A vacuum cooling device for a heating furnace and a heating treatment device

Abstract

The present application discloses a vacuum cooling device and a heating treatment equipment for a heating furnace, wherein the vacuum cooling device comprises: a cooler, which is provided with an air inlet, an exhaust port and an air supply port, wherein the air inlet is connected to the heating furnace through an air inlet pipe to receive the process waste gas output by the heating furnace, the exhaust port is connected to the exhaust pipe, and the air supply port receives cooling gas through the air supply pipe; a vacuum pump is connected to the exhaust pipe; a vacuum gauge and a temperature sensor are both arranged on the exhaust pipe. By inputting cooling gas into the air supply pipe for mixing with the process waste gas, the cooling effect of the high-temperature process waste gas discharged from the heating furnace can be improved, and at the same time, by utilizing the characteristics of the process flow, the vacuum pump speed margin when the heating furnace is in process is fully utilized, thereby saving the implementation cost of the technical solution.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic production equipment, and in particular to a vacuum cooling device and heating treatment equipment for a heating furnace. Background Art

[0002] During the preparation of solar cells, silicon wafers need to go through processes such as texturing, diffusion, etching, coating and printing in sequence. Among them, diffusion furnaces, oxidation furnaces, and coating equipment such as ALD and CVD all need to heat the chamber and evacuate the chamber to carry out the process. Taking the diffusion furnace as an example, the silicon wafer is placed in the diffusion furnace with a quartz boat as a carrier, and nitrogen and diffusion sources are introduced into the diffusion furnace at a certain temperature to diffuse and deposit PN junctions on the surface of the silicon wafer. The diffusion process of the diffusion furnace is carried out at high temperature, and the process exhaust gas needs to be connected to a vacuum pump to be extracted. However, since the process exhaust gas temperature is too high, it needs to be cooled by a cooler. In the prior art, the process exhaust gas can flow for a longer time before being extracted from the cooler by increasing the length of the air inlet pipe of the cooler or by adding a blocking component inside the cooler. However, such a cooling effect is still poor, which will not only cause the plastic parts in the vacuum pump to be burned or aged by high temperature, but also cause damage to the sealing rings of pipe joints and the like. Utility Model Content

[0003] In view of the above problems, the present application provides a vacuum cooling device and a heating treatment equipment for a heating furnace, which can improve the cooling effect and protect the vacuum pump and the sealing ring of the pipe joint.

[0004] In order to solve the above problems, the present application provides a vacuum cooling device for a heating furnace, the vacuum cooling device comprising: a cooler, provided with an air inlet, an exhaust port and an air supply port, the air inlet being connected to the heating furnace through an air inlet pipe to receive the process exhaust gas output by the heating furnace, the exhaust port being connected to the exhaust pipe, and the air supply port receiving the cooling gas through the air supply pipe; a vacuum pump, connected to the exhaust pipe; a vacuum gauge and a temperature sensor, both arranged on the exhaust pipe.

[0005] In one embodiment, the vacuum cooling device further includes: a frequency converter coupled to the vacuum pump to adjust the pumping speed of the vacuum pump; and a valve disposed on the air supply pipe to adjust the flow rate of the cooling gas in the air supply pipe.

[0006] In one embodiment, a partition is provided inside the cooler, the partition is located between the air inlet and the air outlet, and the partition is provided with a connecting portion for air flow to pass through.

[0007] In one embodiment, the air supplement port and the air inlet port are located on the same side of the partition.

[0008] In one embodiment, the connecting portion includes at least one of a pore and a notch.

[0009] In one embodiment, the connecting portion on the partition is staggered with the exhaust port.

[0010] In one embodiment, a plurality of partitions are provided inside the cooler, the plurality of partitions are arranged at intervals, and the connecting portions of adjacent partitions are arranged in a staggered manner.

[0011] In one embodiment, the gas path of the gas supplement port and the gas flow path of the gas inlet port are intersected before reaching the partition.

[0012] In one embodiment, the cooler includes a side wall, a first end and a second end, the first end and the second end are arranged on both sides of the partition relatively to each other and are both connected to the side wall, wherein the air inlet and the first end are located on the same side of the partition, the air flow directions of the air inlet and the air supply port are both directed to the first end, and the exhaust port and the second end are located on the same side of the partition.

[0013] In one embodiment, the inner surface of the first end portion is concave.

[0014] In one embodiment, the vacuum cooling device further comprises: a filter, which is connected and arranged downstream of the exhaust port and is used to filter the gas discharged from the exhaust port.

