A glass substrate IC carrier laser cutting workbench

Abstract

The present application discloses a glass substrate IC carrier laser cutting workbench, which belongs to the field of laser cutting technology. A glass substrate IC carrier laser cutting workbench includes a base, a cavity is provided inside the base, a plurality of negative pressure pipes are provided in the cavity, a plurality of through holes are provided outside the negative pressure pipe, and the orientations of the plurality of through holes are different. The negative pressure pipe is connected to an adjustment seat at the through hole, the negative pressure pipe runs through the adjustment seat, and is rotatably connected to the adjustment seat, the adjustment seat is connected and fixed to the base, a connecting cavity is provided on the upper part of the adjustment seat, the connecting cavity extends to the upper surface of the adjustment seat, a cover plate is fixedly connected to the upper part of the base, a plurality of negative pressure holes are provided on the cover plate, the negative pressure holes are located above the connecting cavity, and a fence is provided between the negative pressure hole and the connecting cavity, and the fence is set in a closed state. The user can adjust the connection state between the through hole and the connecting cavity by rotating the negative pressure pipe, and form negative pressure at different negative pressure holes of the cover plate, so that the device can be suitable for fixing carriers of different sizes.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and more specifically, to a glass substrate IC carrier laser cutting workbench. Background Art

[0002] Compared with traditional IC substrates with resin between layers, glass substrates have high rigidity and are more brittle than traditional resin substrates. When using a milling cutter for molding, the glass-based IC substrate will crack during the milling process and needs to be cut with the help of laser cutting equipment.

[0003] After searching, the patent document with the existing announcement number CN212734688U provides a partitioned adsorption control device for a PC laser cutting machine. The device divides the suction chamber into several suction cavities by setting a partition bar, and controls the air pressure in each suction cavity by a pressure switch and an air control valve, thereby realizing partitioned adsorption, partitioned control, and partitioned pressure regulation, which is beneficial to improving the adsorption effect of the adsorption device when adsorbing different materials at the same time.

[0004] In the above device, the position of the air suction holes on the work surface is fixed and cannot be adjusted according to the size of the carrier. When facing carriers of different sizes, the fixing effect is poor. In view of this, we propose a glass-based IC carrier laser cutting workbench. Utility Model Content

[0005] 1. Technical problems to be solved

[0006] The purpose of the present application is to provide a glass substrate IC carrier laser cutting workbench to solve the problems raised in the above background technology.

[0007] 2. Technical solution

[0008] This application is implemented through the following technical solutions:

[0009] A glass-based IC carrier laser cutting workbench comprises a base, a cavity is provided inside the base, a plurality of negative pressure pipes are provided in the cavity, a plurality of through holes are provided on the outside of the negative pressure pipe, and the orientations of the plurality of through holes are different. The negative pressure pipe is connected to an adjustment seat at the through hole, the negative pressure pipe passes through the adjustment seat and is rotatably connected to the adjustment seat, the adjustment seat is fixedly connected to the base, a connecting cavity is provided on the upper part of the adjustment seat, the connecting cavity extends to the upper surface of the adjustment seat, a cover plate is fixedly connected to the upper part of the base, a plurality of negative pressure holes are provided on the cover plate, the negative pressure holes are located above the connecting cavity, an enclosure is provided between the negative pressure hole and the connecting cavity, and the enclosure is arranged in a closed state.

[0010] As an optional solution of the technical solution of the present application document, a first sealing groove is opened on the upper part of the adjustment seat, the enclosure is plugged into and matched with the first sealing groove, and the enclosure is fixedly connected to the bottom of the cover plate.

[0011] As an optional solution to the technical solution of the present application document, one end of the negative pressure pipe is closed, and the other end extends to the outside of the base and is connected to a branch pipe. A connecting piece is provided between the negative pressure pipe and the branch pipe, and the negative pressure pipe is rotatably connected to the branch pipe through the connecting piece.

[0012] As an optional solution of the technical solution of this application document, the cover plate is connected and fixed to the base by bolts.

[0013] As an optional solution of the technical solution of the present application document, the adjustment seat is divided into an upper connecting part and a lower connecting part, the connecting cavity is opened in the upper connecting part, and a second sealing groove is opened at the lower part of the upper connecting part and the upper part of the lower connecting part, and the second sealing groove is arranged in a closed shape. A sealing gasket is sleeved on the outside of the negative pressure pipe, and the sealing gasket is plugged into the second sealing groove.

[0014] As an optional solution of the technical solution of the present application document, the upper connecting part and the lower connecting part are connected and fixed by bolts, and the lower connecting part is connected and fixed to the base.

[0015] As an optional solution of the technical solution of the present application document, a plurality of the negative pressure pipes are arranged in rows and columns in the cavity.

