A semiconductor material hole processing device

Abstract

The utility model provides a semiconductor material hole processing device. The semiconductor material hole processing device includes: a base; two slide grooves, both of which are opened on the base; an L-shaped frame, the L-shaped frame is fixedly installed on the base; a plurality of first limit rods, the plurality of first limit rods are fixedly installed on the inner wall of the base; a displacement mechanism, the displacement mechanism is arranged on the top inner wall of the L-shaped frame, and the displacement mechanism is used to control the hole position; a connecting mechanism, the connecting mechanism is arranged on the displacement mechanism; a hole inner diameter adjustment mechanism, the hole inner diameter adjustment mechanism is arranged on the connecting mechanism. The semiconductor material hole processing device provided by the utility model has the advantages of being easy to adjust the inner diameter of the hole of the semiconductor material, having the positioning function of the semiconductor material, and being relatively convenient to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor materials, in particular to a semiconductor material hole opening processing device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials. In the process of semiconductor material processing, it is necessary to make holes in it.

[0003] However, the existing semiconductor material hole-making processing devices are often not easy to adjust the inner diameter of the hole of the semiconductor material, which is relatively inconvenient, and the semiconductor material may shift during the hole-making process, thereby causing a deviation in the hole position.

[0004] Therefore, it is necessary to provide a semiconductor material hole opening processing device to solve the above technical problems. Utility Model Content

[0005] In order to solve the technical problem that the existing semiconductor material hole opening processing device is inconvenient to adjust the inner diameter of the semiconductor material hole, the utility model provides a semiconductor material hole opening processing device.

[0006] The semiconductor material hole-opening processing device provided by the utility model comprises: a base; two slide grooves, both of which are arranged on the base; an L-shaped frame, which is fixedly installed on the base; a plurality of first limit rods, which are fixedly installed on the inner wall of the base; a displacement mechanism, which is arranged on the top inner wall of the L-shaped frame, and is used to control the hole opening position; a connecting mechanism, which is arranged on the displacement mechanism; a hole opening inner diameter adjustment mechanism, which is arranged on the connecting mechanism; two laser hole opening heads, which are both arranged on the hole opening inner diameter adjustment mechanism; a driving mechanism, which is arranged on the connecting mechanism; a positioning mechanism, which is arranged on the base, and is used to clamp and fix the semiconductor material.

[0007] Preferably, the displacement mechanism includes a plurality of longitudinal electric slide rails, a transverse electric slide rail, an electric cylinder and a rectangular plate, the plurality of longitudinal electric slide rails are fixedly mounted on the top inner wall of the L-shaped frame, the transverse electric slide rail is fixedly mounted on the output blocks of the plurality of longitudinal electric slide rails, the electric cylinder is fixedly mounted on the output block of the transverse electric slide rail, and the rectangular plate is fixedly mounted on the output rod of the electric cylinder.

[0008] Preferably, the connecting mechanism includes a rotating shaft, a U-shaped plate, a circular plate and a circular cover, the rotating shaft is rotatably mounted on the bottom of the rectangular plate, the U-shaped plate is fixedly mounted on the bottom end of the rotating shaft, the circular plate is fixedly mounted on the bottom of the U-shaped plate, and the circular cover is fixedly mounted on the bottom of the circular plate.

[0009] Preferably, the circular plate is provided with two limiting grooves, and two limiting plates are fixedly mounted on the circular plate.

[0010] Preferably, the opening inner diameter adjustment mechanism includes a first dual-axis motor, two first screws, multiple second limit rods and two sliders, the first dual-axis motor is fixedly mounted on the top of the circular plate, the two first screws are respectively fixedly mounted on the two ends of the output shaft of the first dual-axis motor, the two first screws are rotatably connected to the U-shaped plate, the two first screws are respectively rotatably connected to the two limit plates, multiple second limit rods are respectively fixedly mounted on both sides of the U-shaped plate, multiple second limit rods are respectively fixedly connected to the two limit plates, two sliders are respectively threadedly sleeved on the two first screws, the two sliders are respectively slidably connected to the multiple second limit rods, the two sliders are respectively slidably connected to the inner walls on both sides of the two limit grooves, and the two sliders are respectively fixedly connected to the two laser opening heads.