[0015] The present application also provides a heating treatment device, comprising a vacuum cooling device and a heating furnace as described in any one of the above embodiments, wherein the exhaust end of the heating furnace is connected to the air inlet pipe.

[0016] Different from the prior art, the beneficial effects of the present application are as follows: the cooler is connected to a first air inlet pipe, a first exhaust pipe and an air supply pipe, and a vacuum gauge and a temperature sensor are arranged on the first exhaust pipe. According to the temperature of the monitored temperature sensor, the gas temperature can be adjusted by adjusting the gas flow rate of the cooling gas in the air supply pipe. At the same time, according to the monitored pressure of the vacuum gauge, the pressure can be stabilized by adjusting the pumping speed of the vacuum pump. Through the structure of the present application, by inputting cooling gas into the air supply pipe for mixing with the process exhaust gas, the cooling effect of the high-temperature process exhaust gas discharged from the heating furnace can be improved, and the plastic parts in the vacuum pump can be prevented from being burned / aged by high temperature, as well as damage to the sealing rings of the pipe joints, etc. At the same time, the characteristics of the process flow are utilized to fully utilize the pumping speed margin of the vacuum pump when the heating furnace is in process, thereby saving the cost of implementing the technical solution.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0019] Figure 1 This is a schematic structural diagram of an embodiment of a heating treatment device of the present application;

[0020] Figure 2 for Figure 1 A schematic diagram of a half-section structure of a first embodiment of an intermediate cooler;

[0021] Figure 3 for Figure 2 A schematic diagram of a half section of the intercooler;

[0022] Figure 4 for Figure 1 A schematic diagram of an embodiment of the internal coupling of the vacuum cooling device;

[0023] Figure 5 for Figure 1 A schematic diagram of a half-section structure of a second embodiment of an intermediate cooler;

[0024] Figure 6 for Figure 1 A schematic diagram of a half-section structure of a third embodiment of an intermediate cooler;

[0025] Figure 7 for Figure 6 A schematic diagram of a half section of the intercooler;

[0026] Figure 8 for Figure 1 A schematic diagram of a half-section structure of a fourth embodiment of an intermediate cooler;

[0027] Fig. 9 for Figure 1 A schematic diagram of the half-section structure of a fifth embodiment of an intercooler. DETAILED DESCRIPTION

[0028] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0031] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] The heating furnace using the vacuum cooling device 20 may be a diffusion furnace 10, an oxidation furnace, an ALD device or a CVD device. Figure 1 , Figure 2 and Figure 3 The present application provides a vacuum cooling device 20 for a diffusion furnace 10, and the vacuum cooling device 20 includes a cooler 210, a vacuum pump 220, a vacuum gauge 230 and a temperature sensor 240. The cooler 210 is provided with an air inlet A, an exhaust port B and an air supply port C. The air inlet A is connected to the diffusion furnace 10 through an air inlet pipe 211 to receive the process exhaust gas output by the diffusion furnace 10, the exhaust port B is connected to the exhaust pipe 212, and the air supply port C receives the cooling gas through the air supply pipe 213. The vacuum pump 220 is connected to the exhaust pipe 212. The vacuum gauge 230 and the temperature sensor 240 are both arranged on the exhaust pipe 212. Because the temperature of the gas extracted from the heating furnace is relatively high, the high temperature resistance of the cooler 210 itself is required, so the cooler 210 is preferably made of quartz material. For the cooler 210 made of quartz material, if a water cooling solution is adopted, there is a risk that the cooler 210 will burst due to the drastic temperature change, so the method of mixing and cooling the cooling gas is more suitable for the equipment environment.

