Water-cooling head assembly and water-cooling radiator

Abstract

The utility model discloses a water-cooling head assembly and a water-cooling radiator, and the water-cooling head assembly comprises a water pump assembly which comprises a pump body which is used for communicating with a water-cooling radiator assembly; the cold head assembly and the water pump assembly are arranged on the cold head assembly, the cold head assembly comprises a cold head shell, a connecting plate and a plurality of cooling fins, the cold head shell and the pump body are connected and communicated in a sealed mode, a liquid storage cavity is defined by the cold head shell and the connecting plate, and the liquid storage cavity is used for being communicated with the water cooling row assembly. The multiple cooling fins extend in the first direction and are arranged on the side face, facing the liquid storage cavity, of the connecting plate in an array mode in the second direction, a first communicating groove extending in the second direction is formed in the middle of the cold head shell, and the first communicating groove communicates with the pump body. The water cooling head assembly is more compact in structure, the number of sealing positions is reduced, and the cooling liquid leakage risk is reduced; and a cold liquid flowing path can be increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of water-cooling radiators, and in particular to a water-cooling head assembly and a water-cooling radiator. Background Art

[0002] Existing water-cooled radiators are used in electronic devices (such as computers). The water-cooled radiator includes a water-cooled head assembly and a water pump assembly. The water-cooled head assembly contacts the heating area of ​​the electronic device. Under the action of the water pump assembly, the coolant takes away the heat absorbed by the water-cooled head assembly from the heating area, thereby improving the heat dissipation efficiency of the heating area. However, the above-mentioned coolant flow path is short, which makes the heat dissipation efficiency of the water-cooled head assembly poor, and further leads to poor heat dissipation efficiency of the water-cooled radiator. Utility Model Content

[0003] The present application provides a water-cooling head assembly and a water-cooling radiator to solve the technical problem that the coolant flow path in the existing water-cooling radiator is short, resulting in poor heat dissipation efficiency of the water-cooling head assembly, which in turn leads to poor heat dissipation efficiency of the water-cooling radiator.

[0004] To solve the above technical problems, the present application proposes a water-cooling head assembly, comprising: a water pump assembly, comprising a pump body, the pump body being used to communicate with a water-cooling radiator assembly; a cold head assembly, the water pump assembly being arranged on the cold head assembly, the cold head assembly comprising a cold head shell, a connecting plate and a plurality of heat sinks, the cold head shell being connected to the pump body and being sealed and connected, the cold head shell and the connecting plate being arranged to form a liquid storage cavity, the liquid storage cavity being used to communicate with the water-cooling radiator assembly, a plurality of heat sinks extending along a first direction and being arranged in an array along a second direction on a side surface of the connecting plate facing the liquid storage cavity, a first connecting groove extending along the second direction being provided in the middle of the cold head shell, the first connecting groove being connected to the pump body.

[0005] Wherein, the water pump assembly is arranged above the cold head assembly in the vertical direction; wherein, the pump body is at least partially formed integrally with the cold head shell.

[0006] The water pump assembly is arranged above the cold head assembly in the transverse direction; the water pump assembly also includes a connecting portion, and the pump body is connected with the cold head shell through the connecting portion.

[0007] The water cooling head assembly further comprises a transition shell, the middle part of the transition shell is connected with the middle part of the pump body, and the pump body is connected with the transition shell through the connecting part.

[0008] Among them, the water pump assembly also includes a first connecting part, the first connecting part is connected to the pump body, and the first connecting part is used to connect to the water cooling radiator assembly; the cold head assembly also includes a second connecting part, the second connecting part is connected to the liquid storage chamber, and the second connecting part is used to connect to the water cooling radiator assembly; wherein the first connecting part is the water outlet, and the second connecting part is the water inlet; or, the first connecting part is the water inlet, and the second connecting part is the water outlet.

[0009] Among them, the cold head assembly also includes a water pressure plate, which is arranged between the inner side wall of the cold head shell close to the water pump assembly and a plurality of heat sinks, and is used for the cooling liquid to flow from the two ends of the heat sink to the middle thereof or from the middle of the heat sink to the two ends thereof; wherein, the water pressure plate is provided with a second connecting groove extending along the second direction, and the second connecting groove is connected to the first connecting groove.