[0011] Preferably, the driving mechanism includes a servo motor, a driving gear and a driven gear, the servo motor is fixedly mounted on the bottom of the rectangular plate, the driving gear is fixedly sleeved on the output shaft of the servo motor, the driven gear is fixedly sleeved on the rotating shaft, and the driving gear is meshed with the driven gear.

[0012] Preferably, the positioning mechanism includes a second dual-axis motor, two second screws, two sliding plates and two arc-shaped clamping covers, the second dual-axis motor is fixedly mounted on the top inner wall of the base, the two second screws are respectively fixedly mounted on the two ends of the output shaft of the second dual-axis motor, the two second screws are both rotatably connected to the inner wall of the base, the two sliding plates are respectively threaded on the two second screws, the two sliding plates are respectively slidably connected to the plurality of first limit rods, the two sliding plates are respectively slidably connected to the inner walls of both sides of the two slide grooves, and the two arc-shaped clamping covers are respectively fixedly mounted on the top of the two sliding plates.

[0013] Preferably, a controller is provided on the top of the L-shaped frame, and the controller is electrically connected to the plurality of longitudinal electric slide rails, transverse electric slide rails, electric cylinders, servo motors and the second dual-axis motor. A conductive slip ring is provided on the fixed sleeve on the rotating shaft, and the conductive slip ring is fixedly connected to the rectangular plate. The conductive slip ring is electrically connected to the controller, the first dual-axis motor and the two laser opening heads.

[0014] Compared with the related art, the semiconductor material hole processing device provided by the utility model has the following beneficial effects:

[0015] The utility model provides a semiconductor material hole opening processing device, which can drive two laser hole opening heads to move horizontally, vertically and up and down through a displacement mechanism, connect the displacement mechanism with a hole opening inner diameter adjustment mechanism through a connection mechanism, adjust the position between the two laser hole opening heads through the hole opening inner diameter adjustment mechanism, thereby adjusting the hole opening inner diameter, and make holes in semiconductor materials through the two laser hole opening heads, drive the two laser hole opening heads to rotate through a driving mechanism, clamp and fix the semiconductor materials through a positioning mechanism, thereby preventing the semiconductor materials from shifting during the hole opening process, limit the two sliders through two limiting grooves, control a plurality of longitudinal electric slide rails, a transverse electric slide rail, an electric cylinder, two laser hole opening heads, a servo motor and a second dual-axis motor through a controller, and electrically connect the first dual-axis motor and the two laser hole opening heads to the controller in a rotating state through a conductive slip ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a preferred embodiment of the semiconductor material hole-making processing device provided by the utility model;

[0017] Figure 2 for Figure 1 Schematic diagram of the three-dimensional assembly structure of the circular plate and the circular cover;

[0018] Figure 3 for Figure 1An enlarged schematic diagram of part A is shown in FIG.

[0019] Numbers in the figure: 1. base; 2. slide groove; 3. L-shaped frame; 4. first limit rod; 5. longitudinal electric slide rail; 6. transverse electric slide rail; 7. electric cylinder; 8. rectangular plate; 9. rotating shaft; 10. U-shaped plate; 11. circular plate; 12. circular cover; 13. limit groove; 14. limit plate; 15. first dual-axis motor; 16. first screw; 17. second limit rod; 18. slider; 19. laser opening head; 20. servo motor; 21. driving gear; 22. driven gear; 23. second dual-axis motor; 24. second screw; 25. sliding plate; 26. arc clamping cover; 27. controller; 28. conductive slip ring. DETAILED DESCRIPTION

