Wafer limiting device for chip production

Abstract

The utility model relates to the technical field of chips, and discloses a wafer limiting device for chip production. Comprising a connecting shell and further comprises supporting legs arranged at the four corners of the bottom of the connecting shell, four extending shells are fixedly connected to the top of the connecting shell, and a fixing plate is fixedly connected to one side of the bottom of each extending shell; the driving assembly is fixed at the bottom of the connecting shell and used for limiting the wafer, the driving assembly comprises a direct current motor and a push rod, and four clamping rings are arranged at the top of the connecting shell. A direct current motor is turned on to enable a first bevel gear to be meshed with a second bevel gear to rotate, at the moment, a threaded rod rotates on one side of a fixing plate, a threaded sleeve drives an extension plate to enable a push rod to drive a clamping ring to move when the threaded rod rotates, and then a first spring drives an arc-shaped plate to clamp and limit a wafer when the clamping ring moves. The four arc-shaped plates and the four clamping rings are symmetrically arranged, so that four-direction clamping force can be provided, and meanwhile, wafers of different sizes can be conveniently limited.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to a wafer limiting device for chip production. Background Art

[0002] "Wafer for chip production" refers to the round silicon wafer used in the manufacturing process of integrated circuits (chips), also known as wafers. Wafers are the basic materials for integrated circuit manufacturing. Multiple chips are made by performing a series of process steps such as lithography, etching, deposition, and ion implantation on their surface. In each processing step of chip manufacturing, such as lithography, etching, deposition, etc., the wafer needs to be precisely positioned to ensure accurate replication of the pattern and processing accuracy.

[0003] However, current wafer limiting devices usually use bidirectional relative movement to limit and clamp the wafer during use, and the bidirectional relative movement clamping device can usually only clamp and move in the horizontal direction, which limits the size range of the wafer. For wafers of different sizes, it may be necessary to replace fixtures of different specifications, which increases the complexity and cost of operation. Moreover, when responding to changes in wafer size, the bidirectional movement clamping device needs to manually adjust the clamping position and clamping force, which is cumbersome and prone to errors, affecting production efficiency and processing accuracy. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer limiting device for chip production to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a wafer limiting device for chip production, comprising a connecting shell, and also comprising:

[0006] Support legs are arranged at the four corners of the bottom of the connection shell, the top of the connection shell is fixedly connected with four extension shells, and one side of the bottom of the extension shell is fixedly connected with a fixing plate;

[0007] A driving assembly fixed to the bottom of the connection shell for limiting the position of the wafer comprises a DC motor and a push rod, and four clamping rings are arranged on the top of the connection shell.

[0008] Preferably, both sides of the bottom of the clamping ring are fixedly connected with sliding blocks, and the top of the connecting shell is provided with a sliding groove used in conjunction with the sliding blocks.

[0009] Preferably, an arc-shaped plate is provided on one side of the clamping ring, and a first spring is fixedly connected between the arc-shaped plate and the clamping ring.

[0010] Preferably, a soft pad for protecting wafers is fixedly connected to one side of the arc-shaped plate, and a placement groove is provided on the top of the clamping ring.

[0011] Preferably, the DC motor is fixed to the bottom of the connecting shell, the output end of the DC motor passes through the inner cavity of the connecting shell and is fixedly connected to the first bevel gear, the surface of the first bevel gear is meshingly connected with four second bevel gears, the side of the second bevel gear away from the first bevel gear is fixedly connected to a threaded rod, one side of the threaded rod is movably connected to a fixed plate through a bearing, the surface of the threaded rod is sleeved with a threaded sleeve, the top of the threaded sleeve is fixedly connected to an extension plate, one side of the extension plate is fixedly connected to a push rod, and the side of the push rod close to the retaining ring is fixedly connected to the retaining ring.

[0012] Preferably, a second spring is fixedly connected to one side of the extension plate, and one side of the second spring is fixedly connected to the fixing plate.

