A semiconductor refrigeration chip cutting device

Abstract

The utility model discloses a semiconductor cooling sheet cutting device, including a base, a clamp assembly, a cutting line group and a lifting member; the cutting line group is located directly above the base, the cutting line group includes a plurality of cutting lines, and the plurality of cutting lines are used to cut the semiconductor cooling sheet; the lifting end of the lifting member is fixedly connected to the bottom of the base, the top of the base is connected to the clamp assembly, the base is used to place the semiconductor cooling sheet, the clamp assembly is used to clamp the semiconductor cooling sheet, and the lifting member is used to drive the base and the clamp assembly to approach or move away from the cutting line group. The utility model cuts a large semiconductor cooling sheet into a plurality of small semiconductor cooling sheets of the same size through cutting lines, thereby solving the problems of low cutting efficiency and poor cutting quality of traditional cutting devices when cutting semiconductor cooling sheets.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration sheets, in particular to a cutting device for semiconductor refrigeration sheets. Background Art

[0002] The semiconductor cooling plate of this scheme is made by utilizing the Peltier effect. The Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat. In other words, the semiconductor cooling plate is made of two semiconductor materials to form a hot end and a cold end. The cold end continuously absorbs heat to achieve cooling, while the hot end continuously releases heat to achieve heat dissipation.

[0003] Semiconductor refrigerators are made using the Peltier effect of semiconductor materials and can produce cooling or heating effects. They have the characteristics of small size, compact structure, and easy control of cooling capacity. They are widely used in small refrigeration products such as wine refrigerators, hot and cold dual-purpose boxes for cars, electronic ice cream machines, etc.

[0004] The semiconductor refrigeration sheet includes a first substrate, a second substrate, and a crystal grain disposed between the first substrate and the second substrate. During the assembly process of the semiconductor refrigeration sheet, the electrical parameters (such as resistance, etc.) of the semiconductor refrigeration sheet are usually different due to the influence of the crystal grain preparation process and the semiconductor refrigeration sheet assembly process, that is, there is an error between the actual electrical parameters and the theoretical electrical parameters of the semiconductor refrigeration sheet. The application scenarios applicable to semiconductor refrigeration sheets with different electrical parameters are different. If the actual application parameters of the semiconductor refrigeration sheet are ignored, the working efficiency of the semiconductor refrigeration sheet will be affected and its service life will be shortened.

[0005] At this time, the cutting of semiconductor refrigerators is a crucial link, which is directly related to the quality, production efficiency and cost of semiconductor refrigerators.

[0006] The traditional semiconductor cooling sheet cutting process uses a cutting knife to cut the semiconductor cooling sheet. Each operation can only cut the semiconductor cooling sheet into two pieces, so that the entire production process requires repeated cutting actions many times. The cutting efficiency is relatively low, which makes the production time of the semiconductor cooling sheet longer.

[0007] Moreover, when the cutting knife applies force, it is difficult to ensure uniform distribution of force, especially when encountering hard points or uneven structures inside the semiconductor cooling chip, which can easily cause stress concentration, resulting in edge collapse or breakage of the semiconductor cooling chip. This cutting quality problem not only reduces the product yield, but also increases the difficulty and cost of subsequent processing. Utility Model Content

[0008] In view of the above defects, the utility model proposes a cutting device for semiconductor refrigeration sheets, which solves the problems of low cutting efficiency and poor cutting quality when traditional cutting devices cut semiconductor refrigeration sheets.

[0009] To achieve this purpose, the utility model adopts the following technical solutions:

[0010] A semiconductor cooling sheet cutting device comprises a base, a clamp assembly, a cutting wire assembly and a lifting member;

[0011] The cutting line group is located directly above the base, and the cutting line group includes multiple cutting lines, and the multiple cutting lines are all used to cut the semiconductor cooling plate; the lifting end of the lifting member is fixedly connected to the bottom of the base, and the top of the base is connected to the clamp assembly, the base is used to place the semiconductor cooling plate, and the clamp assembly is used to clamp the semiconductor cooling plate, and the lifting member is used to drive the base and the clamp assembly to approach or move away from the cutting line group.

