A GPP chip glass polishing device

Abstract

The utility model belongs to the technical field of chip glass grinding, specifically a GPP chip glass grinding device, comprising a frame, an operating table, an X-axis slide rail, a Y-axis slide rail, a Z-axis slide rail and a grinder, the operating table is connected to the frame, the operating table is connected with a bracket, the X-axis slide rail is connected to the bracket, the X-axis slide rail is slidably connected with an X-axis slide seat, the Y-axis slide rail is connected to the X-axis slide seat, the Y-axis slide rail is slidably connected with a Y-axis slide seat, the Z-axis slide rail is connected to the Y-axis slide seat, the Z-axis slide rail is slidably connected with a Z-axis slide seat, the grinder is connected to the Z-axis slide seat through a motor seat, and a console and a card seat are also provided on the operating table; compared with the prior art, the utility model can better fix the chip during the grinding process, and also provides a better heat dissipation effect, thereby improving the product yield rate.

Description

Technical Field

[0001] The utility model relates to the technical field of chip glass grinding, in particular to a GPP chip glass grinding device. Background Art

[0002] GPP chip is a silicon power diode that uses a photoresist mask and a V-groove etched or mechanically cut table before the silicon diffusion sheet is metallized (or after the glass passivation process temperature allows). Then, glass powder is applied to the junction surface for table passivation. There are three main methods for applying glass: electrophoresis, spin coating, and medical scalpel. Glass powder is a suspension composed of a mixture of certain adhesives and high-purity fine glass powder. The glass powder suspension is applied to the V-groove according to a certain process method. The adhesive is burned off at high temperature, and the glass melts and forms a sealing protective layer on the surface of the entire junction.

[0003] During the glass passivation process, uneven heating may sometimes cause an uneven surface. The GPP chip glass grinding device is a device used to grind and polish the glass on the surface of the chip. Its main function is to make the glass on the surface of the chip smoother and flatter through grinding, polishing and other processes, thereby improving the performance and quality of the chip.

[0004] The existing chip glass grinding generally uses water for cooling for heat dissipation treatment. This method will pollute the operating table and is not conducive to continuous grinding operations. Therefore, it is necessary to invent a GPP chip glass grinding device with a new heat dissipation method. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model develops a GPP chip glass grinding device, which can better fix the chip during the grinding process, and also provides a better heat dissipation effect, thereby improving the product yield rate.

[0006] The technical solution to the technical problem solved by the utility model is: a GPP chip glass grinding device, comprising a frame, an operating table, an X-axis slide rail, a Y-axis slide rail, a Z-axis slide rail and a grinder, the operating table is connected to the frame, the operating table is connected to a bracket, the X-axis slide rail is connected to the bracket, the X-axis slide rail is slidably connected to the X-axis slide seat, the Y-axis slide rail is connected to the X-axis slide seat, the Y-axis slide rail is slidably connected to the Y-axis slide seat, the Z-axis slide rail is connected to the Y-axis slide seat, the Z-axis slide rail is slidably connected to the Z-axis slide seat, the grinder is connected to the Z-axis slide seat through a motor seat, and a console and a card seat are also provided on the operating table.

[0007] Preferably, the X-axis slide, the Y-axis slide and the Z-axis slide are connected to the X-axis slide rail, the Y-axis slide rail and the Z-axis slide rail respectively through ball screws, and the ball screws are connected to the output end of the servo motor.

[0008] Preferably, a dust suction device is connected to the motor base.

[0009] Preferably, a vacuum suction cup is provided in the holder, the vacuum suction cup is connected to a vacuum pump via an air guide pipe, and the vacuum pump is connected to the frame via a flange.

[0010] Preferably, a water cooling module is provided in the holder, the water cooling module is connected to a circulating water tank, and the circulating water tank is connected to the frame.

[0011] Preferably, the card holders are arranged in an array on the operating table.

