A low-vibration, high-precision, fast-cooling automated laser processing device

Abstract

The utility model relates to the technical field of laser processing, and discloses a low-vibration, high-precision, fast-cooling automated laser processing device, comprising a shell, a laser head is fixedly connected to the inside of the shell, a placement rack is fixedly connected to the inside of the shell, a coil is fixedly connected to the inside of the shell, a heat dissipation fin 2 is fixedly connected to the outer wall of the coil, an air inlet is opened inside the shell, a cooling box is arranged on one side of the shell, a sealing cover is arranged on the top of the cooling box, and a semiconductor refrigeration plate is fixedly connected to the inside of the cooling box. In the utility model, the cooling surface of the semiconductor refrigeration plate is attached to the inside of the cooling box to cool the coolant, and the heat dissipation surface of the semiconductor refrigeration plate increases the contact area with the air through the heat dissipation fin 1, thereby achieving the effect of improving the heat dissipation efficiency, solving the problem of poor heat dissipation efficiency due to high ambient temperature when only external air is sucked in by a fan for heat dissipation, and improving the heat dissipation efficiency of the laser processing device.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, in particular to a low-vibration, high-precision, fast-cooling automatic laser processing device. Background Art

[0002] Automated laser processing devices are equipment used for laser processing in industrial production. These devices are usually composed of components such as laser generators, optical systems, motion control systems, and automated control systems. Some applications require extremely high processing accuracy and require precise processing at the micron or even nanometer level, so low-vibration, high-precision, fast-cooling automated laser processing devices are required.

[0003] In the use of traditional automated laser processing equipment, the workpiece is usually fixed on the work platform by a clamping device. The work platform can move along multiple axes to achieve processing in three-dimensional space. The motion control system is responsible for controlling the movement of the work platform to achieve precise processing path and processing depth.

[0004] However, it does not solve the problem of only using fans to draw in external air for heat dissipation to prevent parts from overheating during processing, causing deformation or quality problems, and the problem of poor heat dissipation efficiency due to high ambient temperature in hot summer weather. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a low-vibration, high-precision, fast-cooling automated laser processing device, which aims to improve the problem of poor heat dissipation efficiency due to the high ambient temperature in hot summer weather when heat is only dissipated by sucking in external air through a fan.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a low-vibration, high-precision, fast-cooling automated laser processing device, comprising a shell, a laser head is fixedly connected to the inside of the shell, a placement rack is fixedly connected to the inside of the shell, a coil is fixedly connected to the inside of the shell, a heat dissipation fin 2 is fixedly connected to the outer wall of the coil, an air inlet is opened inside the shell, a cooling box is arranged on one side of the shell, a sealing cover is arranged on the top of the cooling box, a semiconductor refrigeration plate is fixedly connected to the inside of the cooling box, a heat dissipation fin 1 is fixedly connected to one side of the semiconductor refrigeration plate, a fan 1 is arranged inside the cooling box, a heat dissipation port is opened inside the cooling box, a liquid outlet is fixedly connected to the inside of the cooling box, one end of the liquid outlet is fixedly connected to a water pump, the input end of the water pump is fixedly connected to one end of the liquid outlet pipe, the output end of the water pump is fixedly connected to one end of the coil, the other end of the coil is fixedly connected to the inside of the liquid outlet pipe, a slide groove is opened on one side of the shell, and a dustproof component is arranged on one side of the shell.

[0007] As a further description of the above technical solution:

[0008] The dustproof component comprises a dustproof net, an outer wall of the dustproof net is fixedly connected with a frame, and an outer wall of the frame is slidably connected inside the slide groove.

[0009] As a further description of the above technical solution:

[0010] A filter barrel is fixedly connected to one side of the shell, and a partition is fixedly connected inside the filter barrel.

[0011] As a further description of the above technical solution:

[0012] A fixing ring is slidably connected inside the filter barrel, and a filter screen is fixedly connected inside the fixing ring.

[0013] As a further description of the above technical solution:

[0014] The outer wall of the filter barrel is threadedly connected with a top cover, and a second fan is arranged inside the top cover.

[0015] As a further description of the above technical solution:

[0016] The top cover is fixedly connected with a limiting ring 1 inside, and the limiting ring 1 is slidably connected with a limiting plate inside.

[0017] As a further description of the above technical solution:

[0018] The bottom of the limiting plate is fixedly connected to the second limiting ring, and the bottom of the second limiting ring is attached to the top of the fixing ring.