[0012] Furthermore, the cutting line group includes a first mounting roller and a second mounting roller, the connecting direction of the first mounting roller and the second mounting roller is left-right, and the two ends of the multiple groups of cutting lines are fixedly connected to the first mounting roller and the second mounting roller respectively.

[0013] Furthermore, the base comprises a plurality of bottom plates, the plurality of bottom plates are spliced ​​with each other, and a clamp assembly is provided on both the left and right sides of the bottom plates;

[0014] The clamp assembly includes a first clamping plate and a second clamping plate, the first clamping plate is installed at the left end of the base plate, a T-shaped block is fixedly installed at the bottom of the second clamping plate, a sliding groove is provided at the right end of the base plate, the T-shaped block is slidably connected to the sliding groove, and the T-shaped block abuts against the base plate through a locking member.

[0015] Furthermore, the locking member is a screw.

[0016] Furthermore, the base also includes a mounting plate, and the mounting block has a plurality of clamping block groups evenly arranged along the front-to-back direction, and the clamping block groups are used to fixedly connect the mounting plate and the plurality of base plates.

[0017] Furthermore, the clamping block group includes two relatively arranged clamping blocks, the two clamping blocks are respectively located on the left and right sides of the mounting plate, the bottom plate is respectively clamped with the clamping blocks at the left and right ends, and the bottom of the mounting plate is connected to the lifting end of the lifting member.

[0018] Furthermore, a first dial indicator is provided on the side wall of the first clamping plate, and a foot of the first dial indicator vertically abuts the second clamping plate; a second dial indicator is provided on the side wall of the second clamping plate, and a foot of the second dial indicator vertically abuts the second clamping plate.

[0019] Furthermore, the cutting line group also includes a third mounting roller, the first mounting roller, the second mounting roller and the third mounting roller form a triangular structure, and a plurality of the cutting lines are arranged around the triangular structure.

[0020] The technical solution provided by the embodiments of the present application may have the following beneficial effects:

[0021] 1. The cutting line group is composed of multiple cutting lines, so the multiple cutting lines work together to cut a large semiconductor cooling sheet into multiple small semiconductor cooling sheets of the same size at one time, thereby improving the cutting efficiency of the semiconductor cooling sheet. In addition, the cutting line has good hardness, and it is not easy to produce edge collapse or fragmentation during the cutting process, thereby ensuring the flatness and smoothness of the cutting surface of the semiconductor cooling sheet, and effectively ensuring the cutting quality of the semiconductor cooling sheet.

[0022] 2. The lifting member drives multiple bottom plates to rise and fall together in the vertical direction, so that the cutting line cuts the semiconductor refrigeration sheet and is then located in the gap between two adjacent bottom plates, effectively avoiding the situation where the cutting line cuts the bottom plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of a cutting device according to one embodiment of the utility model;

[0024] Figure 2 This is an exploded view of a cutting device according to one embodiment of the present invention;

[0025] Figure 3 It is a schematic diagram of a base plate of one embodiment of the utility model;

[0026] Among them, 1. base; 11. bottom plate; 12. mounting plate; 13. clamping block; 2. clamp assembly; 21. first clamping plate; 22. second clamping plate; 23. T-shaped block; 3. cutting line group; 31. first mounting roller; 32. second mounting roller; 33. cutting line; 4. first dial indicator; 41. second dial indicator. DETAILED DESCRIPTION

[0027] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0028] In the description of the present invention, it should be understood that the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, the meaning of "plurality" is more than two.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "splicing", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Combine the following Figures 1 to 3 , describing a cutting device for a semiconductor refrigeration sheet according to an embodiment of the utility model.

