Wafer detecting and conveying device

Abstract

The utility model relates to a wafer detecting and conveying device convenient to discharge, in particular to a wafer detecting and conveying device which comprises a plate chain conveying device, a plurality of fixing plates are symmetrically and fixedly connected to the upper surface of the plate chain conveying device, the upper surfaces of the fixing plates are attached to the lower surface of a base, and a screw a and a screw b are driven by a servo motor to rotate. A screw a and a screw b rotate to drive two threaded sleeves and two placement grooves to get close to each other to clamp and fix a wafer so as to adapt to wafers with different diameters, an air cylinder pushes a rubber pad to move rightwards to be matched with the placement grooves to fix the wafer, and a gear motor drives a connecting rod to rotate to perform angle adjustment on the placement grooves and the wafer in the placement grooves. According to the wafer detection device, the problem that the wafer is easily damaged in the process of manually taking down the wafer from the conveying belt and then putting the detected wafer back to the conveying belt in the existing device is solved.

Description

Technical Field

[0001] The utility model relates to a round wafer detection and conveying device, in particular to a round wafer detection and conveying device which is convenient for unloading. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. The main processing methods of wafers are sheet processing and batch processing, that is, processing single or multiple wafers at the same time.

[0003] Currently, when inspecting a wafer, the wafer needs to be moved. However, the process of moving the wafer is not the process of inspecting the wafer. In addition, the wafer is manually removed from the conveyor belt, and then the inspected wafer is put back on the conveyor belt. This process can easily cause damage to the wafer. Utility Model Content

[0004] In order to solve the problems raised in the above background technology, the utility model provides a round wafer detection and conveying device.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a round wafer detection and conveying device, including a plate chain conveying device, the upper surface of the plate chain conveying device is symmetrically fixed with a plurality of fixed plates, the upper surface of the fixed plates is in contact with the lower surface of the base, the upper surface of the base is symmetrically fixed with three connecting plates, the opposite sides of the three connecting plates are rotatably connected with a plurality of connecting rods, the upper surface of the connecting rod is symmetrically provided with a plurality of movable grooves, the interior of the movable groove is provided with a distance adjustment component, the upper surface of the connecting rod is respectively slidably connected with the lower surfaces of two placement grooves, and the left side of the placement groove is provided with a fixing component.

[0006] Preferably, two positioning columns are symmetrically fixed to the upper surface of the fixing plate, the outer surfaces of the positioning columns are plugged into the inner walls of the positioning holes, and the positioning holes are provided on the lower surface of the base.

[0007] Preferably, the pitch adjustment assembly includes a servo motor installed on the back side of the inner wall of the movable groove, the output shaft of the servo motor is fixedly connected to one end of the back side of the screw a, one end of the front side of the screw a is fixedly connected to one end of the back side of the screw b, one end of the front side of the screw b is rotatably connected to the front side of the inner wall of the movable groove, the outer surfaces of the screw a and the screw b are both threadedly connected with a threaded sleeve, and the upper surface of the threaded sleeve is fixedly connected with a placement groove.

[0008] Preferably, the thread direction of the screw a is opposite to the thread direction of the screw b.

[0009] Preferably, the fixing assembly comprises a cylinder installed on the left side of the placement groove, the telescopic end of the cylinder is fixedly connected to the left side of the rubber pad, and the lower surface of the rubber pad is slidably connected to the lower surface of the inner wall of the placement groove.

[0010] Preferably, a plurality of reduction motors are symmetrically mounted on the front side of the left connecting plate, and the output shafts of the reduction motors pass through the front side of the connecting plate and are fixedly connected to the front side of the connecting rod.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The utility model drives screw a and screw b to rotate through a servo motor. The rotation of screw a and screw b drives two threaded sleeves and two placement grooves to approach each other to clamp and fix the round wafer, so as to adapt to round wafers with different diameters. The cylinder pushes the rubber pad to move right to cooperate with the placement groove to fix the round wafer. The reduction motor drives the connecting rod to rotate to adjust the angle of the placement groove and the round wafer inside the placement groove, so as to detect the round wafer. This solves the problem that the existing device manually removes the round wafer from the conveyor belt and then puts the detected round wafer back on the conveyor belt, and the process is easy to cause damage to the round wafer.