[0020] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0021] Please refer to Figure 1-3 ,in, Figure 1 A schematic structural diagram of a preferred embodiment of the semiconductor material hole-making processing device provided by the utility model; Figure 2 for Figure 1 Schematic diagram of the three-dimensional assembly structure of the circular plate and the circular cover; Figure 3 for Figure 1 The enlarged schematic diagram of part A shown in the figure. The semiconductor material hole processing device includes: a base 1; two slide grooves 2, both of which are arranged on the base 1; an L-shaped frame 3, both of which are fixedly mounted on the base 1; a plurality of first limit rods 4, both of which are fixedly mounted on the inner wall of the base 1; a displacement mechanism, which is arranged on the top inner wall of the L-shaped frame 3, and is used to control the hole position; a connecting mechanism, which is arranged on the displacement mechanism; a hole inner diameter adjustment mechanism, which is arranged on the connecting mechanism; two laser hole opening heads 19, both of which are arranged on the hole inner diameter adjustment mechanism; a driving mechanism, which is arranged on the driving mechanism. The positioning mechanism is arranged on the connecting mechanism; the positioning mechanism is arranged on the base 1, and the positioning mechanism is used to clamp and fix the semiconductor material. The displacement mechanism can drive the two laser hole opening heads 19 to move horizontally, vertically and up and down. The displacement mechanism can be connected to the hole inner diameter adjustment mechanism through the connecting mechanism. The position between the two laser hole opening heads 19 can be adjusted through the hole inner diameter adjustment mechanism, so as to adjust the hole inner diameter. The semiconductor material can be opened by the two laser hole opening heads 19, and the two laser hole opening heads 19 can be driven to rotate by the driving mechanism. The semiconductor material can be clamped and fixed by the positioning mechanism, so as to prevent the semiconductor material from shifting during the hole opening process.

[0022] The displacement mechanism includes multiple longitudinal electric slide rails 5, transverse electric slide rails 6, electric cylinders 7 and rectangular plates 8. The multiple longitudinal electric slide rails 5 are fixedly mounted on the top inner wall of the L-shaped frame 3, the transverse electric slide rails 6 are fixedly mounted on the output blocks of the multiple longitudinal electric slide rails 5, the electric cylinder 7 is fixedly mounted on the output block of the transverse electric slide rail 6, and the rectangular plate 8 is fixedly mounted on the output rod of the electric cylinder 7. The two laser opening heads 19 can be driven to move horizontally, vertically and up and down through the displacement mechanism.

[0023] The connecting mechanism includes a rotating shaft 9, a U-shaped plate 10, a circular plate 11 and a circular cover 12. The rotating shaft 9 is rotatably installed at the bottom of the rectangular plate 8, the U-shaped plate 10 is fixedly installed at the bottom end of the rotating shaft 9, the circular plate 11 is fixedly installed at the bottom of the U-shaped plate 10, and the circular cover 12 is fixedly installed at the bottom of the circular plate 11. The displacement mechanism can be connected to the opening inner diameter adjustment mechanism through the connecting mechanism.

[0024] The circular plate 11 is provided with two limiting grooves 13 , and two limiting plates 14 are fixedly mounted on the circular plate 11 . The two limiting grooves 13 can limit the two sliding blocks 18 .

[0025] The opening inner diameter adjustment mechanism includes a first dual-axis motor 15, two first screws 16, a plurality of second limit rods 17 and two sliders 18, wherein the first dual-axis motor 15 is fixedly mounted on the top of the circular plate 11, and the two first screws 16 are respectively fixedly mounted on both ends of the output shaft of the first dual-axis motor 15, and the two first screws 16 are both rotatably connected to the U-shaped plate 10, and the two first screws 16 are respectively rotatably connected to the two limit plates 14, and the plurality of second limit rods 17 are respectively fixedly mounted on both sides of the U-shaped plate 10. , multiple second limit rods 17 are fixedly connected to the two limit plates 14 respectively, the two sliders 18 are threadedly sleeved on the two first screw rods 16 respectively, the two sliders 18 are slidably connected to the multiple second limit rods 17 respectively, the two sliders 18 are slidably connected to the inner walls of both sides of the two limit grooves 13 respectively, and the two sliders 18 are fixedly connected to the two laser hole opening heads 19 respectively, and the position between the two laser hole opening heads 19 can be adjusted by the hole inner diameter adjustment mechanism, thereby adjusting the hole inner diameter.

[0026] The driving mechanism includes a servo motor 20, a driving gear 21 and a driven gear 22. The servo motor 20 is fixedly mounted on the bottom of the rectangular plate 8. The driving gear 21 is fixedly sleeved on the output shaft of the servo motor 20. The driven gear 22 is fixedly sleeved on the rotating shaft 9. The driving gear 21 is meshed with the driven gear 22. The two laser opening heads 19 can be driven to rotate through the driving mechanism.

