Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, a chip module and a heat dissipation piece, the chip module and the heat dissipation piece are stacked and arranged on the circuit board, the chip module and the circuit board are conducted through a solder ball, and the heat dissipation piece is in heat conduction connection with the chip module; the circuit board assembly further comprises heat-conducting glue and a heat-conducting piece, in the plane direction of the circuit board, a part of the heat-conducting glue is filled in the gap between the chip module and the circuit board and makes contact with the solder balls, the other part of the heat-conducting glue is located outside the chip module, and the heat-conducting piece extends in the thickness direction of the circuit board and makes contact with the solder balls. The heat-conducting piece is used for being in heat-conducting connection with the heat-dissipating piece and the other part of the heat-conducting glue. According to the circuit board assembly, through contact between the solder balls and the heat-conducting glue and contact between the heat-conducting glue and the heat-conducting piece, heat-conducting connection between the chip module and the heat-dissipating piece is achieved, thermal resistance between the chip module and the heat-dissipating piece is reduced through the heat-conducting piece and the heat-conducting glue, and therefore the heat-dissipating efficiency of the circuit board assembly is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] In an electronic device, the circuit board assembly usually dissipates heat from the chips in the circuit board assembly through a heat sink. However, due to the large thermal resistance between the chip and the heat sink, when the heat generated by the chip during operation is too large, the heat is difficult to be transferred to the heat sink in time, resulting in abnormal temperature of the circuit board assembly and affecting the working efficiency of the electronic device. Summary of the Invention

[0003] This application provides a circuit board assembly and an electronic device, which realize the heat conduction connection between the heat sink and the solder balls of the chip module through a thermal conductive adhesive and a heat conducting member, so as to reduce the thermal resistance between the heat sink and the chip module, thereby improving the heat dissipation efficiency.

[0004] In a first aspect, this application provides a circuit board assembly, which includes a circuit board, a chip module, and a heat sink. The chip module and the heat sink are stacked on the circuit board. The chip module and the circuit board are electrically connected through solder balls, and the heat sink is thermally connected to the chip module.

[0005] The circuit board assembly further includes a thermal conductive adhesive and a heat conducting member. Along the plane direction of the circuit board, a part of the thermal conductive adhesive is filled in the gap between the chip module and the circuit board and is in contact with the solder balls, and another part of the thermal conductive adhesive is located outside the chip module. The heat conducting member extends along the thickness direction of the circuit board, and the heat conducting member is used to be thermally connected to the heat sink and the other part of the thermal conductive adhesive respectively.

[0006] In the circuit board assembly provided by this application, the chip module is disposed between the heat sink and the circuit board along the thickness direction of the circuit board, and a part of the thermal conductive adhesive is filled between the chip module and the circuit board. Another part of the thermal conductive adhesive is located outside the chip module and is thermally connected to one end of the heat conducting member. The other end of the heat conducting member along the thickness direction of the circuit board is thermally connected to the heat sink, so that the heat generated when the chip module operates can be sequentially transferred to the heat sink through the solder balls, the thermal conductive adhesive, and the heat conducting member of the chip module. Among them, during the preparation process of the circuit board assembly provided by this application, a part of the thermal conductive adhesive filled between the circuit board and the chip module will overflow along the plane direction of the circuit board, and the other part of the thermal conductive adhesive is the thermal conductive adhesive that overflows between the circuit board and the chip module.

[0007] The circuit board assembly provided by this application realizes the thermal connection between the chip module and the heat sink through the contact between the solder balls and the thermal conductive adhesive, and the contact between the thermal conductive adhesive and the heat conducting member, and reduces the thermal resistance between the chip module and the heat sink by relying on the heat conducting member and the thermal conductive adhesive, thereby improving the heat dissipation efficiency of the circuit board assembly of this application.

[0008] In one implementation, the material of the heat-conducting member is a colloid, and the heat-conducting member is also used to adhere to the side wall of the chip module, where: the heat-conducting member is thermally connected to the heat sink by adhering to the side wall of the heat sink. Or, the heat-conducting member is thermally connected to the heat sink by adhering to the bottom surface of the heat sink extending out of the chip module.

[0009] In this implementation, by adhering to the side wall of the chip module, the heat generated when the chip module operates can also be transferred from the side wall to the heat-conducting member. The circuit board assembly of the present application is adhered to the heat sink through the heat-conducting member to ensure that the heat transferred to the heat-conducting member can be transferred to the heat sink.

[0010] In one implementation, the material of a part of the thermal conductive adhesive is the same as that of another part of the thermal conductive adhesive, and the material of the heat-conducting member is different from that of another part of the thermal conductive adhesive.

[0011] In one implementation, the material of a part of the thermal conductive adhesive is different from that of another part of the thermal conductive adhesive, and the material of the heat-conducting member is the same as that of another part of the thermal conductive adhesive.

[0012] In this implementation, the heat-conducting member and another part of the thermal conductive adhesive are formed as one body. Along the plane direction of the circuit board, a part of the thermal conductive adhesive is flush with the side wall of the chip module and contacts the heat-conducting member.

[0013] In one implementation, the material of the heat-conducting member is the same as that of another part of the thermal conductive adhesive, and the material of a part of the thermal conductive adhesive includes multiple types of adhesive materials, and at least one of the multiple types of adhesive materials has the same material as the heat-conducting member.

[0014] In this implementation, the heat-conducting member and another part of the thermal conductive adhesive are formed as one body. Along the thickness direction of the circuit board, a part of the heat-conducting member is filled between the chip module and the circuit board and contacts a part of the thermal conductive adhesive.

[0015] In one implementation, along the thickness direction of the circuit board, one end of the heat-conducting member extends into another part of the thermal conductive adhesive, and the other end of the heat-conducting member extends towards the heat sink. The other end of the heat-conducting member contacts the side wall of the heat sink to be thermally connected to the heat sink. Or, the other end of the heat-conducting member contacts the bottom surface of the heat sink extending out of the chip module to be thermally connected to the heat sink.

[0016] In this implementation, the material of the heat-conducting member is a solid material, and one end of the heat-conducting member absorbs and transfers the heat transferred from the solder ball to the thermal conductive adhesive by extending into another part of the thermal conductive adhesive. The circuit board assembly of the present application contacts the heat sink through the heat-conducting member to ensure that the heat transferred to the heat-conducting member can be transferred to the heat sink.

[0017] In one implementation, along the plane direction of the circuit board, the heat-conducting member contacts the side wall of the chip module.

[0018] In this implementation, the heat generated when the chip module operates can be transferred from the sidewalls of the chip module to the heat conducting member, and then transferred to the heat dissipating member by the heat conducting member. Thereby, the heat exchange area between the chip module and the heat conducting member is increased, and the heat dissipation efficiency of the circuit board assembly of the present application is improved.

[0019] In one implementation, the chip module includes a first surface and a plurality of sidewalls. Solder balls are convexly provided on the first surface, and each sidewall is connected to the first surface. The plurality of sidewalls include a first sidewall. In the plane direction of the circuit board, the first sidewall is located between a part of the thermal conductive adhesive and another part of the thermal conductive adhesive, and the another part of the thermal conductive adhesive is located on one side of the first sidewall of the chip module. Wherein, the number of the heat conducting members is multiple, and the multiple heat conducting members are located on one side of the first sidewall of the chip module.

[0020] In this implementation, in the plane direction of the circuit board, the thermal conductive adhesive extends from the first sidewall of the chip module to outside the chip module to form another part of the thermal conductive adhesive. The multiple heat conducting members are respectively in contact with the another part of the thermal conductive adhesive to increase the contact area between the another part of the thermal conductive adhesive and the heat conducting members. Thereby, the heat dissipation efficiency of the circuit board assembly of the present application is improved.

[0021] In one implementation, the number of the first sidewalls is multiple. The number of the heat conducting members is multiple, and a plurality of heat conducting members are arranged on one side of each first sidewall of the chip module.

[0022] In this implementation, in the plane direction of the circuit board, the thermal conductive adhesive extends from each first sidewall to outside the chip module in different directions to form another part of the thermal conductive adhesive, and the another part of the thermal conductive adhesive is thermally connected to the heat dissipating member through the multiple heat conducting members located on different sides of the chip module.

[0023] In one implementation, the another part of the thermal conductive adhesive surrounds the chip module. The heat conducting member is used to surround the chip module.

[0024] In this implementation, the number of the heat conducting members is multiple, and the multiple heat conducting members are spaced apart to surround the chip module. Alternatively, the heat conducting member is in a ring shape and surrounds the chip module.

[0025] In one implementation, the thermal conductivity of the thermal conductive adhesive is greater than the thermal conductivity of air, and the thermal conductivity of the thermal conductive adhesive is greater than the thermal conductivity of the circuit board.

[0026] In one implementation, the thermal conductivity of the heat conducting member is greater than the thermal conductivity of air, and the thermal conductivity of the heat conducting member is greater than the thermal conductivity of the circuit board.

[0027] In one implementation, the material of the heat conducting member includes epoxy resin and a filler material. Wherein, the filler material of the heat conducting member includes alumina and / or aluminum nitride.

[0028] In this implementation, the material of the heat-conducting member is a colloid, the matrix material of the heat-conducting member is epoxy resin, and the filling material of the heat-conducting member includes alumina and / or aluminum nitride. During the preparation of the circuit board assembly of the present application, alumina and / or aluminum nitride are filled into the epoxy resin to form the material of the heat-conducting member.

[0029] In one implementation, the material of the thermal conductive adhesive includes epoxy resin and a filling material, wherein the filling material of the thermal conductive adhesive includes alumina and / or silica.

[0030] In this implementation, the matrix material of the thermal conductive adhesive is epoxy resin, and the filling material of the heat-conducting member includes alumina and / or silica. During the preparation of the thermal conductive adhesive, alumina and / or silica can be filled into the epoxy resin to form the thermal conductive adhesive.

[0031] In one implementation, the chip module includes two stacked chips, and the two chips are electrically connected through second solder balls, wherein: a second thermal conductive adhesive is filled between the two chips, and the second thermal conductive adhesive is used for thermally connecting to the second solder balls and the heat-conducting member respectively.

[0032] In this implementation, the second thermal conductive adhesive can transfer the heat transferred to the second solder balls during the operation of the two chips to the heat-conducting member, and the heat is transferred from the heat-conducting member to the heat sink to achieve heat dissipation. Thus, in cooperation with the thermal conductive adhesive, the thermal resistance between the chip module and the heat sink is further reduced, and the heat dissipation efficiency of the circuit board assembly of the present application is further improved.

[0033] In one implementation, each chip includes a heat-conducting surface, the two heat-conducting surfaces of the two chips are opposite along the thickness direction of the circuit board, the areas of the two heat-conducting surfaces of the two chips are equal, and along the plane direction of the circuit board, the second thermal conductive adhesive is flush with the side walls of the two chips and contacts the heat-conducting member.

[0034] In one implementation, the two chips include a first chip and a second chip, the area of the heat-conducting surface of the first chip is larger than the area of the heat-conducting surface of the second chip, a part of the second thermal conductive adhesive is located between the first chip and the second chip, and another part of the second thermal conductive adhesive is located outside the second chip and contacts the heat-conducting member. The material of a part of the second thermal conductive adhesive is the same as the material of another part of the second thermal conductive adhesive, and the material of the heat-conducting member is different from the material of another part of the second thermal conductive adhesive.

[0035] In one implementation, the material of a part of the second thermal conductive adhesive is different from the material of another part of the second thermal conductive adhesive, and the material of the second heat-conducting member is the same as the material of another part of the second thermal conductive adhesive.

[0036] In one implementation, the material of the heat conducting member is the same as that of the other part of the second heat conducting adhesive. The material of a part of the second heat conducting adhesive includes a plurality of second adhesive materials, and the material of at least one of the plurality of second adhesive materials is the same as that of the heat conducting member.

[0037] In one implementation, each chip includes a heat conducting surface. Along the thickness direction of the circuit board, the two heat conducting surfaces of the two chips face each other. At least one heat conducting surface includes a heat dissipation pad, and the heat dissipation pad is used to extend into the interior of the chip and conduct heat connection with the heat generating unit of the chip. The second heat conducting adhesive or the heat conducting member is also used to conduct heat connection with the heat dissipation pad.

[0038] In this implementation, along the thickness direction of the circuit board, one end of the heat dissipation pad is located inside the chip and conducts heat connection with the heat generating unit of the chip, and the other end of the heat dissipation pad exposes from the heat conducting surface of the chip and conducts heat connection with the heat conducting member or the second heat conducting adhesive. The heat generated by the chip with the heat dissipation pad during operation can also be transferred to the heat conducting member or the second heat conducting adhesive through the heat dissipation pad, and thus transferred to the heat dissipation member. Thereby, the thermal resistance between the heat dissipation member and the chip module is further reduced, and the heat dissipation efficiency of the circuit board assembly of the present application is further improved.

[0039] In one implementation, the thermal conductivity of the second heat conducting adhesive is greater than that of air.

[0040] In one implementation, the two chips include a first chip and a second chip. The area of the heat conducting surface of the first chip is larger than the area of the heat conducting surface of the second chip. The heat dissipation pad is located on the heat conducting surface of the first chip, and along the thickness direction of the circuit board, the projection of the second chip on the heat conducting surface of the first chip does not cover.

