Laser processing device

By using spectroscopic components and distance-tuning mirrors in the laser processing device, combined with the dimming module, the problem that the laser processing device is difficult to form a light beam with a smaller and consistent spacing is solved, and the processing quality is significantly improved.

CN222696253UActive Publication Date: 2025-04-01LONGI GREEN ENERGY TECH CO LTD
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Patent Information

Application Number
CN202421337114.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-12
Publication Date
2025-04-01
Estimated Expiration
2034-06-12

AI Technical Summary

Technical Problem

It is difficult for existing laser processing devices to take into account the problems of forming light beams with smaller spacing and beam consistency, resulting in inconsistent trenches produced.

Method used

Using a spectroscopic component and a specially made distance-tuning mirror, a smaller spacing laser beam splitting is formed through the reflecting surface on the distance-tuning mirror, and the power density of the laser beam splitting is adjusted through the dimming module to ensure the consistency of the light beam.

Benefits of technology

A laser beam splitting with smaller spacing and higher consistency is achieved, improving the uniform and stable quality of the laser processing process.

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Abstract

The embodiment of the utility model provides a laser processing device, the laser processing device includes: a beam splitter component, the beam splitter component is used to emit at least two laser beams; a distance-adjustable reflector, the distance-adjustable reflector includes at least two reflection surfaces in different planes, the distance-adjustable reflector is arranged on the beam emission path of the beam splitter component, each of the laser beams is irradiated on different reflection surfaces and reflected to form a group of parallel beams. The laser processing device of the embodiment of the utility model can obtain laser beams with smaller spacing, and the mutually parallel reflected beams obtained by reflection by the distance-adjustable reflector have higher consistency, which is more conducive to ensuring the uniform and stable quality of the laser processing process.
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Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, in particular to a laser processing device. Background Art

[0002] Laser processing can be used to process and prepare the required groove structures during the production and manufacturing of semiconductor products such as integrated circuit chips and photovoltaic cells.

[0003] Taking photovoltaic cells as an example, for PERC, Topcon, HJT or BC cells, in the process of preparing the grid lines, it is necessary to use lasers to process grooves for preparing electrodes on the surface of the silicon wafer. As the industry has realized, the use of more detailed and densely arranged grid line structures can effectively increase the short-circuit current, thereby improving battery efficiency. The current laser processing device adjusts the orientation of optical components so that a beam with a smaller spacing can be obtained after the beam is deflected, so as to process more detailed and densely arranged grooves. However, the consistency of the power density and energy distribution of each laser beam obtained by this laser processing device when it hits the processing position is poor, and the consistency of the processed grooves cannot be guaranteed.

[0004] Therefore, when preparing this grid line structure, higher requirements are placed on the laser. The laser processing device needs to be able to form a beam with a smaller spacing to process more detailed and densely arranged grooves, and also needs to be able to ensure the consistency of the power density and energy distribution of each beam. Utility Model Content

[0005] The utility model provides a laser processing device, aiming to solve the problem that the laser processing device is difficult to form a light beam with a smaller spacing and the light beam consistency.

[0006] The present invention provides a laser processing device, which includes:

[0007] A beam splitter component, the beam splitter component is used to emit at least two laser beams;

[0008] A distance-adjustable reflector, the distance-adjustable reflector comprising at least two reflecting surfaces in different planes, the distance-adjustable reflector being arranged on the light beam emission path of the light splitting component,

[0009] Each of the laser beams is irradiated on different reflection surfaces and reflected to form a group of parallel light beams.

[0010] Optionally, when the laser beams are parallel to each other, the reflection surfaces are parallel to each other and arranged at intervals.

[0011] Optionally, the spacings between the reflecting surfaces are the same, increase sequentially, or decrease sequentially.

[0012] Optionally, the angle between each of the laser beams and the corresponding reflecting surface is 45°.

[0013] Optionally, when there are obliquely intersecting light beams in at least two of the laser beam splits, adjacent reflecting surfaces are obliquely intersecting, and corresponding reflecting surfaces are obliquely intersecting or spaced apart.

[0014] Optionally, the light splitting component includes at least one semi-transparent and semi-reflective mirror;

[0015] One of the semi-transparent and semi-reflective mirrors is used for reflection and refraction to form two laser beams.

[0016] Optionally, the light splitting component further comprises a reflecting mirror located on an emission path of the light beam of the semi-transparent and semi-reflective mirror.

