Automatic uniformity adjusting device for annealing furnace

Abstract

The utility model provides an automatic uniformity adjusting device for an annealing furnace. The automatic uniformity adjusting device comprises a temperature adjusting system, a pressure detection module, a furnace door detection module, a controller module, a heat-conducting medium control valve module, a circulating fan module and a vacuum pump module. Constant-temperature regulation and control of the temperature in the annealing furnace are completed through the temperature acquisition module, the PI D regulation module and the temperature control equipment of the temperature regulation system installed in the annealing furnace, constant-temperature setting is completed through the controller module, and when a semiconductor material is placed in the annealing furnace and the furnace door detection module detects that the furnace door is closed, the furnace door detection module detects that the furnace door is closed. The vacuum pump module is opened to vacuumize the annealing furnace, and when the pressure detection module detects a vacuum state, the controller module releases a heat-conducting medium into the annealing furnace by opening the heat-conducting medium control valve module and starts the circulating fan module, so that the heat-conducting medium is uniformly blown to a heated semiconductor material.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to an automatic uniformity adjustment device for an annealing furnace. Background Art

[0002] Annealing furnace is an important equipment in the semiconductor industry, which is widely used in the preparation and process development of various semiconductor materials. Annealing furnace heats semiconductor materials to a certain temperature to improve the crystal structure, electrical properties and mechanical properties of the materials. Temperature control is very important in the semiconductor annealing process. In the traditional annealing process, due to the influence of various factors, such as air flow in the furnace, layout of heating elements, etc., the temperature distribution inside the annealing furnace is often uneven, which affects the annealing effect and quality stability of the sheet.

[0003] Publication number CN107643782A provides a quartz lamp temperature test heating system with adjustable speed and uniform heating and a control method thereof. The system heats the object to be tested uniformly in all directions by installing a quartz bulb on the inner wall of a cylindrical device; the heating temperature of the quartz bulb is controlled by a power controller, and the cylindrical device is connected to a motor drive system through a coupling to control the cylindrical device to rotate at a set rate, so that the object to be tested can be uniformly heated in a short time; a heat dissipation cover is set outside the cylindrical device to form a uniform temperature field. However, the system is realized by evenly distributing quartz lamps in the furnace, but due to the different quality of the lamp tubes and the air flow in the furnace, the local heating of the quartz lamps will be biased, and the materials heated by the system are easily contaminated by air in a high temperature environment, and are not suitable for the field of semiconductor equipment technology.

[0004] Based on the above problems, there is an urgent need in the art for an automatic uniformity adjustment device for an annealing furnace that heats evenly, reduces the influence of air flow in the furnace on temperature uniformity, and is not easily contaminated by air at high temperatures. Summary of the invention

[0005] The utility model aims to provide an automatic uniformity adjustment device for an annealing furnace to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An automatic uniformity adjustment device for an annealing furnace, comprising:

[0008] A temperature regulating system, which is electrically connected to the controller module and is used to detect temperature data in the annealing furnace and regulate the temperature in the annealing furnace;

[0009] A pressure detection module, which is electrically connected to the controller module and installed in the annealing furnace, and is used to detect the gas pressure data in the annealing furnace and send it to the controller module;

[0010] A furnace door detection module, which is electrically connected to the controller module and installed at the annealing furnace door, and is used to detect the switch status of the annealing furnace door and send it to the controller module;

[0011] A controller module, the controller module is used to receive the pressure data in the furnace, the switch status of the furnace door, issue control instructions, and exchange data with the temperature control system;

[0012] A heat transfer medium control valve module, which is electrically connected to the controller module and installed on the wall of the annealing furnace, and is used to receive control instructions from the controller module to close the valve and release the heat transfer medium;

[0013] A circulation fan module, which is electrically connected to the controller module and installed on the furnace wall of the annealing furnace, and is used to receive control instructions from the controller module to circulate the heat-conducting medium in the annealing furnace;

[0014] The vacuum pump module is electrically connected to the controller module and is used to receive control instructions from the controller module to evacuate the gas in the annealing furnace.

