Electronic component and circuit board equipment
By designing an MLCC end electrode structure with the second layer of the elastic material body, the existing MLCC cannot meet the on-board test requirements, and the effect of good conductivity, low loss and heat generation, long service life, and improved plate bending, mechanical impact and vibration performance is achieved.
Patent Information
- Application Number
- CN202421224820.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing MLCC hard terminal structure cannot meet the requirements of test items such as plate bending, mechanical impact, and vibration on the vehicle. At the same time, the use of soft terminal layers leads to large losses, poor conductivity, high heat generation, and low life and safety when powered on.
An electronic component is designed, and its end electrode structure includes a first electrode layer, a second layer, a second electrode layer and a third electrode layer. The second layer is composed of a body of elastic material, which only encloses the peripheral portion of the first electrode layer, and has a through hole so that the current does not conduct through the second layer.
Through this structure, electronic components have good conductivity when powered on, reduced equivalent series resistance, reduced loss and heat generation, extended service life, and exhibit higher resistance in tests such as plate bending, mechanical impact, and vibration.
Smart Images
Figure CN222705317U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of communication technologies. Background Art
[0002] Driven by 5G communications, smart phones, and new energy vehicles, the electronic information industry is thriving and has become an important pillar in the economic market. Among them, electronic components, especially multilayer ceramic capacitors (MLCC), as the passive electronic components with the largest market share, have become one of the key products that require breakthroughs in key technologies for technological innovation. MLCC has the advantages of high capacitance, small size, low cost, and high reliability. It is widely used in automotive electronics, electrical control, power grid frequency modulation, instrumentation, aerospace, and other fields, and is known as the "rice of the electronics industry."
[0003] When MLCC is used in automotive electronics, the quality requirements for MLCC itself are significantly improved due to the high temperature, high vibration, strong mechanical shock, etc. of the working environment. For example: When MLCC is used in consumer electronics, it only needs to bend the board 2mm for 60s to ensure that the capacity drop rate does not exceed 10%, and there are no requirements for mechanical shock, vibration and other test items; when it is used in automotive electronics, the board bending test item standard is to bend the board 10mm for 60s to ensure that the capacity drop rate does not exceed 10%, and the mechanical shock item standard is pressure 1500G, holding time 0.5ms, descent speed 4.7m / s, and MLCC capacity drop rate is within 10%. The vibration test item standard is 10HZ, 2000HZ, 10HZ cycle, each cycle 20min, amplitude 1.5mm, 12 cycles in 3 directions (up and down, front and back, left and right), and the MLCC capacity drop rate is within 10%.
[0004] Conventional MLCC terminal electrode structures cannot meet the requirements of vehicle-mounted board bending, mechanical shock, vibration and other test items. Therefore, MLCCs with soft terminal layer structures have emerged. The terminal electrode structure of MLCC hard terminals in the prior art is: from the inside to the outside, it is the first electrode layer, the second electrode layer, and the third electrode layer; the terminal electrode structure of soft terminal MLCC in the prior art is: from the inside to the outside, it is the first electrode layer, the soft terminal layer, the second electrode layer, and the third electrode layer.
[0005] In the process of implementing the present application, the applicant discovered that although the use of a soft terminal layer increases the effect of electronic components in resisting board bending, mechanical shock, and vibration, the use of the soft terminal layer requires that power must be passed through the soft terminal layer with larger resistance, resulting in larger losses and reducing the conductivity of the electronic components. The equivalent series resistance is large, and due to the use of the soft terminal layer, the electronic components generate a lot of heat during operation, and their lifespan and safety are low. Utility Model Content
[0006] In view of the above problems, the embodiments of the present application provide an electronic component and a circuit board device, which overcome the above problems or at least partially solve the above problems.