[0017] Optionally, the light splitting component further includes a dimming module; the dimming module is arranged on the light beam emission path of the reflector, and the dimming module is used to adjust the power density of the laser beam.

[0018] Optionally, the dimming module includes a wave plate and a PBS prism;

[0019] The wave plate is located on the optical path between the PBS prism and the reflector, and the PBS prism is located on the optical path between the wave plate and the distance-adjustable reflector.

[0020] Optionally, the optical splitter component includes an SLM, a DMD, a DOE, an MLA or a beam mask splitter.

[0021] The laser processing device of the embodiment of the utility model can obtain laser beam splitting with a smaller spacing by installing a special distance-adjustable reflector on the light beam emission path of the splitting component and utilizing at least two skew reflective surfaces on the distance-adjustable reflector. In addition, the mutually parallel reflected light beams obtained by reflection by the distance-adjustable reflector have higher consistency, which is more conducive to ensuring the uniform and stable quality of the laser processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments of the utility model will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A simplified schematic diagram of a laser processing device used in a first distance-adjustable reflector in an embodiment of the utility model is shown;

[0024] Figure 2The utility model embodiment is shown Figure 1 Schematic diagram of the reflected light path of the adjustable distance reflector;

[0025] Figure 3 A simplified schematic diagram of a second distance-adjustable reflector in an embodiment of the utility model is shown;

[0026] Figure 4 A simplified schematic diagram of a third adjustable distance reflector in an embodiment of the utility model is shown;

[0027] Figure 5 A simplified schematic diagram of another laser processing device used in the first adjustable distance reflector in an embodiment of the utility model is shown;

[0028] Figure 6 A simplified schematic diagram of a laser processing device used for a fourth adjustable distance reflector in an embodiment of the utility model is shown.

[0029] Description of the accompanying drawings:

[0030] Splitting component-10, laser beam splitter-20, first laser beam splitter-20a, second laser beam splitter-20b, distance-adjustable reflector-30, semi-transparent and semi-reflective mirror-101, reflector-102, dimming module-103, reflecting surface-301, first reflecting surface-301a, second reflecting surface-301b, third reflecting surface-301c, fourth reflecting surface-301d, fifth reflecting surface-301e, wave plate-1031, PBS prism-1032. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Reference Figure 1 The present invention provides a laser processing device, which includes:

[0033] A beam splitter component 10, the beam splitter component 10 is used to emit at least two laser beams 20;

[0034] The adjustable distance reflector 30 includes at least two reflecting surfaces 301 in different planes. The adjustable distance reflector 30 is arranged on the light beam emission path of the light splitting component 10.

[0035] Each of the laser beams 20 is irradiated on a different reflection surface 301 and reflected to form a group of parallel light beams.

[0036] The laser processing device of the embodiment of the utility model is a device that can be used for processing semiconductor products. The processed semiconductor products can be integrated circuit chips or photovoltaic cells. Of course, it can also be used in industrial scenarios such as laser marking as needed. To facilitate the introduction of the laser processing device of the embodiment of the utility model, the following embodiments are described by using the processing of photovoltaic cells as an example.

[0037] like Figure 1 As shown in FIG. 1 , the laser processing device of the embodiment of the utility model includes a beam splitter component 10, which can disperse a single laser beam emitted by a laser light source to form at least two laser beams 20. The at least two laser beams 20 emitted from the beam splitter component 10 can be parallel to each other or can be inclined beams with an angle. The embodiment of the utility model does not limit the structure of the beam splitter component 10.

[0038] like Figure 1 As shown in the figure, a distance-adjustable reflector 30 is arranged on the light beam emission path of the light splitting component 10. The laser beams 20 emitted by the light splitting component 10 are all irradiated on the distance-adjustable reflector 30, and then irradiated to the surface of the object to be processed (for example, a silicon wafer) after being reflected by the distance-adjustable reflector 30. Figure 1 It should be noted that, unlike conventional reflectors, the adjustable distance reflector 30 in the embodiment of the utility model includes at least two reflective surfaces 301 in different planes. For example, Figure 1 The adjustable distance reflector 30 may include a first reflective surface 301a, a second reflective surface 301b, a third reflective surface 301c and a fourth reflective surface 301d. The four reflective surfaces 301 may be designed to be parallel and staggered with each other.