[0012] The effects provided in the utility model content are only the effects of the embodiments, not all the effects of the utility model. The above technical solution has the following advantages or beneficial effects:

[0013] 1. By setting the card holder, a certain limit function is provided for the placement of the GPP chip, so that the temporary fixation effect is better;

[0014] 2. By setting a vacuum suction cup in the card holder, the GPP chip can be better fixed, which is conducive to improving the operation accuracy;

[0015] 3. By setting the X-axis slide, Y-axis slide and Z-axis slide, the position of the grinder can be adjusted in three degrees of freedom;

[0016] 4. By using a ball screw to control the position of the slide, the position accuracy of the grinder during movement is improved, and the yield rate of the product is improved;

[0017] 5. By setting a water cooling module in the card holder, the heat can be better dissipated during the grinding process, and the cleaning of the operating table is also easier, which improves production efficiency;

[0018] 6. By setting a dust suction device on the motor seat, the glass powder produced by grinding can be sucked away during the grinding process, which improves the cleanliness of the operating table and makes the subsequent cleaning work easier. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is the front view of the utility model;

[0020] Figure 2 It is the overall structural diagram of the utility model;

[0021] Figure 3 for Figure 2 A partial enlarged view of the middle A area;

[0022] Figure 4 It is a top view of the utility model;

[0023] Figure 5 This is the structural diagram of the water cooling module.

[0024] Among them: 1. frame; 2. operating table; 3. bracket; 4. X-axis slide rail; 41. X-axis slide seat; 5. Y-axis slide rail; 51. Y-axis slide seat; 6. Z-axis slide rail; 61. Z-axis slide seat; 7. ball screw; 8. servo motor; 9. grinder; 91. motor seat; 10. dust suction device; 11. holder; 12. vacuum suction cup; 121. vacuum pump; 122. air duct; 13. water cooling module; 131. circulating water tank; 14. control console. DETAILED DESCRIPTION

[0025] In order to clearly illustrate the technical features of the present invention, the present invention is described in detail below through specific implementation methods and in conjunction with the accompanying drawings.

[0026] Example 1

[0027] See also Figures 1 to 5 A GPP chip glass polishing device includes a frame 1, an operating table 2, an X-axis slide rail 4, a Y-axis slide rail 5, a Z-axis slide rail 6 and a grinder 9, wherein the operating table 2 is connected to the frame 1, the operating table 2 is connected to a bracket 3, the X-axis slide rail 4 is connected to the bracket 3, the X-axis slide rail 4 is slidably connected to an X-axis slide seat 41, the Y-axis slide rail 5 is connected to the X-axis slide seat 41, the Y-axis slide rail 5 is slidably connected to a Y-axis slide seat 51, the Z-axis slide rail 6 is connected to the Y-axis slide seat 51, the Z-axis slide rail 6 is slidably connected to a Z-axis slide seat 61, the grinder 9 is connected to the Z-axis slide seat 61 through a motor seat 91, and a console 14 and a card seat 11 are also provided on the operating table 2.

[0028] like Figure 1 and Figure 2 As shown, the X-axis slide 41 , the Y-axis slide 51 and the Z-axis slide 61 are respectively connected to the X-axis slide rail 4 , the Y-axis slide rail 5 and the Z-axis slide rail 6 through the ball screw 7 , and the ball screw 7 is connected to the output end of the servo motor 8 .

[0029] like Figure 3 As shown, the motor seat 91 is connected with a dust suction device 10, and an annular slide seat may also be provided on the motor seat 91, in which the dust suction device 10 is slidably connected, so that dust can be suctioned from more positions and angles, and later cleaning is more convenient.

[0030] like Figure 1 , Figure 3 and Figure 4As shown, a vacuum suction cup 12 is disposed in the holder 11 , and the vacuum suction cup 12 is connected to a vacuum pump 121 through an air guide pipe 122 , and the vacuum pump 121 is connected to the frame 1 through a flange.

[0031] like Figure 1 and Figure 5 As shown, a water cooling module 13 is disposed in the card holder 11 , and the water cooling module 13 is connected to a circulating water tank 131 , and the circulating water tank 131 is connected to the frame 1 .

[0032] like Figure 2 and Figure 4 As shown, the card holders 11 are arranged in an array on the operating table 2. The card holders 11 can also be designed into a variety of different specifications, which is more conducive to coping with different specifications of GPP chips.