[0041] In this implementation, along the plane direction of the circuit board, a part of the second heat conducting adhesive is located between the first chip and the second chip, and the other part of the second heat conducting adhesive is located outside the second chip and contacts the heat conducting member. The heat dissipation pad is located outside the second chip and contacts the other part of the second heat conducting adhesive. And / or, the heat dissipation pad is located outside the second chip and contacts the heat conducting member.

[0042] In one implementation, the heat dissipation pad is located between the two chips and is arranged at intervals with the second solder ball, and the heat dissipation pad contacts the second heat conducting adhesive to conduct heat connection with the second heat conducting adhesive.

[0043] In one implementation, the chip module includes a first chip and a second chip. The first chip and the second chip are conducted through the second solder ball. The area of the heat conducting surface of the first chip is larger than the area of the heat conducting surface of the second chip. The heat dissipation pad is located on the heat conducting surface of the first chip and is arranged at intervals with the second chip, and the heat dissipation pad contacts the heat conducting member.

[0044] In this implementation, the heat generated during the operation of the first chip is sequentially transferred to the heat sink through the heat dissipation pad and the heat conducting member. Thereby, the thermal resistance between the heat sink and the first chip is reduced, and the heat dissipation efficiency of the circuit board assembly of the present application is improved.

[0045] In one implementation, the material of the heat dissipation pad is copper.

[0046] In one implementation, the chip module includes a first chip and a second chip. The first chip and the second chip are electrically connected through the second solder balls. Along the thickness direction of the circuit board, the first chip is closer to the circuit board than the second chip. The second chip is thermally connected to the heat sink, and the material of the surface of the second chip facing the heat sink includes metal.

[0047] In this implementation, the heat generated during the operation of the second chip and the heat transferred by the second chip can both be transferred to the heat sink through the surface of the second chip facing the heat sink. The material of the surface of the second chip facing the heat sink includes metal, which can reduce the thermal resistance between the second chip and the heat sink and improve the heat dissipation efficiency of the circuit board assembly of the present application.

[0048] In one implementation, the chip module includes a single chip. The chip is electrically connected to the circuit board through solder balls. Among them: along the thickness direction of the circuit board, the surface of the chip facing away from the circuit board is thermally connected to the heat sink.

[0049] In one implementation, along the thickness direction of the circuit board, the surface of the circuit board facing the chip module includes a second heat dissipation pad. One end of the second heat dissipation pad extends into the circuit board, and the other end of the second heat dissipation pad is exposed on the surface of the circuit board facing the chip module. The other end of the second heat dissipation pad is thermally connected to the heat conducting member, or the other end of the second heat dissipation pad is spaced from the solder ball in the plane direction of the circuit board and is thermally connected to the thermal conductive adhesive.

[0050] In this implementation, since part of the heat generated during the operation of the chip module is also transferred to the circuit board through the solder balls, the circuit board also generates heat during operation. The second heat dissipation pad is used to transfer the heat of the circuit board to the heat conducting member or the thermal conductive adhesive, so that the heat conducting member or the thermal conductive adhesive can transfer the heat to the heat sink. Thereby, the heat dissipation efficiency of the circuit board assembly of the present application is further improved.

[0051] In one implementation, the heat sink includes a heat sink fin and a shielding cover. Along the thickness direction of the circuit board, the shielding cover is attached to the surface of the heat sink facing the chip module. The projection of the shielding cover covers the chip module, the thermal conductive adhesive, and the heat conducting member. The outer edge of the shielding cover includes a protruding portion, and the protruding portion extends towards the circuit board and is fixedly connected to the circuit board. The protruding portion at least surrounds the chip module and the heat conducting member.

[0052] In this implementation, the protruding part of the shielding cover contacts the circuit board and surrounds the chip module to shield the propagation of electromagnetic waves and avoid the influence of electromagnetic waves on the operation of the chip module. This makes the operation of the circuit board assembly of the present application stable. During the operation of the circuit board assembly of the present application, the heat transferred by the chip module through the thermal conductive adhesive and the heat conducting member during operation will be transferred to the heat sink via the shielding cover, and the heat sink will dissipate the heat.

[0053] In one implementation, the material of the heat sink is graphite.

[0054] In one implementation, the circuit board assembly further includes a retaining wall, which is fixed to the circuit board and extends towards the heat dissipating member. Along the plane direction of the circuit board, the retaining wall is spaced apart from the chip module, and the other part of the thermal conductive adhesive and the heat conducting member are both located between the chip module and the retaining wall.

[0055] In this implementation, along the plane direction of the circuit board, the retaining wall is used to limit the flow range of the other part of the thermal conductive adhesive. When the material of the heat conducting member is a colloid, the retaining wall is also used to limit the flow range of the heat conducting member to facilitate the preparation of the heat conducting member.

[0056] In one implementation, the other part of the thermal conductive adhesive surrounds the chip module along the plane direction of the circuit board. The number of retaining walls is multiple, and the multiple retaining walls are used to surround the thermal conductive adhesive. Alternatively, the retaining wall is annular, and the retaining wall is used to surround the thermal conductive adhesive.

[0057] In this implementation, the retaining wall is used to surround the thermal conductive adhesive to further limit the flow range of the thermal conductive adhesive. When the material of the heat conducting member is a colloid, the retaining wall is also used to surround the heat conducting member to further limit the flow range of the heat conducting member.

[0058] In one implementation, along the thickness direction of the circuit board, the height of the retaining wall is less than or equal to the spacing distance between the heat dissipating member and the circuit board.

[0059] In this implementation, along the thickness direction of the circuit board, the end of the retaining wall away from the substrate contacts the surface of the heat dissipating member facing the circuit board, or the end of the retaining wall away from the substrate is thermally connected to the surface of the heat dissipating member facing the circuit board, so that the heat generated when the chip module operates can also be transferred to the retaining wall through the heat conducting member and the thermal conductive adhesive, and then transferred to the heat dissipating member by the retaining wall. This further reduces the thermal resistance between the chip module and the heat dissipating member and further improves the heat dissipation efficiency of the circuit board of the present application.

[0060] In one implementation, the number of retaining walls is multiple, and at least some of the multiple retaining walls are respectively thermally connected to a heat transfer line in the heat dissipating member and the circuit board along the thickness direction of the circuit board. Each heat transfer line extends along the plane direction of the circuit board and is electrically connected to a heating unit in the chip module through solder balls.

[0061] In this implementation manner, based on the conduction relationship between each heat - generating unit in the chip module and the heat - transfer line in the circuit board, part of the retaining wall is thermally connected to the heat - transfer route conducted by the heat - generating unit, so that the heat generated when the heat - generating unit in the chip module works can be sequentially transferred to the retaining wall through the solder balls and the heat - transfer line of the circuit board, and transferred to the heat sink through the retaining wall. Thereby, the thermal resistance between the chip module and the heat sink is further reduced, and the heat - dissipation efficiency of the circuit - board assembly of the present application is further improved.

[0062] In one implementation manner, the material of the retaining wall is metal; and / or, the circuit - board assembly further includes components, the components are mounted on the surface of the circuit board where the chip module is mounted, and the other part of the heat - conducting member and the heat - conducting adhesive is located between the chip module and the components, and the components form the retaining wall.

[0063] In one implementation manner, the material of the retaining wall is copper.

[0064] In one implementation manner, the circuit - board assembly includes a second heat - conducting member, the material of the second heat - conducting member is a colloid, and along the thickness direction of the circuit board, the second heat - conducting member is used to fill the installation gap between the retaining wall and the heat sink to achieve the thermal connection between the retaining wall and the heat sink.

[0065] In one implementation manner, the circuit - board assembly includes a second heat - conducting member, the material of the second heat - conducting member is a colloid, and along the thickness direction of the circuit board, the second heat - conducting member is used to fill the installation gap between the heat sink and the chip module.

[0066] In this implementation manner, the chip module is thermally connected to the heat sink through the second heat - conducting member, and the heat generated when the chip module works can also be transferred to the heat sink through the second heat - conducting member. Thereby, the thermal resistance between the chip module and the heat sink is further reduced, and the heat - dissipation efficiency of the circuit - board assembly of the present application is improved.

[0067] In one implementation manner, the material of the heat - conducting member is a colloid, and the material of the second heat - conducting member is the same as that of the heat - conducting member.

[0068] In a second aspect, an electronic device includes a housing and a circuit - board assembly, and the circuit - board assembly is received in the housing.

[0069] Since the electronic device of the present application includes the circuit - board assembly provided in any of the above - mentioned implementation manners, the heat generated during its working process can be sequentially transferred to the heat sink through the heat - conducting adhesive and the heat - conducting member, so as to reduce the thermal resistance between the heat sink and the chip module, thereby improving the heat - dissipation efficiency. Description of the Drawings

[0070] To more clearly illustrate the technical solutions of the present application, the accompanying drawings required for the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0071] Figure 1 Schematic cross-sectional structure diagram of the electronic device provided by the embodiment of the present application;

[0072] Figure 2 Schematic partial cross-sectional structure diagram of the electronic device provided by the embodiment of the present application;

[0073] Figure 3 Schematic structure diagram of the circuit board assembly provided by the embodiment of the present application;

[0074] Figure 4 Schematic cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application;

[0075] Figure 5 Schematic structure diagram of the circuit board assembly provided by the embodiment of the present application in one embodiment;

[0076] Figure 6 Schematic structure diagram of the circuit board assembly provided by the embodiment of the present application in another embodiment;

[0077] Figure 7 Another schematic structure diagram of the circuit board assembly provided by the embodiment of the present application;

[0078] Figure 8 Schematic top-down cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application in one embodiment;

[0079] Figure 9 Schematic cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application;

[0080] Figure 10 Schematic top-down cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application in another embodiment;

[0081] Figure 11 Schematic top-down cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application in yet another embodiment;

[0082] Figure 12 Schematic top-down cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application in still another embodiment;

[0083] Figure 13 Schematic cross-sectional structure diagram of the circuit board assembly provided by the embodiment of the present application in one embodiment;

[0084] Figure 14 Another structural schematic diagram of the circuit board assembly provided by the embodiment of the present application;

[0085] Figure 15 Diagram of applying glue to the first chip of the circuit board assembly provided by the embodiment of the present application;

[0086] Figure 16 Diagram of applying glue to the second chip of the circuit board assembly provided by the embodiment of the present application;

[0087] Figure 17 Cross-sectional structural schematic diagram of the circuit board assembly provided by the embodiment of the present application in another embodiment;

[0088] Figure 18 Cross-sectional structural schematic diagram of the circuit board assembly provided by the embodiment of the present application in yet another embodiment;

[0089] Figure 19 Cross-sectional structural schematic diagram of the internal structure of the chip of the circuit board assembly provided by the embodiment of the present application;

[0090] Figure 20 Another cross-sectional structural schematic diagram of the internal structure of the chip of the circuit board assembly provided by the embodiment of the present application;

[0091] Figure 21 Top-view structural schematic diagram of the chip module of the circuit board assembly provided by the embodiment of the present application;

[0092] Figure 22 Another cross-sectional structural schematic diagram of the internal structure of the chip of the circuit board assembly provided by the embodiment of the present application;

[0093] Figure 23 Another cross-sectional structural schematic diagram of the internal structure of the chip of the circuit board assembly provided by the embodiment of the present application;

[0094] Figure 24 Structural schematic diagram of the internal structure of the circuit board of the circuit board assembly provided by the embodiment of the present application;

[0095] Figure 25 Another structural schematic diagram of the internal structure of the circuit board of the circuit board assembly provided by the embodiment of the present application;

[0096] Figure 26 Another structural schematic diagram of the circuit board assembly provided by the embodiment of the present application;

[0097] Figure 27 Structural schematic diagram of the retaining wall of the circuit board assembly provided by the embodiment of the present application;

[0098] Figure 28 Another structural schematic diagram of the retaining wall of the circuit board assembly provided by the embodiment of the present application;

[0099] Figure 29 Partial top view structural schematic diagram of the circuit board assembly provided by the embodiment of the present application;

[0100] Figure 30 Another partial top view structural schematic diagram of the circuit board assembly provided by the embodiment of the present application;

[0101] Figure 31 Another structural schematic diagram of the retaining wall of the circuit board assembly provided by the embodiment of the present application;

[0102] Figure 32 Another structural schematic diagram of the retaining wall of the circuit board assembly provided by the embodiment of the present application;

[0103] Figure 33 Another structural schematic diagram of the internal structure of the circuit board of the circuit board assembly provided by the embodiment of the present application. Detailed implementation manners

[0104] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0105] Please refer to Figure 1 The cross-sectional structural schematic diagram of the electronic device provided by the embodiment of the present application shown.

[0106] As Figure 1 shown, the electronic device provided by the present application includes a housing 201 and a circuit board assembly 100. Among them, the circuit board assembly 100 is Figure 1 the remaining structure in the area outlined by the dashed line in

[0107] In one embodiment, as Figure 1As shown, the housing 201 includes an outer frame 2011 and a middle plate 2012. The middle plate 2012 is received within the outer frame 2011 and fixed to the inner surface of the outer frame 2011. Along the thickness direction of the middle plate 2012, there is a gap between the middle plate 2012 and the opening of the outer frame 2011. The middle plate 2012 is used to cooperate with the outer frame 2011 to form a receiving cavity. The circuit board assembly 100 is at least partially received within the receiving cavity.