[0013] Preferably, a bearing seat for auxiliary support of the threaded rod is sleeved on one side of the surface of the threaded rod, and the bottom of the bearing seat is fixedly connected to the connecting shell.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model turns on the DC motor to make the first bevel gear mesh with the second bevel gear to rotate. At this time, the threaded rod will rotate on one side of the fixed plate. When the threaded rod rotates, the threaded sleeve will drive the extension plate to make the push rod drive the clamping ring to move. Then, when the clamping ring moves, the first spring will drive the arc plate to clamp and limit the wafer. Since there are four arc plates and clamping rings and they are symmetrically arranged, a four-way clamping force can be provided, and it is also convenient to limit wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a preferred embodiment of a wafer limiting device for chip production provided by the utility model;

[0017] Figure 2 A schematic diagram of the top view structure of the connection shell provided by the utility model;

[0018] Figure 3 A schematic diagram of the structure of the drive assembly provided by the utility model;

[0019] Figure 4 This is a schematic diagram of the clamping ring structure provided by the utility model.

[0020] In the figure: 1, connecting shell; 2, supporting leg; 3, extension shell; 4, fixing plate; 5, snap ring; 51, slider; 52, slide groove; 53, arc plate; 54, shelf groove; 6, driving assembly; 601, DC motor; 602, push rod; 603, first bevel gear; 604, second bevel gear; 605, threaded rod; 606, threaded sleeve; 607, extension plate; 608, second spring; 609, bearing seat; 7, first spring; 8, cushion. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 As shown, a wafer limiting device for chip production includes a connecting shell 1, and also includes support legs 2 arranged at the four corners of the bottom of the connecting shell 1. The top of the connecting shell 1 is fixedly connected with four extension shells 3, and the extension shell 3 and the fixing plate 4 are conveniently used to cooperate with the driving assembly 6. One side of the bottom of the extension shell 3 is fixedly connected with the fixing plate 4;

[0023] A driving assembly 6 for limiting the wafer is fixed at the bottom of the connecting shell 1, and the driving assembly 6 includes a DC motor 601 and a push rod 602. Four clamping rings 5 ​​are arranged on the top of the connecting shell 1. Slide blocks 51 are fixedly connected to both sides of the bottom of the clamping ring 5. A slide groove 52 used to cooperate with the slide block 51 is provided on the top of the connecting shell 1. The sliding connection between the slide block 51 and the slide groove 52 can improve the stability of the clamping ring 5 when moving. An arc plate 53 is provided on one side of the clamping ring 5. A first spring 7 is fixedly connected between the arc plate 53 and the clamping ring 5. When the arc plate 53 contacts the wafer, the arc plate 53 will squeeze the first spring 7, thereby achieving the effect of elastic limiting. A soft pad 8 for protecting the wafer is fixedly connected to one side of the arc plate 53. A shelf groove 54 is provided on the top of the clamping ring 5. Through the setting of the shelf groove 54 and the soft pad 8, the wafer can be supported by the shelf groove 54. The soft pad 8 can increase a certain soft elasticity when the wafer is clamped to prevent the wafer from being limited when limiting the wafer.

[0024] The DC motor 601 is fixed to the bottom of the connecting shell 1, and the output end of the DC motor 601 passes through the inner cavity of the connecting shell 1 and is fixedly connected to the first bevel gear 603. The surface of the first bevel gear 603 is meshed with four second bevel gears 604. The second bevel gear 604 is fixedly connected to a threaded rod 605 on the side away from the first bevel gear 603. One side of the threaded rod 605 is movably connected to the fixed plate 4 through a bearing. When the DC motor 601 is turned on to make the first bevel gear 603 mesh with the second bevel gear 604 to rotate, the threaded rod 605 will rotate on one side of the fixed plate 4 and also on the surface of the bearing seat 609. The surface of the threaded rod 605 is sleeved with a threaded sleeve 606, and the top of the threaded sleeve 606 is fixed. An extension plate 607 is connected, one side of the extension plate 607 is fixedly connected to the push rod 602, and the side of the push rod 602 close to the retaining ring 5 is fixedly connected to the retaining ring 5, and one side of the extension plate 607 is fixedly connected to the second spring 608. When the threaded rod 605 rotates, the threaded sleeve 606 will drive the extension plate 607 to make the push rod 602 drive the retaining ring 5 to move, and when the extension plate 607 moves, the second spring 608 will be stretched, and then the retaining ring 5 is moved by the push rod 602 to limit the wafer, one side of the second spring 608 is fixedly connected to the fixed plate 4, and one side of the surface of the threaded rod 605 is provided with a bearing seat 609 for auxiliary support of the threaded rod 605, and the bottom of the bearing seat 609 is fixedly connected to the connecting shell 1.