[0039] by Figure 1 The reflection process of the light beam is further explained by taking the adjustable distance reflector 30 as an example. Figure 2 Shows Figure 1 The illustrated distance-adjustable reflector 30 schematically illustrates the reflection of mutually parallel laser beams 20 . Figure 2The first laser beam 20a is irradiated on the first reflection surface 301a and then irradiated toward the silicon wafer, and the second laser beam 20b is irradiated on the second reflection surface 301b and then irradiated toward the silicon wafer. α represents the angle between the first laser beam 20a, the second laser beam 20b and the corresponding reflection surface 301, β represents the angle between the first reflection surface 301a and the second reflection surface 301b, d1 represents the distance between the first laser beam 20a and the second laser beam 20b directly emitted from the light splitting component 10, and d2 represents the distance between the first laser beam 20a and the second laser beam 20b after being reflected by the adjustable distance reflector 30. Figure 2 As can be seen from the schematic diagram, the connection part of the first reflecting surface 301a and the second reflecting surface 301b is a plane parallel to the X direction. The distance between the plane and the two intersection lines formed by the first reflecting surface 301a and the second reflecting surface 301b is M shown in the figure, and M is also the size of the plane in the X direction. Since the first reflecting surface 301a and the second reflecting surface 301b are separated by a certain distance M in the X direction shown in the figure, the first reflecting surface 301a and the second reflecting surface 301b have a distance N. Therefore, d1 is greater than d2, and according to Figure 2 From the geometric relationship shown, it is easy to know that tan2α=(d1-d2) / Δ, tanα=N / Δ, and N=[(d1-d2)tanα] / tan2α can be calculated. The parameter N is the distance between the first reflecting surface 301a and the second reflecting surface 301b. In addition, it should be noted that the plane of the connecting part of the first reflecting surface 301a and the second reflecting surface 301b can also be inclined to intersect with the X direction, or the connecting part can also be a curved surface or other shapes, as long as the distance N can be formed between the first reflecting surface 301a and the second reflecting surface 301b. The embodiment of the utility model does not limit the shape structure of the connecting part of the first reflecting surface 301a and the second reflecting surface 301b.

[0040] Similarly, the distance between the second reflecting surface 301b and the third reflecting surface 301c, and the distance between the third reflecting surface 301c and the fourth reflecting surface 301d can also be calculated, which will not be described one by one here. Through actual measurement, it is verified that the distance d2 can be no more than 1cm, and the error between the light beams can be less than 5μm.

[0041] In addition, it should be noted that, depending on the different orientations of the incident light beam irradiating the adjustable distance reflector 30, at least two light beams reflected by the adjustable distance reflectors 30 of different structures are parallel to each other, the spot shapes of the parallel reflected light beams are closer, and their power density and energy distribution are more consistent.

[0042] It can be seen that in the embodiment of the utility model, by installing a special distance-adjustable reflector 30 on the light beam emission path of the splitter component 10, and utilizing at least two unequal reflecting surfaces on the distance-adjustable reflector 30, a laser beam splitting with a smaller spacing can be obtained, and the mutually parallel reflected light beams obtained by reflection by the distance-adjustable reflector 30 have higher consistency, which is more conducive to ensuring the uniformity and stability of the quality of the laser processing process.

[0043] Optionally, refer to Figure 2 When the laser beams 20 are parallel to each other, the reflection surfaces 301 are parallel to each other and spaced apart.

[0044] Specifically, in one embodiment, Figure 2 As shown, when the laser beams 20 emitted by the light splitting component 10 are parallel to each other, correspondingly, the reflection surfaces 301 on the adjustable reflector 30 are parallel to each other and spaced apart.

[0045] Combination Figure 2 As shown in FIG. 1 , the first laser beam splitter 20a irradiates the incident light beam to the first reflection surface 301a, and the second laser beam splitter 20b irradiates the incident light beam to the second reflection surface 301b, and the two incident light beams are parallel to each other. The first reflection surface 301a and the second reflection surface 301b are two reflection surfaces that are parallel to each other and spaced apart. The reflected light beams formed by the reflection of the two reflection surfaces can remain parallel to each other, thereby ensuring that the obtained small-pitch light beams have higher consistency.

[0046] Optionally, refer to Figures 2 to 4 The spacing between the reflecting surfaces 301 is the same, increases sequentially, or decreases sequentially.