[0019] As a further description of the above technical solution:

[0020] A spring is sleeved inside the limiting ring 1, one end of the spring is fixedly connected to the inside of the limiting ring 1, and the other end of the spring is fixedly connected to the top of the limiting plate.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, firstly, the cooling surface of the semiconductor refrigeration plate is attached to the inside of the cooling box to cool the coolant, and the heat dissipation surface of the semiconductor refrigeration plate increases the contact area with the air through the heat dissipation fins, thereby achieving the effect of improving the heat dissipation efficiency, solving the problem of poor heat dissipation efficiency due to high ambient temperature in hot summer weather when only external air is sucked in for heat dissipation by a fan, thereby improving the heat dissipation efficiency of the automated laser processing device.

[0023] 2. In the utility model, the frame inside the top cover always extends out of the limit ring 1, and the limit ring 2 is supported by the tension of the spring to push the bottom of the limit ring 2 to always fit the top of the fixed ring, thereby achieving the effect of resisting the flue gas filter. This solves the problem that when installing the filter of the traditional laser processing device, the sealing cover needs to be unscrewed and then the filter needs to be screwed in, which is inconvenient during the installation process and causes low filter replacement efficiency, thereby improving the production efficiency of the automated laser processing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A three-dimensional diagram of a low-vibration, high-precision, fast-cooling automated laser processing device proposed by the utility model;

[0025] Figure 2 This is a schematic diagram of the rear structure of a low-vibration, high-precision, fast-cooling automated laser processing device proposed by the utility model;

[0026] Figure 3 This is a schematic diagram of the cooling box structure of a low-vibration, high-precision, fast-cooling automated laser processing device proposed by the utility model;

[0027] Figure 4 This is a schematic diagram of the coil structure of a low-vibration, high-precision, fast-cooling automated laser processing device proposed by the utility model;

[0028] Figure 5 This is a schematic diagram of the internal structure of a filter barrel of a low-vibration, high-precision, fast-cooling automated laser processing device proposed by the utility model;

[0029] Figure 6 Based Figure 5 Schematic diagram of the enlarged structure at point A in the middle.

[0030] Legend:

[0031] 1. Shell; 2. Laser head; 3. Placement rack; 4. Cooling box; 5. Sealing cover; 6. Fan 1; 7. Heat dissipation port; 8. Liquid outlet pipe; 9. Water pump; 10. Coil; 11. Semiconductor refrigeration plate; 12. Heat dissipation fin 1; 13. Heat dissipation fin 2; 14. Air inlet; 15. Slide; 16. Frame; 17. Dust net; 18. Filter barrel; 19. Top cover; 20. Fan 2; 21. Partition; 22. Fixing ring; 23. Filter; 24. Limiting ring 1; 25. Limiting plate; 26. Limiting ring 2; 27. Spring. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Reference Figure 1-Figure 3 The utility model provides an embodiment: a low-vibration, high-precision, fast-cooling automated laser processing device, comprising a shell 1, a laser head 2 is fixedly connected to the shell 1, a placement rack 3 is fixedly connected to the shell 1, a coil 10 is fixedly connected to the shell 1, a heat dissipation fin 13 is fixedly connected to the outer wall of the coil 10, an air inlet 14 is opened inside the shell 1, a cooling box 4 is arranged on one side of the shell 1, a sealing cover 5 is arranged on the top of the cooling box 4, a semiconductor refrigeration plate 11 is fixedly connected to the cooling box 4, and a heat dissipation fin 1 is fixedly connected to one side of the semiconductor refrigeration plate 11 2. A fan 6 is arranged inside the cooling box 4, a heat dissipation port 7 is provided inside the cooling box 4, a liquid outlet pipe 8 is fixedly connected inside the cooling box 4, one end of the liquid outlet pipe 8 is fixedly connected to a water pump 9, an input end of the water pump 9 is fixedly connected to one end of the liquid outlet pipe 8, an output end of the water pump 9 is fixedly connected to one end of a coil 10, and the other end of the coil 10 is fixedly connected to the inside of the liquid outlet pipe 8, a slide groove 15 is provided on one side of the shell 1, a dustproof component is provided on one side of the shell 1, and the dustproof component includes a dustproof net 17, an outer wall of the dustproof net 17 is fixedly connected to a frame 16, and an outer wall of the frame 16 is slidably connected to the inside of the slide groove 15;