[0032] A semiconductor cooling sheet cutting device comprises a base 1, a clamp assembly 2, a cutting line assembly 3 and a lifting member;

[0033] The cutting line group 3 is located directly above the base 1, and the cutting line group 3 includes multiple cutting lines 33, and the multiple cutting lines 33 are all used to cut the semiconductor cooling plate; the lifting end of the lifting member is fixedly connected to the bottom of the base 1, and the top of the base 1 is connected to the clamp assembly 2. The base 1 is used to place the semiconductor cooling plate, and the clamp assembly 2 is used to clamp the semiconductor cooling plate. The lifting member is used to drive the base 1 and the clamp assembly 2 to approach or move away from the cutting line group 3.

[0034] The present invention provides a semiconductor cooling sheet cutting device, in which a semiconductor cooling sheet is placed on the top of the base 1, and the clamp assembly 2 is adjusted so that the clamp assembly 2 clamps the semiconductor cooling sheet, ensuring that the semiconductor cooling sheet is always located on the base 1 during the cutting process. Then the lifting member is started, and the lifting member drives the base 1 and the clamp assembly 2 to move up and down, because the cutting line group 3 is located directly above the base 1. Therefore, when the lifting member drives the base 1, the clamp assembly 2 and the semiconductor cooling sheet to move upward together, the cutting line group 3 abuts against the semiconductor cooling sheet and slowly cuts the semiconductor cooling sheet. After the cutting line group 3 completely cuts the semiconductor cooling sheet, the lifting member drives the base 1, the clamp assembly 2 and the semiconductor cooling sheet to move downward together, so that the base 1, the clamp assembly 2 and the semiconductor cooling sheet are away from the cutting line group 3, and the cutting process is completed.

[0035] It is worth noting that the cutting wire group 3 is composed of a plurality of cutting wires 33, and the cutting wires 33 are preferably corundum wires, so the plurality of corundum wires work together to cut a large semiconductor cooling sheet into a plurality of small semiconductor cooling sheets of the same size at one time, thereby improving the cutting efficiency of the semiconductor cooling sheet. In addition, the corundum wire has good hardness, and is not prone to edge collapse or fragmentation during the cutting process, thereby ensuring the flatness and smoothness of the cutting surface of the semiconductor cooling sheet, and effectively ensuring the cutting quality of the semiconductor cooling sheet. Therefore, the present solution uses the cutting wire group 3 to cut the semiconductor cooling sheet, which solves the problem of low cutting efficiency and poor cutting quality when the traditional cutting device cuts the semiconductor cooling sheet.

[0036] The cutting line group 3 includes a first mounting roller 31 and a second mounting roller 32. The connecting direction of the first mounting roller 31 and the second mounting roller 32 is the left-right direction. The two ends of the plurality of cutting lines 33 are fixedly connected to the first mounting roller 31 and the second mounting roller 32 respectively.

[0037] Among them, the first mounting roller 31 and the second mounting roller 32 can fix the left and right ends of the cutting line 33, so that the cutting line 33 is in a straight state. In this state, the cutting line 33 can easily and accurately cut into the semiconductor refrigeration sheet, ensuring the smooth progress of the cutting process.

[0038] The cutting line 33 can also ensure excellent cutting quality when cutting the semiconductor cooling sheet. Due to its high hardness, it is not easy to break or break during the cutting process, thereby ensuring the flatness and smoothness of the cut surface of the semiconductor cooling sheet. At the same time, the cutting accuracy of the cutting line 33 is extremely high, and the cutting depth and width can be accurately controlled, so that each cut semiconductor cooling sheet meets the design requirements.

[0039] If the cutting line 33 is in a relaxed state, the first installation roller 31 or the second installation roller 32 is rotated so that the cutting line 33 is kept in a straight state again.

[0040] Furthermore, the cutting line group 3 further includes a third mounting roller, the first mounting roller 31, the second mounting roller 32 and the third mounting roller form a triangular structure, and a plurality of the cutting lines 33 are arranged around the triangular structure. By rotating the first mounting roller 31, the second mounting roller 32 and the third mounting roller, the cutting lines can be rotated on the triangular structure, thereby improving the cutting efficiency of the semiconductor cooling sheet.