[0108] In one embodiment, as Figure 1 shown, the electronic device provided in the present application further includes a screen 202 and a battery 203. The housing 201 is used to fix the screen 202 and to accommodate the battery 203 and the circuit board assembly 100. Among them, the screen 202 is fixed at the opening of the outer frame 2011 and covers the opening of the outer frame 2011.

[0109] The middle plate 2012 is used to cooperate with the outer frame 2011 to form a receiving cavity on the side of the middle plate 2012 away from the screen 202. The battery 203 is received within the receiving cavity and electrically connected to the circuit board assembly 100. A part of the circuit board assembly 100 is received within the receiving cavity, and another part of the circuit board assembly 100 passes through the middle plate 2012 to be electrically connected to the screen 202. The circuit board assembly 100 and the battery 203 are spaced apart and fixed to the middle plate 2012. The battery 203 is used to provide the electrical energy required for the operation of the electronic device. The circuit board assembly 100 is used to control the screen 202 to display information.

[0110] Please refer to Figure 2 the partial cross-sectional structural schematic diagram of the electronic device provided by the embodiment of the present application shown. Among them, Figure 2 is Figure 1 the cross-sectional structural schematic diagram of the circular area marked with a dotted line.

[0111] As Figure 1 and Figure 2 shown, in one embodiment, the electronic device provided in the present application further includes a first heat sink 2041 and a second heat sink 2042. Along the thickness direction of the middle plate 2012, the first heat sink 2041 is located between the middle plate 2012 and the screen 202 and fixed to the surface of the middle plate 2012 facing the screen 202. The second heat sink 2042 is fixed to the bottom surface of the outer frame 2011 opposite to the middle plate 2012. Among them, the thickness direction of the middle plate 2012 is parallel to the thickness direction of the circuit board 10. Along the thickness direction of the circuit board 10, the surfaces on the opposite sides of the circuit board assembly 100 are respectively in thermal conductive connection with the first heat sink 2041 and the second heat sink 2042. The heat generated when the circuit board assembly 100 operates will be respectively transferred to the first heat sink 2041 and the second heat sink 2042, and the first heat sink 2041 and the second heat sink 2042 are used to dissipate the heat of the circuit board assembly 100.

[0112] That is, the first heat sink 2041 and the second heat sink 2042 are respectively used to dissipate heat from the circuit board assembly 100. In one embodiment, as Figure 1 and Figure 2 shown, the projections of the first heat sink 2041 and the second heat sink 2042 on the middle plate 2012 also cover the battery 203, and the first heat sink 2041 and the second heat sink 2042 are also used to dissipate heat from the battery 203.

[0113] In one embodiment, as Figure 1 and Figure 2 shown, the electronic device provided by the present application further includes a heat pipe 205. Along the thickness direction of the circuit board 10, the heat pipe 205 is respectively attached to the first heat sink 2041 and the circuit board assembly 100. The heat pipe 205 is used to cooperate with the first heat sink 2041 to dissipate heat from the circuit board assembly 100 and improve the heat dissipation efficiency of the circuit board assembly 100. Thereby ensuring the working efficiency of the electronic device of the present application.

[0114] In the embodiment of the present application, the electronic device of the present application dissipates heat from the circuit board 10 through the first heat sink 2041 and the second heat sink 2042 on opposite sides of the circuit board assembly 100. In another embodiment, the electronic device of the present application includes a heat sink, which is located on one side of the circuit board assembly 100 along the thickness direction of the circuit board 10 and is thermally connected to the circuit board assembly 100 to dissipate heat from the circuit board assembly 100. Among them, the heat sink can be arranged on the side of the circuit board assembly 100 with relatively large heat generation to improve the heat dissipation efficiency of the circuit board assembly 100.

[0115] In one embodiment, as Figure 2 shown, the circuit board assembly 100 provided by the present application includes a circuit board 10 and a chip module 20. The circuit board 10 is fixed on the surface of the middle plate 2012 facing away from the screen 202, and the chip module 20 is mounted on the surface of the circuit board 10 facing away from the middle plate 2012 and is electrically connected to the circuit board 10 through solder balls 21. The chip module 20 is thermally connected to the second heat sink 2042. Among them, the chip module 20 is electrically connected to the battery 203 through the circuit board 10. The chips in the chip module 20 include a system on chip (SOC). The system on chip is used to receive the electrical signals output by the battery 203 and process the electrical signals based on the user's input instructions to control the operation of each component 1001 mounted on the circuit board 10. The system on chip is also used to control the screen 202 to display corresponding display content based on the user's input instructions.

[0116] During the operation of the system-on-chip, the system-on-chip generates heat. The electronic device of the present application thermally connects the second heat sink 2042 to the chip module 20, so that the heat generated when the system-on-chip in the chip module 20 operates can dissipate outward through the second heat sink 2042, avoiding the phenomenon of thermal throttling when the temperature of the chip module 20 reaches the over-temperature protection threshold, thereby preventing the display screen 202 from experiencing phenomena such as stuttering and frame drops. This ensures the working efficiency of the electronic device of the present application and the user experience.

[0117] In one embodiment, the circuit board assembly 100 provided by the present application further includes a heat dissipation member 30, and the chip module 20 and the heat dissipation member 30 are stacked on the circuit board 10. Specifically, along the thickness direction of the circuit board 10, one end of the heat dissipation member 30 is thermally connected to the chip module 20, and the other end of the heat dissipation member 30 is attached to the second heat sink 2042. When the chip module 20 operates, the heat generated by the chip module 20 can dissipate outward through the heat dissipation member 30, and the heat dissipation member 30 can also transfer the heat absorbed from the chip module 20 to the second heat sink 2042 to cooperate with the second heat sink 2042 to dissipate the heat of the chip module 20.

[0118] In one embodiment, the circuit board 10 is a double-layer circuit board, the middle board 2012 includes through holes, and the circuit board 10 is fixed on the middle board 2012 and covers the through holes. The circuit board assembly 100 provided by the present application further includes a plurality of components 1001, and each component 1001 is mounted on the circuit board 10. Among them, along the thickness direction of the circuit board 10, at least some of the plurality of components 1001 are mounted on the surface of the circuit board 10 exposed from the through holes. In one embodiment, some of the plurality of components 1001 and the chip module 20 are mounted on the same surface of the circuit board 10, and another part of the plurality of components 1001 are mounted on the surface of the circuit board 10 facing away from the chip module 20. Each component 1001 is electrically connected to the chip module 20, and the chip module 20 is used to control the operation of each component 1001.

[0119] As Figure 2 shown, the component 1001 mounted on the surface of the circuit board 10 facing the screen 202 is thermally connected to the first heat sink 2041. During the operation of the circuit board assembly 100, the heat generated when each component 1001 mounted on the surface of the circuit board 10 facing the screen 202 operates is absorbed by the first heat sink 2041. Thus, heat dissipation of each component 1001 is achieved.

[0120] When the heat generated during the operation of the chip module 20 is transferred to the second heat sink 2042, it can also be transferred to the first heat sink 2041 via the circuit board 10, and the first heat sink 2041 dissipates the heat of the chip module 20. That is, the first heat sink 2041 and the second heat sink 2042 of the electronic device of the present application cooperate with each other to dissipate the heat of the chip module 20.

[0121] In the embodiment of the present application, the circuit board 10 is set as a double-layer circuit board, so as to facilitate the arrangement of the components 1001 and the chip module 20 on the opposite surfaces of the circuit board 10, thereby making the structure of the circuit board assembly 100 of the present application compact. In another embodiment, the circuit board 10 is a single-layer circuit board, and all the components 1001 and the chip module 20 are spaced and mounted on the surface of the circuit board 10 facing away from the screen 202.

[0122] In one embodiment, as Figure 2 shown, the components 1001 mounted on the surface of the circuit board 10 facing the screen 202 include at least one of a resistor and a capacitor.

[0123] In one embodiment, the material of the first heat sink 2041 is graphite.

[0124] In one embodiment, the material of the second heat sink 2042 is graphite.

[0125] In one embodiment, the circuit board assembly 100 of the present application further includes a thermal conductive adhesive 40 and a thermal conductive member 50. Along the plane direction of the circuit board 10, a part of the thermal conductive adhesive 40 is filled between the gaps of the chip module 20 and the circuit board 10 and is in contact with the solder balls 21, and another part of the thermal conductive adhesive 40 is located outside the chip module 20. The thermal conductive member 50 extends along the thickness direction of the circuit board 10, and the thermal conductive member 50 is used for thermally connecting with the heat dissipation member 30 and the other part of the thermal conductive adhesive 40 respectively.

[0126] Among them, for the convenience of description, a part of the thermal conductive adhesive 40 is defined as the first thermal conductive part 41, and another part of the thermal conductive adhesive 40 is defined as the second thermal conductive part 42.

[0127] Please refer to Figure 3 the schematic structural diagram of the circuit board assembly 100 provided by the embodiment of the present application shown. Among them, Figure 3 for Figure 2 the legend shown by the circuit board assembly 100 outlined by the dotted line in Figure 3 after being rotated 180°. For the convenience of description, in

[0128] Figure 3 ​As shown in the figure, along the thickness direction of the circuit board 10, the chip module 20 is located between the heat sink 30 and the circuit board 10. The surface of the body of the chip module 20 facing the circuit board 10 is convexly provided with solder balls 21, and the solder balls 21 are used for electrical connection between the body of the chip module 20 and the circuit board 10. Thus, the conduction between the chip module 20 and the circuit board 10 is achieved.

[0129] When the chip module 20 is working, the heating units inside the chip module 20 will generate heat. This part of the heat will dissipate to the surroundings, causing the temperature of the housing of the chip module 20 and the solder balls 21 to rise. Since the material of the housing of the chip module 20 is usually a plastic encapsulation material, and in order to achieve the conduction between the chip module 20 and the circuit board 10, the material of the solder balls 21 is usually a metal material. Among them, the thermal conductivity coefficient of the plastic encapsulation material is less than that of the metal material. Therefore, the heat generated when the chip module 20 is working is mainly transferred out through the solder balls 21. That is to say, the solder balls 21 of the chip module 20 are equivalent to the main heat source exposed to the outside of the chip module 20.

[0130] In the embodiment of the present application, the first heat conducting part 41 is used to fill the gap between the chip module 20 and the circuit board 10 and is in contact with the solder balls 21, and the second heat conducting part 42 is located outside the chip module 20. When the chip module 20 is working, the first heat conducting part 41 absorbs the heat released by the solder balls 21 through contact with the solder balls 21, and the second heat conducting part 42 absorbs the heat absorbed by the first heat conducting part 41 to transfer the heat of the solder balls 21 outside the chip module 20. That is to say, the thermal conductive adhesive 40 is used to absorb the heat transferred through the solder balls 21 when the chip module 20 is working and transfer the absorbed heat outside the chip module 20.

[0131] Along the thickness direction of the circuit board 10, one end of the heat conducting member 50 is thermally connected to the second heat conducting part 42, and the other end of the heat conducting member 50 is thermally connected to the heat sink 30. That is to say, when the chip module 20 is working, the heat of the solder balls 21 absorbed by the first heat conducting part 41 can be absorbed by the heat conducting member 50 after being transferred to the second heat conducting part 42, and then transferred to the heat sink 30, and then dissipated to the outside by the heat sink 30, so as to realize the heat dissipation of the chip module 20.

[0132] In the prior art, the housing of the chip module is thermally connected to the heat sink. When the chip module is working, the heat generated will be transferred from the housing of the chip module to the heat sink. However, due to the relatively small thermal conductivity coefficient of the housing of the chip module, correspondingly, the thermal resistance between the chip module and the heat sink is relatively large, resulting in poor heat dissipation efficiency of the chip module. In this application, the circuit board assembly 100 realizes the thermal connection between the chip module 20 and the heat sink 30 through the contact between the solder balls 21 and the thermal conductive adhesive 40, and the contact between the thermal conductive adhesive 40 and the heat conducting member 50, so that the heat generated when the chip module 20 is working can be transferred to the heat sink 30 through the solder balls 21, the thermal conductive adhesive 40 and the heat conducting member 50 in sequence. Thus, the heat dissipation function of the circuit board assembly 100 in this application is realized.

[0133] Compared with the prior art solution of thermally connecting the housing of the chip module to the heat sink. Since the thermal conductive adhesive 40 and the heat conducting member 50 have relatively large thermal conductivity coefficients. The circuit board assembly 100 in this application reduces the thermal resistance between the chip module 20 and the heat sink 30 by relying on the thermal conductive adhesive 40 and the heat conducting member 50, increasing the heat transfer efficiency between the chip module 20 and the heat sink 30. Thereby improving the heat dissipation efficiency of the circuit board assembly 100 in this application.

[0134] In one embodiment, the material of the heat conducting member 50 is a colloid, and the heat conducting member 50 is also used to fit against the side wall 22 of the chip module 20.