[0016] As an optional solution of the technical solution of the present application document, a main pipe is provided on the outside of the base, and the plurality of branch pipes are all connected to the main pipe, and a control valve is installed on the branch pipe.

[0017] As an optional solution to the technical solution of the present application document, an adjusting hand wheel is fixedly connected to the outside of the negative pressure pipe, and the adjusting hand wheel is located on the outside of the base.

[0018] 3. Beneficial effects

[0019] Compared with the prior art, the beneficial effects of this application are:

[0020] 1) The present application provides a plurality of adjustment seats on the outside of the negative pressure pipe, so that the user can adjust the connection state between the through hole and the connecting cavity by rotating the negative pressure pipe, thereby forming negative pressure at different negative pressure holes of the cover plate, so that the present device can be suitable for fixing carriers of different sizes.

[0021] 2) The present application can effectively increase the sealing performance of the adjustment seat by providing a sealing gasket between the upper connecting part and the lower connecting part, thereby avoiding the problem of insufficient sealing at the connection between the through hole and the connecting cavity, which leads to the inability to effectively load the board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of a glass substrate IC carrier laser cutting workbench;

[0023] Figure 2 It is a schematic diagram of the internal structure of a glass substrate IC substrate laser cutting workbench;

[0024] Figure 3 It is a schematic diagram of the cover structure of a glass substrate IC carrier laser cutting workbench;

[0025] Figure 4 It is a schematic diagram of the structure of an adjustment seat of a glass substrate IC carrier laser cutting workbench;

[0026] In the figure: 1. base; 101. cavity; 2. negative pressure pipe; 201. through hole; 202. adjusting hand wheel; 3. adjusting seat; 301. connecting cavity; 302. first sealing groove; 303. upper connecting part; 304. lower connecting part; 305. second sealing groove; 4. cover plate; 401. negative pressure hole; 402. enclosure; 5. branch pipe; 501. control valve; 6. connecting piece; 7. sealing gasket; 8. main pipe. DETAILED DESCRIPTION

[0027] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings.

[0028] See also Figure 1 and Figure 2 ,This application provides a technical solution:

[0029] A glass substrate IC carrier laser cutting workbench comprises a base 1, a cavity 101 is provided inside the base 1, a plurality of negative pressure pipes 2 are provided in the cavity 101, a plurality of through holes 201 are provided on the outer side of the negative pressure pipe 2, the orientations of the plurality of through holes 201 are different, the negative pressure pipe 2 is connected to an adjustment seat 3 at the through hole 201, the negative pressure pipe 2 passes through the adjustment seat 3 and is rotatably connected to the adjustment seat 3, the adjustment seat 3 is fixedly connected to the base 1, a connecting cavity 301 is provided on the upper part of the adjustment seat 3, the connecting cavity 301 extends to the upper surface of the adjustment seat 3, a cover plate 4 is fixedly connected to the upper part of the base 1, a plurality of negative pressure holes 401 are provided on the cover plate 4, the negative pressure holes 401 are located above the connecting cavity 301, a fence 402 is provided between the negative pressure hole 401 and the connecting cavity 301, and the fence 402 is arranged in a closed state.

[0030] When in use, the device can rotate the negative pressure pipe 2 so that one of the through holes 201 on the negative pressure pipe 2 can be set upward and communicated with the connecting cavity 301, so as to adjust the communication state between the negative pressure hole 401 on the cover plate 4 and the negative pressure pipe 2; preferably, a plurality of negative pressure pipes 2 are arranged in rows and columns in the cavity 101, and an adjustment hand wheel 202 is fixedly connected to the outside of the negative pressure pipe 2, and the adjustment hand wheel 202 is located outside the base 1. The user can adjust the position of the negative pressure hole 401 on the cover plate 4 by adjusting the hand wheel 202 to meet the fixing requirements of glass IC carriers of different sizes.

[0031] like Figure 3 As shown, a first sealing groove 302 is opened on the upper part of the adjustment seat 3, and the enclosure 402 is plugged into the first sealing groove 302. The enclosure 402 is fixedly connected to the bottom of the cover plate 4, and the cover plate 4 is connected and fixed to the base 1 by bolts; by plugging the enclosure 402 into the first sealing groove 302, the sealing of the connection between the connecting cavity 301 and the negative pressure hole 401 can be increased.

[0032] Preferably, one end of the negative pressure pipe 2 is closed, and the other end extends to the outside of the base 1 and is connected to the branch pipe 5. A connector 6 is provided between the negative pressure pipe 2 and the branch pipe 5. The negative pressure pipe 2 is rotatably connected to the branch pipe 5 through the connector 6. A main pipe 8 is provided on the outside of the base 1. Multiple branch pipes 5 are connected to the main pipe 8. A control valve 501 is installed on the branch pipe 5. The user can form a negative pressure in the main pipe 8 by using a negative pressure pump, and form a negative pressure in multiple branch pipes 5 through the main pipe 8. The pressure at the negative pressure hole 401 can be adjusted by the control valve 501 to meet the fixing requirements of carriers of different shapes.

