IGBT component comprises: PCB board; the PCB board is assembled to the supporting component of the heat dissipation assembly through a plurality of first fastening components; IGBT transistor module; the IGBT transistor module is assembled to the heat sink of the heat dissipation assembly through a plurality of second fastening components; Wherein, at least a part of the IGBT transistor module forms a communication connection with the PCB board.

7. The energy storage power supply device according to claim 6, characterized in that: The IGBT transistor module comprises: IGBT transistor; the IGBT transistor comprises: a transistor body and a plurality of connecting pins arranged on the transistor body; Wherein, the IGBT transistor can form a communication connection with the PCB board through the connecting pin; The pressing block is in contact with the transistor body so that the IGBT transistor is fixed on the heat dissipation substrate of the heat sink.

8. The energy storage power supply device according to claim 7, characterized in that: The pressing block comprises: A base and a convex rib; the base is provided with a snap-fitting groove, and a positioning column is arranged in the snap-fitting groove; the convex rib is arranged on the surface of the base and the snap-fitting groove which are away from each other; Wherein, a positioning hole is provided on the transistor body; the positioning column is inserted into the positioning hole to guide the pressing block to abut against the transistor body in a preset situation to limit the mutual movement between the pressing block and the transistor body.

9. The energy storage power supply device according to claim 8, characterized in that: The convex ribs include: A mounting portion and an anti-foolproof portion; the anti-foolproof portion protrudes from the outer side surface of the mounting portion; Wherein, the PCB board is provided with a through hole matching the shape of the convex rib; the through hole is provided with an anti-fool groove matching the anti-fool part; When the convex rib passes through the through hole, the fool-proofing portion cooperates with the fool-proofing groove to connect the PCB board to the supporting component in a preset state and to limit the mutual rotation between the pressing block and the PCB board.

10. The energy storage power supply device according to claim 8, characterized in that: A second mounting hole penetrating the base is provided on the mounting portion of the convex rib; the second fastening member passes through the second mounting hole so that the pressing block is fixed on the heat dissipation substrate; The surface of the transistor body is respectively in contact with the heat dissipation substrate and the heat pipe.

11. The energy storage power supply device according to claim 8, characterized in that: The pressing block is made of insulating material; a metal piece is embedded in the base.

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