[0010] Among them, the cold head assembly also includes a buffer component, which is arranged between the water pressure plate and the inner wall of the cold head shell close to the water pump assembly, and the buffer component causes the water pressure plate to act on a number of heat sinks; wherein the buffer component is provided with a third connecting groove extending along the second direction, and the third connecting groove is connected to the second connecting groove.

[0011] The orthographic projection areas of the plurality of heat sinks on the water pressure plate are smaller than or equal to the area of ​​the water pressure plate.

[0012] The water pump assembly further includes a water pump motor, a motor shaft and an impeller. The water pump motor is connected to the motor shaft, the impeller is arranged on the motor shaft, and the water pump motor is connected to the pump body.

[0013] To solve the above technical problems, the present application proposes a water-cooled radiator, comprising: the water-cooling head assembly mentioned above, wherein the cold head assembly in the water-cooling head assembly is used to be detachably connected to the electronic device so that the connecting plate in the water-cooling head assembly fits with the heating area in the electronic device; a water-cooling radiator assembly; a first heat-conducting pipe, one end of which is connected to the water-cooling radiator assembly and the other end of which is connected to the first connecting portion in the water-cooling head assembly; a second heat-conducting pipe, one end of which is connected to the water-cooling radiator assembly and the other end of which is connected to the second connecting portion in the water-cooling head assembly.

[0014] The beneficial effects of the present application are as follows: Different from the prior art, the present application provides a water cooling head assembly. The water cooling head assembly includes a water pump assembly and a cold head assembly. The water pump assembly includes a pump body. The pump body is used to communicate with the water cooling radiator assembly. The water pump assembly is arranged on the cold head assembly. The water pump assembly is directly assembled on the cold head assembly, which not only reduces the water pump bracket, making the water cooling head assembly structure more compact, but also reduces the sealing position due to the connection between the water pump bracket and the water pump assembly, and the connection between the water pump bracket and the cold head assembly, thereby reducing the risk of coolant leakage.

[0015] The cold head assembly includes a cold head shell, a connecting plate and a heat sink. The cold head shell is connected to the pump body and is sealed and connected. The cold head shell and the connecting plate are surrounded to form a liquid storage cavity. The heat sink is extended along the first direction and arranged in an array along the second direction. A first connecting groove extending along the second direction is provided in the middle of the cold head shell. The liquid storage cavity of the cold head shell is used to communicate with the water cooling radiator assembly. Through the interaction of the above-mentioned liquid storage cavity, the heat sink extending in the first direction and the first connecting groove extending in the second direction in the middle of the cold head shell, the coolant can completely pass through any position of a number of heat sinks, thereby increasing the coolant flow path and improving the heat dissipation efficiency of the water cooling head assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0017] Figure 1 It is a structural schematic diagram of the first embodiment of the water cooling head assembly of the present application;

[0018] Figure 2 is a first cross-sectional schematic diagram of a first embodiment of a water-cooling head assembly of the present application;

[0019] Figure 3 yes Figure 2 A schematic diagram of the structure shown;

[0020] Figure 4 is a second cross-sectional schematic diagram of the first embodiment of the water-cooling head assembly of the present application;

[0021] Figure 5 yes Figure 4 The structural schematic diagram of B shown;

[0022] Figure 6 This is a schematic diagram of a first state of a cold head housing in a water-cooled head assembly of the present application;

[0023] Figure 7 It is a schematic diagram of the second state of the cold head shell in the water cooling head assembly of the present application;

[0024] Figure 8 It is a structural schematic diagram of the second embodiment of the water cooling head assembly of the present application;

[0025] Fig. 9 is a first cross-sectional schematic diagram of a second embodiment of a water-cooling head assembly of the present application;

[0026] Fig.10 is a second cross-sectional schematic diagram of a second embodiment of the water cooling head assembly of the present application;

[0027] Fig.11 It is a partial schematic diagram of the second embodiment of the water cooling head assembly of the present application;

[0028] Fig.12 is a structural schematic diagram of a third embodiment of a water cooling head assembly of the present application;

[0029] Fig.13 is a first cross-sectional schematic diagram of a third embodiment of a water-cooling head assembly of the present application;

[0030] Fig.14is a second cross-sectional schematic diagram of the third embodiment of the water cooling head assembly of the present application;

[0031] Fig.15 It is a first partial schematic diagram of the water cooling head assembly of the present application;

[0032] Fig.16 It is a first partial exploded schematic diagram of the water cooling head assembly of the present application;

[0033] Fig.17 It is an exploded schematic diagram of an embodiment of the water-cooled radiator of the present application.