[0135] Please refer to Figure 4 the schematic cross-sectional structure diagram of the circuit board assembly 100 provided by the embodiment of this application shown in

[0136] Specifically, as Figure 4 shown, along the plane direction of the circuit board 10, the heat conducting member 50 fits against the side wall 22 of the chip module 20, so that the heat transferred to the housing of the chip module 20 when the chip module 20 is working can be transferred from the side wall 22 to the heat conducting member 50 and then from the heat conducting member 50 to the heat sink 30. That is to say, the fitting of the heat conducting member 50 against the side wall 22 of the chip module 20 increases the heat transfer path between the heat sink 30 and the chip module 20. On the other hand, on the premise that the first heat conducting portion 41 of the thermal conductive adhesive 40 is filled between the chip module 20 and the circuit board 10, the contact between the heat conducting member 50 and the side wall 22 of the chip module 20 increases the heat exchange area between the chip module 20 and the heat conducting member 50 and the thermal conductive adhesive 40. Thereby further improving the heat dissipation efficiency of the circuit board assembly 100 in this application.

[0137] In one embodiment, the material of the heat conducting member 50 is a colloid, the heat sink 30 extends out of the chip module 20 along the plane direction of the circuit board 10, and the heat conducting member 50 is thermally connected to the heat sink 30 by fitting against the surface of the heat sink 30 facing the circuit board 10.

[0138] Specifically, asFigure 4 As shown, along the planar direction of the circuit board 10, the heat dissipation component 30 extends out of the chip module 20. Along the thickness direction of the circuit board 10, the projection of the heat dissipation component 30 on the circuit board 10 covers the chip module 20 and the heat conduction component 50. The heat conduction component 50 is attached to the surface of the heat dissipation component 30 facing the circuit board 10 to ensure that the heat transferred from the chip module 20 to the heat conduction component 50 can be transferred to the heat dissipation component 30. Thus, the heat dissipation function of the heat dissipation component 30 for the chip module 20 is ensured.

[0139] In one embodiment, the material of the heat conduction component 50 is a colloid, and the heat conduction component 50 is thermally connected to the heat dissipation component 30 by being attached to the side wall of the heat dissipation component 30.

[0140] Specifically, along the thickness direction of the circuit board 10, the projection of the heat dissipation component 30 on the circuit board 10 covers the chip module 20. The heat conduction component 50 contacts the side wall of the heat dissipation component 30 to ensure that the heat transferred from the chip module 20 to the heat conduction component 50 can be transferred to the heat dissipation component 30. Thus, the heat dissipation function of the heat dissipation component 30 for the chip module 20 is ensured.

[0141] In one embodiment, along the thickness direction of the circuit board 10, the projection of the heat dissipation component 30 on the circuit board 10 covers the chip module 20 and partially covers the heat conduction component 50, and the heat conduction component 50 is attached to the surface of the heat dissipation component 30 facing the circuit board 10. In one embodiment, along the thickness direction of the circuit board 10, the projection of the heat dissipation component 30 on the circuit board 10 covers the chip module 20 and partially covers the heat conduction component 50, and the heat conduction component 50 is attached to the surface of the heat dissipation component 30 facing the circuit board 10 and the side wall of the heat dissipation component 30 respectively.

[0142] In one embodiment, the material of the first heat conduction part 41 is the same as that of the second heat conduction part 42, and the material of the heat conduction component 50 is different from that of the second heat conduction part 42. As Figure 4 shown, part of the thermal conductive adhesive 40 is filled between the chip module 20 and the circuit board 10, and the other part of the thermal conductive adhesive 40 overflows from between the chip module 20 and the circuit board 10 to facilitate contact with the heat conduction component 50. During the preparation process of the circuit board assembly 100 in this application, the thermal conductive adhesive 40 with the same material can be first filled between the chip module 20 and the circuit board 10, and part of the thermal conductive adhesive 40 is made to overflow outside the chip module 20. At this time, the thermal conductive adhesive 40 located between the chip module 20 and the circuit board 10 is the first heat conduction part 41, and the thermal conductive adhesive 40 that overflows outside the chip module 20 is the second heat conduction part 42. Then, a colloid with the same material as the heat conduction component 50 is coated on the second heat conduction part 42 until the colloid contacts the heat dissipation component 30. Thus, the heat conduction component 50 is formed.

[0143] In one embodiment, the material of the first heat conduction part 41 is different from that of the second heat conduction part 42, and the material of the heat conduction component 50 is the same as that of the second heat conduction part 42.

[0144] Please refer to the Figure 5 schematic structural diagram of the circuit board assembly 100 provided by the embodiment of the present application shown in one embodiment.

[0145] Specifically, as Figure 5 shown, the heat conducting member 50 and the second heat conducting portion 42 are formed as one body. The first heat conducting portion 41 is filled between the chip module 20 and the circuit board 10. Along the plane direction of the circuit board 10, the first heat conducting portion 41 is flush with the side wall 22 of the chip module 20 to facilitate contact with the second heat conducting portion 42. During the preparation process of the circuit board assembly 100 of the present application, a colloid having the same material as the first heat conducting portion 41 can be filled between the chip module 20 and the circuit board 10 first, and then the overflowing colloid is processed to ensure that the colloid is flush with the side wall of the chip module 20. Thus, the first heat conducting portion 41 is formed. Then, a colloid having the same material as the heat conducting member 50 is coated outside the chip module 20, and the colloid is made to contact the first heat conducting portion 41 until the colloid contacts the heat sink 30. Thus, the second heat conducting portion 42 and the heat conducting member 50 are formed.

[0146] In one embodiment, the material of the heat conducting member 50 is the same as that of the second heat conducting portion 42, and the material of the first heat conducting portion 41 includes a variety of adhesives, and at least one of the variety of adhesives has the same material as the heat conducting member 50.

[0147] Please refer to the Figure 6 schematic structural diagram of the circuit board assembly 100 provided by the embodiment of the present application shown in another embodiment.

[0148] Specifically, as Figure 6 shown, the heat conducting member 50 and the second heat conducting portion 42 are formed as one body. Along the thickness direction of the circuit board 10, the first heat conducting portion 41 is filled between the chip module 20 and the circuit board 10, and a part of the heat conducting member 50 is filled between the chip module 20 and the circuit board 10 and contacts the first heat conducting portion 41. During the preparation process of the circuit board assembly 100 of the present application, a colloid having the same material as the first heat conducting portion 41 can be filled between the chip module 20 and the circuit board 10, and the colloid is made not to overflow from between the chip module 20 and the circuit board 10. Then, a colloid having the same material as the heat conducting member 50 is coated outside the chip module 20. The colloid can flow into the space between the chip module 20 and the circuit board 10 and contact the colloid set in the previous step. Thus, the first heat conducting portion 41 is formed. When the colloid contacts the heat sink 30, the colloid outside the chip module 20 forms the second heat conducting portion 42 and the heat conducting member 50.

[0149] In one embodiment, the material of the heat conducting member 50 is the same as that of the thermal conductive adhesive 40. During the preparation of the circuit board assembly 100 of the present application, a colloid having the same material as the heat conducting member 50 can be directly filled between the circuit board 10 and the heat sink 30, and the colloid is made to fill the gap between the chip module 20 and the circuit board 10 at the same time. Thus, the heat conducting member 50 and the thermal conductive adhesive 40 are formed.

[0150] In one embodiment, along the thickness direction of the circuit board 10, one end of the heat conducting member 50 extends into the second heat conducting portion 42, and the other end of the heat conducting member 50 extends toward the heat sink 30. The other end of the heat conducting member 50 is in contact with the side wall of the heat sink 30 to conductively connect the heat sink 30. Alternatively, the other end of the heat conducting member 50 is in contact with the bottom surface of the heat sink 30 extending out of the chip module 20 to conductively connect the heat sink 30.

[0151] Please refer to Figure 7 Another schematic structural diagram of the circuit board assembly 100 provided by the embodiment of the present application shown in the figure.

[0152] As Figure 7 As shown, the material of the heat conducting member 50 is a solid material, and the end of the heat conducting member 50 close to the circuit board 10 extends into the second heat conducting portion 42 to conductively connect with the thermal conductive adhesive 40. When the chip module 20 is working, the heat absorbed and transferred outside the chip module 20 by the thermal conductive adhesive 40 can be transferred to the heat sink 30 through the heat conducting member 50. Thus, the thermal connection between the chip module 20 and the heat sink 30 is realized, and the heat dissipation efficiency of the circuit board assembly 100 of the present application is improved.

[0153] In one embodiment, the material of the heat conducting member 50 is a solid material, and along the plane direction of the circuit board 10, the heat conducting member 50 is in contact with the side wall 22 of the chip module 20. When the chip module 20 is working, the heat generated by the chip module 20 can be transferred from the side wall 22 of the chip module 20 to the heat conducting member 50, and transferred to the heat sink 30 by the heat conducting member 50. Thus, the heat transfer path between the chip module 20 and the heat sink 30 is increased, and the heat dissipation efficiency of the circuit board assembly 100 of the present application is improved.

[0154] In one embodiment, the chip module 20 includes a first surface 23 and a plurality of side walls 22, the first surface 23 is convexly provided with solder balls 21, and each side wall 22 is connected to the first surface 23. The plurality of side walls 22 include a first side wall 221. Along the plane direction of the circuit board 10, the first side wall 221 is located between the first heat conducting portion 41 and the second heat conducting portion 42, and the second heat conducting portion 42 is located on one side of the first side wall 221 of the chip module 20. Among them, the number of the heat conducting members 50 is multiple, and the multiple heat conducting members 50 are located on one side of the first side wall 221 of the chip module 20.

[0155] Please refer to Figure 8The schematic top-down sectional structure diagram of the circuit board assembly 100 provided by the embodiment of the present application as shown. Among them, Figure 8 is Figure 4 The schematic top-down sectional structure diagram obtained by looking down at the circuit board 10 after slicing along the first top-down line L1 after removing the heat sink 30.

[0156] As Figure 4 and Figure 8 shown, during the preparation process of the circuit board assembly 100 of the present application, along the plane direction of the circuit board 10, the thermal conductive adhesive 40 extends from the first side wall 221 of the chip module 20 to outside the chip module 20 to form a second thermal conductive part 42. In Figure 8 the shown schematic, the number of the first side walls 221 is one. A plurality of heat conducting members 50 and the second thermal conductive part 42 are located on the same side of the first side wall 221 of the chip module 20 and are in contact with the second thermal conductive part 42.

[0157] In one embodiment, the number of the first side walls 221 is multiple. The number of the heat conducting members 50 is multiple, and a plurality of heat conducting members 50 are arranged on one side of each first side wall 221 of the chip module 20.

[0158] Please refer to Figure 9 and Figure 10 , where Figure 9 is the sectional structure diagram of the circuit board assembly 100 provided by the embodiment of the present application, Figure 10 is the schematic top-down sectional structure diagram of the circuit board assembly 100 provided by the embodiment of the present application in another embodiment. Among them Figure 10 is Figure 9 A schematic top-down sectional structure diagram obtained by looking down at the circuit board 10 after slicing along the second top-down line L2 after removing the heat sink 30.

[0159] As Figure 9 and Figure 10 shown, during the preparation process of the circuit board assembly 100 of the present application, along the plane direction of the circuit board 10, the thermal conductive adhesive 40 extends from each first side wall 221 to outside the chip module 20 along different directions to form a second thermal conductive part 42. In Figure 10 the shown schematic, the number of the first side walls 221 is two, and along the plane direction of the circuit board 10, the two first side walls 221 are two opposite side walls 22 of the chip module 20. A plurality of heat conducting members 50 are arranged on the corresponding side of each first side wall 221 of the chip module 20, and each heat conducting member 50 is in contact with the corresponding second thermal conductive part 42.

[0160] In one embodiment, the second thermal conductive part 42 surrounds the chip module 20. The heat conducting members 50 are used to surround the chip module 20.

[0161] Please see Figure 11 The schematic diagram of the top cross-sectional structure of the circuit board 10 provided in the embodiment of the present application in another embodiment is shown. Figure 11 correspond Figure 9 Another schematic diagram of a top-view cross-sectional structure obtained by looking down toward the circuit board 10 after cutting along the second top-view line L2 after omitting the heat sink 30 .

[0162] like Figure 11 As shown, there are multiple heat-conducting members 50, and the multiple heat-conducting members 50 are spaced around the chip module 20 and are respectively in contact with the second heat-conducting portion 42. Among them, the number of the first side walls 221 is the same as the number of the side walls 22 connected to the first surface 23 of the chip module 20. That is, in the process of preparing the circuit board assembly 100 of the present application, along the plane direction of the circuit board 10, the thermal conductive adhesive 40, on the premise of filling the gap between the chip module 20 and the circuit board 10, extends to the outside of the chip module 20 to form the second heat-conducting portion 42.

[0163] In one embodiment, the heat conducting member 50 is annular, surrounds the chip module 20, and contacts the second heat conducting portion 42. Thus, a heat conducting connection between the chip module 20 and the heat sink 30 is achieved.

[0164] Please see Figure 12 The schematic diagram of the top cross-sectional structure of the circuit board assembly 100 provided in the embodiment of the present application in another embodiment is shown. Figure 12 correspond Figure 9 After omitting the heat sink 30 , another schematic top-view cross-sectional structure diagram is obtained by looking down toward the circuit board 10 after cutting along the second top-view line L2 .