[0041] The base 1 includes a plurality of bottom plates 11, the plurality of bottom plates 11 are spliced ​​together, and a clamp assembly 2 is provided on both the left and right sides of the bottom plate 11;

[0042] The clamp assembly 2 includes a first clamping plate 21 and a second clamping plate 22. The first clamping plate 21 is installed at the left end of the base plate 11. A T-shaped block 23 is fixedly installed at the bottom of the second clamping plate 22. A sliding groove is provided at the right end of the base plate 11. The T-shaped block 23 is slidably connected to the sliding groove. The T-shaped block 23 is abutted against the base plate 11 through a locking member.

[0043] It is worth noting that, in order to ensure that the cutting line 33 can cut the bottom of the semiconductor cooling sheet, the complete semiconductor cooling sheet is divided into a plurality of small semiconductor cooling sheets of specific sizes, so the base 1 is composed of a plurality of bottom plates 11 spliced ​​together, and a plurality of cutting lines 33 are located directly above the gap between two adjacent bottom plates 11. The lifting member drives the plurality of bottom plates 11 to rise and fall together in the vertical direction, so that the cutting line 33 cuts the semiconductor cooling sheet and is then located in the gap between two adjacent bottom plates 11, effectively preventing the cutting line 33 from cutting the bottom plate 11.

[0044] In addition, a T-shaped block 23 is provided at the bottom of the second clamping plate 22. The T-shaped block 23 drives the second clamping plate 22 to slide on the bottom plate 11 until the second clamping plate 22 and the first clamping plate 21 jointly clamp the two sides of the semiconductor refrigeration plate. The staff can lock the T-shaped block 23 at a specific position of the bottom plate 11 through a locking piece, so that the first clamping plate 21 and the second clamping plate 22 can clamp the semiconductor refrigeration plate for a long time.

[0045] When the staff replaces the semiconductor refrigeration plate with other sizes, the connection between the T-shaped block 23 and the base plate 11 is released by the locking piece, and the distance between the first clamping plate 21 and the second clamping plate 22 is adjusted, thereby expanding the scope of use of the cutting device of this scheme.

[0046] The locking piece is a screw.

[0047] Screw locking provides a secure and stable connection. By turning the screw deeper into the screw hole or nut, sufficient friction can be generated to ensure that the connected parts will not loosen or fall off. Turning the screw in the correct direction can achieve the fixing or separation of the parts.

[0048] The base 1 further includes a mounting plate 12 , and the mounting plate 12 has a plurality of clamping block groups evenly arranged along the front-to-back direction, and the clamping block groups are used to fixedly connect the mounting plate 12 and the plurality of bottom plates 11 .

[0049] In order to ensure that multiple base plates 11 are lifted and lowered synchronously, a mounting plate 12 is provided at the bottom of the multiple base plates 11. Multiple clamping blocks 13 are evenly arranged on the mounting plate 12, and two opposite clamping blocks 13 form a set of clamping block groups, which can fix one base plate 11 on the mounting plate 12. At this time, multiple clamping block groups can simultaneously install multiple base plates 11 on the mounting plate 12. Since the lifting end of the lifting member is connected to the bottom of the mounting plate 12, the lifting member can simultaneously drive the mounting plate 12 and multiple base plates 11 to lift and lower together, ensuring that the front and rear ends of the semiconductor refrigeration sheet move at the same speed and in the same direction, thereby ensuring the cutting quality of the semiconductor refrigeration sheet.

[0050] The clamping block group includes two relatively arranged clamping blocks 13, and the two clamping blocks 13 are respectively located on the left and right sides of the mounting plate 12. The bottom plate 11 is respectively clamped with the clamping blocks 13 at the left and right ends, and the bottom of the mounting plate 12 is connected to the lifting end of the lifting member.

[0051] It is worth noting that, compared with using one clamping block 13 to connect the base plate 11 and the mounting plate 12, using two clamping blocks 13 can provide stronger stability, better force distribution, smaller deformation and higher safety, thereby extending the service life of the cutting device of this solution.

