Wafer cleaning and drying equipment

Abstract

The utility model discloses wafer cleaning and drying equipment which comprises a shell, first sliding grooves are formed in the two sides of the inner wall of the shell respectively, sliding blocks are arranged on the two first sliding grooves in a sliding connection mode respectively, a sliding plate is fixedly connected to one sides of the two sliding blocks, threaded columns are arranged at the two ends of the sliding plate in a threaded connection mode respectively, and the threaded columns are arranged on the two sides of the shell respectively. The upper sides of the two threaded columns are fixedly connected with first bevel gears correspondingly, one sides of the two first bevel gears are engaged with second bevel gears correspondingly, one sides of the two second bevel gears are fixedly connected with a rotating rod, one side of the rotating rod is connected with a double-end motor, and the center of one side of the sliding plate is connected with a connecting column. And the upper side of the connecting column is connected with a fixed clamping device. Compared with the prior art, the wafer cleaning and drying equipment provided by the utility model has the advantages that the cleaning and drying efficiency is high, and the wafer is prevented from falling off.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing and production, in particular to wafer cleaning and drying equipment. Background Art

[0002] Wafer cleaning and drying equipment is an essential equipment in the semiconductor manufacturing process, used to clean and dry semiconductor wafers. In the semiconductor manufacturing process, the purity of the wafer surface has an important impact on the quality and performance of the final product.

[0003] The existing patent number CN218179516U discloses a drying device for wafer cleaning, which aims to solve the technical problems in the prior art that the position of the wafer remains relatively unchanged during the drying process, the gap area between the wafer and the supporting component is prone to retain water stains, and the wafer surface cannot be dried synchronously and quickly. The solution of the prior art is: a drying device for wafer cleaning, comprising a base, a drying chamber is arranged on the upper end of the base, a bearing assembly for placing wafers is arranged in the drying chamber, the bearing assembly comprises a mounting base plate, the mounting base plate is located in the drying chamber and is fixedly connected thereto, an adjusting disk is rotatably connected to the upper end of the mounting base plate, a plurality of first bearing protrusions are arranged on the upper end of the adjusting disk, a accommodating chamber is opened on the upper end of the mounting base plate, the adjusting disk is located in the accommodating chamber and is sealed and rotatably connected thereto, a control chamber connected to the accommodating chamber is opened on the inner wall of the mounting base plate, an adjusting block is fixedly connected to the side wall of the adjusting disk, the adjusting block is located in the control chamber and is sealed and slidably connected thereto, the control chamber is connected to an external regulating device through a connecting pipeline for driving the adjusting block to drive the adjusting disk to rotate, a plurality of accommodating ports are opened on the upper end of the adjusting disk, a first sealing member is slidably connected in the accommodating port, a second bearing protrusion is fixedly connected to the upper end of the first sealing member, and the accommodating port is connected to the control chamber.

[0004] However, the patents in the prior art have the following disadvantages:

[0005] (1) The prior art patents have low efficiency in cleaning and drying wafers.

[0006] (2) The prior art patents do not have a fixed clamping device, which is not convenient for workers to place and take out the wafers that need to be cleaned and dried. On the other hand, it cannot guarantee that the wafers will not fall during the cleaning and drying process. Utility Model Content

[0007] The technical problem to be solved by the utility model is to overcome the above technical defects and provide a wafer cleaning and drying device with high cleaning and drying efficiency and which ensures that the wafers will not fall.

[0008] In order to solve the above problems, the technical solution of the utility model is: a wafer cleaning and drying equipment, including a shell, first slide grooves are respectively provided on both sides of the inner wall of the shell, sliders are respectively slidably connected on the two first slide grooves, sliding plates are fixedly connected on one side of the two sliders, threaded columns are respectively threadedly connected at both ends of the sliding plates, first bevel gears are respectively fixedly connected on the upper sides of the two threaded columns, second bevel gears are respectively meshed on one side of the two first bevel gears, rotating rods are fixedly connected on one side of the two second bevel gears, a double-headed motor is connected on one side of the rotating rod, a connecting column is centrally connected to one side of the sliding plate, and a fixed clamping device is connected on the upper side of the connecting column.

[0009] Furthermore, the fixed clamping device includes two cylinders, a clamping plate and a second slide groove, the two cylinders are fixedly connected with connecting parts at both ends, the two connecting parts are fixedly connected with sliding blocks on one side, the two sliding blocks are rotatably connected with connecting rods on one side, and the other ends of the two connecting rods are rotatably connected with rotating blocks.

[0010] Furthermore, one side of the rotating block is connected to one end of four connecting rods, the rotating block is rotatably connected to one side of the clamping plate, the upper sides of the four sliding blocks are respectively fixedly connected with clamping plates, and the upper sides of the four clamping plates are respectively fixedly connected with arc plates.

[0011] Furthermore, two springs are fixedly connected to one side of the four arc-shaped plates respectively, and a buffer plate is fixedly connected to one end of the two springs.

[0012] Furthermore, a cleaning liquid tank is fixedly connected to one side of the shell, a pipeline is connected to one side of the cleaning liquid tank, the pipeline extends to the inner side of the shell, a liquid pump is connected to the pipeline, and a nozzle is connected to the other end of the pipeline.