[0027] The positioning mechanism includes a second dual-axis motor 23, two second screws 24, two sliding plates 25 and two arc-shaped clamping covers 26. The second dual-axis motor 23 is fixedly mounted on the top inner wall of the base 1. The two second screws 24 are respectively fixedly mounted on the two ends of the output shaft of the second dual-axis motor 23. The two second screws 24 are both rotatably connected to the inner wall of the base 1. The two sliding plates 25 are respectively threadedly sleeved on the two second screws 24. The two sliding plates 25 are respectively slidably connected to multiple first limit rods 4. The two sliding plates 25 are respectively slidably connected to the inner walls of both sides of the two slide grooves 2. The two arc-shaped clamping covers 26 are respectively fixedly mounted on the top of the two sliding plates 25. The semiconductor material can be clamped and fixed by the positioning mechanism, thereby preventing the semiconductor material from shifting during the hole opening process.

[0028] A controller 27 is provided on the top of the L-shaped frame 3, and the controller 27 is electrically connected to the multiple longitudinal electric slide rails 5, the transverse electric slide rails 6, the electric cylinder 7, the servo motor 20 and the second dual-axis motor 23. A conductive slip ring 28 is fixedly sleeved on the rotating shaft 9, and the conductive slip ring 28 is fixedly connected to the rectangular plate 8. The conductive slip ring 28 is electrically connected to the controller 27 and the first dual-axis motor 15 and the two laser hole opening heads 19. The multiple longitudinal electric slide rails 5, the transverse electric slide rails 6, the electric cylinder 7, the two laser hole opening heads 19, the servo motor 20 and the second dual-axis motor 23 can be controlled by the controller 27, and the first dual-axis motor 15 and the two laser hole opening heads 19 can be electrically connected to the controller 27 when rotating through the conductive slip ring 28.

[0029] The working principle of the semiconductor material hole processing device provided by the utility model is as follows:

[0030] When in use, the semiconductor material is placed on the two arc-shaped clamping covers 26, and the second double-axis motor 23 is started. The second double-axis motor 23 drives the two second screws 24 to rotate. The rotation of the two second screws 24 drives the two sliding plates 25 and the two arc-shaped clamping covers 26 to approach each other, thereby clamping and positioning the semiconductor material. The inner diameter of the opening is adjusted as needed, and the first double-axis motor 15 is started. The first double-axis motor 15 drives the two first screws 16 to rotate. The rotation of the two first screws 16 drives the two sliders 18 to approach or move away from each other, thereby adjusting the position between the two laser opening heads 19. The position is adjusted to adjust the inner diameter of the hole, and the two laser hole opening heads 19 can be driven to move horizontally and vertically through multiple longitudinal electric slide rails 5 and transverse electric slide rails 6, so as to adjust the hole opening position, start the electric cylinder 7, and the electric cylinder 7 drives the two laser hole opening heads 19 to move downward, start the two laser hole opening heads 19 and the servo motor 20, and the servo motor 20 drives the rotating shaft 9 to rotate through the driving gear 21 and the driven gear 22, and the rotating shaft 9 indirectly drives the two laser hole opening heads 19 to rotate, and holes are opened in the semiconductor material through the two rotating laser hole opening heads 19.

[0031] Compared with the related art, the semiconductor material hole processing device provided by the utility model has the following beneficial effects:

[0032] The utility model provides a semiconductor material hole-making processing device, which can drive two laser hole-making heads 19 to move horizontally, vertically and up and down through a displacement mechanism, connect the displacement mechanism with a hole-making inner diameter adjustment mechanism through a connecting mechanism, adjust the position between the two laser hole-making heads 19 through the hole-making inner diameter adjustment mechanism, thereby adjusting the hole-making inner diameter, make holes in semiconductor materials through the two laser hole-making heads 19, drive the two laser hole-making heads 19 to rotate through a driving mechanism, clamp and fix the semiconductor material through a positioning mechanism, thereby preventing the semiconductor material from shifting during the hole-making process, limit the two sliders 18 through two limiting grooves 13, control a plurality of longitudinal electric slide rails 5, transverse electric slide rails 6, electric cylinders 7, two laser hole-making heads 19, servo motors 20 and a second dual-axis motor 23 through a controller 27, and electrically connect the first dual-axis motor 15 and the two laser hole-making heads 19 to the controller 27 when rotating through a conductive slip ring 28.