[0015] Furthermore, there are two groups of temperature regulating systems, which are located on the upper and lower sides of the heated wafer, and five temperature regulating systems are evenly installed on each side.

[0016] Furthermore, the temperature control system includes a temperature acquisition module, a PID adjustment module and a temperature control device. The temperature acquisition module is installed above the temperature control device in the annealing furnace, and is used to detect the temperature data in the annealing furnace and send it to the PID adjustment module. The PID adjustment module is electrically connected to the controller module, and is used to send temperature control instructions to the temperature control device, and exchange temperature data and temperature control instructions with the controller module. The temperature control device is installed on the upper and lower sides of the heating table in the annealing furnace, and is used to adjust the temperature in the annealing furnace under the temperature control instructions of the PID adjustment module.

[0017] Furthermore, the temperature regulating system is connected to the RS485 interface of the controller module via the RS485 interface of the PID regulating module.

[0018] Furthermore, there are ten circulation fan modules, which are evenly installed on the furnace wall of the annealing furnace.

[0019] The beneficial effects of the utility model are:

[0020] The utility model provides an automatic uniformity adjustment device for an annealing furnace, comprising a temperature adjustment system, a pressure detection module, a furnace door detection module, a controller module, a heat transfer medium control valve module, a circulation fan module and a vacuum pump module. The utility model completes constant temperature control of the temperature in the annealing furnace through the temperature acquisition module, the PID adjustment module and the temperature control equipment of the temperature adjustment system installed in the annealing furnace, and completes the constant temperature setting through the controller module. When the semiconductor material is placed in the annealing furnace, when the furnace door detection module detects that the furnace door is closed, the vacuum pump module is turned on to evacuate the annealing furnace. When the pressure detection module detects the vacuum state, the controller module releases the heat transfer medium in the annealing furnace by opening the heat transfer medium control valve module, and turns on the circulation fan module, so that the heat transfer medium is evenly blown to the heated semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the system structure of the utility model.

[0022] In the figure: 10 temperature regulation system, 20 pressure detection module, 30 furnace door detection module, 40 controller module, 50 heat transfer medium control valve module, 60 circulation fan module, 70 vacuum pump module. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example:

[0025] See also Figure 1 , the utility model provides a technical solution:

[0026] An automatic uniformity adjustment device for an annealing furnace includes a temperature adjustment system 10, a pressure detection module 20, a furnace door detection module 30, a controller module 40, a heat transfer medium control valve module 50, a circulation fan module 60 and a vacuum pump module 70, wherein:

[0027] The temperature adjustment system 10 is electrically connected to the controller module 40 and is used to detect the temperature data in the annealing furnace and adjust the temperature in the annealing furnace.

[0028] In this embodiment, there are two groups of temperature regulation systems 10, which are located on the upper and lower sides of the heated wafer. Five temperature regulation systems 10 are evenly installed on each side. The temperature regulation systems distributed on the upper and lower sides heat the wafer at the same time, further making the wafer heated evenly.

[0029] In this embodiment, the temperature control system 10 includes a temperature acquisition module 11, a PID adjustment module 12 and a temperature control device 13. The temperature acquisition module 11 is a probe-type thermocouple of model WRNK-191, which is installed above the temperature control device 13 in the annealing furnace, and is used to detect the temperature data in the annealing furnace and send it to the PID adjustment module 12. The PID adjustment module 12 is a temperature controller of model AI-207, which is electrically connected to the controller module 40, and is used to send temperature control instructions to the temperature control device 13, and exchange temperature data and temperature control instructions in the controller module 40. The temperature control device 13 is a halogen lamp of model ALARGE-FJC180, which is installed on the upper and lower sides of the heating table in the annealing furnace, and is used to adjust the temperature in the annealing furnace under the temperature control instructions of the PID adjustment module 12.