[0013] Furthermore, a dryer is connected to the upper end of the inner wall of the shell.

[0014] Furthermore, a protection box is provided on the outer sides of the first bevel gear and the second bevel gear, and the protection box is fixedly connected to the inner wall of the shell.

[0015] The advantages of the utility model compared with the existing technology are:

[0016] (1) The utility model has a double-headed motor, a rotating rod, a threaded rod, a slider and a sliding plate. The double-headed motor drives the rotating rod to rotate, and the first bevel gear and the second bevel gear start to rotate. The transmission threaded rod starts to rotate, driving the slider to slide on the first slide groove, causing the sliding plate to start to move, thereby realizing the lifting and lowering of the fixed clamping device, facilitating the cleaning and drying of the wafer, and improving the efficiency of wafer processing.

[0017] (2) The utility model sets a fixed clamping device, which drives the connecting rod to start rotating through two cylinders, drives the two sliding blocks to slide on the second slide slot, drives the rotating block to rotate, and drives the other two connecting rods to drive the other two sliding blocks to slide on the second slide slot, so that the four sliding blocks slide on the second slide slot at the same time, and achieves a fixed clamping effect on the wafer. It ensures that the wafer will not fall during the cleaning and drying process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The utility model is a three-dimensional wafer cleaning and drying device Figure 1 .

[0019] Figure 2 The utility model is a three-dimensional fixed clamping device in a wafer cleaning and drying device. Figure 2 .

[0020] Figure 3 The utility model is a three-dimensional fixed clamping device in a wafer cleaning and drying device. Figure 3 .

[0021] Figure 4 The utility model is a cross-sectional view of a protective box in a wafer cleaning and drying device. Figure 4 .

[0022] Figure 5 The utility model is a three-dimensional wafer cleaning and drying device Figure 5 .

[0023] As shown in the figure: 1. Shell; 2. First slide groove; 3. Sliding block; 4. Sliding plate; 5. Threaded column; 6. First bevel gear; 7. Second bevel gear; 8. Rotating rod; 9. Double-headed motor; 10. Protection box; 11. Connecting column; 12. Fixed clamping device; 13. Cylinder; 14. Connecting piece; 15. Sliding block; 16. Connecting rod; 17. Rotating block; 18. Clamping plate; 19. Arc plate; 20. Spring; 21. Buffer plate; 22. Cleaning liquid tank; 23. Pipeline; 24. Liquid pump; 25. Spray nozzle; 26. Dryer; 27. Clamping plate; 28. Second slide groove. DETAILED DESCRIPTION

[0024] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.

[0025] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0026] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0027] like Figures 1 to 5 As shown, a wafer cleaning and drying device comprises a shell 1, wherein first slide grooves 2 are respectively provided on both sides of the inner wall of the shell 1, and sliders 3 are respectively slidably connected on the two first slide grooves 2, and a sliding plate 4 is fixedly connected on one side of the two sliders 3, and threaded columns 5 are respectively threadedly connected at both ends of the sliding plate 4, and first bevel gears 6 are respectively fixedly connected on the upper side of the two threaded columns 5, and second bevel gears 7 are respectively meshed on one side of the two first bevel gears 6, and a rotating rod 8 is fixedly connected on one side of the two second bevel gears 7, and a double-headed motor 9 is connected on one side of the rotating rod 8, and a connecting column 11 is centrally connected on one side of the sliding plate 4, and a fixed clamping device 12 is connected on the upper side of the connecting column 11. The rotating rod 8 is driven to rotate by the double-headed motor 9, and the first bevel gear 6 and the second bevel gear 7 start to rotate, and the transmission threaded column 5 starts to rotate, driving the slider 3 to slide on the first slide groove 2, so that the sliding plate 4 starts to move, thereby realizing the lifting and lowering of the fixed clamping device 12, facilitating the cleaning and drying of the wafer, and improving the efficiency of wafer processing.

[0028] The fixed clamping device 12 includes two cylinders 13, a clamping plate 27 and a second slide groove 28. The two cylinders 13 are fixedly connected with connecting members 14 at both ends, and the two connecting members 14 are fixedly connected with sliding blocks 15 on one side. The two sliding blocks 15 are rotatably connected with connecting rods 16 on one side, and the other ends of the two connecting rods 16 are rotatably connected with rotating blocks 17. One side of the rotating block 17 is connected to one end of four connecting rods 16, and the rotating block 17 is rotatably connected to one side of the clamping plate 27. The upper sides of the four sliding blocks 15 are fixedly connected with clamping plates 18, and the upper sides of the four clamping plates 18 are fixedly connected with arc plates 19. One side of the four arc plates 19 is fixedly connected with two springs 20, which have a buffering effect on the wafer. One end of the two springs 20 is fixedly connected with a buffer plate 21. The two cylinders 13 drive the connecting rod 16 to start rotating, drive the two sliding blocks 15 to slide on the second slide slot, drive the rotating block 17 to rotate, and drive the other two connecting rods 16 to drive the other two sliding blocks 15 to slide on the second slide slot, so that the four sliding blocks 15 slide on the second slide slot 18 at the same time, and achieve the effect of fixing and clamping the wafer, ensuring that the wafer will not fall during the cleaning and drying process.