[0034] Figure numbers: 10, water cooling head assembly; 11, water pump assembly; 111, pump body; 1111a, mounting portion; 112, first connecting portion; 113, water pump motor; 114, motor shaft; 115, impeller; 116c, connecting portion; 117c, transition shell; 12, cold head assembly; 121, cold head shell; 1211, first connecting groove; 1212, raised portion; 12121, buffer groove; 122, connecting plate; 123, heat sink; 124, liquid storage chamber; 125, second connecting portion; 126, water pressure plate; 1261, second connecting groove; 1262, receiving groove; 127, buffer member; 1271, third connecting groove; 1272, buffer portion; 13, external shell; 20, water cooling row assembly; 30, first heat pipe; 40, second heat pipe; 100, water cooling radiator. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] The water-cooling head assembly and the water-cooling radiator provided by the utility model are described in detail below in conjunction with the embodiments.

[0038] See also Figure 1 , Figure 2 as well as Figure 3 , Figure 1It is a structural schematic diagram of the first embodiment of the water cooling head assembly of the present application; Figure 2 is a first cross-sectional schematic diagram of a first embodiment of a water-cooling head assembly of the present application;

[0039] Figure 3 yes Figure 2 A structural schematic diagram is shown. The present application provides a water cooling head assembly 10. The water cooling head assembly 10 includes a water pump assembly 11 and a cold head assembly 12. The water pump assembly 11 is used to circulate the coolant. The water pump assembly 11 includes a pump body 111. The pump body 111 is used to communicate with the water cooling radiator assembly 20. The coolant can flow between the pump body 111 and the water cooling radiator assembly 20, and the flow direction of the coolant is not limited. The water pump assembly 11 is arranged on the cold head assembly 12.

[0040] Compared with the existing solution in which the water pump assembly 11 and the cold head assembly 12 need to be connected through a water pump bracket (not shown in the figure), in the present application, the water pump assembly 11 is directly assembled on the cold head assembly 12, which not only reduces the water pump bracket and makes the structure of the water cooling head assembly 10 more compact, but also reduces the sealing positions caused by the connection between the water pump bracket and the water pump assembly 11 and the connection between the water pump bracket and the cold head assembly 12, thereby reducing the risk of coolant leakage.

[0041] See also Figures 4 to 7 , Figure 4 is a second cross-sectional schematic diagram of the first embodiment of the water-cooling head assembly of the present application; Figure 5 yes Figure 4 The structural schematic diagram of B shown; Figure 6 This is a schematic diagram of a first state of a cold head housing in a water-cooled head assembly of the present application; Figure 7 Schematic diagram of the second state of the cold head shell in the water cooling head assembly of the present application. Figures 1 to 3 The cold head assembly 12 includes a cold head shell 121, a connecting plate 122 and a plurality of heat sinks 123. The cold head shell 121 is connected to the pump body 111; at the same time, the cold head shell 121 is sealed and connected to the pump body 111 so that the coolant can flow between the cold head shell 121 and the pump body 111. The cold head shell 121 and the connecting plate 122 are surrounded to form a liquid storage cavity 124. The liquid storage cavity 124 can contain coolant. The liquid storage cavity 124 is used to communicate with the water cooling radiator assembly 20. Among them, the coolant can flow between the liquid storage cavity 124 and the water cooling radiator assembly 20, and the flow direction of the coolant is not limited.

[0042] A plurality of heat sinks 123 are extended along a first direction and arranged on a side surface of the connecting plate 122 facing the liquid storage chamber 124; at the same time, a plurality of heat sinks 123 are arranged in an array along a second direction on a side surface of the connecting plate 122 facing the liquid storage chamber 124. The bottom of the heat sink 123 is attached to the heating area of ​​the electronic device (not shown in the figure) through the connecting plate 122, and the heat from the heating area is transferred to the heat sink 123. The heat sink 123 is in contact with the coolant and transfers the heat to the coolant. A plurality of heat sinks 123 are located in the liquid storage chamber 124. The coolant in the liquid storage chamber 124 can completely wrap the plurality of heat sinks 123, ensuring that the coolant can better pass through the heat sink 123 when it flows, so that the heat in the heat sink 123 can be better transferred to the coolant, thereby improving the heat dissipation efficiency of the water cooling head assembly 10.