[0030] In this embodiment, the temperature control system 10 is connected to the RS485 interface of the controller module 40 via the RS485 interface of the PID control module 12, and adopts the RS485 communication mode, so that the controller module 40 can send the set temperature data to multiple PID control modules 12, thus saving the communication interface resources.

[0031] When in use, the temperature acquisition module 11 is installed above the temperature control device 13, and the temperature data in the annealing furnace can be detected more accurately. The temperature acquisition module 11 includes a temperature probe and a temperature transmitter part. One end of the temperature probe extends into the annealing furnace, and the temperature probe is located above the temperature control device 13. The temperature transmitter part converts the collected temperature data into an analog signal. The temperature acquisition module 11 sends the collected temperature data to the PID adjustment module 12 through the analog signal. The PID adjustment module 12 is based on the set temperature value. The temperature value set by the PID adjustment module 12 is set through the controller module 40. The PID adjustment is performed by controlling the power of the temperature control device 13, so that the temperature control is more accurate. Since the temperature acquisition module 11 and the temperature control device 13 are evenly distributed in the annealing furnace, the temperature in the annealing furnace is more uniform when heated.

[0032] The pressure detection module 20 is a negative pressure transmitter of model MI K-P300, which is electrically connected to the controller module 40 and installed in the annealing furnace to detect the gas pressure data in the annealing furnace. When the vacuum pressure is detected, the internal contacts are closed to form a current loop, generate a high-level signal, and send it to the controller module 40.

[0033] The furnace door detection module 30 is a limit switch of model EE-SX670, which is electrically connected to the controller module 40 and installed at the annealing furnace door. It is used to detect the switch status of the annealing furnace door and send it to the controller module 40. When the furnace door is closed, the furnace door touches the limiter of the detection module 30, and the limiter closes the internal contacts to form a closed loop, generating a high-level signal, and the high-level signal is sent to the controller module 40.

[0034] The controller module 40 is a variable logic controller of model XMZS7-1200, which is used to receive pressure data inside the furnace, furnace door switch status, issue control instructions, and exchange data with the temperature control system 10.

[0035] The heat transfer medium control valve module 50 is a vacuum ball valve of model 304-KF16, which is electrically connected to the controller module 40 and installed on the wall of the annealing furnace to receive control instructions from the controller module 40 to close the valve and release the heat transfer medium.

[0036] The circulating fan module 60 is an axial flow fan of model YFSFE. The circulating fan module 60 includes two parts: a fan blade and a motor. The motor is installed on the outside of the annealing furnace wall and is electrically connected to the controller module 40. It is started and stopped according to the high and low level control instructions issued by the controller module 40. The fan blade and the motor are connected by a connecting shaft. The connecting shaft passes through the annealing furnace wall. One end of the connecting shaft is connected to the motor rotor rotating shaft, and the other end is connected to the fan blade. The fan blade is made of high-temperature resistant stainless steel and is installed on the furnace wall of the annealing furnace. After the motor receives the instruction to rotate, the fan blade is driven to rotate through the connecting shaft to circulate the heat transfer medium in the annealing furnace.

[0037] The vacuum pump module 70 is a vacuum pump of model VALUE-VRD-4, which is electrically connected to the controller module 40 and is used to receive control instructions from the controller module 40 to evacuate the gas in the annealing furnace to maintain the purity of the heat transfer medium and prevent the wafer from being contaminated by oxygen and impurities in the air.

[0038] In this embodiment, there are ten circulation fan modules 60 which are evenly installed on the furnace wall of the annealing furnace.

[0039] After the wafer material is placed in the annealing furnace, the furnace door is closed. When it is closed, the limit switch of the furnace door detection module 30 will be triggered, and the internal circuit will be turned on to form a high-level signal. The high-level signal is sent to the controller module 40. When the controller module 40 receives the high-level signal, it controls the vacuum pump module 70 to start and evacuate the air in the annealing furnace. The pressure detection module 20 performs real-time detection of the air pressure in the furnace. When the vacuum pressure setting value is detected, a high-level signal is sent to the controller module 40. The controller module 40 controls the heat transfer medium control valve module 50 to open the valve to release the heat transfer medium gas into the annealing furnace. Since there is a gap between the temperature control devices 13, and the heat is radiated outward from the temperature control device 13, peak-valley heat waves are formed. The peak-valley heat waves will cause differences in the internal temperature. By starting the circulation fan module 60, the heat emitted by the temperature control device 13 is blown to the wafer material through the heat transfer medium. In the process of the flow of the heat transfer medium, the heat is further mixed, and the heat will be more uniform.