[0033] Specifically, the air inlet pipe 211 is connected to the diffusion furnace 10 and is used to receive the process waste gas output by the diffusion furnace 10. Since the diffusion furnace 10 performs a high-temperature diffusion process, the temperature of the discharged process waste gas is still very high, and it needs to be cooled by the cooler 210 before being drawn into the vacuum pump 220. A vacuum gauge 230 and a temperature sensor 240 are provided on the exhaust pipe 212 of the cooler 210. The vacuum gauge 230 is used to monitor the pressure of the gas discharged from the cooler 210, and the temperature sensor 240 is used to monitor the temperature of the gas discharged from the cooler 210. When the vacuum gauge 230 detects a change in pressure, the vacuum pump 220 can be controlled manually or automatically to adjust its pumping speed to ensure the stability of the pressure. The air inlet pipe 211 is connected to the interior of the cooler 210 through the air inlet port A, the exhaust pipe 212 is connected to the interior of the cooler 210 through the exhaust port B, and the air supply pipe 213 is connected to the interior of the cooler 210 through the air supply port C. A cooling gas, such as nitrogen or clean dry air, is input into the air supply pipe 213. The cooling gas is mixed with the high-temperature process exhaust gas entering from the air inlet pipe 211 to achieve the purpose of lowering the gas temperature. The gas flow in the air supply pipe 213 can be adjusted according to the temperature monitored by the temperature sensor 240 so that the temperature of the mixed gas meets the requirements. For example, when the temperature is too high, the gas flow in the air supply pipe 213 is increased, or when the temperature is too low, the gas flow in the air supply pipe 213 is reduced to save cooling gas. At the same time, the pumping speed of the vacuum pump 220 can be adjusted according to the pressure of the mixed gas monitored by the vacuum gauge 230 to meet the pressure requirements. For example, when the pressure is too high, the pumping speed of the vacuum pump 220 is increased, or when the pressure is too low, the pumping speed of the vacuum pump 220 is reduced.

[0034] In the prior art, the vacuuming process of the diffusion furnace is mainly divided into two steps, namely, the vacuuming stage and the process stage. The vacuuming stage mainly involves evacuating the gas in the diffusion furnace cavity to a near-vacuum state. At this time, the pumping speed of the vacuum pump can be full speed or close to full speed. In the process stage, since the cavity is already close to a vacuum state, it is only necessary to extract the process waste gas in the production process. Therefore, the pumping speed of the vacuum pump can be less than half of the full speed, for example, it can be between 15% and 30%. Therefore, when the cooling gas is supplemented to the cooler 210 through the air supply pipe 213 of the present application, the pumping speed of the vacuum pump 220 is simultaneously increased. There is no need to modify or replace the vacuum pump 220, and the original pressure can be maintained. At the same time, on this basis, the cooling effect of the cooler 210 can be improved, which is very suitable for low-cost improvements to existing diffusion equipment.

[0035] From the above content, it can be seen that the present application sets an air supply pipe 213 on the cooler 210, and further sets a vacuum gauge 230 and a temperature sensor 240, and uses a method of mixing cooling gas with high-temperature process waste gas to cool the process waste gas, so that the temperature of the mixed gas can eventually meet the requirements, thereby preventing the plastic parts in the vacuum pump 220 from being burned or aged.

[0036] In one embodiment, the vacuum cooling device 20 further includes a frequency converter and a valve. The frequency converter is coupled to the vacuum pump 220 to adjust the pumping speed of the vacuum pump 220 . The valve is disposed on the air supply pipe 213 to adjust the flow rate of the cooling gas in the air supply pipe 213 .

[0037] In one embodiment, see Figure 4 The vacuum cooling device 20 further includes a frequency converter 250, a valve 260 and a processor 270. The frequency converter 250 is coupled to the vacuum pump 220; the valve 260 is arranged on the air supply pipe 213; the processor 270 is coupled to the valve 260, the vacuum gauge 230, the temperature sensor 240 and the frequency converter 250, wherein the processor 270 controls the valve 260 to adjust the flow of the cooling gas in the air supply pipe 213 according to the temperature detected by the temperature sensor 240, and the processor 270 controls the frequency converter 250 to adjust the pumping speed of the vacuum pump 220 according to the pressure detected by the vacuum gauge 230. The processor 270 can be a central processing unit (CPU), a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a programmable logic controller (PLC) or a microprocessor, etc.

[0038] Specifically, the frequency converter 250 is used to adjust the pumping speed of the vacuum pump 220. The frequency converter 250 may be integrated in the vacuum pump 220, or may be arranged outside the vacuum pump 220 and coupled to the vacuum pump 220. The frequency converter 250 receives a control signal from the processor 270 to adjust the pumping speed of the vacuum pump 220. The processor 270 receives the pressure detected by the vacuum gauge 230, and sends a control signal to control the frequency converter 250 according to the pressure value to adjust the pumping speed of the vacuum pump 220. When the pressure detected by the vacuum gauge 230 increases or is higher than the first pressure threshold, the processor 270 controls the frequency converter 250 to increase the pumping speed of the vacuum pump 220; when the pressure detected by the vacuum gauge 230 decreases or is lower than the second pressure threshold, the processor 270 controls the frequency converter 250 to reduce the pumping speed of the vacuum pump 220, wherein the first pressure threshold and the second pressure threshold are determined according to actual process requirements. The processor 270 receives the temperature of the temperature sensor 240, and sends a control signal to control the valve 260 to adjust the gas flow of the cooling gas in the gas supply pipe 213 according to the temperature. When the temperature detected by the temperature sensor 240 increases or is higher than the first temperature threshold, the processor 270 controls the valve 260 to increase the gas flow of the cooling gas in the gas supply pipe 213; when the temperature detected by the temperature sensor 240 decreases or is lower than the second temperature threshold, the processor 270 controls the valve 260 to reduce the gas flow of the cooling gas in the gas supply pipe 213. It can be seen from the above that by coupling the processor 270 with the vacuum gauge 230, the temperature sensor 240, the inverter 250 and the valve 260, the effect of automatic cooling when overheating can be achieved without manual intervention.