[0007] According to one aspect of an embodiment of the present application, an electronic component is provided, including a ceramic body; an end electrode, the end electrode is arranged at one end of the ceramic body, and the end electrode includes a first electrode layer, a second layer, a second electrode layer and a third electrode layer; wherein the first electrode layer includes a top and a periphery, the periphery is arranged around the top, the top is arranged to fit the end surface of one end of the ceramic body, and the top is electrically connected to an internal electrode in the ceramic body; the second layer includes an elastic material body, the second layer is arranged around the periphery, the second layer has a through hole, and the top is exposed to the through hole; the second electrode layer wraps the second layer, and the second electrode layer is electrically connected to the first electrode layer at the through hole; the third electrode layer wraps the second electrode layer, and the third electrode layer is electrically connected to the second electrode layer.
[0008] In an optional manner, the number of the end electrodes is two, and the two end electrodes are arranged opposite to each other at two ends of the ceramic body.
[0009] In an optional manner, one end of the ceramic body is arc-shaped.
[0010] In an optional manner, the terminal electrode is arc-shaped.
[0011] In an optional manner, the first electrode layer is a copper layer, the second electrode layer is a nickel layer, and the third electrode layer is a tin layer.
[0012] In an optional manner, the second layer includes an epoxy resin matrix and metal powder, and the metal powder is embedded in the epoxy resin matrix.
[0013] In an optional manner, the metal powder is copper powder.
[0014] In an optional manner, the ceramic body includes a ceramic matrix and the inner electrode, the inner electrode is embedded in the ceramic matrix, and the inner electrode is electrically connected to the top of the first electrode layer.
[0015] According to another aspect of the embodiments of the present application, a circuit board device is provided, including the above-mentioned electronic components and a PCB board, wherein the third electrode layer is electrically connected to the PCB board.
[0016] The beneficial effects of the embodiments of the present application include: providing an electronic component, including a ceramic body; an end electrode, the end electrode is arranged at one end of the ceramic body, and the end electrode includes a first electrode layer, a second layer, a second electrode layer and a third electrode layer; wherein the first electrode layer includes a top and a periphery, the periphery is arranged around the top, the top is arranged in contact with the end surface of one end of the ceramic body, and the top is electrically connected to the internal electrode in the ceramic body; the second layer includes an elastic material body, the second layer is arranged around the periphery, the second layer has a through hole, and the top is exposed to the through hole; the second electrode layer wraps the second layer, and the second electrode layer is electrically connected to the first electrode layer at the through hole; the third electrode layer wraps the second electrode layer, and the third electrode layer is electrically connected to the second electrode layer. Through the above arrangement, since the second layer only wraps the periphery of the first electrode layer, the first electrode layer and the second electrode layer are electrically connected at the through hole of the second layer, when power is turned on, the current can be connected from the third electrode layer to the second electrode layer, and then to the top of the first electrode layer and then to the ceramic body, that is, the current can not pass through the second layer, and the conductivity is good. In addition, since the second layer has through holes, not only can the use of raw materials for the second layer be reduced, but also the heat generation is lower than that of the second layer structure in the prior art, and the service life of the electronic component is longer. Furthermore, due to the provision of the second layer, when the electronic component is connected to an external PCB board, since the terminal electrode connected to the PCB board is provided with the second layer, the second layer includes an elastic material body and can have elastic deformation, and the electronic component is improved in anti-board bending, anti-mechanical shock, and anti-vibration performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0018] Figure 1 is a schematic diagram of an electronic component provided in an embodiment of the present application;
[0019] Figure 2 The embodiment of the present application provides Figure 1 Sectional view along line AA;
[0020] Figure 3 The embodiment of this application provides Figure 2 The enlarged schematic diagram of the middle B part;
[0021] Figure 4 is a partial exploded view of an electronic component provided in an embodiment of the present application;
[0022] Figure 5 It is a schematic diagram of a circuit board device provided in an embodiment of the present application.