[0047] Specifically, in one embodiment, the reflective surfaces 301 of the adjustable distance reflector 30 are parallel to each other and spaced apart. Figure 2 As shown, when the spacings between the reflection surfaces 301 are the same, the spacings between the reflection light beams are also the same. This adjustable distance reflector 30 can obtain reflection light beams with smaller spacings and equal spacings.

[0048] like Figure 3 As shown, the four intervals corresponding to the first reflecting surface 301a and the second reflecting surface 301b, the second reflecting surface 301b and the third reflecting surface 301c, and the third reflecting surface 301c and the fourth reflecting surface 301d can be increased successively. This adjustable distance reflector 30 can obtain a reflected light beam with a smaller interval and a gradually decreasing interval.

[0049] like Figure 4As shown, the four intervals corresponding to the first reflecting surface 301a and the second reflecting surface 301b, the second reflecting surface 301b and the third reflecting surface 301c, and the third reflecting surface 301c and the fourth reflecting surface 301d can be successively reduced. This adjustable distance reflector 30 can obtain a reflected light beam with a smaller interval and a gradually increasing interval.

[0050] In practical applications, the above-mentioned gate line trenches can be selected according to the processing requirements of the gate line trenches on the silicon wafer. Figures 2 to 4 Any of the illustrated adjustable distance reflectors 30 can be processed to obtain grid line grooves with equal spacing, grid line grooves with increasing spacing, or grid line grooves with decreasing spacing.

[0051] Optionally, refer to Figure 5 The included angle between each laser beam 20 and the corresponding reflecting surface 301 is 45°.

[0052] Specifically, in one embodiment, the reflective surfaces 301 of the adjustable distance reflector 30 are parallel to each other and spaced apart. Figure 5 As shown in FIG. 1 , the angle between the first laser beam 20a and the first reflection surface 301a is 45°, and the angle between the second laser beam 20b and the second reflection surface 301b is 45°.

[0053] This laser processing device arranges the light beam emitted by the splitter component 10 and the corresponding reflective surface 301 of the adjustable distance reflector 30 at an angle of 45 degrees. The reflective surface 301 of the adjustable distance reflector 30 is simpler to process, and the installation and arrangement of each optical component is more convenient, so that the required small spacing and higher consistency laser beam splitting can be obtained more easily.

[0054] Optionally, refer to Figure 6 When there are obliquely intersecting beams in at least two of the laser beam splitters 20, the adjacent reflecting surfaces 301 obliquely intersect, and the corresponding reflecting surfaces 301 obliquely intersect or are arranged at intervals.

[0055] Specifically, in one embodiment, when there are obliquely intersecting beams in the laser beam splitter 20, the Figure 6 The schematic distance-adjustable reflector 30 adjusts the distance between the light beams. Figure 6 The adjustable distance reflector 30 may include a first reflecting surface 301a, a second reflecting surface 301b, a third reflecting surface 301c, a fourth reflecting surface 301d and a fifth reflecting surface 301e, and two adjacent reflecting surfaces among the five reflecting surfaces 301 are inclined to intersect.

[0056] Combination Figure 6As shown in the diagram, the first laser beam 20a irradiates the incident light beam to the second reflection surface 301b, and the second laser beam 20b irradiates the incident light beam to the fourth reflection surface 301d, and the two incident light beams intersect at an angle, and the adjacent reflection surfaces 301 in the first reflection surface 301a, the second reflection surface 301b, the third reflection surface 301c, the fourth reflection surface 301d and the fifth reflection surface 301e intersect at an angle to form a tortuous reflection structure. Among them, the second reflection surface 301b and the fourth reflection surface 301d can intersect at an angle or be spaced in parallel. The reflected light beams formed by the reflection of the two reflection surfaces can remain parallel to each other, thereby ensuring that the obtained small-pitch light beams have higher consistency. Similarly, when the other laser beams also intersect at an angle to each other, the corresponding reflection surfaces 301 can also intersect at an angle or be spaced in parallel. It is understandable that the angle at which the corresponding reflecting surfaces 301 intersect each other is determined by the angle at which the incident light beam is tilted, and it is sufficient to ensure that the reflected light beams are parallel to each other. The embodiment of the utility model does not specifically limit the angle at which the reflecting surfaces 301 intersect each other.