[0034] Specifically, when performing heat dissipation work, a proper amount of coolant is injected into the cooling box 4, and the cooling surface of the semiconductor refrigeration plate 11 starts to work. The cooling surface is tightly attached to the inside of the cooling box 4 to form a tight contact surface. As the refrigeration surface continues to work, the coolant inside the cooling box 4 gradually cools down, providing a necessary low-temperature environment for the subsequent heat dissipation process. In order to ensure the maximum heat dissipation effect, the heat dissipation surface of the semiconductor refrigeration plate 11 adopts the design of heat dissipation fins 12. These heat dissipation fins 12 can significantly increase the contact area with the air, thereby improving the heat dissipation efficiency. When the temperature of the heat dissipation surface rises, the heat dissipation fins 12 can effectively transfer heat to the surrounding air. In order to further improve the heat dissipation effect, a fan 6 is also equipped. The fan 6 draws in external air through rotation and blows it through the heat dissipation fins 12. In this way, the air can not only take away the heat on the heat dissipation fins 12, but also increase The circulation of the coolant inside the cooling box 4 is quickly cooled to further improve the heat dissipation efficiency. The air passing through the heat dissipation fins 12 is then discharged from the heat dissipation port 7, completing the entire heat dissipation process. After completing a round of heat dissipation, the water pump 9 begins to work. The input end of the water pump 9 draws the coolant in the cooling box 4 through the liquid outlet pipe 8. The cooled coolant then enters the coil 10 through the output end of the water pump 9. The coil 10 is coiled back and forth for multiple turns inside the shell 1 to form a complex heat dissipation network. This design can not only increase the contact area between the coolant and the air inside the shell 1, but also increase the diffusion rate of the cold air. In addition, the outer wall of the coil 10 is also fixed with heat dissipation fins 13. These heat dissipation fins 13 can further increase the heat dissipation area and improve the heat dissipation effect. When the coolant flows inside the coil 10, the heat it carries will be quickly transferred to the heat dissipation fins 13 and dissipated to the surrounding environment through air convection.

[0035] Reference Figure 4-Figure 6 A filter barrel 18 is fixedly connected to one side of the shell 1, a partition plate 21 is fixedly connected inside the filter barrel 18, a fixing ring 22 is slidably connected inside the filter barrel 18, a filter screen 23 is fixedly connected inside the fixing ring 22, a top cover 19 is threadedly connected to the outer wall of the filter barrel 18, a fan 20 is arranged inside the top cover 19, a limiting ring 1 24 is fixedly connected inside the top cover 19, a limiting plate 25 is slidably connected inside the limiting ring 1 24, a limiting ring 26 is fixedly connected to the bottom of the limiting plate 25, and the bottom of the limiting ring 26 is attached to the top of the fixing ring 22, a spring 27 is sleeved inside the limiting ring 1 24, one end of the spring 27 is fixedly connected inside the limiting ring 1 24, and the other end of the spring 27 is fixedly connected to the top of the limiting plate 25;

[0036] Specifically, the fan 20 draws in external air through the air inlet 14, and the dustproof net 17 filters out dust and impurities in the air to ensure that the air entering the shell 1 is clean and dust-free. Next, the filtered air will flow through the surface of the heat sink fins 2 13. The surface of the coil 10 is covered with dense heat sink fins 2 13, which greatly increases the contact area between the air and the heat sink surface, thereby improving the heat dissipation efficiency. In the process of air flowing through the heat sink fins 2 13, the heat is effectively taken away, which significantly reduces the temperature of the air. Subsequently, the cooled air will enter the working area of ​​the laser head 2 and the parts. In this area, the laser head 2 will generate a large amount of heat and harmful smoke, which will be The filter 23 is taken away and enters the filter barrel 18 together. The filter barrel 18 is equipped with a filter 23 inside, which can further filter out harmful substances in the air to ensure that the exhausted air meets environmental protection standards. During the installation of the filter 23, the frame 16 in the top cover 19 always extends out of the limit ring 1 24. This design ensures the stability and reliability of the filter 23 during the installation process. At the same time, the limit ring 26 is supported by the tension of the spring 27 and pushes its bottom to always fit on the top of the fixing ring 22. This design not only ensures the close fit between the filter 23 and the partition 21, and prevents their separation, but also allows the filter 23 to have a certain buffer space when subjected to external force, thereby avoiding damage caused by external force.