[0029] A cleaning liquid tank 22 is fixedly connected to one side of the housing 1, and a pipe 23 is connected to one side of the cleaning liquid tank 22. The pipe 23 extends to the inner side of the housing 1, and a liquid pump 24 is connected to the pipe 23. A nozzle 25 is connected to the other end of the pipe 23. The cleaning liquid in the cleaning liquid tank 22 is pumped out through the pipe 23 by the liquid pump 24, and the wafer on the fixed clamping device 12 is cleaned by the nozzle 25. A drying machine 26 is connected to the upper end of the inner wall of the housing 1. A protective box 10 is provided on the outer side of the first bevel gear 6 and the second bevel gear 7, and the protective box 10 is fixedly connected to the inner wall of the housing 1.

[0030] In specific use, the wafer is placed on the upper side of the clamping plate 27, and the connecting rod 16 is driven by two cylinders 13 to start rotating, and the two sliding blocks 15 are driven to slide on the second slide slot, and the rotating block 17 is driven to rotate, and the other two connecting rods 16 are driven to drive the other two sliding blocks 15 to slide on the second slide slot, so that four sliding blocks 15 slide on the second slide slot 18 at the same time, and the fixed clamping effect of the wafer is achieved. It is ensured that the wafer will not fall during the cleaning and drying process. The rotating rod 8 is driven to rotate by the double-headed motor 9, and the first bevel gear 6 and the second bevel gear 7 start to rotate, and the transmission threaded column 5 starts to rotate, driving the slider 3 to slide on the first slide slot 2, so that the sliding plate 4 starts to move, and then the lifting and lowering of the fixed clamping device 12 is realized, which is convenient for cleaning and drying the wafer and improving the efficiency of wafer processing. The cleaning liquid in the cleaning liquid tank 22 is extracted through the pipeline 23 by the liquid pump 24, and the wafer on the fixed clamping device 12 is cleaned by the nozzle 25. After cleaning is completed, the double-headed motor 9 drives the fixed clamping device 12 to rise to the upper side of the inner wall of the housing 1, and the cleaned wafer is dried using the dryer 26. The work is completed.

[0031] The above describes the utility model and its implementation methods, which are not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A wafer cleaning and drying device, comprising a housing (1), characterized in that: First slide grooves (2) are respectively provided on both sides of the inner wall of the shell (1), and sliders (3) are respectively slidably connected on the two first slide grooves (2), and a sliding plate (4) is fixedly connected to one side of the two sliders (3), and threaded columns (5) are respectively threadedly connected at both ends of the sliding plate (4), and a first bevel gear (6) is respectively fixedly connected to the upper side of the two threaded columns (5), and a second bevel gear (7) is respectively meshed on one side of the two first bevel gears (6), and a rotating rod (8) is fixedly connected to one side of the two second bevel gears (7), and a double-headed motor (9) is connected to one side of the rotating rod (8), and a connecting column (11) is connected to the center of one side of the sliding plate (4), and a fixed clamping device (12) is connected to the upper side of the connecting column (11).

2. The wafer cleaning and drying equipment according to claim 1, characterized in that: The fixed clamping device (12) comprises two cylinders (13), a clamping plate (27) and a second slide groove (28); the two cylinders (13) are respectively fixedly connected with connecting members (14) at both ends; the two connecting members (14) are respectively fixedly connected with sliding blocks (15) at one side; the two sliding blocks (15) are respectively rotatably connected with connecting rods (16) at one side; and the other ends of the two connecting rods (16) are respectively rotatably connected with rotating blocks (17).

3. The wafer cleaning and drying equipment according to claim 2, characterized in that: One side of the rotating block (17) is connected to one end of four connecting rods (16), and the rotating block (17) is rotatably connected to one side of the clamping plate (27). The upper sides of the four sliding blocks (15) are respectively fixedly connected with clamping plates (18), and the upper sides of the four clamping plates (18) are respectively fixedly connected with arc plates (19).

4. The wafer cleaning and drying equipment according to claim 3, characterized in that: Two springs (20) are fixedly connected to one side of the four arc-shaped plates (19), and a buffer plate (21) is fixedly connected to one end of the two springs (20).

5. The wafer cleaning and drying equipment according to claim 1, characterized in that: A cleaning liquid tank (22) is fixedly connected to one side of the shell (1), a pipeline (23) is connected to one side of the cleaning liquid tank (22), the pipeline (23) extends to the inside of the shell (1), a liquid pump (24) is connected to the pipeline (23), and a nozzle (25) is connected to the other end of the pipeline (23).

6. The wafer cleaning and drying equipment according to claim 1, characterized in that: A drying machine (26) is connected to the upper end of the inner wall of the outer shell (1).

7. The wafer cleaning and drying equipment according to claim 1, characterized in that: A protection box (10) is provided on the outside of the first bevel gear (6) and the second bevel gear (7), and the protection box (10) is fixedly connected to the inner wall of the outer shell (1).

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