[0025] Working principle: First, when in use, the user can place the wafer on the shelf slot 54, and then turn on the DC motor 601 to make the first bevel gear 603 engage the second bevel gear 604 to rotate. At this time, the threaded rod 605 will rotate on one side of the fixed plate 4, and will also rotate on the surface of the bearing seat 609. When the threaded rod 605 rotates, the threaded sleeve 606 will drive the extension plate 607 to make the push rod 602 drive the retaining ring 5 to move. When the extension plate 607 moves, the second spring 608 will be stretched, and then the retaining ring 5 will be moved by the push rod 602 to limit the wafer. However, when the retaining ring 5 moves, the first spring 7 will drive the movable arc plate 53 to contact the wafer. At this time, the arc plate 53 will squeeze the first spring 7, thereby achieving the effect of elastic limiting. At the same time, the soft pad 8 on one side of the arc plate 53 can also provide certain protection for the wafer, so that the device can not only limit wafers of different sizes, but also protect the wafer.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer limiting device for chip production, comprising a connecting shell (1), characterized in that: Also includes: Support legs (2) are arranged at the four corners of the bottom of the connection shell (1); the top of the connection shell (1) is fixedly connected to four extension shells (3); and one side of the bottom of the extension shell (3) is fixedly connected to a fixing plate (4); A drive assembly (6) is fixed to the bottom of the connection shell (1) and is used to limit the position of the wafer. The drive assembly (6) comprises a DC motor (601) and a push rod (602). Four clamping rings (5) are arranged on the top of the connection shell (1).

2. A wafer limiting device for chip production according to claim 1, characterized in that: Slide blocks (51) are fixedly connected to both sides of the bottom of the clamping ring (5), and a sliding groove (52) used in conjunction with the slide blocks (51) is provided on the top of the connecting shell (1).

3. The wafer limiting device for chip production according to claim 1, characterized in that: An arc-shaped plate (53) is provided on one side of the snap ring (5), and a first spring (7) is fixedly connected between the arc-shaped plate (53) and the snap ring (5).

4. The wafer limiting device for chip production according to claim 3, characterized in that: A soft pad (8) for protecting wafers is fixedly connected to one side of the arc-shaped plate (53), and a placement groove (54) is provided on the top of the clamping ring (5).

5. The wafer limiting device for chip production according to claim 1, characterized in that: The DC motor (601) is fixed to the bottom of the connecting shell (1); the output end of the DC motor (601) passes through the inner cavity of the connecting shell (1) and is fixedly connected to a first bevel gear (603); the surface of the first bevel gear (603) is meshingly connected to four second bevel gears (604); a threaded rod (605) is fixedly connected to a side of the second bevel gear (604) away from the first bevel gear (603); one side of the threaded rod (605) is movably connected to a fixing plate (4) via a bearing; a threaded sleeve (606) is sleeved on the surface of the threaded rod (605); an extension plate (607) is fixedly connected to the top of the threaded sleeve (606); one side of the extension plate (607) is fixedly connected to the push rod (602); and the side of the push rod (602) close to the snap ring (5) is fixedly connected to the snap ring (5).

6. A wafer limiting device for chip production according to claim 5, characterized in that: A second spring (608) is fixedly connected to one side of the extension plate (607), and one side of the second spring (608) is fixedly connected to the fixing plate (4).

7. The wafer limiting device for chip production according to claim 5, characterized in that: A bearing seat (609) for auxiliary support of the threaded rod (605) is sleeved on one side of the surface of the threaded rod (605), and the bottom of the bearing seat (609) is fixedly connected to the connecting shell (1).

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