[0033] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor material hole processing device, characterized in that: include: Base; Two slide grooves, both of which are arranged on the base; An L-shaped frame, the L-shaped frame is fixedly mounted on the base; A plurality of first limiting rods, wherein the plurality of first limiting rods are all fixedly mounted on the inner wall of the base; A displacement mechanism, the displacement mechanism is arranged on the top inner wall of the L-shaped frame, and the displacement mechanism is used to control the position of the opening; A connecting mechanism, wherein the connecting mechanism is arranged on the displacement mechanism; An opening inner diameter adjustment mechanism, wherein the opening inner diameter adjustment mechanism is arranged on the connecting mechanism; Two laser perforating heads, both of which are arranged on the perforating inner diameter adjustment mechanism; A driving mechanism, wherein the driving mechanism is arranged on the connecting mechanism; A positioning mechanism is arranged on the base and is used to clamp and fix the semiconductor material.

2. The semiconductor material hole processing device according to claim 1, characterized in that: The displacement mechanism includes a plurality of longitudinal electric slide rails, a transverse electric slide rail, an electric cylinder and a rectangular plate. The plurality of longitudinal electric slide rails are fixedly mounted on the top inner wall of the L-shaped frame, the transverse electric slide rail is fixedly mounted on the output blocks of the plurality of longitudinal electric slide rails, the electric cylinder is fixedly mounted on the output block of the transverse electric slide rail, and the rectangular plate is fixedly mounted on the output rod of the electric cylinder.

3. The semiconductor material hole processing device according to claim 2, characterized in that: The connecting mechanism includes a rotating shaft, a U-shaped plate, a circular plate and a circular cover. The rotating shaft is rotatably installed at the bottom of the rectangular plate, the U-shaped plate is fixedly installed at the bottom end of the rotating shaft, the circular plate is fixedly installed at the bottom of the U-shaped plate, and the circular cover is fixedly installed at the bottom of the circular plate.

4. The semiconductor material hole processing device according to claim 3, characterized in that: The circular plate is provided with two limiting grooves, and the circular plate is fixedly mounted with two limiting plates.

5. The semiconductor material hole processing device according to claim 4, characterized in that: The opening inner diameter adjustment mechanism includes a first dual-axis motor, two first screws, multiple second limit rods and two sliders, the first dual-axis motor is fixedly mounted on the top of the circular plate, the two first screws are respectively fixedly mounted on the two ends of the output shaft of the first dual-axis motor, the two first screws are rotatably connected to the U-shaped plate, the two first screws are respectively rotatably connected to the two limit plates, multiple second limit rods are respectively fixedly mounted on both sides of the U-shaped plate, multiple second limit rods are respectively fixedly connected to the two limit plates, the two sliders are respectively threadedly sleeved on the two first screws, the two sliders are respectively slidably connected to the multiple second limit rods, the two sliders are respectively slidably connected to the inner walls on both sides of the two limit grooves, and the two sliders are respectively fixedly connected to the two laser opening heads.

6. The semiconductor material hole processing device according to claim 5, characterized in that: The driving mechanism includes a servo motor, a driving gear and a driven gear. The servo motor is fixedly mounted on the bottom of the rectangular plate. The driving gear is fixedly sleeved on the output shaft of the servo motor. The driven gear is fixedly sleeved on the rotating shaft. The driving gear is meshed with the driven gear.

7. The semiconductor material hole-making processing device according to claim 6, characterized in that: The positioning mechanism includes a second dual-axis motor, two second screws, two sliding plates and two arc-shaped clamping covers. The second dual-axis motor is fixedly mounted on the top inner wall of the base. The two second screws are respectively fixedly mounted on the two ends of the output shaft of the second dual-axis motor. The two second screws are rotatably connected to the inner wall of the base. The two sliding plates are respectively threaded on the two second screws. The two sliding plates are respectively slidably connected to the plurality of first limit rods. The two sliding plates are respectively slidably connected to the inner walls on both sides of the two slide grooves. The two arc-shaped clamping covers are respectively fixedly mounted on the top of the two sliding plates.

8. The semiconductor material hole-making processing device according to claim 7, characterized in that: A controller is provided on the top of the L-shaped frame, and the controller is electrically connected to the plurality of longitudinal electric slide rails, transverse electric slide rails, electric cylinders, servo motors and the second dual-axis motor. A conductive slip ring is provided on the fixed sleeve on the rotating shaft, and the conductive slip ring is fixedly connected to the rectangular plate. The conductive slip ring is electrically connected to the controller, the first dual-axis motor and the two laser opening heads.

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