[0023] Reference numerals:
[0024] Electronic component 100, ceramic body 1 and terminal electrode 2;
[0025] Ceramic substrate 11 and internal electrode 12; end surface 101 at one end of ceramic body 1;
[0026] A first electrode layer 21, a second layer 22, a third electrode layer 23 and a third electrode layer 24;
[0027] A top portion 211, a peripheral portion 212;
[0028] Through hole 221;
[0029] Circuit board device 200, PCB board 3, welding part 4. DETAILED DESCRIPTION
[0030] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only.
[0031] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0032] See also Figure 1 The embodiment of the present application provides an electronic component 100, which includes a ceramic body 1 and a terminal electrode 2. The terminal electrode 2 is disposed at one end of the ceramic body 1, the terminal electrode 2 is electrically connected to the ceramic body 1, and the terminal electrode 2 is used to be electrically connected to an external PCB board.
[0033] In some embodiments, the electronic component 100 is a capacitor, an inductor, a resistor, etc.; in some other embodiments, the electronic component 100 is a multilayer ceramic capacitor (MLCC).
[0034] For the above ceramic body 1, in some embodiments, see Figure 2 and Figure 3 The ceramic body 1 includes a ceramic substrate 11 and an internal electrode 12 . The internal electrode 12 is embedded in the ceramic substrate 11 , and the internal electrode 12 is electrically connected to the terminal electrode 2 .
[0035] For the terminal electrode 2 mentioned above, see Figure 3 and Figure 4 The end electrode 2 includes a first electrode layer 21, a second layer 22, a second electrode layer 23 and a third electrode layer 24; wherein the first electrode layer 21 includes a top 211 and a periphery 212, the periphery 212 is arranged around the top 211, the top 211 is arranged in contact with the end surface 101 of one end of the ceramic body 1, and the top 211 is electrically connected to the internal electrode 12 in the ceramic body 1; the second layer 22 includes an elastic material body, the second layer 22 is arranged around the periphery 212, the second layer 22 has a through hole 221, and the top 211 is exposed to the through hole 221; the second electrode layer 23 wraps the second layer 22, and the second electrode layer 23 is electrically connected to the first electrode layer 21 at the through hole 221; the third electrode layer 24 wraps the second electrode layer 23, and the third electrode layer 24 is electrically connected to the second electrode layer 23. Since the second layer 22 only wraps the periphery 212 of the first electrode layer 21, the first electrode layer 21 and the second electrode layer 23 are electrically connected at the through hole 221 of the second layer 22, so when power is turned on, the current can be connected from the third electrode layer 24 to the second electrode layer 23, and then connected to the top 211 of the first electrode layer 21 and then connected to the ceramic body 1, that is, the current does not need to pass through the second layer 22, and the conductivity is good. However, in the prior art, when power is turned on, it must pass through the soft terminal layer with large resistance, resulting in large losses and heat generation. In addition, since the second layer 22 has a through hole 221, not only can the use of raw materials for the second layer 22 be reduced, but also compared with the soft terminal structure in the prior art, the heat generation is lower, and the service life of the electronic component 100 is longer. Furthermore, due to the setting of the second layer 22, when the electronic component 100 is connected to an external PCB board, since the end electrode 2 connected to the PCB board is provided with the second layer 22, the second layer 22 includes an elastic material body and can have elastic deformation, the electronic component 100 is more resistant to board bending, mechanical shock and vibration.
[0036] In some embodiments, the number of the terminal electrodes 2 is two, and the two terminal electrodes 2 are relatively arranged at the two ends of the ceramic body 1. That is, the second layer 22 is arranged at both ends of the ceramic body 1 of the electronic component 100, and the electronic component 100 has good resistance to board bending, mechanical shock and vibration.
[0037] In some embodiments, the ceramic body 1 is in an arc shape, and the terminal electrode 2 is in an arc shape, so that the ceramic body 1 and the terminal electrode 2 can be easily connected.