[0043] A first connecting groove 1211 is provided in the middle of the cold head housing 121. The first connecting groove 1211 is extended along the second direction. At the same time, the first connecting groove 1211 is connected to the pump body 111. The first direction and the second direction are different. That is, the cooling liquid can flow between the liquid storage chamber 124, the first connecting groove 1211 and the pump body 111.

[0044] The coolant can flow from the cold head assembly 12 to the water pump assembly 11. Alternatively, the coolant can flow from the water pump assembly 11 to the cold head assembly 12. The flow direction of the coolant can be determined according to actual needs. In order to elaborate on the heat dissipation process of the water cooling head assembly 10, in this embodiment, it is assumed that the coolant in the water cooling radiator assembly 20 flows into the liquid storage chamber 124 and flows from the water pump assembly 11 to the water cooling radiator assembly 20.

[0045] That is, the coolant flows into the liquid storage cavity 124 of the cold head housing 121, and the coolant wraps a plurality of heat sinks 123. The coolant is sucked by the water pump assembly 11, and flows along the two ends of the heat sink 123 to the middle of the heat sink 123. At this time, the coolant absorbs the heat of the heat sink 123 and is used to transfer the heat of the heating area in the electronic device to the coolant. Then, the coolant flows to the first connecting groove 1211 in the middle of the cold head housing 121, reaches the pump body 111, and reaches the water cooling radiator assembly 20 through the action of the water pump assembly 11.

[0046] Through the interaction of the liquid storage cavity 124, the heat sink 123 extending in the first direction, and the first connecting groove 1211 extending in the second direction in the middle of the cold head shell 121, the coolant can completely pass through any position of the heat sink 123, thereby increasing the coolant flow path and improving the heat dissipation efficiency of the water-cooled head assembly 10.

[0047] The water pump assembly 11 is detachably connected or fixedly connected to the cold head assembly 12, and the specific connection method is not limited. For example, the water pump assembly 11 is installed on the cold head assembly 12 by bolts, clamping and plugging. Alternatively, at least part of the water pump assembly 11 is integrally formed on the cold head assembly 12. The heat sink 123 is detachably connected or fixedly connected to the side of the connecting plate 122 facing the liquid storage chamber 124. For example, the heat sink 123 is fixed to the connecting plate 122 by screws, bolts, etc. Alternatively, the heat sink 123 is fixed to the connecting plate 122 by welding.

[0048] In some embodiments, the first direction and the second direction may be arranged at an angle. For example, the angle between the first direction and the second direction may be greater than 0° and less than 180°. That is, the angle between the heat sink 123 and the first connecting groove 1211 may be greater than 0° and less than 180°. For example, the angle between the first direction and the second direction may be 10°, 30°, 50°, 66°, 70°, 90°, 110°, 140°, 156°, 170°, etc.

[0049] Specifically, the angle between the first direction and the second direction may be 90°. The heat sink 123 and the first connecting groove 1211 are vertically arranged to further improve the heat dissipation efficiency of the water cooling head assembly 10 .

[0050] In some embodiments, the water pump assembly 11 is disposed above the cold head assembly 12. The water pump assembly 11 may be disposed above the cold head assembly 12 in a vertical direction or a horizontal direction.

[0051] As in a specific embodiment, the water pump assembly 11 is arranged above the cold head assembly 12 in the vertical direction. Among them, the pump body 111 is at least partially integrally formed with the cold head shell 121. The pump body 111 is partially or completely integrally formed with the cold head shell 121. By integrally connecting the pump body 111 at least partially with the cold head shell 121, that is, the pump body 111 is directly assembled on the cold head assembly 12, not only the water pump bracket is reduced, making the structure of the water cooling head assembly 10 more compact, but also the sealing position due to the connection between the water pump bracket and the water pump assembly 11, and the connection between the water pump bracket and the cold head assembly 12 can be reduced, thereby reducing the risk of coolant leakage; at the same time, the sealing position between at least part of the pump body 111 and the cold head shell 121 is also reduced.