[0013] The utility model inserts the positioning column into the positioning hole, plugs the base with the fixed plate, and fixes the base on the upper side of the plate chain conveying equipment, and pulls the base to move upward and separate from the fixed plate, so as to facilitate the discharge of the base and the round wafer above the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the exploded three-dimensional structure of the distance adjustment component in the utility model;

[0017] Figure 3 It is a schematic diagram of the cross-sectional structure of the base in the utility model from top view;

[0018] In the figure: 1. Plate chain conveyor; 2. Fixed plate; 3. Positioning column; 4. Base; 5. Connecting plate; 6. Connecting rod; 7. Moving groove;

[0019] Pitch adjustment assembly: 81, servo motor; 82, screw a; 83, screw b; 84, threaded sleeve;

[0020] 9. Placement slot;

[0021] Fixed components: 101, cylinder; 102, rubber pad;

[0022] 11. Gear motor; 12. Positioning hole. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example

[0025] See also Figure 1-3 The utility model provides the following technical solutions: a round wafer detection and conveying device, including a plate chain conveying device 1, a plurality of fixed plates 2 are symmetrically fixedly connected to the upper surface of the plate chain conveying device 1, the upper surface of the fixed plate 2 is in contact with the lower surface of a base 4, and three connecting plates 5 are symmetrically fixedly connected to the upper surface of the base 4, and a plurality of connecting rods 6 are rotatably connected to the opposite sides of the three connecting plates 5, and a plurality of movable grooves 7 are symmetrically opened on the upper surface of the connecting rod 6, and a distance adjustment component is arranged inside the movable groove 7, and the upper surface of the connecting rod 6 is slidably connected to the lower surfaces of two placement grooves 9, and a fixing component is arranged on the left side of the placement groove 9.

[0026] Specifically, two positioning columns 3 are symmetrically fixed to the upper surface of the fixing plate 2, and the outer surface of the positioning column 3 is plugged into the inner wall of the positioning hole 12, and the positioning hole 12 is opened on the lower surface of the base 4;

[0027] Insert the positioning column 3 into the positioning hole 12, plug the base 4 into the fixing plate 2, and fix the base 4 on the upper side of the plate chain conveying device 1;

[0028] The base 4 is pulled upward to be separated from the fixing plate 2 , so as to facilitate unloading of the base 4 and the round wafer above the base 4 .

[0029] Specifically, the pitch adjustment assembly includes a servo motor 81 installed on the back of the inner wall of the moving groove 7, the output shaft of the servo motor 81 is fixedly connected to one end of the back of the screw a82, one end of the front of the screw a82 is fixedly connected to one end of the back of the screw b83, one end of the front of the screw b83 is rotatably connected to the front of the inner wall of the moving groove 7, the outer surfaces of the screw a82 and the screw b83 are both threadedly connected with a threaded sleeve 84, and the upper surface of the threaded sleeve 84 is fixedly connected with a placement groove 9;

[0030] Specifically, by setting the thread direction of the screw a82 to be opposite to the thread direction of the screw b83;

[0031] The servo motor 81 drives the screw a82 and the screw b83 to rotate. The rotation of the screw a82 and the screw b83 drives the two threaded sleeves 84 and the two placement grooves 9 to approach each other. The wafer is clamped and fixed by the two placement grooves 9 to accommodate wafers of different diameters.

[0032] Specifically, the fixing assembly includes a cylinder 101 installed on the left side of the placement groove 9, the telescopic end of the cylinder 101 is fixedly connected to the left side of the rubber pad 102, and the lower surface of the rubber pad 102 is slidably connected to the lower surface of the inner wall of the placement groove 9;

[0033] The cylinder 101 pushes the rubber pad 102 to move rightward, and the rubber pad 102 cooperates with the placement groove 9 to fix the wafer.