[0165] The number of the first side walls 221 is the same as the number of the side walls 22 of the chip module 20 connected to the first surface 23. That is, in the process of preparing the circuit board assembly 100 of the present application, along the plane direction of the circuit board 10, the thermal conductive adhesive 40 extends to the outside of the chip module 20 to form the second heat conducting portion 42 while filling the gap between the chip module 20 and the circuit board 10.

[0166] In the above four embodiments, the number and arrangement position of the heat conducting members 50 are set based on the position matching of the second heat conducting portion 42 to ensure that the heat conducting adhesive 40 extending outside the chip module 20 in each direction can contact the heat conducting member 50. On the other hand, the provision of multiple heat conducting members 50 also increases the contact area between the second heat conducting portion 42 and the heat conducting member 50, thereby increasing the heat exchange area between the chip module 20 and the heat sink 30. This further reduces the thermal resistance between the chip module 20 and the heat sink 30, and improves the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0167] For ease of description, in subsequent embodiments of the present application, the second heat conducting part 42 surrounds the chip module 20, the material of the heat conducting member 50 is a colloid, and the heat conducting member 50 is annular and surrounds the chip module 20. It is worth noting that for ease of preparing the heat conducting member 50, when the material of the heat conducting member 50 is a colloid, the heat conducting member 50 can be set as annular. When the material of the heat conducting member 50 is a solid material, multiple heat conducting members 50 can be spaced apart to surround the chip module 20.

[0168] In one embodiment, the thermal conductivity of the thermal conductive adhesive 40 is greater than that of air, and the thermal conductivity of the thermal conductive adhesive 40 is greater than that of the circuit board 10. In the embodiment of the present application, the circuit board assembly 100 of the present application fills the thermal conductive adhesive 40 between the chip module 20 and the circuit board 10, exhausting the air between the chip module 20 and the circuit board 10, thereby enhancing the heat transfer efficiency of the circuit board assembly 100 of the present application for the heat released by the solder balls 21 during the operation of the chip module 20.

[0169] Since the circuit board 10 is in contact with the solder balls 21, during the operation of the chip module 20, the heat released by the solder balls 21 will also be released outward through the circuit board 10. In the embodiment of the present application, the thermal conductivity of the thermal conductive adhesive 40 is set to be greater than that of the circuit board 10, so that most of the heat released by the solder balls 21 can be absorbed by the thermal conductive adhesive 40, reducing the situation where the heat released by the solder balls 21 is released outward through the circuit board 10. Thereby improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0170] In one embodiment, the thermal conductivity of the thermal conductive adhesive 40 is greater than or equal to 0.5 w / (m·k). In one embodiment, the thermal conductivity of the thermal conductive adhesive 40 is equal to 1.3 w / (m·k). In one embodiment, the thermal conductivity of the thermal conductive adhesive 40 is equal to 2 w / (m·k).

[0171] In one embodiment, the material of the thermal conductive adhesive 40 includes epoxy resin and a filler material, and the filler material of the thermal conductive adhesive 40 includes alumina and / or silica. During the preparation of the thermal conductive adhesive 40, epoxy resin is used as the matrix material, and alumina and / or silica are filled into the matrix material. Thus, the thermal conductive adhesive 40 required for preparing the circuit board assembly 100 of the present application is formed.

[0172] In one embodiment, the ratio of the mass of the filling material of the thermal conductive adhesive 40 to the sum of the mass of the filling material and the matrix material of the thermal conductive adhesive 40 is greater than or equal to 10%. In one embodiment, the ratio of the mass of the filling material of the thermal conductive adhesive 40 to the sum of the mass of the filling material and the matrix material of the thermal conductive adhesive 40 is greater than or equal to 10%. Exemplarily, in one embodiment, the filling material of the thermal conductive adhesive 40 is silicon oxide, the proportion of epoxy resin in the thermal conductive adhesive 40 is 90%, and the proportion of silicon oxide is 10%. Correspondingly, the thermal conductivity of the thermal conductive adhesive 40 is equal to 0.5 w / (m·k). In another embodiment, the filling material of the thermal conductive adhesive 40 is aluminum oxide, the proportion of epoxy resin in the thermal conductive adhesive 40 is 30%, and the proportion of aluminum oxide is 70%. Correspondingly, the thermal conductivity of the thermal conductive adhesive 40 is equal to 1.4 w / (m·k).

[0173] In one embodiment, the shape of the filling material of the thermal conductive adhesive 40 is flaky.

[0174] In one embodiment, the thermal conductivity of the heat conducting member 50 is greater than the thermal conductivity of air, and the thermal conductivity of the heat conducting member 50 is greater than the thermal conductivity of the circuit board 10. In the embodiment of the present application, the circuit board assembly 100 of the present application is provided with a heat conducting member 50 whose thermal conductivity is greater than the thermal conductivity of air, so that the heat transferred into the thermal conductive adhesive 40 can be transferred to the heat sink 30 by the heat conducting member 50 to a greater extent. Thus, the improvement effect of the setting of the heat conducting member 50 on the heat dissipation efficiency of the circuit board assembly 100 of the present application is ensured.

[0175] Since the circuit board 10 is in contact with the heat conducting member 50 through the second heat conducting portion 42, during the operation of the chip module 20, the heat absorbed by the thermal conductive adhesive 40 will also be released outward through the circuit board 10. In the embodiment of the present application, the thermal conductivity of the heat conducting member 50 is set to be greater than the thermal conductivity of the circuit board 10, so that the heat absorbed by the thermal conductive adhesive 40 can be absorbed by the heat conducting member 50 to a greater extent, thereby reducing the situation that the heat absorbed by the thermal conductive adhesive 40 is released outward through the circuit board 10. Thus, the heat dissipation efficiency of the circuit board assembly 100 of the present application is improved.

[0176] In one embodiment, the thermal conductivity of the heat conducting member 50 is greater than or equal to 6 w / (m·k). In one embodiment, the thermal conductivity of the heat conducting member 50 is equal to 8 w / (m·k). In one embodiment, the thermal conductivity of the heat conducting member 50 is equal to 10 w / (m·k).

[0177] In one embodiment, the material of the heat conducting member 50 includes epoxy resin and a filler material. Among them, the filler material of the heat conducting member 50 includes alumina and / or aluminum nitride. During the preparation of the heat conducting member 50, with epoxy resin as the matrix material, alumina and / or aluminum nitride are filled into the matrix material. Thus, the colloid required for preparing the heat conducting member 50 of the circuit board assembly 100 of the present application is formed. In one embodiment, the filler material of the heat conducting member 50 includes alumina and aluminum nitride. Exemplarily, in one embodiment, the proportion of epoxy resin in the heat conducting member 50 is 20%, the proportion of alumina is 40%, and the proportion of aluminum nitride is 40%. Correspondingly, the thermal conductivity of the heat conducting member 50 is equal to 6 w / (m·k).

[0178] In the embodiment of the present application, when the filler material of the heat conducting member 50 includes aluminum nitride, since the thermal conductivity of alumina is 35 w / (m·k), while the thermal conductivity of aluminum nitride is 250 w / (m·k). The circuit board assembly 100 of the present application adopts the heat conducting member 50 with aluminum nitride to utilize the aluminum nitride to increase the thermal conductivity of the heat conducting member 50, thereby improving the heat transfer efficiency between the heat sink 30 and the thermal conductive adhesive 40, and improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0179] Thus, based on the limitations of the above various embodiments, the circuit board assembly 100 of the present application realizes the thermal connection between the chip module 20 and the heat sink 30 through the contact between the solder balls 21 and the thermal conductive adhesive 40, and the contact between the thermal conductive adhesive 40 and the heat conducting member 50, and reduces the thermal resistance between the chip module 20 and the heat sink 30 by relying on the heat conducting member 50 and the thermal conductive adhesive 40, thereby improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0180] Based on the fact that the circuit board assembly 100 of the present application realizes the thermal connection between the heat sink 30 and the solder balls 21 of the chip module 20 through the heat conducting member 50 and the thermal conductive adhesive 40, and reduces the thermal resistance between the heat sink 30 and the chip module 20 to improve the heat dissipation efficiency. When the circuit board assembly 100 of the present application is applied to an electronic device, the electronic device of the present application can cooperate with the circuit board assembly 100 and the screen 202 through the battery 203 to realize the display function of the electronic device. The improvement of the heat dissipation efficiency of the circuit board assembly 100 also improves the heat dissipation efficiency of the electronic device, ensuring the reliability of the electronic device of the present application.

[0181] The circuit board assembly 100 of the present application can also be applied to other usage scenarios where power signals are received and processed. Exemplarily, the structure of the circuit board assembly 100 is applied to electronic devices such as tablets, computers, mobile phones, wearable devices, etc. The present application does not make any special restrictions in this regard. Since the circuit board assembly 100 of the present application includes a heat conducting member 50 and a heat conducting adhesive 40, the heat conducting member 50 and the heat conducting adhesive 40 can reduce the thermal resistance between the chip module 20 and the heat sink 30, so as to improve the heat dissipation efficiency of the circuit board assembly 100. In other usage scenarios, the electronic devices applying the circuit board assembly 100 of the present application have higher heat dissipation efficiency and better reliability.

[0182] In one embodiment, the circuit board assembly 100 of the present application includes a second heat conducting member 60. The material of the second heat conducting member 60 is a colloid. Along the thickness direction of the circuit board 10, the second heat conducting member 60 is used to fill the installation gap between the heat sink 30 and the chip module 20.

[0183] Please look back Figure 9 , along the thickness direction of the circuit board 10, the surface of the chip module 20 facing away from the circuit board 10 is thermally connected to the heat sink 30 through the second heat conducting member 60. When the chip module 20 is working, the heat generated by the chip module 20 is transferred from the surface of the chip module 20 facing away from the circuit board 10 to the second heat conducting member 60, and is transferred from the second heat conducting member 60 to the heat sink 30. Thereby further reducing the thermal resistance between the chip module 20 and the heat sink 30, and further improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0184] On the other hand, based on the existence of an installation gap between the heat sink 30 and the chip module 20, the setting of the second heat conducting member 60 can also discharge the air between the heat sink 30 and the chip module 20, thereby reducing the thermal resistance between the chip module 20 and the heat sink 30, and improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0185] In one embodiment, the material of the second heat conducting member 60 is the same as that of the heat conducting member 50.

[0186] In one embodiment, the chip module 20 includes two stacked chips 24. The two chips 24 are electrically connected through a second solder ball 25. Among them: a second heat conducting adhesive 26 is filled between the two chips 24. The second heat conducting adhesive 26 is used to be thermally connected to the second solder ball 25 and the heat conducting member 50 respectively.

[0187] In Figure 9In the shown schematic diagram, when the two chips 24 are operating, the heat generating units inside the two chips 24 will generate heat. This part of the heat will dissipate in all directions, causing the temperatures of the outer casings of each chip 24 and the second solder balls 25 to rise. Since the material of the outer casing of each chip 24 is usually a plastic encapsulation material, and in order to achieve conduction between the two chips 24, the material of the second solder balls 25 is usually a metal material. Among them, the thermal conductivity coefficient of the plastic encapsulation material is less than that of the metal material. Therefore, the heat generated when the two chips 24 are operating is mainly transferred outward through the second solder balls 25. That is to say, the second solder balls 25 are equivalent to the main heat sources exposed to the outside between the two chips 24.

[0188] In the embodiment of the present application, the second thermal conductive adhesive 26 is filled between the two chips 24 and is in contact with the second solder balls 25. The second thermal conductive adhesive 26 is used to absorb the heat transferred to the second solder balls 25 when the two chips 24 are operating, and transfer the heat to the heat conducting member 50, and then from the heat conducting member 50 to the heat dissipating member 30. Thus, heat dissipation of the second solder balls 25 is achieved.

[0189] In the prior art, a chip module includes two stacked chips. One of the two chips is thermally connected to the heat dissipating member, and the other chip of the two chips is close to the circuit board. The two chips are conducted through the second solder balls. When the two chips are operating, both chips will generate heat. At this time, if the heat generated by the chip close to the circuit board is too large, the heat generated by the chip close to the circuit board will be transferred to the outer casing of the other chip through the second solder balls, and transferred from the outer casing of the other chip to the heat dissipating member. And because the thermal conductivity coefficient of the outer casing of the chip is small, correspondingly, the thermal resistance between the chip module and the heat dissipating member is relatively large, resulting in poor heat dissipation efficiency of the chip module.

[0190] The circuit board assembly 100 of the present application realizes the thermal connection between the chip module 20 and the heat dissipating member 30 through the contact between the second solder balls 25 and the second thermal conductive adhesive 26, and the contact between the second thermal conductive adhesive 26 and the heat conducting member 50, so that the heat generated when the two chips 24 are operating can be sequentially transferred to the heat dissipating member 30 through the second solder balls 25, the second thermal conductive adhesive 26 and the heat conducting member 50.

[0191] Since the second thermal conductive adhesive 26 has a large thermal conductivity coefficient. The circuit board assembly 100 of the present application further reduces the thermal resistance between the chip module 20 and the heat dissipating member 30 in cooperation with the thermal conductive adhesive 40, increasing the heat transfer efficiency between the chip module 20 and the heat dissipating member 30. Thereby further improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0192] On the other hand, compared with the solution in the prior art where two chips are arranged at intervals, the circuit board assembly 100 of the present application stacks two chips 24, reducing the space occupied by the chip module 20 on the circuit board 10 and making the structure of the circuit board assembly 100 of the present application compact.