[0052] See also Figures 8 to 11 , Figure 8 It is a structural schematic diagram of the second embodiment of the water cooling head assembly of the present application; Fig. 9 is a first cross-sectional schematic diagram of a second embodiment of a water-cooling head assembly of the present application; Fig.10 is a second cross-sectional schematic diagram of a second embodiment of the water cooling head assembly of the present application; Fig.11It is a partial schematic diagram of the second embodiment of the water cooling head assembly of the present application. As in another specific embodiment, the water pump assembly 11 is arranged above the cold head assembly 12 in the vertical direction. Among them, the pump body 111 and the cold head shell 121 are detachably connected. At the same time, the pump body 111 and the cold head shell 121 are sealed and connected. By directly assembling the pump body 111 above the cold head assembly 12 in the vertical direction, not only the water pump bracket is reduced, making the water cooling head assembly 10 more compact, but also the sealing position can be reduced, thereby reducing the risk of coolant leakage. The outer periphery of the above-mentioned pump body 111 is provided with a mounting portion 1111a. The mounting portion 1111a is bolted to the cold head shell 121. Among them, the number of mounting portions 1111a can be one, two, three, etc.

[0053] See also Figure 12 to Figure 14 , Fig.12 is a structural schematic diagram of a third embodiment of a water cooling head assembly of the present application; Fig.13 is a first cross-sectional schematic diagram of a third embodiment of a water-cooling head assembly of the present application; Fig.14 It is a second cross-sectional schematic diagram of the third embodiment of the water cooling head assembly of the present application. In another alternative specific embodiment, the water pump assembly 11 is arranged above the cold head assembly 12 in the lateral direction. The water pump assembly 11 also includes a connecting portion 116c. The pump body 111 is connected to the connecting portion 116c. The pump body 111 is connected to the cold head shell 121 through the connecting portion 116c. The coolant flows between the pump body 111, the connecting portion and the cold head shell 121. By directly assembling the water pump assembly 11 above the cold head assembly 12 in the lateral direction, not only the water pump bracket is reduced, but also the structure of the water cooling head assembly 10 is made more compact. It is only necessary to ensure that the connecting portion 116c and the cold head shell 121 are sealed.

[0054] In some embodiments, when the water pump assembly 11 is disposed above the cold head assembly 12 in the lateral direction, the water cooling head assembly 10 further includes a transition housing 117c. The middle portion of the transition housing 117c is connected to the middle portion of the pump body 111. The pump body 111 is connected to the transition housing 117c through the connecting portion 116c. Through the transition housing 117c, the coolant can be drawn out from or flow into the middle of the water cooling head assembly 10, increasing the coolant flow path and heat dissipation uniformity, thereby improving the heat dissipation efficiency of the water cooling head assembly 10.

[0055] In some embodiments, the water pump assembly 11 further includes a first connection portion 112. The first connection portion 112 is in communication with the pump body 111. The first connection portion 112 is used to communicate with the water cooling radiator assembly 20. The cooling liquid can flow between the pump body 111, the first connection portion 112, and the water cooling radiator assembly 20. The cold head assembly 12 further includes a second connection portion 125. The second connection portion 125 is in communication with the liquid storage chamber 124. The second connection portion 125 is used to communicate with the water cooling radiator assembly 20. The cooling liquid can flow between the liquid storage chamber 124, the second connection portion 125, and the water cooling radiator assembly 20.

[0056] The first connection part 112 can be a water outlet (not shown in the figure) or a water inlet (not shown in the figure). The second connection part 125 can be a water inlet or a water outlet. The water outlet or water inlet can be selected according to actual conditions and is not limited here.

[0057] In a specific embodiment, the first connection part 112 is a water outlet. The second connection part 125 is a water inlet. That is, the first connection part 112 is used for the coolant to flow out. The second connection part 125 is used for the coolant to flow in. That is, the coolant flows through the second connection part 125, the liquid storage chamber 124, the two ends of the heat sink 123 to the middle, the first connecting groove 1211, the pump body 111 and the first connection part 112 in sequence. Alternatively, the coolant flows through the second connection part 125, the liquid storage chamber 124, the two ends of the heat sink 123 to the middle, the first connecting groove 1211, the middle of the transition shell 117c, the connecting part 116c, the pump body 111 and the first connection part 112 in sequence.