[0039] Of course, in some other embodiments, the processor may not be used, and the vacuum pump speed may be manually adjusted when the value of the vacuum gauge changes, and the valve of the air supply pipe may be manually adjusted when the value of the temperature sensor changes. That is, the vacuum cooling device 20 includes a frequency converter 250, which is coupled to the vacuum pump 220 to adjust the pumping speed of the vacuum pump 220; and a valve 260, which is arranged on the air supply pipe 213 to adjust the flow of the cooling gas in the air supply pipe 213.

[0040] In one embodiment, see Figure 2 and Figure 3 A partition 214 is provided inside the cooler 210 . The partition 214 is located between the air inlet A and the air outlet B. The partition 214 is provided with a connecting portion D for air flow to pass through.

[0041] Specifically, a partition 214 is provided in the cooler 210, and the partition 214 is provided with a connecting portion D. The gas entering from the air inlet A flows to the exhaust port B through the connecting portion D. The solid part on the partition 214 has a certain blocking effect on the gas, which can increase the time the gas stays in the cooler 210, thereby increasing the mixing time of the process exhaust gas and the cooling gas, and improving the cooling effect on the gas.

[0042] In one embodiment, see Figure 2 The air supply port C and the air inlet A are located on the same side of the partition 214. In this way, the cooling gas and the high-temperature process exhaust gas can be blocked by the partition 214 before flowing through the connecting portion D, so that the cooling gas and the high-temperature process exhaust gas are fully mixed to achieve a sufficient cooling effect.

[0043] Of course, in some other embodiments, the air supply port C and the exhaust port B may also be located on the same side of the partition 214. In this case, the cooling gas entering the cooler 210 from the air supply port C contacts and mixes with the process exhaust gas passing through the connecting portion D to achieve cooling.

[0044] Furthermore, the connecting portion D includes at least one of a pore and a notch. Figure 2 As shown in , the connecting portion D is a notch, such as Figure 5 As shown in , the connecting portion D is a pore. Of course, in some other embodiments, the connecting portion D includes both a pore and a notch.

[0045] In one embodiment, see Figure 3 The connecting portion D on the partition 214 and the air flow path of the exhaust port B are staggered.

[0046] Specifically, the air flow path of the exhaust port B is staggered with the connecting portion D. This can prevent the gas entering from the air inlet A from flowing directly toward the exhaust port B along the direction of the connecting portion D. In other words, the time and distance the gas stays in the cooler 210 after passing through the partition 214 are increased, thereby increasing the mixing time of the cooling gas and the process exhaust gas, improving the mixing uniformity of the cooling gas and the process exhaust gas, and improving the cooling effect.

[0047] Of course, in some other embodiments, the connecting portion D on the partition 214 and the air flow path of the exhaust port B can be arranged to face each other.

[0048] In one embodiment, see Figure 6 and Figure 7 A plurality of partitions 214 are provided inside the cooler 210 . The plurality of partitions 214 are arranged at intervals, and the connecting portions D of adjacent partitions 214 are arranged in a staggered manner.

[0049] Specifically, the number of the multi-layer partitions 214 is greater than or equal to 2 layers, and can be 2 layers, 5 layers or 8 layers, etc., and this application does not make specific restrictions. The multi-layer partitions 214 are arranged at intervals, and the gaps between adjacent partitions 214 can flow gas. The connecting parts D of adjacent partitions 214 are arranged in a staggered manner, thereby forming a tortuous air flow channel, so that the gas travels more in the cooler 210, thereby increasing the time for the cooling gas and the process exhaust gas to mix, and improving the cooling effect.

[0050] In one embodiment, see Figure 2 , the height of the air supply port C is higher than the height of the air inlet A.