[0193] In one embodiment, each chip 24 includes a heat-conducting surface 241. Along the thickness direction of the circuit board 10, the two heat-conducting surfaces 241 of the two chips 24 face each other, and the areas of the two heat-conducting surfaces 241 of the two chips 24 are equal. Along the plane direction of the circuit board 10, the second heat-conducting adhesive 26 is flush with the side walls of the two chips 24 and contacts the heat-conducting member 50.

[0194] Please refer to Figure 13 the schematic cross-sectional structure diagram of the circuit board assembly 100 provided by the embodiment of the present application shown in

[0195] As Figure 13 shown, the side walls of the two chips 24 are flush, and the heat-conducting member 50 contacts the side walls of the two chips 24 and contacts the second heat-conducting adhesive 26 to ensure that the heat released by the two chips 24 through the second solder balls 25 during operation can be transferred to the heat-conducting member 50 via the second heat-conducting adhesive 26. Thus, the heat dissipation function of the circuit board assembly 100 of the present application for the two chips 24 is ensured.

[0196] In one embodiment, the two chips 24 include a first chip 24a and a second chip 24b. The area of the heat-conducting surface 241 of the first chip 24a is larger than the area of the heat-conducting surface 241 of the second chip 24b. A part of the second heat-conducting adhesive 26 is located between the first chip 24a and the second chip 24b, and another part of the second heat-conducting adhesive 26 is located outside the second chip and contacts the heat-conducting member 50.

[0197] For ease of description, a part of the second heat-conducting adhesive 26 is defined as the third heat-conducting portion 261, and another part of the second heat-conducting adhesive 26 is defined as the fourth heat-conducting portion 262.

[0198] Please look back at Figure 9, along the thickness direction of the circuit board 10, the projection of the second chip 24b on the first chip 24a is received on the first chip 24a. The third heat conducting part 261 is used to fill the gap between the first chip 24a and the second chip 24b and is in contact with the second solder ball 25, and the fourth heat conducting part 262 is located outside the second chip 24b. That is, when the two chips 24 are working, the third heat conducting part 261 absorbs the heat released by the second solder ball 25 through contact with the second solder ball 25, and the fourth heat conducting part 262 transfers the heat of the second solder ball 25 outside the second chip 24b by absorbing the heat absorbed by the third heat conducting part 261. The heat conducting member 50 is in contact with the fourth heat conducting part 262 to absorb the heat of the second solder ball 25 transferred by the fourth heat conducting part 262 and transfer the heat to the heat dissipating member 30.

[0199] In Figure 9 In the schematic diagram shown, along the thickness direction of the circuit board 10, the first chip 24a is closer to the circuit board 10 than the second chip 24b, and the first chip 24a is electrically connected to the circuit board 10 through the solder ball 21. In another embodiment, along the thickness direction of the circuit board 10, the first chip 24a is farther from the circuit board 10 than the second chip 24b, and the second chip 24b is electrically connected to the circuit board 10 through the solder ball 21. In some other embodiments, the chip module 20 includes multiple chips 24, the number of chips 24 is greater than two, and the first chip 24a and the second chip 24b are any two stacked chips 24 among them.

[0200] In one embodiment, the chip module 20 includes one chip 24, and the chip 24 is electrically connected to the circuit board 10 through the solder ball 21, wherein: along the thickness direction of the circuit board 10, the surface of the chip 24 facing away from the circuit board 10 is thermally connected to the heat dissipating member 30.

[0201] Please refer to Figure 14 Another structural schematic diagram of the circuit board assembly 100 provided by the embodiment of the present application shown.

[0202] As Figure 14 shown, the heat conducting member 50 is in contact with the side wall of the chip 24. When the chip 24 is working, the heat generated by the chip 24 is sequentially transferred to the heat conducting adhesive 40 and the heat conducting member 50 through the solder ball 21. The heat generated by the chip 24 can also be transferred from the side wall of the chip 24 to the heat conducting member 50 through the outer shell of the chip 24. The heat transferred to the heat conducting member 50 is transferred to the heat dissipating member 30. On the other hand, the heat generated by the chip 24 can also be transferred from the surface of the chip 24 facing away from the circuit board 10 to the heat dissipating member 30 through the outer shell of the chip 24. Thus, the thermal connection between the chip 24 and the heat dissipating member 30 is realized, and the thermal resistance between the chip 24 and the heat dissipating member 30 is reduced by relying on the heat conducting member 50 and the heat conducting adhesive 40, and the thermal conductivity coefficient of the circuit board assembly 100 of the present application is improved.

[0203] In this embodiment, the chip 24 is a system on chip (SOC).

[0204] For ease of description, in the illustrations of the embodiments of the present application and subsequent embodiments, it is shown that the chip module 20 includes two chips 24. Along the thickness direction of the circuit board 10, the first chip 24a is closer to the circuit board 10 than the second chip 24b. The first chip 24a is electrically connected to the circuit board 10 through solder balls 21.

[0205] In one embodiment, the first chip 24a is a system on chip (SOC). Among them, as Figure 15 shown, the solder balls 21 of the first chip 24a are arranged in a full array on the surface of the first chip 24a facing the circuit board 10. During the preparation of the circuit board assembly 100 of the present application, when filling the thermal conductive adhesive 40 between the first chip 24a and the circuit board 10, dispensing can be performed along the outer edges of any two adjacent side walls of the first chip 24a. In one embodiment, as Figure 15 shown, when filling the thermal conductive adhesive 40 between the first chip 24a and the circuit board 10, dispensing can be performed in the Figure 15 direction shown by the arrow. In another embodiment, when filling the thermal conductive adhesive 40 between the first chip 24a and the circuit board 10, dispensing can also be performed in other ways, and it is ensured that the thermal conductive adhesive 40 fills the gap between the first chip 24a and the circuit board 10.

[0206] In one embodiment, the second chip 24b is a double data rate synchronous dynamic random access memory (DDR). Among them, as Figure 16 shown, the second solder balls 25 of the second chip 24b are not arranged in a full array on the surface of the second chip 24b facing the first chip 24a. In the Figure 16 schematic diagram shown, each of the second solder balls 25 is arranged in an array around the central area of the surface of the second chip 24b facing the first chip 24a. During the preparation of the circuit board assembly 100 of the present application, when filling the second thermal conductive adhesive 26 between the second chip 24b and the first chip 24a, dispensing can be performed along the outer edges of any three adjacent side walls of the second chip 24b. In one embodiment, as Figure 16 shown, when filling the second thermal conductive adhesive 26 between the second chip 24b and the first chip 24a, dispensing can be performed in the Figure 16 direction shown by the arrow. In another embodiment, when filling the second thermal conductive adhesive 26 between the second chip 24b and the first chip 24a, dispensing can also be performed in other ways, and it is ensured that the second thermal conductive adhesive 26 fills the gap between the first chip 24a and the second chip 24b.

[0207] In one embodiment, the materials of the third heat-conducting part 261 and the fourth heat-conducting part 262 are the same, and the material of the heat-conducting member 50 is different from that of the fourth heat-conducting part 262. As Figure 9 shown, part of the second heat-conducting adhesive 26 is filled between the first chip 24a and the second chip 24b, and the other part of the second heat-conducting adhesive 26 overflows from between the first chip 24a and the second chip 24b to facilitate contact with the heat-conducting member 50. During the preparation of the circuit board assembly 100 of the present application, the second heat-conducting adhesive 26 with the same material can be first filled between the first chip 24a and the second chip 24b, and part of the second heat-conducting adhesive 26 is made to overflow outside the second chip 24b. Thus, the third heat-conducting part 261 and the fourth heat-conducting part 262 are respectively formed. Then, a colloid with the same material as the heat-conducting member 50 is coated on the second heat-conducting part 42, and the colloid is made to contact the fourth heat-conducting part 262 until the colloid contacts the heat-dissipating member 30. Thus, the heat-conducting member 50 is formed.

[0208] In one embodiment, the materials of the third heat-conducting part 261 and the fourth heat-conducting part 262 are different, and the material of the heat-conducting member 50 is the same as that of the fourth heat-conducting part 262.

[0209] Please refer to Figure 17 the schematic cross-sectional structure diagram of the circuit board assembly 100 provided by the embodiment of the present application shown in another embodiment.

[0210] Specifically, as Figure 17 shown, the heat-conducting member 50 and the fourth heat-conducting part 262 are formed as one body. The third heat-conducting part 261 is filled between the first chip 24a and the second chip 24b. Along the plane direction of the circuit board 10, the third heat-conducting part 261 is flush with the side wall of the second chip 24b to facilitate contact with the fourth heat-conducting part 262. During the preparation of the circuit board assembly 100 of the present application, a colloid with the same material as the third heat-conducting part 261 can be first filled between the first chip 24a and the second chip 24b, and then the overflowing colloid is processed to ensure that the colloid is flush with the side wall of the second chip 24b. Thus, the third heat-conducting part 261 is formed. Then, a colloid with the same material as the heat-conducting member 50 is coated on the second heat-conducting part 42, and the colloid is made to contact the third heat-conducting part 261 until the colloid contacts the heat-dissipating member 30. Thus, the fourth heat-conducting part 262 and the heat-conducting member 50 are formed.

[0211] In one embodiment, the material of the heat-conducting member 50 is the same as that of the fourth heat-conducting part 262, and the material of the third heat-conducting part 261 includes a variety of second adhesive materials, and at least one of the variety of second adhesive materials has the same material as the heat-conducting member 50.

[0212] Please refer to Figure 18Schematic cross-sectional structure diagram of the circuit board assembly 100 provided by the embodiment of the present application in another embodiment.

[0213] Specifically, as Figure 18 shown, the heat conducting member 50 and the fourth heat conducting portion 262 are formed as one body. Along the thickness direction of the circuit board 10, the third heat conducting portion 261 is filled between the first chip 24a and the second chip 24b, and a part of the heat conducting member 50 is filled between the first chip 24a and the second chip 24b and contacts the third heat conducting portion 261. During the preparation process of the circuit board assembly 100 of the present application, a colloid having the same material as that of the third heat conducting portion 261 can be filled between the first chip 24a and the second chip 24b first, and the colloid is prevented from overflowing between the first chip 24a and the second chip 24b. Then, a colloid having the same material as that of the heat conducting member 50 is coated on the second heat conducting portion 42, and the colloid can flow into the space between the first chip 24a and the second chip 24b and contact the colloid set in the previous step. Thus, the third heat conducting portion 261 is formed. When the colloid contacts the heat dissipating member 30, the colloid located outside the chip module 20 forms the fourth heat conducting portion 262 and the heat conducting member 50.

[0214] In one embodiment, the thermal conductivity of the second thermal conductive adhesive 26 is greater than the thermal conductivity of air.

[0215] In one embodiment, the material of the third heat conducting portion 261 is the same as the material of the first heat conducting portion 41.

[0216] In one embodiment, the material of the fourth heat conducting portion 262 is the same as the material of the second heat conducting portion 42.

[0217] In one embodiment, the material of the first heat conducting portion 41 is the same as the material of the second heat conducting portion 42, and the materials of the third heat conducting portion 261 and the fourth heat conducting portion 262 are the same. The thermal conductive adhesive 40 and the second thermal conductive adhesive 26 have the same material.

[0218] In one embodiment, each chip 24 includes a heat conducting surface 241. Along the thickness direction of the circuit board 10, the two heat conducting surfaces 241 of the two chips 24 face each other, and at least one heat conducting surface 241 includes a heat dissipating pad 242. The heat dissipating pad 242 is used to extend into the interior of the chip 24 and is thermally connected to the heat generating unit 243 of the chip 24. The second thermal conductive adhesive 26 or the heat conducting member 50 is also used to thermally connect the heat dissipating pad 242.

[0219] Please refer to Figures 19 - 21 , where Figure 19 is a schematic cross-sectional structure diagram of the internal structure of the chip 24 of the circuit board assembly 100 provided by the embodiment of the present application, Figure 20 is another schematic cross-sectional structure diagram of the internal structure of the chip 24 of the circuit board assembly 100 provided by the embodiment of the present application, Figure 21This is a top - view structural schematic diagram of the chip module 20 of the circuit board assembly 100 provided by an embodiment of the present application. Among them, to facilitate the display of the relative position of the heat - dissipation pad 242, in Figure 21 the shown top - view structural schematic diagram, the second thermal conductive adhesive 26 is omitted.

[0220] As Figures 19 - 21 shown, the chip 24 includes a housing 244 and a heat - generating unit 243, and the heat - generating unit 243 is received in the housing 244. For the chip 24 with a heat - dissipation pad 242 provided on the heat - conducting surface 241, along the thickness direction of the circuit board 10, one end of the heat - dissipation pad 242 is received in the housing 244 and is thermally connected to the heat - generating unit 243, and the other end of the heat - dissipation pad 242 exposes from the heat - conducting surface 241 of the chip 24, so as to be thermally connected to the second thermal conductive adhesive 26 or the heat - conducting member 50.