[0058] In another specific embodiment, the first connection part 112 is a water inlet part. The second connection part 125 is a water outlet part. That is, the cooling liquid flows through the first connection part 112, the pump body 111, the first connecting groove 1211, the middle of the heat sink 123 to its two ends, the liquid storage chamber 124 and the second connection part 125 in sequence. Alternatively, the cooling liquid flows through the first connection part 112, the pump body 111, the connecting part 116c, the middle of the transition shell 117c, the first connecting groove 1211, the middle of the heat sink 123 to its two ends, the liquid storage chamber 124 and the second connection part 125 in sequence.

[0059] The location of the first connection portion 112 on the pump body 111 and the location of the second connection portion 125 on the cold head housing 121 can be determined according to actual needs and are not limited here.

[0060] See also Figure 15 to Figure 16 , Fig.15 It is a first partial schematic diagram of the water cooling head assembly of the present application; Fig.16 This is a first partial exploded schematic diagram of the water cooling head assembly of the present application. Figures 1 to 7In some embodiments, the cold head assembly 12 further includes a water pressure plate 126. The water pressure plate 126 is disposed between the inner side wall of the cold head housing 121 close to the water pump assembly 11 and a plurality of heat sinks 123, and is used for the cooling liquid to flow from the two ends of the heat sink 123 to the middle thereof or the cooling liquid to flow from the middle of the heat sink 123 to the two ends thereof. The water pressure plate 126 is provided with a second connecting groove 1261. The second connecting groove 1261 is extended along the second direction. The second connecting groove 1261 is connected to the first connecting groove 1211. The cooling liquid can flow between the first connecting groove 1211 and the second connecting groove 1261.

[0061] By abutting the water pressure plate 126 against the tops of the plurality of heat sinks 123 , the coolant flows from both ends of the heat sink 123 to the middle thereof or from the middle of the heat sink 123 to both ends thereof, thereby increasing the coolant flow path and improving the heat dissipation efficiency of the water cooling head assembly 10 .

[0062] In some embodiments, the cold head assembly 12 further includes a buffer 127. The buffer 127 is disposed between the water pressure plate 126 and the inner side wall of the cold head housing 121 close to the water pump assembly 11. The buffer 127 causes the water pressure plate 126 to act on a plurality of heat sinks 123. The buffer 127 is provided with a third connecting groove 1271. The third connecting groove 1271 is extended along the second direction. The third connecting groove 1271 is connected to the second connecting groove 1261. The coolant can flow between the first connecting groove 1211, the second connecting groove 1261 and the third connecting groove 1271.

[0063] The buffer 127 can act on the water pressure plate 126 to abut against the tops of the plurality of heat sinks 123, thereby improving the stability of the water pressure plate 126 acting on the heat sink 123, thereby further improving the heat dissipation efficiency of the water cooling head assembly 10. The buffer 127 can be, but is not limited to, a silicone member.

[0064] In a specific embodiment, the cold head housing 121 is provided with a protrusion 1212. The protrusion 1212 is extended toward the liquid storage chamber 124. The water pressure plate 126 is formed with a receiving groove 1262 with an opening (not shown in the figure). The buffer 127 is arranged in the receiving groove 1262. At the same time, at least a part of the protrusion 1212 is also located in the receiving groove 1262. Through the joint action of the protrusion 1212, the receiving groove 1262 of the water pressure plate 126 and the buffer 127, the stability of the water pressure plate 126 is improved, thereby improving the heat dissipation efficiency.

[0065] Further, a buffer portion 1272 is convexly provided on one side of the buffer member 127 facing the protrusion 1212. A buffer groove 12121 is concavely provided on one end of the protrusion 1212 facing the buffer member 127. The buffer portion 1272 is located in the buffer groove 12121. The buffer portion 1272 and the buffer groove 12121 cooperate with each other to reduce the movement deviation of the buffer member 127, and further improve the stability of the water pressure plate 126.

[0066] In some embodiments, the second connecting groove 1261 at least partially overlaps with the first connecting groove 1211 in the vertical direction. The third connecting groove 1271 at least partially overlaps with the first connecting groove 1211 in the vertical direction. As in this embodiment, the first connecting groove 1211, the second connecting groove 1261 and the third connecting groove 1271 completely overlap in the vertical direction.