[0033] like Figure 4 As shown, the adjustment seat 3 is divided into an upper connection part 303 and a lower connection part 304, the connection cavity 301 is opened in the upper connection part 303, the lower part of the upper connection part 303 and the upper part of the lower connection part 304 are both provided with a second sealing groove 305, the second sealing groove 305 is set in a closed shape, a sealing gasket 7 is sleeved on the outside of the negative pressure pipe 2, the sealing gasket 7 is plugged and matched with the second sealing groove 305, the upper connection part 303 and the lower connection part 304 are connected and fixed by bolts, and the lower connection part 304 is connected and fixed to the base 1. By dividing the adjustment seat 3 into the upper connection part 303 and the lower connection part 304, it is convenient for users to install the negative pressure pipe 2, and by sleeved with a sealing gasket 7 on the outside of the negative pressure pipe 2, the sealing performance of the connection between the through hole 201 and the connection cavity 301 can be increased.

Claims

1. A glass substrate IC carrier laser cutting workbench, characterized in that: The invention comprises a base (1), wherein a cavity (101) is provided inside the base (1), wherein a plurality of negative pressure pipes (2) are provided in the cavity (101), wherein a plurality of through holes (201) are provided outside the negative pressure pipes (2), wherein the directions of the plurality of through holes (201) are different, wherein the negative pressure pipes (2) are connected to an adjustment seat (3) at the through holes (201), wherein the negative pressure pipes (2) pass through the adjustment seat (3) and are rotatably connected to the adjustment seat (3), and wherein the adjustment seat (3) is connected to the base (1). ) are connected and fixed, a connecting cavity (301) is provided on the upper part of the adjusting seat (3), and the connecting cavity (301) extends to the upper surface of the adjusting seat (3); a cover plate (4) is fixedly connected to the upper part of the base (1), and a plurality of negative pressure holes (401) are provided on the cover plate (4), and the negative pressure holes (401) are located above the connecting cavity (301); a baffle (402) is provided between the negative pressure holes (401) and the connecting cavity (301), and the baffle (402) is arranged in a closed state.

2. A glass substrate IC carrier laser cutting workbench according to claim 1, characterized in that: A first sealing groove (302) is provided on the upper portion of the adjustment seat (3), the enclosure (402) is plugged into and matched with the first sealing groove (302), and the enclosure (402) is fixedly connected to the bottom of the cover plate (4).

3. A glass substrate IC carrier laser cutting workbench according to claim 1, characterized in that: One end of the negative pressure pipe (2) is closed, and the other end extends to the outside of the base (1) and is connected to a branch pipe (5). A connecting piece (6) is provided between the negative pressure pipe (2) and the branch pipe (5), and the negative pressure pipe (2) is rotatably connected to the branch pipe (5) via the connecting piece (6).

4. The glass substrate IC carrier laser cutting workbench according to claim 1, characterized in that: The cover plate (4) is connected and fixed to the base (1) by means of bolts.

5. The glass substrate IC carrier laser cutting workbench according to claim 1, characterized in that: The adjustment seat (3) is divided into an upper connecting portion (303) and a lower connecting portion (304); the connecting cavity (301) is provided in the upper connecting portion (303); a second sealing groove (305) is provided at the lower portion of the upper connecting portion (303) and the upper portion of the lower connecting portion (304); the second sealing groove (305) is arranged in a closed state; a sealing gasket (7) is sleeved on the outer side of the negative pressure pipe (2); the sealing gasket (7) is plugged into and matched with the second sealing groove (305).

6. A glass substrate IC carrier laser cutting workbench according to claim 5, characterized in that: The upper connection part (303) and the lower connection part (304) are connected and fixed by bolts, and the lower connection part (304) is connected and fixed to the base (1).

7. The glass substrate IC carrier laser cutting workbench according to claim 1, characterized in that: The plurality of negative pressure pipes (2) are arranged in rows and columns in the cavity (101).

8. The glass substrate IC carrier laser cutting workbench according to claim 3, characterized in that: A main pipe (8) is provided on the outside of the base (1), and the plurality of branch pipes (5) are all connected to the main pipe (8), and a control valve (501) is installed on the branch pipe (5).

9. The glass substrate IC carrier laser cutting workbench according to claim 1, characterized in that: An adjusting hand wheel (202) is fixedly connected to the outside of the negative pressure pipe (2), and the adjusting hand wheel (202) is located outside the base (1).

Images