[0033] Principle and operation process

[0034] The utility model adopts a new heat dissipation method to dissipate the heat of the chip during the GPP chip glass grinding process. When in use, the chip to be polished is placed in the card holder 11, and then the vacuum pump 121 is started through the control console 14, and the vacuum suction cup 12 in the card holder 11 will adsorb the chip. At the same time, due to the limiting effect of the card holder 11, the chip will be firmly and temporarily fixed in the card holder 11. At this time, the servo motor 8 is controlled by the control console 14 to start, and the X-axis slide 41, the Y-axis slide 51 and the Z-axis slide 61 are controlled to move on the ball screw 7, and the grinder 9 is moved to the chip. The grinding process is started by starting the dust collecting device 10 and the circulating water tank 131, and the glass powder produced by the grinding will be sucked away, thereby improving the cleanliness of the operating table 2 and making it easier to clean the operating table 2 later. The circulating water tank 131 can circulate the water inside the water cooling module 13 to take away the heat of the GPP chip in the card holder 11. The program can also be set on the console 14, and the spacing and position of the card holder 11 can be input into the program. The console 14 controls the grinder 9 to automatically grind the GPP chip in the card holder 11, and the paper only needs to be put on and taken off manually.

[0035] By using the ball screw 7 in conjunction with the slide to control the position of the grinder 9, the accuracy is higher and chip damage caused by overgrinding is avoided. By setting a water cooling module 13 in the holder 11, the heat generated by the chip during the grinding process will be transferred to the water cooling module 13. The water cooling module 13 takes away the heat by connecting with the circulating water tank 131. While ensuring good heat dissipation performance, it also makes the cleaning work of the operating table 2 simpler, thereby improving production efficiency.

[0036] The holder 11 of the utility model can be designed to be of uniform size, or can be designed to be of different sizes according to actual use requirements to cope with the need to process GPP chips of various specifications; the grinding head on the grinder 9 can also be replaced according to the chip size.

[0037] Although the specific implementation methods of the utility model are described above in conjunction with the accompanying drawings, it is not intended to limit the scope of protection of the utility model. On the basis of the technical solution of the utility model, various modifications or deformations that can be made by technical personnel in this field without creative work are still within the scope of protection of the utility model.

Claims

1. A GPP chip glass polishing device, characterized in that: The invention comprises a frame (1), an operating table (2), an X-axis slide rail (4), a Y-axis slide rail (5), a Z-axis slide rail (6) and a grinder (9), wherein the operating table (2) is connected to the frame (1), the operating table (2) is connected to a bracket (3), the X-axis slide rail (4) is connected to the bracket (3), the X-axis slide rail (4) is slidably connected to an X-axis slide seat (41), the Y-axis slide rail (5) is connected to the X-axis slide seat (41), the Y-axis slide rail (5) is slidably connected to a Y-axis slide seat (51), the Z-axis slide rail (6) is connected to the Y-axis slide seat (51), the Z-axis slide rail (6) is slidably connected to the Z-axis slide seat (61), the grinder (9) is connected to the Z-axis slide seat (61) via a motor seat (91), and the operating table (2) is also provided with a control console (14) and a holder (11); The motor base (91) is connected to a dust collecting device (10); A water cooling module (13) is provided in the card seat (11); the water cooling module (13) is connected to a circulating water tank (131); and the circulating water tank (131) is connected to the frame (1).

2. A GPP chip glass polishing device according to claim 1, characterized in that: The X-axis slide (41), the Y-axis slide (51) and the Z-axis slide (61) are respectively connected to the X-axis slide rail (4), the Y-axis slide rail (5) and the Z-axis slide rail (6) via a ball screw (7), and the ball screw (7) is connected to the output end of the servo motor (8).

3. A GPP chip glass polishing device according to claim 1, characterized in that: A vacuum suction cup (12) is provided in the holder (11); the vacuum suction cup (12) is connected to a vacuum pump (121) via an air guide pipe (122); and the vacuum pump (121) is connected to the frame (1) via a flange.

4. A GPP chip glass polishing device according to claim 1, characterized in that: The card holders (11) are arranged in an array on the operating table (2).

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