[0067] In some embodiments, the orthographic projection area of ​​the plurality of heat sinks 123 on the water pressure plate 126 is less than or equal to the area of ​​the water pressure plate 126. In the above manner, the water pressure plate 126 can completely cover the plurality of heat sinks 123, thereby further increasing the flow path of the coolant between adjacent heat sinks 123, thereby improving the heat dissipation efficiency.

[0068] In some embodiments, the water pump assembly 11 includes a water pump motor 113, a motor shaft 114, and an impeller 115. The water pump motor 113 is connected to the motor shaft 114. The impeller 115 is disposed on the motor shaft 114. The water pump motor 113 is connected to the pump body 111. The water pump motor 113, the motor shaft 114, and the impeller 115 work together to circulate the coolant.

[0069] The water pump motor 113 can be threadedly connected or fixedly connected to the pump body 111. The water pump motor 113, the motor shaft 114 and the impeller 115 are all conventional standard parts, and the pump body 111 can be set according to different needs. For example, the pump body 111 is at least partially connected to the cold head shell 121 as an integral part; or, the pump body 111 and the cold head shell 121 are detachably connected; or the pump body 111 is connected to the cold head shell 121 through the connecting portion 116c. When other parts of the water pump assembly 11 except the pump body 111 need to be replaced, conventional standard parts can be used for replacement, which is convenient for maintenance and replacement and reduces costs; in addition, different types of water pump assemblies 11 can be replaced according to the actual needs of different water cooling head assemblies 10 to improve general performance.

[0070] In some embodiments, the water cooling head assembly 10 includes an outer shell 13. The outer shell 13 is detachably connected to the cold head shell 121. The reliability and stability of the installation of the water cooling head assembly 10 can be improved by the outer shell.

[0071] See also Fig.17, Fig.17 Schematic diagram of an explosion of an embodiment of the water cooling radiator of the present application. Figures 1 to 16 In some embodiments, the present application provides a water-cooled radiator 100. The water-cooled radiator 100 includes a water-cooled head assembly 10, a water-cooled row assembly 20, a first heat pipe 30, and a second heat pipe 40. The cold head assembly 12 in the water-cooled head assembly 10 is used to be detachably connected to the electronic device so that the water-cooled head assembly 10 can be installed on the electronic device. Among them, the water-cooled head assembly 10 can be installed on the electronic device by means of screws, snap-ons, plug-ins, etc. During the installation of the water-cooled head assembly 10 to the electronic device, the connecting plate 122 in the water-cooled head assembly 10 is used to fit with the heating area in the electronic device so that the heat in the heating area is transferred to the water-cooled head assembly 10.

[0072] One end of the first heat pipe 30 is in communication with the water cooling radiator assembly 20. The other end of the first heat pipe 30 is in communication with the first connection portion 112 in the water cooling head assembly 10. One end of the second heat pipe 40 is in communication with the water cooling radiator assembly 20. The other end of the second heat pipe 40 is in communication with the second connection portion 125 in the water cooling head assembly 10.

[0073] That is, the heat generated in the heating area of ​​the electronic device is transferred to the cold head assembly 12 by heat conduction, and the coolant absorbs the heat of the heat sink 123 when passing through the second heat pipe 40, the second connecting portion 125, the liquid storage cavity 124 and the heat sink 123. Under the suction force of the water pump assembly 11, when the coolant that absorbs the heat reaches the water cooling radiator assembly 20, the fan and the heat dissipation fins in the water cooling radiator assembly 20 cool the coolant that absorbs the heat, and the coolant cooled by the water cooling radiator assembly 20 will flow through the water cooling head assembly 10 under the action of the water pump assembly 11. As a result, the above-mentioned coolant circulates to achieve circulating heat dissipation of the water cooling radiator 100.

[0074] Therefore, the water-cooled radiator 100 not only has a more compact structure and reduces the risk of coolant leakage by using the above-mentioned water-cooling head assembly 10, but also improves the heat dissipation efficiency. The above-mentioned electronic device can be but is not limited to a computer, a notebook, etc. The heating area can be but is not limited to a CPU (Central Processing Unit), a central processing unit, etc. It should be noted that the water-cooling head assembly 10 in this embodiment is the water-cooling head assembly 10 described in the above-mentioned embodiment, and its specific structure will not be repeated.