[0038] In some embodiments, the first electrode layer 21 is a copper layer, the second electrode layer 23 is a nickel layer, and the third electrode layer 24 is a tin layer, so that the electronic component 100 can function as a multilayer ceramic capacitor (MLCC).
[0039] In some embodiments, the second layer 22 includes an epoxy resin matrix and metal powder, and the metal powder is embedded in the epoxy resin matrix. The epoxy resin matrix is an elastic material body, which can make the terminal electrode 2 have a certain deformation amount, produce partial deformation when the plate is bent, mechanically impacted, and vibrated, offset part of the stress, and meet the test standard. However, due to the addition of epoxy resin, when the terminal electrode 2 is cured, it is impossible to raise the temperature to a higher level to allow the metal powder in the terminal electrode 2 to sinter and densify, so metal powder is used to fix it in the epoxy resin matrix.
[0040] It is worth noting that in some embodiments, the metal powder is copper powder. Since the circuit conduction of the electronic component 100 is achieved through the first electrode layer 21, the second electrode layer 23 and the third electrode layer 24 in the present application, that is, the second layer 22 in the terminal electrode 2 may not participate in the circuit conduction of the electronic component 100, the conductivity requirement for the metal powder in the second layer 22 is relatively low, and the use of copper powder can not only meet the conductivity requirements, but also take into account the price cost. That is, by setting the second layer 22 in the terminal electrode 2 described in the present application, the function of the second layer 22 can be achieved without using expensive silver powder.
[0041] Compared with the electronic component 100 in the prior art, the electronic component 100 provided in the embodiment of the present application can reduce its equivalent series resistance from 110 milliohms to 60 milliohms at a frequency of 500KHz, that is, the electronic component 100 provided in the present application has a low equivalent series resistance, so its loss in the AC circuit is small, and it can pass a larger current more effectively. It has good performance and can be used in applications with higher requirements. And compared with the electronic component 100 in the prior art, it has lower heat generation and longer life.
[0042] The electronic component 100 provided in the embodiment of the present application has improved performance in terms of resistance to board bending, mechanical shock, and vibration compared to the electronic component 100 in the prior art. The capacity reduction rate of the electronic component 100 in the prior art is 100% when the board is bent by 10 mm, and the terminal electrode 2 structure of the hard terminal in the prior art fails in the mechanical shock and vibration tests. When the second layer 22 structure in the embodiment of the present application is used, since the second layer 22 includes an elastic material body, the capacity reduction rate in the board bending by 10 mm, mechanical shock, and vibration tests does not exceed 5%, and the products do not fail.
[0043] The electronic component 100 provided in the embodiment of the present application reduces the raw material cost of the terminal electrode 2 having the second layer 22 relative to the electronic component 100 in the prior art. The second layer 22 in the embodiment of the present application may not participate in the circuit conduction of the electronic component 100, so the conductivity requirement for the metal powder in the soft terminal paste is relatively low, and the low-cost copper powder can be directly used to replace the high-cost silver powder, so that the cost of the second layer 22 paste is reduced from 20,000-50,000 yuan / KG to 1,000 yuan / KG. In addition, a through hole 221 is provided in the second layer 22, and in the process of sealing the second layer 22, it is only necessary to seal the surroundings, and it is not necessary to seal the through hole 221, so the amount of paste used in the second layer 22 will also decrease, which can further reduce costs.