[0037] Working principle: When using the low-vibration, high-precision, fast-cooling automated laser processing device, first, when dissipating heat, coolant is injected into the cooling box 4, and then the cooling surface of the semiconductor refrigeration plate 11 is started, and the cooling surface is attached to the inside of the cooling box 4 to cool the coolant inside the cooling box 4. Then, the heat dissipation surface of the semiconductor refrigeration plate 11 increases the contact area with the air through the heat dissipation fins 12, and then the external air is sucked in and blown through the heat dissipation fins 12 through the fan 6 to dissipate heat, and the air is discharged from the heat dissipation port 7, and then the coolant in the cooling box 4 is extracted from the input end of the water pump 9 through the liquid outlet pipe 8, and then enters the coil 10 through the output end of the water pump 9. The coil 10 is coiled back and forth for multiple turns inside the shell 1, and the outer wall is fixed. The heat dissipation fins 2 13 are used to increase the diffusion rate of the cold air. Then, the fan 20 will draw the external air into the shell 1 through the air inlet 14 after filtering through the dustproof net 17, and cool the air through the surface of the heat dissipation fins 2 13, and then dissipate the heat when passing through the internal laser head 2 and parts. Then, the harmful smoke generated when the laser head 2 is working will enter the filter barrel 18 together with the hot air, so that the harmful smoke will be filtered through the filter 23 and then discharged through the fan 20. During the installation of the filter 23, the frame 16 in the top cover 19 always extends out of the limit ring 1 24, and the limit ring 26 is supported by the tension of the spring 27 to push the bottom of the limit ring 26 to always fit on the top of the fixing ring 22 to prevent the filter 23 from separating from the partition 21.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A low-vibration, high-precision, fast-cooling automated laser processing device, comprising a housing (1), characterized in that: The shell (1) is fixedly connected to a laser head (2), the shell (1) is fixedly connected to a placement rack (3), the shell (1) is fixedly connected to a coil (10), the outer wall of the coil (10) is fixedly connected to a second heat sink fin (13), an air inlet (14) is provided inside the shell (1), a cooling box (4) is provided on one side of the shell (1), a sealing cover (5) is provided on the top of the cooling box (4), a semiconductor refrigeration plate (11) is fixedly connected to the inside of the cooling box (4), and a heat sink fin (13) is fixedly connected to one side of the semiconductor refrigeration plate (11). (12), a fan (6) is arranged inside the cooling box (4), a heat dissipation port (7) is provided inside the cooling box (4), a liquid outlet pipe (8) is fixedly connected inside the cooling box (4), one end of the liquid outlet pipe (8) is fixedly connected to a water pump (9), an input end of the water pump (9) is fixedly connected to one end of the liquid outlet pipe (8), an output end of the water pump (9) is fixedly connected to one end of the coil (10), and the other end of the coil (10) is fixedly connected to the inside of the liquid outlet pipe (8), a slide groove (15) is provided on one side of the shell (1), and a dustproof component is provided on one side of the shell (1).

2. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 1, characterized in that: The dustproof component comprises a dustproof net (17), the outer wall of the dustproof net (17) is fixedly connected to a frame (16), and the outer wall of the frame (16) is slidably connected to the inside of the slide groove (15).

3. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 1, characterized in that: A filter barrel (18) is fixedly connected to one side of the housing (1), and a partition plate (21) is fixedly connected inside the filter barrel (18).

4. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 3, characterized in that: A fixing ring (22) is slidably connected inside the filter barrel (18), and a filter screen (23) is fixedly connected inside the fixing ring (22).

5. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 4, characterized in that: The outer wall of the filter barrel (18) is threadedly connected with a top cover (19), and a second fan (20) is arranged inside the top cover (19).

6. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 5, characterized in that: A limiting ring (24) is fixedly connected inside the top cover (19), and a limiting plate (25) is slidably connected inside the limiting ring (24).

7. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 6, characterized in that: The bottom of the limiting plate (25) is fixedly connected to the second limiting ring (26), and the bottom of the second limiting ring (26) is attached to the top of the fixing ring (22).

8. The low-vibration, high-precision, rapid-cooling automated laser processing device according to claim 6, characterized in that: A spring (27) is sleeved inside the limiting ring (24), one end of the spring (27) is fixedly connected to the inside of the limiting ring (24), and the other end of the spring (27) is fixedly connected to the top of the limiting plate (25).

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