[0075] The terms "first", "second", "third" in this application are only used for descriptive purposes and cannot be understood as indicating the quantity of the indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of these features. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back ...) are only used to explain the relative positional relationship, motion conditions, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "include" and "have" and any of their variations are intended to cover non-exclusive inclusions. The process, method, system, product or equipment such as including a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.

[0076] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A water cooling head assembly, characterized in that: include: A water pump assembly, comprising a pump body, wherein the pump body is used to communicate with the water cooling row assembly; A cold head assembly, wherein the water pump assembly is arranged on the cold head assembly, and the cold head assembly includes a cold head shell, a connecting plate and a plurality of heat sinks, wherein the cold head shell is connected to the pump body and is sealed and communicated with the pump body, wherein the cold head shell and the connecting plate are arranged to form a liquid storage cavity, and the liquid storage cavity is used to communicate with the water cooling radiator assembly, wherein a plurality of heat sinks extend along a first direction and are arranged in an array along a second direction on a side surface of the connecting plate facing the liquid storage cavity, and a first communicating groove extending along the second direction is provided in the middle of the cold head shell, and the first communicating groove is communicated with the pump body.

2. The water cooling head assembly according to claim 1, characterized in that: The water pump assembly is disposed above the cold head assembly in a vertical direction; wherein the pump body is at least partially formed integrally with the cold head housing.

3. The water cooling head assembly according to claim 1, characterized in that: The water pump assembly is arranged above the cold head assembly in a transverse direction; the water pump assembly further comprises a communication portion, and the pump body is communicated with the cold head housing through the communication portion.

4. The water cooling head assembly according to claim 3, characterized in that: The water cooling head assembly further comprises a transition shell, a middle portion of the transition shell is connected to a middle portion of the pump body, and the pump body is connected to the transition shell through the connecting portion.

5. The water cooling head assembly according to claim 1, characterized in that: The water pump assembly further includes a first connection portion, the first connection portion is communicated with the pump body, and the first connection portion is used to communicate with the water cooling radiator assembly; The cold head assembly further includes a second connection portion, the second connection portion is communicated with the liquid storage cavity, and the second connection portion is used to communicate with the water cooling radiator assembly; Wherein, the first connection part is a water outlet, and the second connection part is a water inlet; or, the first connection part is a water inlet, and the second connection part is a water outlet.

6. The water cooling head assembly according to claim 1, characterized in that: The cold head assembly further includes a water pressure plate, which is disposed between the inner side wall of the cold head housing close to the water pump assembly and the plurality of heat sinks, and is used for the cooling liquid to flow from the two ends of the heat sink to the middle thereof or from the middle of the heat sink to the two ends thereof; Wherein, the water pressure plate is provided with a second connecting groove extending along the second direction, and the second connecting groove is connected with the first connecting groove.

7. The water cooling head assembly according to claim 6, characterized in that: The cold head assembly further includes a buffer, which is disposed between the water pressure plate and the inner side wall of the cold head housing close to the water pump assembly, and the buffer causes the water pressure plate to act on a plurality of the heat sinks; Wherein, the buffer component is provided with a third communicating groove extending along the second direction, and the third communicating groove is communicated with the second communicating groove.

8. The water cooling head assembly according to claim 6, characterized in that: The orthographic projection areas of the plurality of heat sinks on the water pressure plate are smaller than or equal to the area of ​​the water pressure plate.

9. The water cooling head assembly according to claim 1, characterized in that: The water pump assembly also includes a water pump motor, a motor shaft and an impeller. The water pump motor is connected to the motor shaft. The impeller is arranged on the motor shaft. The water pump motor is connected to the pump body.

10. A water-cooled radiator, characterized in that: include: The water-cooling head assembly according to any one of claims 1 to 9, wherein the cold head assembly in the water-cooling head assembly is used to be detachably connected to an electronic device so that the connecting plate in the water-cooling head assembly fits with a heat generating area in the electronic device; Water cooling radiator assembly; A first heat conducting pipe, one end of which is connected to the water cooling radiator assembly, and the other end of which is connected to the first connecting portion in the water cooling head assembly; One end of the second heat conduction pipe is connected to the water cooling radiator assembly, and the other end is connected to the second connecting portion in the water cooling head assembly.

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