[0040] The use principle of the utility model: when in use, the temperature in the annealing furnace is controlled by the temperature acquisition module, PID adjustment module and temperature control equipment of the temperature adjustment system installed in the annealing furnace, and the constant temperature setting is completed by the controller module. When the semiconductor material is placed in the annealing furnace and the furnace door detection module detects that the furnace door is closed, the vacuum pump module is turned on to evacuate the annealing furnace. When the pressure detection module detects the vacuum state, the controller module releases the heat-conducting medium in the annealing furnace by opening the heat-conducting medium control valve module, and turns on the circulating fan module, so that the heat-conducting medium is evenly blown toward the heated semiconductor material.

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic uniformity adjustment device for an annealing furnace, characterized in that: include: A temperature regulating system (10), the temperature regulating system (10) being electrically connected to the controller module (40) and used for detecting temperature data in the annealing furnace and regulating the temperature in the annealing furnace; A pressure detection module (20), the pressure detection module (20) being electrically connected to the controller module (40), installed in the annealing furnace, and used for detecting gas pressure data in the annealing furnace and sending the data to the controller module (40); A furnace door detection module (30), the furnace door detection module (30) being electrically connected to the controller module (40), installed at the annealing furnace door, and used for detecting the switch state of the annealing furnace door and sending the state to the controller module (40); A controller module (40), the controller module (40) being used to receive furnace pressure data, furnace door switch status, issue control instructions, and exchange data with the temperature adjustment system (10); A heat transfer medium control valve module (50), the heat transfer medium control valve module (50) being electrically connected to the controller module (40), installed on the wall of the annealing furnace, and used for receiving a control instruction from the controller module (40) to close the valve and release the heat transfer medium; A circulation fan module (60), the circulation fan module (60) being electrically connected to the controller module (40), installed on the furnace wall inside the annealing furnace, and used for receiving control instructions from the controller module (40) to circulate the heat-conducting medium inside the annealing furnace; A vacuum pump module (70) is electrically connected to the controller module (40) and is used to receive control instructions from the controller module (40) to evacuate the gas in the annealing furnace.

2. The automatic uniformity adjustment device for an annealing furnace according to claim 1, characterized in that: The temperature regulating systems (10) have two groups, which are located on the upper and lower sides of the heated wafer, and five temperature regulating systems (10) are evenly installed on each side.

3. The automatic uniformity adjustment device for an annealing furnace according to claim 2, characterized in that: The temperature adjustment system (10) comprises a temperature acquisition module (11), a PID adjustment module (12) and a temperature control device (13); the temperature acquisition module (11) is installed above the temperature control device (13) in the annealing furnace and is used to detect temperature data in the annealing furnace and send it to the PID adjustment module (12); the PID adjustment module (12) is electrically connected to the controller module (40) and is used to send temperature control instructions to the temperature control device (13) and exchange temperature data and temperature control instructions in the controller module (40); the temperature control device (13) is installed on the upper and lower sides of the heating table in the annealing furnace and is used to adjust the temperature in the annealing furnace under the temperature control instructions of the PID adjustment module (12).

4. The automatic uniformity adjustment device for an annealing furnace according to claim 2, characterized in that: The temperature adjustment system (10) is connected to the RS485 interface of the controller module (40) via the RS485 interface of the PID adjustment module (12).

5. The automatic uniformity adjustment device for an annealing furnace according to claim 1, characterized in that: There are ten circulation fan modules (60) which are evenly installed on the inner wall of the annealing furnace.

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