[0051] Specifically, cooling gas enters the air supply port C, and high-temperature process exhaust gas enters the air inlet A. According to the principles of thermodynamics, cold gas descends and hot gas rises. Therefore, setting the height of the air supply port C higher than the height of the air inlet A can allow the cooling gas and the high-temperature process exhaust gas to mix quickly.

[0052] Of course, in some other embodiments, the height of the air supply port C may also be equal to the height of the air inlet A.

[0053] In some embodiments, see Figure 2 The airflow path of the air supply port C and the airflow path of the air inlet A are arranged to intersect before reaching the partition 214. In this way, the cooling gas and the process exhaust gas can flow to the intersection of the gas paths, and the cooling gas and the process exhaust gas can be fully mixed at the intersection. After the first mixing, the cooling gas and the high-temperature process exhaust gas are blocked by the partition 214, so as to further improve the mixing uniformity.

[0054] In one embodiment, see Figure 6 The cooler 210 includes a side wall 215, a first end 216 and a second end 217. The first end 216 and the second end 217 are arranged on both sides of the partition 214 opposite to each other and are both connected to the side wall 215. The air inlet A and the first end 216 are located on the same side of the partition 214, and the air flow directions of the air inlet A and the air supply port C both point to the first end 216. The exhaust port B and the second end 217 are located on the same side of the partition 214.

[0055] Specifically, Figure 2 The cooler 210 is a vertical structure, in which the first end 216 and the air inlet A are arranged on the same side of the partition 214, and the gas flows of the air inlet A and the air supply port C are both directed to the first end 216, so that the cooling gas and the high-temperature process exhaust gas can be fully mixed at the first end 216 and then flow to the connecting part D, which increases the mixing time and air flow distance and enhances the mixing and cooling effect.

[0056] For further information, see Figure 2The inner surface of the first end portion 216 is concave. The concave structure helps the two gases from the gas replenishment port C and the gas inlet port A to converge from the edge to the center of the concave surface of the first end portion 216. The two gases can be arranged to be aligned with the opposite sides of the concave surface of the first end portion 216, respectively, so that they can diffuse along the concave surface in a fan shape to the center of the concave surface and mix with each other, which can improve the mixing efficiency and uniformity.

[0057] Of course, in some other embodiments, the inner surface of the first end portion 216 may also be a plane or other uneven surface.

[0058] In one embodiment, see Figure 8 The air inlet A and the air outlet B are respectively arranged on two opposite side walls 218 of the cooler 210 .

[0059] Specifically, Figure 8 The cooler 210 shown in the figure is a horizontal structure, the air inlet pipe 211 is connected to the side wall 218 of the cooler 210 through the air inlet A, the exhaust pipe 212 is connected to the side wall 218 of the cooler 210 through the exhaust port B, and the air inlet A and the exhaust port B are arranged opposite to each other.

[0060] For further information, see Figure 8 and Fig. 9 At least one partition 214 is provided inside the cooler 210. In the direction from the air inlet A to the exhaust port B, at least two partitions 214 are arranged in sequence and spaced apart. Each partition 214 is provided with a connecting portion D, wherein the height of the connecting portion D on the partition 214 adjacent to the air inlet A is less than the height of the air inlet A.

[0061] Specifically, one or more partitions 214 are arranged at intervals inside the cooler 210 along the direction from the air inlet A to the exhaust port B. Each partition 214 is provided with a connecting portion D for gas circulation. The height of the connecting portion D on the partition 214 adjacent to the air inlet A is smaller than the height of the air inlet A. On the one hand, since cold gas will flow downward and hot gas will flow upward, the setting of the connecting portion D of the partition 214 adjacent to the air inlet A helps to allow the lower gas that has been fully cooled to circulate first. On the other hand, the partition 214 adjacent to the air inlet A serves to block the upper hot gas.

[0062] It should be noted that the structure of the cooler of the present application is not limited to the above content and the structure shown in the drawings. The structural principles achieved through general adjustments are consistent with the present application and are included in the protection scope of the present application.

[0063] In one embodiment, see Figure 1 and Figure 2The vacuum cooling device 20 further includes a filter 280 , which is disposed downstream of the exhaust port B and is used to filter the gas discharged from the exhaust port B to ensure that the gas extracted by the vacuum pump 220 is clean.

[0064] Specifically, the filter 280 can be connected and arranged at any position downstream of the exhaust port B, preferably between the cooler 210 and the vacuum pump 220. Because there are also some plastic parts in the filter 280 that are not resistant to high temperatures, connecting the filter 280 after the cooler 210 helps to ensure the service life of the filter 280.