[0221] For the chip 24 with a heat - dissipation pad 242 provided on the heat - conducting surface 241, during the operation of the chip 24, the heat generated is transferred to the heat - dissipating member 30 through the second solder ball 25, the second thermal conductive adhesive 26, and the heat - conducting member 50 in sequence, and can also be transferred to the heat - dissipating member 30 through the heat - dissipation pad 242. That is, the setting of the heat - dissipation pad 242 increases the heat - transfer path between the chip 24 and the heat - dissipating member 30. Thereby, the thermal resistance between the chip module 20 and the heat - dissipating member 30 is further reduced, and the heat - dissipation efficiency of the circuit board assembly 100 of the present application is further improved.

[0222] In one embodiment, the number of the heat - dissipation pads 242 is multiple, so as to increase the heat - exchange area between the heat - generating unit 243 of the chip 24 and the second thermal conductive adhesive 26 or the heat - conducting member 50, thereby further improving the heat - dissipation efficiency of the circuit board assembly 100 of the present application.

[0223] In one embodiment, the area of the heat - conducting surface 241 of the first chip 24a is larger than the area of the heat - conducting surface 241 of the second chip 24b, the heat - dissipation pad 242 is located on the heat - conducting surface 241 of the first chip 24a, and along the thickness direction of the circuit board 10, the projection of the second chip 24b on the heat - conducting surface 241 of the first chip 24a does not cover the heat - dissipation pad 242.

[0224] In one embodiment, as Figure 19 shown, along the plane direction of the circuit board 10, the heat - dissipation pad 242 is located outside the second chip 24b and contacts the fourth heat - conducting portion 262 of the second thermal conductive adhesive 26. When the chip 24 with the heat - dissipation pad 242 works, the heat generated by the heat - generating unit 243 of the chip 24 will be transferred to the fourth heat - conducting portion 262 and the heat - conducting member 50 through the heat - dissipation pad 242 in sequence, and is transferred to the heat - dissipating member 30 by the heat - conducting member 50. Thus, the thermal connection between the chip module 20 and the heat - dissipating member 30 is realized.

[0225] In one embodiment, as Figure 20As shown, along the planar direction of the circuit board 10, the heat dissipation pad 242 is located outside the second chip 24b and is spaced apart from the fourth heat conduction portion 262 of the second thermal conductive adhesive 26. The heat dissipation pad 242 is in contact with the heat conduction member 50. When the chip 24 having the heat dissipation pad 242 operates, the heat generated by the heat generating unit 243 of the chip 24 is transferred to the heat conduction member 50 through the heat dissipation pad 242 and is transferred to the heat dissipation member 30 by the heat conduction member 50. Thus, a heat conduction connection between the chip module 20 and the heat dissipation member 30 is achieved.

[0226] In the above two embodiments, as Figures 19 - 21 shown, the heat dissipation pad 242 is disposed on the heat conduction surface 241 of the first chip 24a. In another embodiment, the heat dissipation pad 242 may also be disposed on the heat conduction surface 241 of the second chip 24b.

[0227] In one embodiment, along the planar direction of the circuit board 10, the heat dissipation pad 242 is located outside the second chip 24b and is in contact with the fourth heat conduction portion 262 of the second thermal conductive adhesive 26 and the heat conduction member 50 respectively.

[0228] In one embodiment, the heat dissipation pad 242 is located between the two chips 24 and is arranged at intervals from the second solder ball 25. The heat dissipation pad 242 is in contact with the second thermal conductive adhesive 26 to conduct heat and connect to the second thermal conductive adhesive 26.

[0229] Please refer to Figure 22 another cross-sectional structure diagram of the internal structure of the chip 24 of the circuit board assembly 100 provided by the embodiment of the present application shown.

[0230] As Figure 22 shown, along the thickness direction of the circuit board 10, the second solder ball 25 is located on the heat conduction surface 241 of the first chip 24a, and the projection of the second chip 24b on the first chip 24a covers the heat dissipation pad 242. The second thermal conductive adhesive 26 is used to fill the gap between the first chip 24a and the second chip 24b and is in contact with the second solder ball 25 and the heat dissipation pad 242 respectively. When the first chip 24a operates, the heat generated by the heat generating unit 243 of the first chip 24a can be transferred to the second thermal conductive adhesive 26 through the heat dissipation pad 242 and is transferred to the heat dissipation member 30 through the heat conduction member 50. Thus, a heat conduction connection between the chip module 20 and the heat dissipation member 30 is achieved.

[0231] In one embodiment, the chip module 20 includes a first chip 24a and a second chip 24b. The first chip 24a and the second chip 24b are conducted through the second solder ball 25. The area of the heat conduction surface 241 of the first chip 24a is larger than the area of the heat conduction surface 241 of the second chip 24b. The heat dissipation pad 242 is located on the heat conduction surface 241 of the first chip 24a and is arranged at intervals from the second chip 24b. The heat dissipation pad 242 is in contact with the heat conduction member 50.

[0232] Please refer to Figure 23 Another cross-sectional structure schematic diagram of the internal structure of the chip 24 of the circuit board assembly 100 provided by the embodiment of the present application shown in the figure.

[0233] As Figure 23 As shown in the figure, when the first chip 24a is working, the heat generated by the heat generating unit 243 of the first chip 24a can be transferred to the heat conducting member 50 through the heat dissipation pad 242, and transferred to the heat dissipation member 30 through the heat conducting member 50. Thus, the heat conducting connection between the first chip 24a and the heat dissipation member 30 is realized, and the heat resistance between the first chip 24a and the heat dissipation member 30 is reduced by relying on the heat dissipation pad 242, improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0234] In one embodiment, the material of the heat dissipation pad 242 is copper.

[0235] In one embodiment, the chip module 20 includes a first chip 24a and a second chip 24b. The first chip 24a and the second chip 24b are conducted through the second solder ball 25. Along the thickness direction of the circuit board 10, the first chip 24a is closer to the circuit board 10 than the second chip 24b. The second chip 24b is thermally connected to the heat dissipation member 30, and the material of the surface of the second chip 24b facing the heat dissipation member 30 includes metal.

[0236] When the circuit board assembly 100 of the present application is working, a part of the heat in the second chip 24b comes from the heat generated by the operation of the heat generating unit 243 inside the second chip 24b, and the other part comes from the heat transferred from the first chip 24a to the second chip 24b through the second solder ball 25. At this time, the heat in the second chip 24b can be transferred to the heat dissipation member 30 through the surface of the second chip 24b facing the heat dissipation member 30.

[0237] In the embodiment of the present application, since the thermal conductivity coefficient of the metal is greater than that of the plastic encapsulation material, setting the material of the surface of the second chip 24b facing the heat dissipation member 30 as metal can reduce the thermal resistance between the second chip 24b and the heat dissipation member 30, thereby improving the heat dissipation efficiency of the circuit board assembly 100 of the present application. In one embodiment, during the preparation process of the circuit board assembly 100 of the present application, a metal coating can be provided on the surface of the second chip 24b facing the heat dissipation member 30 through a vapor deposition process.

[0238] In one embodiment, along the thickness direction of the circuit board 10, the surface of the circuit board 10 facing the chip module 20 includes a second heat dissipation pad 11. One end of the second heat dissipation pad 11 extends into the circuit board 10, and the other end of the second heat dissipation pad 11 is exposed on the surface of the circuit board 10 facing the chip module 20. The other end of the second heat dissipation pad 11 is spaced from the solder ball 21 in the plane direction of the circuit board 10 and is thermally connected to the thermal conductive adhesive 40.

[0239] Please refer to Figure 24 the schematic structural diagram of the internal structure of the circuit board 10 of the circuit board assembly 100 provided by the embodiment of the present application shown in

[0240] As Figure 24 shown, since the solder balls 21 are in contact with the circuit board 10, during the operation of the chip module 20, the heat generated by the chip module 20 will also be transferred to the circuit board 10 through the solder balls 21. The circuit board 10 will also generate heat during operation. In the embodiment of the present application, the second heat dissipation pad 11 is used to absorb the heat of the circuit board 10, and transfer the heat to the heat conducting member 50 through the heat conducting adhesive 40, and then transferred to the heat dissipating member 30 by the heat conducting member 50. Thus, the heat conduction connection between the circuit board 10 and the heat dissipating member 30 is realized.

[0241] In one embodiment, one end of the second heat dissipation pad 11 extends into the circuit board 10, and the other end of the second heat dissipation pad 11 is exposed on the surface of the circuit board 10 facing the chip module 20. The other end of the second heat dissipation pad 11 is thermally connected to the heat conducting member 50.

[0242] Please refer to Figure 25 another schematic structural diagram of the internal structure of the circuit board 10 of the circuit board assembly 100 provided by the embodiment of the present application shown in

[0243] As Figure 25 shown, the second heat dissipation pad 11 is used to absorb the heat of the circuit board 10, and transfer the heat to the heat dissipating member 30 through the heat conducting member 50. Thus, the heat conduction connection between the circuit board 10 and the heat dissipating member 30 is realized.

[0244] In the above two embodiments, the setting of the second heat dissipation pad 11 reduces the influence of the heat of the circuit board 10 on the operation of the chip module 20. On the other hand, since part of the heat of the circuit board 10 comes from the heat released by the solder balls 21 during the operation of the chip module 20. The setting of the second heat dissipation pad 11 increases the heat transfer path between the solder balls 21 and the heat dissipating member 30, and further improves the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0245] In one embodiment, the heat dissipating member 30 includes a heat sink 31 and a shielding cover 32. Along the thickness direction of the circuit board 10, the shielding cover 32 is attached to the surface of the heat sink 31 facing the chip module 20. The projection of the shielding cover 32 covers the chip module 20, the heat conducting adhesive 40 and the heat conducting member 50. The outer edge of the shielding cover 32 includes a convex portion 321, and the convex portion 321 extends towards the circuit board 10 and is fixedly connected to the circuit board 10. The convex portion 321 at least surrounds the chip module 20 and the heat conducting member 50.

[0246] As Figure 9As shown, one end of the protruding portion 321 of the shielding cover 32 away from the heat sink 31 is in contact with the circuit board 10. The protruding portion 321 is used to surround the chip module 20 to shield the propagation of electromagnetic waves and avoid the influence of electromagnetic waves on the operation of the chip module 20. Thus, the operation of the circuit board assembly 100 of the present application is stable. During the operation of the chip module 20 in the present application, the heat released by the solder balls 21 of the chip module 20 is transferred to the shielding cover 32 through the thermal conductive adhesive 40 and the heat conducting member 50, and then transferred from the shielding cover 32 to the heat sink 31, and finally the heat sink 31 dissipates the heat.

[0247] In this embodiment, one end of the protruding portion 321 away from the heat sink 31 is in contact with the circuit board 10. In some other embodiments, there may be a gap between one end of the protruding portion 321 away from the heat sink 31 and the circuit board 10.

[0248] In one embodiment, the heat dissipating member 30 includes a heat sink 31. Along the thickness direction of the circuit board 10, the heat sink 31 is located on the side of the chip module 20 away from the circuit board 10 and is thermally connected to the chip module 20 and the heat conducting member 50.

[0249] Please refer to Figure 26 Another structural schematic diagram of the circuit board assembly 100 provided by the embodiment of the present application shown.

[0250] As Figure 26 shown, along the thickness direction of the circuit board 10, the projection of the heat sink 31 covers the chip module 20 and the heat conducting member 50, so as to facilitate the thermal connection between the heat conducting member 50 and the chip module 20 and the heat sink 31.

[0251] In one embodiment, the material of the heat sink 31 is graphite.

[0252] In one embodiment, the circuit board assembly 100 of the present application further includes a retaining wall 70. The retaining wall 70 is fixed to the circuit board 10 and extends towards the heat dissipating member 30. Along the plane direction of the circuit board 10, the retaining wall 70 is spaced apart from the chip module 20, and the second heat conducting portion 42 and the heat conducting member 50 are located between the chip module 20 and the retaining wall 70.

[0253] Please refer to Figure 27 The structural schematic diagram of the retaining wall 70 of the circuit board assembly 100 provided by the embodiment of the present application shown.

[0254] As Figure 27 shown, along the plane direction of the circuit board 10, the retaining wall 70 is used to limit the flow range of the thermal conductive adhesive 40, so as to avoid affecting the installation of other components 1001 mounted on the circuit board 10 due to the over-large flow range of the thermal conductive adhesive 40 during the preparation process of the circuit board assembly 100 of the present application.

[0255] In the embodiment of the present application, the material of the heat conductive member 50 is a colloid, and the retaining wall 70 is also used to limit the flow range of the heat conductive member 50, so as to facilitate the heat conductive member 50 to be filled to contact with the heat sink 30 during the preparation process of the circuit board assembly 100 of the present application. That is, the retaining wall 70 is used to ensure the filling height of the heat conductive member 50, ensuring that the heat conductive member 50 can contact with the heat sink 30 and the thermal conductive adhesive 40 respectively. On the other hand, the setting of the retaining wall 70 can also prevent the installation of other components 1001 mounted on the circuit board 10 from being affected by the excessive flow range of the heat conductive member 50 during the preparation process of the circuit board assembly 100 of the present application.

[0256] In one embodiment, the second heat conducting portion 42 surrounds the chip module 20 along the plane direction of the circuit board 10 . There are multiple retaining walls 70 , and the multiple retaining walls 70 are used to surround the thermal conductive adhesive 40 .