[0057] by Figure 6 The reflection process of the light beam is further explained by taking the adjustable distance reflector 30 as an example. Figure 6 The first laser beam 20a is irradiated on the second reflection surface 301b and then irradiated toward the silicon wafer, and the second laser beam 20b is irradiated on the fourth reflection surface 301d and then irradiated toward the silicon wafer. d1 represents the distance between the first laser beam 20a and the second laser beam 20b directly emitted from the splitting component 10, and d2 represents the distance between the first laser beam 20a and the second laser beam 20b after being reflected by the adjustable reflector 30. It should be noted that in the embodiments of the present application, whether for parallel light beams or obliquely intersecting light beams, the distance between the light beams refers to the shortest distance between the two light beams. For parallel light beams, the distances are equal everywhere, and the distance between the light beams is the distance between the centers of the light spots of the two parallel light beams. For obliquely intersecting light beams, the distance between the light beams is the distance between the center of the light spot formed by the light beam that is reflected first and the vertical line segment formed by the other light beam, such as Figure 6 The first laser beam 20a first reaches the second reflection surface 301b to form a light spot, and the length d1 of the vertical line segment formed by the light spot and the second laser beam 20b is the corresponding beam spacing.

[0058] from Figure 6As can be seen from the schematic diagram, since the second reflection surface 301b and the fourth reflection surface 301d are parallel and spaced apart, the reflected light beams of the first laser beam 20a and the second laser beam 20b can be made parallel to each other, and the spacing d2 is smaller than the spacing d1. When the angle between the first laser beam 20a and the second reflection surface 301b, and the angle between the second laser beam 20b and the fourth reflection surface 301d are known, the spacing between the second reflection surface 301b and the fourth reflection surface 301d can be easily calculated based on the geometric relationship, and the specific calculation process will not be described in detail in the embodiment of the utility model.

[0059] Similarly, the angle between the first reflecting surface 301a and the second reflecting surface 301b, the angle between the second reflecting surface 301b and the third reflecting surface 301c, the angle between the third reflecting surface 301c and the fourth reflecting surface 301d, and the angle between the fourth reflecting surface 301d and the fifth reflecting surface 301e can be calculated. Thus, the structural parameters of the adjustable distance reflector 30 with a zigzag reflecting structure can be obtained. Such an adjustable distance reflector 30 with a zigzag reflecting structure can be applied to a beam splitting component 10 in which the emitted laser beams 20 are not parallel to each other.

[0060] Optionally, refer to Figure 1 , the light splitting component 10 includes at least one semi-transparent and semi-reflective mirror 101;

[0061] The semi-transparent and semi-reflective mirror 101 is used for reflection and refraction to form two laser beams 20 .

[0062] Specifically, in one embodiment, when the required laser beam splitter 20 is two beams, a semi-transparent and semi-reflective mirror 101 may be included in the beam splitter component 10, and the light beam reflected from the laser light source is irradiated on the surface of the semi-transparent and semi-reflective mirror 101, and a part of it is reflected to form one beam, and the other part is refracted to form another beam. It is understandable that when more laser beam splitters 20 are needed, the number of semi-transparent and semi-reflective mirrors 101 can be increased in the beam splitter component 10, and the light beam is decomposed multiple times to obtain a larger number of laser beam splitters 20.

[0063] Optionally, refer to Figure 1 The light splitting component 10 also includes a reflecting mirror 102 located on the light beam emission path of the semi-transparent and semi-reflective mirror 101.

[0064] Specifically, in one embodiment, Figure 1 As shown, a reflector 102 is placed on the emission path of at least one light beam reflected and refracted by the semi-transparent and semi-reflective mirror 101. The reflector 102 can adjust the direction of the corresponding reflected light beam or refracted light beam so that the decomposed laser beams 20 remain parallel or tilted before irradiating the adjustable distance reflector 30 to adapt to different optical space structures.

[0065] Optionally, refer to Figure 1 , the light splitting component 10 also includes a dimming module 103;

[0066] The dimming module 103 is disposed on the light beam emission path of the reflector 102 .

[0067] Specifically, in one embodiment, Figure 1 As shown, the spectroscopic component 10 in the embodiment of the utility model also includes a dimming module 103, which is located on the light beam emission path of the reflector 102. The power density of the decomposed laser beam 20 can be adjusted through the dimming module 103 so that the power density of each laser beam 20 tends to be consistent.