[0034] Specifically, a plurality of reduction motors 11 are symmetrically installed on the front of the left connecting plate 5, and the output shafts of the reduction motors 11 pass through the front of the connecting plate 5 and are fixedly connected to the front of the connecting rod 6;

[0035] The reduction motor 11 drives the connecting rod 6 to rotate, and the connecting rod 6 is used to adjust the angle of the placement groove 9 and the round wafer inside the placement groove 9, so as to facilitate the detection of the round wafer.

[0036] The working principle and use process of this utility model:

[0037] The utility model, when in use:

[0038] Insert the positioning column 3 into the positioning hole 12, plug the base 4 into the fixed plate 2, and fix the base 4 on the upper side of the plate chain conveyor 1. The servo motor 81 drives the screw a82 and the screw b83 to rotate. The rotation of the screw a82 and the screw b83 drives the two threaded sleeves 84 and the two placement grooves 9 to approach each other. The two placement grooves 9 are used to clamp and fix the wafer to adapt to wafers of different diameters. The cylinder 101 pushes the rubber pad 102 to move to the right. The rubber pad 102 cooperates with the placement groove 9 to fix the wafer. The reduction motor 11 drives the connecting rod 6 to rotate. The angle of the placement groove 9 and the wafer inside the placement groove 9 is adjusted through the connecting rod 6 to facilitate the detection of the wafer. The base 4 is pulled upward to move away from the fixed plate 2, so as to facilitate the discharge of the base 4 and the wafer above the base 4.

[0039] The circuits, electronic components and modules involved are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by this utility model does not involve improvements to software and methods.

[0040] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wafer inspection and conveying device, comprising a plate chain conveying device (1), characterized in that: The upper surface of the plate chain conveying equipment (1) is symmetrically fixed with a plurality of fixed plates (2), the upper surface of the fixed plates (2) is in contact with the lower surface of the base (4), the upper surface of the base (4) is symmetrically fixed with three connecting plates (5), the opposite sides of the three connecting plates (5) are rotatably connected with a plurality of connecting rods (6), the upper surface of the connecting rod (6) is symmetrically provided with a plurality of movable grooves (7), the interior of the movable groove (7) is provided with a distance adjustment component, the upper surface of the connecting rod (6) is slidably connected with the lower surfaces of two placement grooves (9), and the left side of the placement groove (9) is provided with a fixed component.

2. A wafer inspection and conveying device according to claim 1, characterized in that: Two positioning columns (3) are symmetrically fixed to the upper surface of the fixing plate (2), the outer surfaces of the positioning columns (3) are plugged into the inner walls of the positioning holes (12), and the positioning holes (12) are provided on the lower surface of the base (4).

3. The wafer inspection and conveying device according to claim 1, characterized in that: The pitch adjustment assembly comprises a servo motor (81) mounted on the back side of the inner wall of the movable groove (7); the output shaft of the servo motor (81) is fixedly connected to one end of the back side of the screw rod a (82); one end of the front side of the screw rod a (82) is fixedly connected to one end of the back side of the screw rod b (83); one end of the front side of the screw rod b (83) is rotatably connected to the front side of the inner wall of the movable groove (7); the outer surfaces of the screw rod a (82) and the screw rod b (83) are both threadedly connected to a threaded sleeve (84); and the upper surface of the threaded sleeve (84) is fixedly connected to a placement groove (9).

4. The wafer inspection and conveying device according to claim 3, characterized in that: The thread direction of the screw a (82) is opposite to the thread direction of the screw b (83).

5. The wafer inspection and conveying device according to claim 1, characterized in that: The fixing assembly comprises a cylinder (101) installed on the left side of the placement groove (9), the telescopic end of the cylinder (101) is fixedly connected to the left side of the rubber pad (102), and the lower surface of the rubber pad (102) is slidably connected to the lower surface of the inner wall of the placement groove (9).

6. The wafer inspection and conveying device according to claim 1, characterized in that: A plurality of reduction motors (11) are symmetrically mounted on the front side of the left connection plate (5), and the output shafts of the reduction motors (11) pass through the front side of the connection plate (5) and are fixedly connected to the front side of the connection rod (6).

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