[0257] Please see Figure 28 and Figure 29 ,in Figure 28 Another structural schematic diagram of the retaining wall 70 of the circuit board assembly 100 provided in an embodiment of the present application is shown in FIG. Figure 29 This is a partial top view of the circuit board assembly 100 provided in an embodiment of the present application. Figure 29 for Figure 28 After omitting the heat sink 30 , a partial top view structural schematic diagram is obtained by looking down toward the circuit board 10 after cutting along the third top view line L3 .

[0258] like Figure 28 and Figure 29 As shown, a plurality of retaining walls 70 are spaced around the thermally conductive adhesive 40 to further limit the flow range of the thermally conductive adhesive 40. In the embodiment of the present application, the material of the thermally conductive member 50 is a colloid. Along the plane direction of the circuit board 10, each retaining wall 70 contacts the thermally conductive member 50 on the surface facing the chip module 20 to further limit the flow range of the thermally conductive member 50, so as to facilitate the preparation of the thermally conductive member 50 in contact with the heat sink 30 and the thermally conductive adhesive 40.

[0259] In one embodiment, the second heat conducting portion 42 surrounds the chip module 20 along the plane direction of the circuit board 10. The retaining wall 70 is annular and is used to surround the thermal conductive adhesive 40.

[0260] Please see Figure 30 Another partial top view of the circuit board assembly 100 provided in the embodiment of the present application is shown. Figure 30 for Figure 28 After omitting the heat sink 30 , another partial top view schematic diagram is obtained by looking down toward the circuit board 10 after cutting along the third top view line L3 .

[0261] like Figure 30As shown, the annular retaining wall 70 is used to further limit the flow range of the thermal conductive adhesive 40. In the embodiment of the present application, the material of the heat conducting member 50 is a colloid. Along the plane direction of the circuit board 10, the inner surface of the annular retaining wall 70 contacts the heat conducting member 50 to further limit the flow range of the heat conducting member 50, facilitating the preparation of the heat conducting member 50 that contacts the heat dissipating member 30 and the thermal conductive adhesive 40.

[0262] In one embodiment, the height of the retaining wall 70 along the thickness direction of the circuit board 10 is greater than or equal to the height of the chip module 20. When the material of the heat conducting member 50 is a colloid, the heat conducting member 50 contacts the side wall 22 of the chip module 20. In the embodiment of the present application, the retaining wall 70 with a height greater than or equal to the height of the chip module 20 is provided to facilitate ensuring the contact relationship between the heat conducting member 50 and the side wall 22 of the chip module 20 when preparing the heat conducting member 50. On the other hand, providing the retaining wall 70 with a height greater than or equal to the height of the chip module 20 is also beneficial to preparing the heat conducting member 50 that contacts the heat dissipating member 30 and the thermal conductive adhesive 40.

[0263] In one embodiment, the height of the retaining wall 70 along the thickness direction of the circuit board 10 is less than or equal to the spacing distance between the heat dissipating member 30 and the circuit board 10.

[0264] Please refer to Figure 31 Another schematic diagram of the retaining wall 70 of the circuit board assembly 100 provided by the embodiment of the present application shown.

[0265] As Figure 31 shown, along the thickness direction of the circuit board 10, the end of the retaining wall 70 away from the circuit board 10 contacts the heat dissipating member 30. In Figure 31 the shown schematic diagram, the heat dissipating member 30 extends out of the chip module 20 along the plane direction of the circuit board 10, and the end of the retaining wall 70 away from the circuit board 10 contacts the surface of the heat dissipating member 30 facing the circuit board 10. When the chip module 20 is working, the heat released by the chip module 20 through the solder balls 21 can be transferred to the heat conducting member 50 and the thermal conductive adhesive 40, and can also be transferred to the retaining wall 70 and then transferred to the heat dissipating member 30 by the retaining wall 70. In the embodiment of the present application, the contact between the retaining wall 70 and the heat dissipating member 30 further increases the heat transfer path between the chip module 20 and the heat dissipating member 30, further reduces the thermal resistance between the chip module 20 and the heat dissipating member 30, and thus further improves the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0266] In Figure 31 the shown schematic diagram, the height of the retaining wall 70 along the thickness direction of the circuit board 10 is equal to the spacing distance between the heat dissipating member 30 and the circuit board 10.

[0267] In another embodiment, the height of the retaining wall 70 in the thickness direction of the circuit board 10 is less than the spacing distance between the heat dissipation member 30 and the circuit board 10. Correspondingly, one end of the retaining wall 70 away from the circuit board 10 is thermally connected to the surface of the heat dissipation member 30 facing the circuit board 10.

[0268] Specifically, in one embodiment, the circuit board assembly further includes a third heat conducting member 80. In the thickness direction of the circuit board 10, the third heat conducting member 80 is used to fill the installation gap between the retaining wall 70 and the heat dissipation member 30 to achieve the thermal connection between the retaining wall 70 and the heat dissipation member 30.

[0269] Please refer to Figure 32 Another structural schematic diagram of the retaining wall 70 of the circuit board assembly 100 provided by the embodiment of the present application shown in the figure.

[0270] As Figure 33 shown in the figure, the retaining wall 70 realizes the thermal connection with the heat dissipation member 30 through the third heat conducting member 80. When the chip module 20 works, the heat generated by the chip module 20 is released through the solder balls 21, and is transmitted to the retaining wall 70 through the heat conducting member 50 and the thermal conductive adhesive 40, and then is transmitted from the retaining wall 70 to the heat dissipation member 30. Thus, the thermal connection between the heat dissipation member 30 and the chip module 20 is realized.

[0271] In one embodiment, the material of the third heat conducting member 80 is the same as that of the second heat conducting member 60.

[0272] In one embodiment, the number of the retaining walls 70 is multiple. At least some of the multiple retaining walls 70 are respectively thermally connected to a heat transfer line 12 in the heat dissipation member 30 and the circuit board 10 in the thickness direction of the circuit board 10. Each heat transfer line 12 extends in the plane direction of the circuit board 10 and is conducted to a heating unit 243 in the chip module 20 through the solder ball 21.

[0273] Please refer to Figure 33 Another structural schematic diagram of the internal structure of the circuit board 10 of the circuit board assembly 100 provided by the embodiment of the present application shown in the figure.

[0274] As Figure 33 shown in the figure, the number of the heating units 243 in the chip 24 conducted to the circuit board 10 in the chip module 20 is multiple, and each heating unit 243 is respectively conducted to a heat transfer line 12 through the solder ball 21. When the chip module 20 works, the heat generated by the operation of the heating unit 243 will be transmitted into the heat transfer line 12 through the solder ball 21. The circuit board assembly 100 of the present application conducts some of the retaining walls 70 to the heat transfer lines 12 conducted by the heating units 243, so that the heat generated when the chip module 20 works can be sequentially transmitted to the retaining walls 70 through the solder balls 21 and the heat transfer lines 12, and is transmitted from the retaining walls 70 to the heat dissipation member 30.

[0275] In the embodiment of the present application, the partial heat barrier 70 is thermally connected to the heat transfer line 12, further increasing the heat transfer path between the chip module 20 and the heat sink 30, further reducing the thermal resistance between the chip module 20 and the heat sink 30, and thus further improving the heat dissipation efficiency of the circuit board assembly 100 of the present application.

[0276] In one embodiment, the material of the heat barrier 70 is metal. In one embodiment, the material of the heat barrier 70 is copper.

[0277] In one embodiment, the circuit board assembly 100 further includes a component 1001, the component 1001 is mounted on the surface of the circuit board 10 where the chip module 20 is mounted, the heat conducting member 50 and the second heat conducting portion 42 are located between the chip module 20 and the component 1001, and the component 1001 forms the heat barrier 70.

[0278] Based on the descriptions of the above two embodiments, when preparing the heat barrier 70 of the circuit board assembly 100 of the present application, copper pillars can be provided on the surface of the circuit board 10 where the chip module 20 is mounted to form the heat barrier 70. Correspondingly, the copper pillars should be thermally connected to the heat sink 30. Other components 1001 on the surface of the circuit board 10 where the chip module 20 is mounted can also be used to form the heat barrier 70. Specifically, when the circuit board assembly 100 of the present application is working, the heat generated by the chip module 20 can be transferred to the heat barrier 70 formed by the copper pillars and then transferred to the heat sink 30 by the heat barrier 70. It can also be transferred to the heat barrier 70 formed by the component 1001 and absorbed by the component 1001.

[0279] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the protection scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. A circuit board assembly, characterized in that, The circuit board assembly includes a circuit board, a chip module, and a heat sink. The chip module and the heat sink are arranged in a stacked manner on the circuit board. The chip module and the circuit board are electrically connected through solder balls, and the heat sink is thermally connected to the chip module. The circuit board assembly further includes a thermal conductive adhesive and a heat conducting member. Along the plane direction of the circuit board, a part of the thermal conductive adhesive fills the gap between the chip module and the circuit board and contacts the solder balls, and another part of the thermal conductive adhesive is located outside the chip module. The heat conducting member extends along the thickness direction of the circuit board, and the heat conducting member is used to be thermally connected to the heat sink and the other part of the thermal conductive adhesive respectively.

2. The circuit board assembly according to claim 1, wherein The material of the heat conducting member is a colloid, and the heat conducting member is also used to fit to the side wall of the chip module, wherein: The heat sink extends out of the chip module along the plane direction of the circuit board, and the heat conducting member is thermally connected to the heat sink by fitting to the surface of the heat sink facing the circuit board; or the heat conducting member is thermally connected to the heat sink by fitting to the side wall of the heat sink.

3. The circuit board assembly according to claim 2, wherein, The material of the heat conducting member includes epoxy resin and a filler material. The filler material of the heat conducting member includes alumina and / or aluminum nitride.

4. The circuit board assembly according to any one of claims 1-3, characterized in that, The material of the thermal conductive adhesive includes epoxy resin and a filler material. The filler material of the thermal conductive adhesive includes alumina and / or silica.

5. The circuit board assembly according to any one of claims 1-4, characterized in that, The chip module includes two stacked chips, and the two chips are electrically connected through second solder balls, wherein: A second thermal conductive adhesive is filled between the two chips, and the second thermal conductive adhesive is used to be thermally connected to the second solder balls and the heat conducting member respectively.

6. The circuit board assembly according to claim 5, wherein, Each chip includes a heat conducting surface. Along the thickness direction of the circuit board, the two heat conducting surfaces of the two chips face each other. At least one of the heat conducting surfaces includes a heat dissipation pad, and the heat dissipation pad is used to extend into the interior of the chip and be thermally connected to the heat generating unit of the chip. The second thermal conductive adhesive or the heat conducting member is also used to be thermally connected to the heat dissipation pad.

7. The circuit board assembly according to claim 6, characterized in that, The two chips include a first chip and a second chip. The area of the heat conducting surface of the first chip is larger than the area of the heat conducting surface of the second chip. The heat dissipation pad is located on the heat conducting surface of the first chip. Along the thickness direction of the circuit board, the projection of the first chip on the heat conducting surface of the second chip does not cover the heat dissipation pad.

8. The circuit board assembly according to any one of claims 1-7, characterized in that, The heat sink includes a heat sink fin and a shielding cover. Along the thickness direction of the circuit board, the shielding cover fits to the surface of the heat sink fin facing the chip module. The projection of the shielding cover covers the chip module, the thermal conductive adhesive, and the heat conducting member. The outer edge of the shielding cover includes a protruding portion, and the protruding portion extends towards the circuit board and is fixedly connected to the circuit board. The protruding portion at least surrounds the chip module and the heat conducting member.

9. The circuit board assembly according to any one of claims 1-8, characterized in that, The circuit board assembly further includes a retaining wall, which is fixed to the circuit board and extends towards the heat dissipation component. Along the plane direction of the circuit board, the retaining wall is spaced from the chip module, and the other part of the thermal conductive adhesive and the heat conducting component are both located between the chip module and the retaining wall.

10. The circuit board assembly according to claim 9, characterized in that, Along the plane direction of the circuit board, the other part of the thermal conductive adhesive surrounds the chip module; The number of the retaining walls is multiple, and the multiple retaining walls are used to surround the thermal conductive adhesive at intervals; alternatively, the retaining wall is annular, and the retaining wall is used to surround the thermal conductive adhesive.

11. The circuit board assembly according to claim 10, wherein, Along the thickness direction of the circuit board, the height of the retaining wall is less than or equal to the spacing distance between the heat dissipation component and the circuit board.

12. The circuit board assembly according to claim 10, wherein, The number of the retaining walls is multiple, and at least some of the multiple retaining walls are respectively thermally connected to a heat transfer line in the heat dissipation component and the circuit board along the thickness direction of the circuit board. Each heat transfer line extends along the plane direction of the circuit board and is electrically connected to the heating unit in the chip module through the solder balls.

13. The circuit board assembly according to claim 12, wherein The material of the retaining wall is metal; and / or, the circuit board assembly further includes components, which are mounted on the surface of the circuit board where the chip module is mounted. The heat conducting component and the other part of the thermal conductive adhesive are located between the chip module and the components, and the components form the retaining wall.

14. An electronic device, characterized in that, The electronic device includes a housing and the circuit board assembly according to any one of claims 1-13, and the circuit board assembly is received in the housing.

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