[0068] Optionally, refer to Figure 1 , the dimming module 103 includes a wave plate 1031 and a PBS prism 1032;

[0069] The wave plate 1031 is located on the optical path between the PBS prism 1032 and the reflector 102 , and the PBS prism 1032 is located on the optical path between the wave plate 1031 and the adjustable distance reflector 30 .

[0070] Specifically, in one embodiment, Figure 1 As shown, the dimming module 103 of the embodiment of the utility model may include a wave plate 1031 and a PBS prism 1032. The wave plate 1031 is also called a phase delay plate. The wave plate 1031 is made of a birefringent material, and the phase shift is generated by the two mutually orthogonal polarization components of the wave plate 1031, which can be used to adjust the polarization state of the light beam. For example, when linearly polarized light passes through a half-wave plate, its polarization direction changes. A quarter-wave plate is mostly used to convert linearly polarized light into circularly polarized light. The PBS prism 1032 is a polarizing beamsplitter prism (Polarizing Beamsplitters), and the PBS prism 1032 can split an incident light beam into two polarized light beams whose polarization directions are perpendicular to each other. The P polarized light in the incident light beam can be transmitted through the polarization beam splitting film, and the S polarized light can be reflected by the polarization beam splitting film.

[0071] Therefore, by combining the wave plate 1031 and the PBS prism 1032 and placing them on the optical path between the reflector 102 and the adjustable distance reflector 30 , the light intensity of the laser beam splitter 20 can be adjusted, thereby playing a role in adjusting the power density.

[0072] Optionally, the optical splitter component 101 includes an SLM, a DMD, a DOE, an MLA or a beam mask splitter.

[0073] Specifically, in some implementations, a more integrated optical module can be used to replace the aforementioned semi-transparent and semi-reflective mirror 101, reflector 102, and dimming module 103. These optical modules may include a liquid crystal spatial light modulator (SLM), a digital micromirror device (DMD), an optical diffractive element (DOE), a microlens array (MLA), or a beam mask beam splitter. These optical modules can directly output two or more laser beam splitters 20, and have a higher degree of integration and are more convenient to use and install.

[0074] In addition, for any of the above embodiments, a rotating mirror, a galvanometer mirror and related optical components may be arranged on the optical path between the adjustable distance reflector 30 and the object to be processed, which can further improve the utilization rate of laser performance and enhance the processing speed and efficiency.

[0075] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0076] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, which all fall within the protection of the utility model.

Claims

1. A laser processing device, characterized in that: The laser processing device comprises: A beam splitter component, the beam splitter component is used to emit at least two laser beams; A distance-adjustable reflector, the distance-adjustable reflector comprising at least two reflecting surfaces in different planes, the distance-adjustable reflector being arranged on the light beam emission path of the light splitting component, Each of the laser beams is irradiated on different reflection surfaces and reflected to form a group of parallel light beams.

2. The laser processing device according to claim 1, characterized in that: When the laser beams are parallel to each other, the reflection surfaces are parallel to each other and arranged at intervals.

3. The laser processing device according to claim 2, characterized in that: The spacings between the reflecting surfaces are the same, increase in sequence, or decrease in sequence.

4. The laser processing device according to claim 2, characterized in that: The included angle between each laser beam and the corresponding reflecting surface is 45°.

5. The laser processing device according to claim 1, characterized in that: When there are obliquely intersecting light beams in at least two of the laser beam splits, the adjacent reflecting surfaces obliquely intersect, and the corresponding reflecting surfaces obliquely intersect or are arranged at intervals.

6. The laser processing device according to claim 1, characterized in that: The light splitting component includes at least one semi-transparent and semi-reflective mirror; One of the semi-transparent and semi-reflective mirrors is used for reflection and refraction to form two laser beams.

7. The laser processing device according to claim 6, characterized in that: The light splitting component further comprises a reflecting mirror located on the light beam emission path of the semi-transparent and semi-reflective mirror.

8. The laser processing device according to claim 5, characterized in that: The light splitting component also includes a dimming module; The dimming module is arranged on the light beam emission path of the reflector, and the dimming module is used to adjust the power density of the laser beam.

9. The laser processing device according to claim 8, characterized in that: The dimming module includes a wave plate and a PBS prism; The wave plate is located on the optical path between the PBS prism and the reflector, and the PBS prism is located on the optical path between the wave plate and the distance-adjustable reflector.

10. The laser processing device according to claim 1, characterized in that: The optical splitter component includes an SLM, a DMD, a DOE, an MLA or a beam mask optical splitter.