[0044] In an embodiment of the present application, an electronic component 100 includes: a ceramic body 1; an end electrode 2, wherein the end electrode 2 is arranged at one end of the ceramic body 1, and the end electrode 2 includes a first electrode layer 21, a second layer 22, a second electrode layer 23 and a third electrode layer 24; wherein the first electrode layer 21 includes a top 211 and a periphery 212, wherein the periphery 212 is arranged around the top 211, the top 211 is arranged in contact with an end surface 101 of one end of the ceramic body 1, and the top 211 is electrically connected to an internal electrode 12 in the ceramic body 1; the second layer 22 includes an elastic material body, the second layer 22 is arranged around the periphery 212, the second layer 22 has a through hole 221, and the top 211 is exposed at the through hole 221; the second electrode layer 23 wraps the second layer 22, and the second electrode layer 23 is electrically connected to the first electrode layer 21 at the through hole 221; the third electrode layer 24 wraps the second electrode layer 23, and the third electrode layer 24 is electrically connected to the second electrode layer 23. Through the above arrangement, since the second layer 22 only wraps the periphery 212 of the first electrode layer 21, the first electrode layer 21 and the second electrode layer 23 are electrically connected at the through hole 221 of the second layer 22, so when power is turned on, the current can be connected from the third electrode layer 24 to the second electrode layer 23, and then connected to the top 211 of the first electrode layer 21 and then connected to the ceramic body 1, that is, the current can not pass through the second layer 22, and the conductivity is good. In addition, since the second layer 22 has the through hole 221, not only can the use of the raw materials of the second layer 22 be reduced, but also compared with the second layer 22 structure in the prior art, the heat generation is lower, and the service life of the electronic component 100 is longer. Furthermore, due to the arrangement of the second layer 22, when the electronic component 100 is connected to an external PCB board, since the terminal electrode 2 connected to the PCB board is provided with the second layer 22, the second layer 22 includes an elastic material body and can have elastic deformation, and the anti-board bending, mechanical shock and vibration resistance of the electronic component 100 are improved.
[0045] The present application also provides an embodiment of a circuit board device, such as Figure 5 As shown, the circuit board device includes the electronic component 100 and the PCB board 3. The specific structure and function of the electronic component 100 can be referred to the above embodiment, which will not be repeated here. The third electrode layer 24 of the electronic component 100 is electrically connected to the PCB board 3. In some embodiments, the third electrode layer 24 is welded to the PCB board 3, and a welding portion 4 is formed between the electronic component 100 and the PCB board 3.
[0046] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional limitations on the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the present application; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the present application.
Claims
1. An electronic component, characterized in that: include: Ceramic body; An end electrode, the end electrode being disposed at one end of the ceramic body, the end electrode comprising a first electrode layer, a second electrode layer, a third electrode layer and a third electrode layer; Wherein, the first electrode layer includes a top portion and a peripheral portion, the peripheral portion is arranged around the top portion, the top portion is arranged in contact with an end surface of one end of the ceramic body, and the top portion is electrically connected to an internal electrode in the ceramic body; The second layer comprises an elastic material body, the second layer is arranged around the periphery, the second layer has a through hole, and the top is exposed in the through hole; The second electrode layer wraps the second layer, and the second electrode layer is electrically connected to the first electrode layer at the through hole; The third electrode layer wraps the second electrode layer, and the third electrode layer is electrically connected to the second electrode layer.
2. The electronic component according to claim 1, characterized in that: The number of the terminal electrodes is two, and the two terminal electrodes are arranged oppositely at two ends of the ceramic body.
3. The electronic component according to claim 1, characterized in that: One end of the ceramic body is in an arc shape.
4. The electronic component according to claim 3, characterized in that: The terminal electrode is in an arc shape.
5. The electronic component according to claim 1, characterized in that: The first electrode layer is a copper layer, the second electrode layer is a nickel layer, and the third electrode layer is a tin layer.
6. The electronic component according to claim 1, characterized in that: The second layer includes an epoxy resin matrix and metal powder, wherein the metal powder is embedded in the epoxy resin matrix.
7. The electronic component according to claim 6, characterized in that: The metal powder is copper powder.
8. The electronic component according to claim 1, characterized in that: The ceramic body includes a ceramic matrix and the inner electrode, wherein the inner electrode is embedded in the ceramic matrix and electrically connected to the top of the first electrode layer.
9. A circuit board device, characterized in that: It comprises the electronic component and PCB board as described in any one of claims 1 to 8, wherein the third electrode layer is electrically connected to the PCB board.