[0065] Of course, in some other embodiments, the vacuum cooling device 20 may not include a filter.

[0066] See also Figure 1 and Figure 2 The present application also provides a heating treatment device 30, comprising a vacuum cooling device 20 and a diffusion furnace 10 as in any of the above embodiments, wherein the exhaust end of the diffusion furnace 10 is connected to the air inlet pipe 211. When the high-temperature diffusion process is performed in the diffusion furnace 10, high-temperature process waste gas will be discharged. The vacuum cooling device 20 of the present application can effectively reduce the gas temperature, thereby protecting the vacuum pump 220, and further extending the service life of the entire vacuum cooling device 20.

[0067] In one embodiment, continue to refer to Figure 1 The diffusion furnace 10 includes a cavity 110, a heating unit 120, a supporting unit 130, an air inlet pipe 140 and an exhaust pipe 150. The heating unit 120 is disposed on the cavity 110 to heat the cavity 110 and form a high temperature environment; the supporting unit 130 is located inside the cavity 110 to support a silicon wafer 160; the air inlet pipe 140 is connected to the cavity 110 to input process gas; and the exhaust pipe 150 is connected to the cavity 110 to exhaust the gas in the cavity 110.

[0068] In other embodiments, see Figure 1 The diffusion furnace further includes a furnace door seal 170 and a furnace door 180. When the furnace door 180 is opened, the bearing part 130 and the silicon wafer 160 are sent into the cavity 110 through the furnace door 180, and then the furnace door 180 is closed, and the cavity is sealed by the furnace door seal 170 and the furnace door 180, wherein the furnace door seal includes a furnace door flange or a sealing ring, etc. The bearing part 130 can be a quartz boat, which is specifically entered and exited from the cavity 110 through a paddle rod and a boat support.

[0069] The above description is only an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A vacuum cooling device for a heating furnace, characterized in that: The vacuum cooling device comprises: A cooler, provided with an air inlet, an exhaust port and an air supply port, wherein the air inlet is connected to the heating furnace through an air inlet pipe to receive process waste gas output by the heating furnace, the exhaust port is connected to the exhaust pipe, and the air supply port receives cooling gas through the air supply pipe; A vacuum pump connected to the exhaust pipe; The vacuum gauge and the temperature sensor are both arranged on the exhaust pipe.

2. The vacuum cooling device according to claim 1, characterized in that: The vacuum cooling device also includes: A frequency converter coupled to the vacuum pump to adjust the pumping speed of the vacuum pump; A valve is arranged on the air supply pipe to adjust the flow of the cooling gas in the air supply pipe.

3. The vacuum cooling device according to claim 1, characterized in that: A partition is provided inside the cooler, the partition is located between the air inlet and the air outlet, and the partition is provided with a connecting portion for air flow to pass through.

4. The vacuum cooling device according to claim 3, characterized in that: The air supply port and the air inlet port are located on the same side of the partition.

5. The vacuum cooling device according to claim 3, characterized in that: The connecting portion includes at least one of a pore and a notch.

6. The vacuum cooling device according to claim 3, characterized in that: The connecting portion on the partition is staggered with the exhaust port.

7. The vacuum cooling device according to claim 3, characterized in that: The cooler is provided with multiple layers of partitions inside, the multiple layers of partitions are arranged at intervals, and the communication parts of adjacent partitions are arranged in staggered positions.

8. The vacuum cooling device according to claim 7, characterized in that: The air flow path of the air supply port and the air flow path of the air inlet port are arranged to intersect before reaching the partition plate.

9. The vacuum cooling device according to claim 8, characterized in that: The cooler includes a side wall, a first end and a second end, wherein the first end and the second end are arranged on both sides of the partition relatively to each other and are both connected to the side wall, wherein the air inlet and the first end are located on the same side of the partition, the air flow directions of the air inlet and the air supply port are both directed to the first end, and the exhaust port and the second end are located on the same side of the partition.

10. The vacuum cooling device according to claim 9, characterized in that: The inner surface of the first end portion is concave.

11. The vacuum cooling device according to claim 1, characterized in that: The vacuum cooling device also includes: The filter is connected and arranged downstream of the exhaust port, and is used for filtering the gas discharged from the exhaust port.

12. A heating treatment device, characterized in that: It comprises the vacuum cooling device as described in any one of claims 1 to 11 and a heating furnace, wherein the exhaust end of the heating furnace is connected to the air inlet pipe.

Images