[0052] A first dial indicator 4 is provided on the side wall of the first clamping plate 21 , and a foot of the first dial indicator 4 vertically abuts against the second clamping plate 22 ; a second dial indicator 41 is provided on the side wall of the second clamping plate 22 , and a foot of the second dial indicator 41 vertically abuts against the second clamping plate 22 .

[0053] This solution limits the positions of the first dial gauge 4 and the second dial gauge 41, and horizontally measures the first clamping plate 21 and the second clamping plate 22 respectively. If the values ​​of the first dial gauge 4 and the second dial gauge 41 are not the same, and the difference is large, it can be explained that the first clamping plate 21 and the second clamping plate 22 have position deviations, and the connection direction of the first clamping plate 21 and the second clamping plate 22 is not in the left-right direction. At this time, cutting the semiconductor cooling sheet is likely to increase the number of defective semiconductor cooling sheets and increase the production cost of the semiconductor cooling sheet.

[0054] Therefore, the staff can adjust the positions of the first clamping plate 21 and the second clamping plate 22 in time by checking the values ​​on the first dial indicator 4 and the second dial indicator 41, ensuring that the connecting direction of the first clamping plate 21 and the second clamping plate 22 is in the left-right direction, further ensuring the cutting quality of the cutting device of this scheme and reducing the production cost of the semiconductor refrigeration plate.

[0055] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A semiconductor cooling sheet cutting device, characterized in that: Includes a base, a clamp assembly, a cutting line assembly, and a lifting member; The cutting line group is located directly above the base, and the cutting line group includes multiple cutting lines, and the multiple cutting lines are all used to cut the semiconductor cooling plate; the lifting end of the lifting member is fixedly connected to the bottom of the base, and the top of the base is connected to the clamp assembly, and the clamp assembly is used to clamp the semiconductor cooling plate. The lifting member is used to drive the base and the clamp assembly to approach or move away from the cutting line group.

2. A semiconductor cooling sheet cutting device according to claim 1, characterized in that: The cutting line group includes a first mounting roller and a second mounting roller, the connection direction of the first mounting roller and the second mounting roller is the left-right direction, and the two ends of the multiple groups of cutting lines are fixedly connected to the first mounting roller and the second mounting roller respectively.

3. The semiconductor cooling sheet cutting device according to claim 1, characterized in that: The base comprises a plurality of bottom plates, the plurality of bottom plates are spliced ​​with each other, and a clamp assembly is provided on both the left and right sides of the bottom plates; The clamp assembly includes a first clamping plate and a second clamping plate, the first clamping plate is installed at the left end of the base plate, a T-shaped block is fixedly installed at the bottom of the second clamping plate, a sliding groove is provided at the right end of the base plate, the T-shaped block is slidably connected to the sliding groove, and the T-shaped block abuts against the base plate through a locking member.

4. A semiconductor cooling sheet cutting device according to claim 3, characterized in that: The locking piece is a screw.

5. The semiconductor cooling sheet cutting device according to claim 3, characterized in that: The base also includes a mounting plate, and the mounting plate has a plurality of clamping block groups evenly arranged along the front-to-back direction, and the clamping block groups are used to fixedly connect the mounting plate and the plurality of base plates.

6. A semiconductor cooling sheet cutting device according to claim 5, characterized in that: The clamping block group includes two relatively arranged clamping blocks, which are respectively located on the left and right sides of the mounting plate, the bottom plate is respectively clamped with the clamping blocks at the left and right ends, and the bottom of the mounting plate is connected to the lifting end of the lifting member.

7. The semiconductor cooling sheet cutting device according to claim 3, characterized in that: A first dial indicator is disposed on the side wall of the first clamping plate, and a foot of the first dial indicator vertically abuts against the second clamping plate; a second dial indicator is disposed on the side wall of the second clamping plate, and a foot of the second dial indicator vertically abuts against the second clamping plate.

8. The semiconductor cooling sheet cutting device according to claim 2, characterized in that: The cutting line group further includes a third mounting roller, the first mounting roller, the second mounting roller and the third mounting roller form a triangular structure, and a plurality of the cutting lines are arranged around the triangular structure.

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